Solar cell silicon wafer top finger and assembly thereof

Abstract

The invention discloses a solar cell silicon wafer top finger and an assembly thereof, and relates to the technical field of solar cell production, the top finger comprises a top finger body and a top finger gasket, the top finger body comprises a top finger sheet, one end of the top finger sheet is provided with a top finger groove towards the middle, and the forming plane of the top finger groove is parallel to the surfaces of the two sides of the top finger sheet; the finger jacking gasket is embedded in the inner side of the finger jacking groove and sinks to the bottom of the finger jacking groove, a V-shaped groove is formed in the top face of the finger jacking gasket, and the design direction of an opening of the V-shaped groove is the same as the forming direction of the finger jacking groove; the two outer side walls of the finger jacking gasket are attached to the two inner side walls of the finger jacking groove, and the bottom wall of the finger jacking gasket is attached to the bottom wall of the finger jacking groove. The top finger assembly comprises the top finger, and the outer side walls of a plurality of top finger bodies are sequentially attached, assembled and fixed. According to the invention, the V-shaped groove formed by the top finger gasket can play a good role in guiding the entering silicon wafer, and the top finger gasket is arranged at the bottom of the top finger groove, so that the silicon wafer can be prevented from deviating when falling to the bottom, and the guiding effect is better.

Description

Technical Field

[0001] The invention relates to the technical field of solar cell production, and more particularly to a solar cell silicon chip top finger and a component thereof. Background Art

[0002] As a clean and renewable energy, the utilization of solar energy has always attracted people's attention. Solar energy has become one of the most promising new energy sources. Solar cells are mainly based on semiconductor materials. Their working principle is to use the photoelectric conversion reaction after the photoelectric material absorbs light energy. When a certain illumination is given, the voltage can be output and the current can be generated in the case of a circuit. According to the different materials used, solar cells can be divided into: silicon solar cells, batteries with inorganic salts such as gallium arsenide III-V compounds, cadmium sulfide, copper indium selenide and other multi-compounds as materials, solar cells made of functional polymer materials, and nanocrystalline solar cells.

[0003] In the production line of solar silicon wafers, the silicon wafers need to be sintered or tested, and then the silicon wafers are sorted by the robot and placed in the carrier box for subsequent transportation and processing. This involves the top finger structure used in the robot.

[0004] The top fingers are used to support the battery cells and can also be raised and lowered so that the battery cells can be smoothly put in and out of the basket or carrier. The spacing between adjacent top fingers is narrow, and the width is designed to be only slightly larger than the thickness of the battery cells. If the width is too large, the inserted battery cells will be skewed and not easy to fall into the quartz boat teeth or aluminum boat teeth. If the width is too small, the battery cells cannot be inserted. Therefore, although the normal width can insert the battery cells, during the insertion or withdrawal of the battery cells, since the battery cells are almost in contact with the side walls of the top fingers, it is very easy for the battery cells and the side walls of the top fingers to rub against each other, and the insertion cannot be in place, resulting in problems such as battery cell wear.

[0005] Therefore, how to provide a solar cell silicon wafer top finger structure with better alignment effect is a problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0006] In view of this, the present invention provides a solar cell silicon wafer top finger and a component thereof, aiming to solve the above technical problems.

[0007] In order to achieve the above object, the present invention adopts the following technical solution:

[0008] A solar cell silicon wafer top finger, comprising:

[0009] A finger-lifting body, the finger-lifting body comprising a finger-lifting piece, one end of the finger-lifting piece is provided with a finger-lifting groove toward the middle thereof, and the opening plane of the finger-lifting groove is parallel to the two side surfaces of the finger-lifting piece;

[0010] A top finger gasket, the top finger gasket is embedded in the inner side of the top finger groove and sunk to the bottom of the top finger groove, the top surface of the top finger gasket has a V-shaped groove, the opening design direction of the V-shaped groove is the same as the opening direction of the top finger groove; the two outer side walls of the top finger gasket are fitted with the two inner side walls of the top finger groove, and the bottom wall of the top finger gasket is fitted with the bottom wall of the top finger groove.

