Power semiconductor module mother substrate splitting clamp

Abstract

The invention discloses a power semiconductor module mother substrate splitting clamp, and relates to the technical field of semiconductor packaging processes. The device comprises a base, a fixing plate, a limiting block, a pressing rod, a fixing frame and a bearing plate. The fixed plate is fixed on the base; a groove is formed in the fixing plate, the two limiting blocks are fixed to the two sides of the fixing plate, the pressing rod is connected to the base through the fixing frame, and the bearing plate is arranged under the pressing rod beside the base. According to the substrate splitting device, manual substrate splitting is replaced, the production efficiency is improved, the success rate of substrate splitting is guaranteed, ceramic substrate damage caused by pressing can be avoided, meanwhile, the substrate splitting process is simple and rapid, the substrate splitting efficiency is improved to a great extent, and the production cost is reduced. And the conditions of electrode skew and aluminum wire collapse caused by contact with the aluminum wire and the electrode during manual plate separation are also avoided.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging technology, and in particular to a mother substrate separation fixture for a power semiconductor module. Background Art

[0002] At present, the most widely used substrate for power semiconductor module packaging is ceramic substrate DBC (Direct Bond Copper). For the convenience of transportation and packaging, DBC manufacturers uniformly make it into a 3×5 mother substrate. The mother substrate is pre-processed by laser processing into 15 sub-substrates of the same size, and micro-hole grooves with equal spacing are formed on the ceramic surface between the sub-substrates to facilitate board separation.

[0003] For example, a Chinese patent with publication number CN115985887A discloses a semiconductor packaging structure, including: a stacked first stacking unit to an Nth stacking unit, any nth stacking unit includes an nth substrate, an nth chip and an nth heat dissipation cover, and the nth heat dissipation cover covers the nth chip; N is an integer greater than or equal to 2; any j-1th stacking unit also includes: a j-1th conductive connection seat located on one side of the j-1th substrate and covered by the j-1th heat dissipation cover, and the j-1th conductive connection seat has a j-1th slot; j is an integer greater than or equal to 2 and less than or equal to N; any jth stacking unit also includes: a j-1th conductive connector located on the side of the j-1th substrate away from the j-1th chip and passing through the j-1th heat dissipation cover, one end of the j-1th conductive connector is connected to the j-1th substrate, and the other end of the j-1th conductive connector is inserted into the j-1th slot.

[0004] The semiconductor packaging structure has good stability and good heat dissipation.

[0005] However, including the above-mentioned semiconductor packaging structure, the current way for power module packaging manufacturers to solve the problem of mother substrate depaneling is mainly for process personnel to manually break it and apply external force along the groove. This method is inefficient, and once the mother substrate has undergone semiconductor welding, wire bonding, and terminal welding processes, manual breaking can easily cause damage to the packaging structure, such as aluminum wire collapse, electrode skewness, and ceramic edge collapse, thereby causing module failure.

[0006] Based on the process defects of manual block separation, the present invention aims to improve the efficiency of mother substrate separation and avoid stress damage caused by manual block separation. It is necessary to invent a mother substrate separation fixture with uniform size and neat grooves to promote the advancement of semiconductor power device packaging technology. Summary of the invention

[0007] The present invention aims at the above-mentioned technical problems, overcomes the shortcomings of the prior art, and provides a power semiconductor module mother substrate separation fixture.

[0008] In order to solve the above technical problems, the present invention provides a power semiconductor module mother substrate separation fixture.

[0009] Technical effect: The present invention can realize that a mother substrate with a specification of 3×5 can be separated into 15 sub-boards after chip welding and aluminum wire bonding. The technical principle is: the mother substrate is placed on the plane of the fixture fixing plate, the sub-board to be separated is suspended above the receiving plate, the ceramic side groove contacts one end of the pressure plate, and the clamp pressure rod is pressed, and the sub-board to be separated will be separated from the mother substrate under the balanced pressure of the pressure rod.

[0010] The technical solution further defined in the present invention is: a power semiconductor module mother substrate separation fixture, comprising a base, a fixing plate, a limit block, a pressure rod, a fixing frame and a receiving plate; The fixing plate is fixed on the base; A groove for removing the process edge on the module motherboard is provided inside the fixing plate; Two limit blocks are connected to the two sides of the fixed plate; the pressure rod is connected to the base through a fixed frame; and the bottom of the base is located directly below the pressure rod and is an inclined receiving plate.

[0011] Furthermore, the two limiting blocks are detachably connected to the fixing plate, so as to divide the entire row of submodules into a plurality of single modules.