[0011] Through the above technical scheme, the top finger of the solar cell silicon wafer provided by the present invention is provided with a top finger gasket in the top finger groove of the top finger piece, and the V-shaped groove formed by the top finger gasket can play a good guiding role for the entering silicon wafer, and by arranging the top finger gasket at the bottom of the top finger groove, the silicon wafer can be prevented from deflecting when falling to the bottom, and the guiding effect is better.

[0012] Preferably, in the above-mentioned solar cell silicon wafer top finger, the V-shaped groove includes a V-shaped section and a bevel section from the bottom to the top, the bevel section extends obliquely upward from the top edges of both sides of the V-shaped section to form a trumpet-shaped structure, and the top edge of the bevel section forms a pointed structure and fits with the inner wall of the top finger groove. In order to prevent the tip of the top edge of the V-shaped groove from deforming, the V-shaped groove is composed of a V-shaped section and a bevel section, so that an arch is formed on the inside of the V-shaped groove. By utilizing the structural characteristics of the arch, the outer side wall of the top finger gasket can have a stronger fit with the two inner side walls of the top finger groove.

[0013] Preferably, in the above-mentioned solar cell silicon wafer top finger, a chamfer is formed at the junction of the V-shaped section and the inclined section. The design of the chamfer can make the silicon wafer fall in more smoothly.

[0014] Preferably, in the above-mentioned solar cell silicon wafer top finger, the outer walls and bottom wall of the top finger gasket are bonded and fixed to the inner walls and bottom wall of the top finger groove by adhesive. The bonding fixation can make the connection stability between the top finger gasket and the top finger groove stronger.

[0015] Preferably, in the above-mentioned solar cell silicon wafer top finger, the length of the top finger gasket along the opening through direction of its V-shaped groove is greater than the length of the top finger groove along the opening through direction, and the lengths of the top finger grooves extending from both sides of the top finger gasket are the same, and the bottom walls of the parts extending from the top finger grooves on both sides of the top finger gasket have limiting sections extending downward, and the two limiting sections are clamped on both side edges of the top finger piece. In order to improve the connection stability between the top finger gasket and the top finger groove, the present invention provides a bonding form and a limiting section setting form. In comparison, the two have their own advantages and disadvantages. The bonding form is easy to process and has strong stability, but is not easy to install. The limiting form is easy to install and has reliable stability, but is not easy to process. It can be selected according to the needs.

[0016] Preferably, in the above-mentioned solar cell silicon wafer top finger, the top finger gasket is made of a whole piece of rubber or PEEK material by a grooving cutter and a slicing cutter. The present invention provides a simple and reliable method for making a top finger gasket, which can be formed by two cutting processes and is simple and convenient to make.

[0017] Preferably, in the above-mentioned solar cell silicon wafer top finger, the specific processing method of the top finger gasket is:

[0018] S1, placing the whole piece of the workpiece into a cutting groove, wherein the cutting groove has corresponding grooving notches and slicing notches;

[0019] S2, using a groove cutting knife to groove the workpiece from top to bottom, when the groove cutting knife passes through the workpiece and enters the groove opening, the cutting of the V-shaped groove is completed;

[0020] S3, using a slice cutting knife to slice the workpiece from top to bottom, when the slice cutting knife passes through the workpiece and enters the slice notch, the cutting and forming of a single top finger gasket is completed.

[0021] The present invention uses a grooving cutting knife and a slicing cutting knife to cut the workpiece, and cooperates with the grooving notch and the slicing notch to ensure more reliable cutting control without causing cutting adhesion problems.

[0022] Preferably, in the above-mentioned solar cell silicon wafer top finger, the grooving cutter is formed by a plurality of V-shaped blades connected in sequence in a straight line; the slicing cutter is formed by a plurality of planar blades arranged in parallel and at intervals. The knife body is simply arranged and can meet the cutting requirements.

[0023] Preferably, in the above-mentioned solar cell silicon wafer finger-lifting, in step S3, the cut and formed finger-lifting pad is unloaded by ejecting or flipping. The finger-lifting pad can be unloaded by an adaptive structure, which is a conventional technology and will not be described in detail.

[0024] The present invention also provides a solar cell silicon wafer top finger assembly, comprising the solar cell silicon wafer top finger, wherein the outer side walls of a plurality of the top finger bodies are sequentially attached and assembled and fixed.

[0025] Through the above technical scheme, the present invention provides a solar cell silicon wafer top finger assembly, which, in conjunction with a novel top finger gasket structure with a V-shaped groove, can improve the precise guidance of the silicon wafer and improve the silicon wafer picking and placing effect.

[0026] It can be seen from the above technical solutions that, compared with the prior art, the present invention discloses a solar cell silicon wafer top finger and its components, which have the following beneficial effects:

[0027] 1. The top finger of the solar cell silicon wafer provided by the present invention is provided with a top finger gasket in the top finger groove of the top finger sheet. The V-shaped groove formed by the top finger gasket can play a good guiding role for the entering silicon wafer, and by arranging the top finger gasket at the bottom of the top finger groove, the silicon wafer can be prevented from deflecting when falling to the bottom, and the guiding effect is better.

[0028] 2. In order to prevent the tip of the top edge of the V-shaped groove from deforming, the present invention forms the V-shaped groove with a V-shaped segment and a slope segment, so that an arch is formed on the inner side of the V-shaped groove. By utilizing the structural characteristics of the arch, the outer side wall of the top finger gasket can have a stronger fit with the two inner side walls of the top finger groove.

[0029] 3. In order to improve the connection stability between the top finger gasket and the top finger groove, the present invention provides a bonding form and a form of setting a limiting section. In comparison, the two have their own advantages and disadvantages. The bonding form is easy to process and has strong stability, but it is not convenient to install. The limiting form is easy to install and has reliable stability, but it is not convenient to process. It can be selected according to the adaptability of the needs.

[0030] 4. The present invention provides a simple and reliable method for making a top finger gasket, which can be formed through two cutting processes. The production is simple and convenient. The processed body is cut by a grooving cutting knife and a slicing cutting knife. The grooving notch and the slicing notch are coordinated to meet the requirements of more reliable cutting control and no cutting adhesion problem occurs.

[0031] 5. The present invention provides a solar cell silicon wafer top finger assembly, which, in combination with a novel top finger gasket structure with a V-shaped groove, can improve the precise guidance of the silicon wafer and improve the silicon wafer picking and placing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0033] Figure 1 The accompanying drawing is a front view of the top of the solar cell silicon wafer of Example 1 provided by the present invention;

[0034] Figure 2 The accompanying drawing is a side view of the top of the silicon wafer of the solar cell according to Example 1 provided by the present invention;

[0035] Figure 3 The accompanying drawing is a front view of the top finger gasket of Example 1 provided by the present invention;

[0036] Figure 4The accompanying drawing is a front view of the top of a solar cell silicon wafer according to Example 2 provided by the present invention;

[0037] Figure 5 The accompanying drawing is a side view of the top of a silicon wafer of a solar cell according to Example 2 of the present invention;

[0038] Figure 6 The accompanying drawing is a front view of a top finger gasket according to Example 2 provided by the present invention;

[0039] Figure 7 The accompanying drawing is a side view of the top finger gasket of Example 2 provided by the present invention;

[0040] Figure 8 The accompanying drawing is a top view of the cutting groove provided by the present invention;

[0041] Fig. 9 The accompanying drawing is a bottom view of the grooving cutting knife provided by the present invention;

[0042] Fig.10 The accompanying drawing is a bottom view of the slice cutting knife provided by the present invention;

[0043] Fig.11 The accompanying drawing is a front view of a solar cell silicon wafer top finger assembly according to Example 3 provided by the present invention.

[0044] in:

[0045] 1-The top refers to the body;

[0046] 11-top finger piece; 11-top finger groove;

[0047] 2- Top finger gasket;

[0048] 21-V-shaped groove; 211-V-shaped section; 212-bevel section; 213-rounded corner; 22-limiting section;

[0049] 3-grooving cutting knife;

[0050] 31-V-blade;

[0051] 4- Slicing cutting knife;

[0052] 41- flat blade;

[0053] 5- cutting groove;

[0054] 51-grooving notch; 52-slicing notch. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] Embodiment 1:

[0057] See attached Figure 1 To Attachment Figure 3 The embodiment of the present invention discloses a solar cell silicon wafer top finger, comprising:

[0058] The top finger body 1 includes a top finger piece 11, one end of the top finger piece 11 is provided with a top finger groove 111 toward the middle thereof, and the opening plane of the top finger groove 111 is parallel to the two side surfaces of the top finger piece 11;

[0059] The top finger gasket 2 is embedded in the inner side of the top finger groove 111 and sunk to the bottom of the top finger groove 111. The top surface of the top finger gasket 2 has a V-shaped groove 21. The opening design direction of the V-shaped groove 21 is the same as the opening direction of the top finger groove 111. The two outer side walls of the top finger gasket 2 are fitted with the two inner side walls of the top finger groove 111, and the bottom wall of the top finger gasket 2 is fitted with the bottom wall of the top finger groove 111.