[0012] In the above-mentioned power semiconductor module mother substrate depaneling fixture, two fixing frames are fixed to the base by screws, and the length of the fixing frames is the same as the length of the short side direction of a single wooden block.

[0013] In the above-mentioned power semiconductor module mother substrate separating fixture, the pressing rod is rotatably connected to the fixing frame, and the pressing rod is connected to the acrylic pressing block.

[0014] In the above-mentioned power semiconductor module mother substrate separation fixture, the pressing rod and the fixing frame are rotatably connected via a rotating shaft.

[0015] In the above-mentioned power semiconductor module mother substrate depaneling fixture, the pressure rod includes a bottom pressure rod and a top pressure rod, the bottom of the connecting rod is connected to the bottom pressure rod, and the top is connected to the top pressure rod, which is used to drive the pressure rod to move.

[0016] The beneficial effects of the present invention are: (1) In the present invention, the specific depaneling process is as follows: placing the process edge of the motherboard to be depaneled in the groove and removing the process edge; placing the motherboard on the fixed plate for a first depaneling; and performing a second depaneling on a row of submodules after the first depaneling is completed, thereby completing the entire depaneling process; (2) In the present invention, the motherboard is placed on a fixed plate, and the board separation is completed by contacting the ceramic edge with a pressure rod. This device is easy to observe and avoids the situation in which the electrodes are skewed and the aluminum wires are collapsed when the boards are separated due to contact with the aluminum wires and electrodes during manual board separation. (3) In the present invention, the substrate depaneling device replaces manual depaneling, improves production efficiency, ensures the success rate of depaneling, and can avoid damage to the ceramic substrate caused by pressing. At the same time, the depaneling process is simple and fast, which greatly improves the depaneling efficiency; in addition, the present invention has high compatibility, and the substrate depaneling device can simultaneously complete the separation process and depanel multiple sub-modules obtained from the first depaneling to obtain a single module; (4) In the present invention, the force is uniform, the motherboard is placed flat on the fixed plate, the length of the pressure rod is consistent with that of the motherboard, and the force applied to the process strip edge of the motherboard by the pressure rod is consistent; (5) In the present invention, a mother substrate with a specification of 3×5 can be separated into 15 sub-boards after chip welding and aluminum wire bonding. The technical principle is: the mother substrate is placed on the plane of the fixture fixing plate, the sub-board to be separated is suspended above the receiving plate, the ceramic side groove contacts one end of the pressure plate, and the clamp pressure rod is pressed, and the sub-board to be separated will be separated from the mother substrate under the balanced pressure of the pressure rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The structure diagram of the motherboard that needs to be split; Figure 2 This is a diagram of a panel splitting device for a power module substrate panel splitting process according to the present invention; Figure 3 It is a schematic diagram of a power module substrate splitting device for splitting multiple substrates according to the present invention; Figure 4 The figure is a schematic diagram of a power module substrate depaneling device for depaneling a single substrate.

[0018] In the figure, 1, fixed plate; 2, groove; 3, base; 4, limit block; 5, fixed frame; 6, connecting rod; 7, top pressure rod; 8, bottom pressure rod 9, acrylic pressure block 10, receiving plate; 11, rotating shaft. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the present invention clearer, a detailed description is given below in conjunction with the accompanying drawings and specific embodiments. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific implementation disclosed below.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to an element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0022] Figure 1 This is the motherboard to be separated. At this time, the motherboard has four process edges, that is, to leave track transmission positions during SMT (surface mount technology) processing. The width of the process edge is generally 3-10mm, two long frames and two short frames. There will be no solder pads on the frames, but there will be positioning holes. The main function is to position reference points during printing and patching. The process edge is not part of the motherboard and needs to be removed after welding is completed.

[0023] In the prior art, the power module substrate is separated manually, and it is easy for the terminals to be skewed, the aluminum wire to collapse, and the ceramic to be damaged during the manual separation process.

[0024] Therefore, the present embodiment provides a power module mother substrate separation fixture, the structure of which is as follows Figures 2 to 4 As shown, it includes a base 3, a fixed plate 1, a limit block 4, a pressure rod, a fixed frame 5, and a receiving plate. The fixed plate 1 is fixed on the base 3; a groove 2 is provided inside the fixed plate 1, two limit blocks 4 are fixed on both sides of the fixed plate 1, the pressure rod is connected to the base 3 through the fixed frame 5, and the receiving plate is located next to the base 3 and directly below the pressure rod.