[0060] See attached Figure 3 The V-shaped groove 21 includes a V-shaped section 211 and a slope section 212 from the bottom to the top. The slope section 212 extends obliquely upward from the top edges of both sides of the V-shaped section 211 to form a trumpet-shaped structure. The top edge of the slope section 212 forms a pointed structure and fits with the inner wall of the top finger groove 111.

[0061] In order to further optimize the above technical solution, a rounded corner 213 is formed at the junction of the V-shaped segment 211 and the inclined segment 212 .

[0062] In this embodiment, in order to improve the embedding stability of the top finger gasket 2 and the top finger groove 111, the outer walls and bottom walls of the top finger gasket 2 are bonded and fixed to the inner walls and bottom walls of the top finger groove 111 by adhesive.

[0063] See attached Figure 8 To Attachment Fig. 9 The top finger gasket 2 provided in this embodiment is made of a whole piece of rubber or PEEK material by a grooving cutter 3 and a slicing cutter 4. The specific processing method of the top finger gasket 2 is as follows:

[0064] S1, placing the whole workpiece into the cutting groove 5, wherein the cutting groove 5 has corresponding grooving notches 51 and slicing notches 52;

[0065] S2, using the groove cutting knife 3 to groove the workpiece from top to bottom, when the groove cutting knife 3 passes through the workpiece and enters the groove notch 51, the cutting of the V-shaped groove 21 is completed;

[0066] S3, using the slice cutting knife 4 to slice the workpiece from top to bottom. When the slice cutting knife 4 passes through the workpiece and enters the slice notch 52, the cutting and forming of a single top finger gasket 2 is completed.

[0067] In this embodiment, the grooving cutting blade 3 is formed by a plurality of V-shaped blades 31 connected in sequence in a straight line; the slicing cutting blade 4 is formed by a plurality of planar blades 41 arranged in parallel and at intervals.

[0068] In step S3, the cut and formed top finger gasket 2 is unloaded by ejecting or flipping over.

[0069] Embodiment 2:

[0070] The difference between this embodiment and embodiment 1 is that this embodiment does not use bonding to connect the top finger gasket 2 and the top finger groove 111. In this embodiment:

[0071] See attached Figure 4 To Attachment Figure 7 The length of the top finger gasket 2 along the opening through direction of its V-shaped groove 21 is greater than the length of the top finger groove 111 along the opening through direction, and the lengths of the top finger grooves 111 extending from both sides of the top finger gasket 2 are the same, and the bottom walls of the parts of the top finger grooves 111 extending from both sides of the top finger gasket 2 extend downward with limiting sections 22, and the two limiting sections 22 are clamped on the two side edges of the top finger piece 11.

[0072] See attached Figure 8 To Attachment Fig. 9 The top finger gasket 2 provided in this embodiment is made of a whole piece of rubber or PEEK material by a grooving cutter 3 and a slicing cutter 4. The specific processing method of the top finger gasket 2 is as follows:

[0073] S1, placing the whole piece of the workpiece into the cutting groove 5. In this embodiment, the whole piece of the workpiece is first subjected to the groove cutting process of the limiting section 22, and then this step is performed; the cutting groove 5 has corresponding grooving notches 51 and slicing notches 52;

[0074] S2, using the groove cutting knife 3 to groove the workpiece from top to bottom, when the groove cutting knife 3 passes through the workpiece and enters the groove notch 51, the cutting of the V-shaped groove 21 is completed;

[0075] S3, using the slice cutting knife 4 to slice the workpiece from top to bottom. When the slice cutting knife 4 passes through the workpiece and enters the slice notch 52, the cutting and forming of a single top finger gasket 2 is completed.

[0076] The other contents of this embodiment are the same as those of Embodiment 1 and will not be described again.