[0025] like Figure 2 As shown, the fixing plate 1 is connected to the base 3 by screws. A 2mm groove 2 is provided on the base 3. The groove 2 can achieve the purpose of breaking off the four process edges. The process edges are inserted into the groove 2 and tilted in one direction with force, so that the process edges can be separated.

[0026] like Figure 3 As shown, two limit blocks 4 are distributed on both sides of the fixed plate 1. In the present application, the two limit blocks 4 and the fixed plate 1 are detachable. The two limit blocks 4 and the fixed plate 1 are convenient for adjusting the size and movement of the motherboard. Two fixing frames 5 are fixed to the base 3 with screws, and the length of the fixing frames 5 is consistent with the length of the short side direction of a single module.

[0027] The setting of the fixing frame 5 is to support the connection rod 6 and the pressure rod. After being pressed downward, the motherboard separates a row of sub-modules and returns to the original position. The pressure rod and the acrylic pressure block are connected to the fixing frame 5. The acrylic pressure block is used to connect the pressure rod to avoid damage to the ceramic substrate. The pressure rod includes a top pressure rod 7 and a bottom pressure rod. The bottom pressure rod is rotatably connected to the fixing frame 5 through a rotating shaft 11. In addition, the bottom of the connection rod 6 is connected to the top pressure rod 7, and the top is connected to the top pressure rod 7.

[0028] When the motherboard is separated, when the ceramic edge of the motherboard contacts the bottom pressure rod to press the top pressure rod 7, the rotating shaft 11 of the bottom pressure rod will drive the connecting rod 6 to move downward, and a row of sub-modules will be separated. Such a design of the pressure rod and the fixing frame 5 will avoid electrode skew, electrode collapse and ceramic damage, and the separated row of sub-modules will slide off the receiving plate.

[0029] like Figure 4 As shown, the limiting block 4 is detachably connected to the fixing plate 1, and a row of submodules can be divided into single modules by replacing the limiting block 4.

[0030] The principle of the present invention is: after the chip welding and aluminum wire bonding process, a mother substrate with a specification of 3×5 can be separated into 15 sub-boards from the mother substrate. The technical principle is: the mother substrate is placed on the plane of the fixture fixing plate 1, the sub-board to be separated is suspended above the receiving plate, the ceramic side groove contacts one end of the pressure plate, and the clamp pressure rod is pressed, and the sub-board to be separated will be separated from the mother substrate under the balanced pressure of the pressure rod.

[0031] The substrate depaneling device of the present invention replaces manual depaneling, improves production efficiency, ensures the success rate of depaneling, and can avoid damage to the ceramic substrate caused by pressing. At the same time, the depaneling process is simple and fast, which greatly improves the depaneling efficiency and avoids the situation in which the electrodes are skewed and the aluminum wires are collapsed during depaneling due to contact with the aluminum wires and electrodes during manual depaneling.

[0032] In addition to the above embodiments, the present invention may also have other implementation modes. Any technical solution formed by equivalent replacement or equivalent transformation falls within the protection scope required by the present invention.

Claims

1. A power semiconductor module mother substrate separation fixture, characterized in that: It comprises a base (3), a fixing plate (1), a limiting block (4), a pressure rod, a fixing frame (5) and a receiving plate; The fixing plate (1) is fixed on the base (3); The fixing plate (1) is provided with a groove (2) inside for removing the process edge on the module motherboard; The two limit blocks (4) are connected to the two sides of the fixing plate (1); the pressure rod is connected to the base (3) via a fixing frame (5); the bottom of the base (3) is an inclined receiving plate located directly below the pressure rod.

2. A power semiconductor module mother substrate separation fixture according to claim 1, characterized in that: The two limit blocks (4) are detachably connected to the fixing plate (1) and are used to divide a whole row of submodules into a plurality of single modules.

3. A power semiconductor module mother substrate separation fixture according to claim 1, characterized in that: The two fixing frames (5) are fixed to the base (3) by means of screws, and the length of the fixing frames (5) is the same as the length of the short side of a single wooden block.

4. The power semiconductor module mother substrate separation fixture according to claim 1, characterized in that: The pressure rod is rotatably connected to the fixing frame (5), and an acrylic pressure block is connected to the pressure rod.

5. A power semiconductor module mother substrate separation fixture according to claim 4, characterized in that: The pressure rod is rotatably connected to the fixing frame (5) via a rotating shaft (11).

6. A power semiconductor module mother substrate separation fixture according to claim 5, characterized in that: The pressure rod comprises a bottom pressure rod and a top pressure rod (7); the bottom of the connecting rod (6) is connected to the bottom pressure rod, and the top is connected to the top pressure rod (7), so as to drive the pressure rod to move.

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