[0077] Embodiment 3:

[0078] See attached Fig.11 The embodiment of the present invention discloses a solar cell silicon wafer top finger assembly, including a solar cell silicon wafer top finger of embodiment 1 or embodiment 2, and the outer side walls of multiple top finger bodies 1 are sequentially attached and assembled and fixed.

[0079] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0080] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A solar cell silicon wafer top finger, characterized in that: include: A finger-pushing body (1), the finger-pushing body (1) comprising a finger-pushing sheet (11), one end of the finger-pushing sheet (11) being provided with a finger-pushing groove (111) toward the middle thereof, the plane of the finger-pushing groove (111) being provided being parallel to the two side surfaces of the finger-pushing sheet (11); A top finger gasket (2), the top finger gasket (2) is embedded in the inner side of the top finger groove (111) and sunk to the bottom of the top finger groove (111); the top surface of the top finger gasket (2) has a V-shaped groove (21); the opening design direction of the V-shaped groove (21) is the same as the opening direction of the top finger groove (111); the two outer side walls of the top finger gasket (2) are in contact with the two inner side walls of the top finger groove (111), and the bottom wall of the top finger gasket (2) is in contact with the bottom wall of the top finger groove (111).

2. A solar cell silicon wafer top finger according to claim 1, characterized in that: The V-shaped groove (21) comprises a V-shaped section (211) and a slope section (212) in sequence from the bottom to the top, the slope section (212) extending obliquely upward from the top edges of both sides of the V-shaped section (211) to form a bell-shaped structure, the top edge of the slope section (212) forming a pointed structure and fitting with the inner wall of the top finger groove (111).

3. A solar cell silicon wafer top finger according to claim 2, characterized in that: A rounded corner (213) is formed at the junction of the V-shaped section (211) and the inclined surface section (212).

4. A solar cell silicon wafer top finger according to any one of claims 1 to 3, characterized in that: The outer walls on both sides and the bottom wall of the top finger gasket (2) are bonded and fixed to the inner walls on both sides and the bottom wall of the top finger groove (111) by adhesive.

5. A solar cell silicon wafer top finger according to any one of claims 1 to 3, characterized in that: The length of the top finger gasket (2) along the opening through direction of its V-shaped groove (21) is greater than the length of the top finger groove (111) along the opening through direction, and the lengths of the top finger grooves (111) extending from both sides of the top finger gasket (2) are the same. The bottom walls of the parts of the top finger gasket (2) extending from the top finger grooves (111) on both sides extend downwardly with limiting sections (22), and the two limiting sections (22) are clamped on the two side edges of the top finger piece (11).

6. The solar cell silicon wafer top finger according to claim 1, characterized in that: The top finger gasket (2) is made from a whole piece of rubber or PEEK material by being processed by a grooving cutter (3) and a slicing cutter (4).

7. A solar cell silicon wafer top finger according to claim 6, characterized in that: The specific processing method of the top finger gasket (2) is: S1, placing a whole piece of the workpiece into a cutting groove (5), wherein the cutting groove (5) has corresponding grooving notches (51) and slicing notches (52); S2, using a grooving cutter (3) to groove the workpiece from top to bottom, when the grooving cutter (3) passes through the workpiece and enters the grooving notch (51), the cutting of the V-shaped groove (21) is completed; S3, using a slicing cutter (4) to slice the workpiece from top to bottom. When the slicing cutter (4) passes through the workpiece and enters the slicing notch (52), the cutting and forming of a single top finger gasket (2) is completed.

8. A solar cell silicon wafer top finger according to claim 6 or 7, characterized in that: The grooving cutting blade (3) is formed by a plurality of V-shaped blades (31) connected in sequence in a straight line; the slicing cutting blade (4) is formed by a plurality of planar blades (41) arranged in parallel and at intervals.

9. A solar cell silicon wafer top finger according to claim 6 or 7, characterized in that: In step S3, the cut and formed top finger gasket (2) is unloaded by ejecting or flipping over.

10. A solar cell silicon wafer top finger assembly, characterized in that: It comprises a solar cell silicon wafer top finger according to any one of claims 1 to 9, wherein the outer side walls of a plurality of top finger bodies (1) are sequentially attached and assembled and fixed.

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