Efficient heat dissipation module using VC to replace traditional fins
By using multiple VC heat sink plates and capillary structures in the heat dissipation module to replace traditional fins, the problems of low heat dissipation efficiency and slow coolant reflow are solved, and efficient heat dissipation and rapid coolant reflow are achieved.
Patent Information
- Application Number
- CN202411249867.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2024-12-13
AI Technical Summary
Traditional fins have low heat dissipation efficiency and slow reflow speed of coolant, making it difficult to meet the efficient heat dissipation needs of modern electronic components.
Multiple VC heat sinks are used to replace traditional fins, combining capillary structures and installation mechanisms to improve heat dissipation efficiency and accelerate coolant reflux.
The heat dissipation efficiency and coolant reflow speed are significantly improved, and the return path is shortened through the capillary structure, enhancing the heat dissipation efficiency.
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Figure CN119136486A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic components, and in particular to a high-efficiency heat dissipation module in which VC replaces traditional fins. Background Art
[0002] A vapor chamber, also commonly called a temperature vapor chamber or VC vapor chamber, is a vacuum chamber with a microstructured inner wall, usually made of copper. When heat is conducted from the heat source to the evaporation zone, the coolant in the chamber begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gaseous cooling medium quickly fills the entire chamber. When the gaseous working medium contacts a relatively cold area, condensation will occur, and the heat accumulated during evaporation will be released through condensation. The condensed coolant will return to the evaporation heat source through the microstructured capillary channels, and this operation will be repeated in the chamber. The traditional fin heat dissipation efficiency is insufficient to meet the heat dissipation needs. VC vapor chambers are the mainstream of heat dissipation devices.
[0003] For example, a VC vapor chamber heat sink is disclosed in a Chinese patent (CN219761797U), comprising a VC vapor chamber, a fixing part being fixedly installed on the outer surface of the VC vapor chamber, the fixing part being used to facilitate fixing the VC vapor chamber, a heat sink being fixedly installed on the top of the VC vapor chamber, the heat sink being used to increase the heat dissipation area and accelerate the heat dissipation of the VC vapor chamber, the VC vapor chamber comprising a heat input surface and a heat output surface, the heat input surface being located at the bottom end of the VC vapor chamber, the heat output surface being located at the top end of the VC vapor chamber, and the heat output surface being fixedly connected to the heat sink, an installation cavity being provided inside the VC vapor chamber, a vacuum cavity being fixedly installed on the inner cavity side wall of the installation cavity, a capillary structure being formed between the vacuum cavity and the installation cavity, the utility model can not only perform efficient heat dissipation, but also has strong thermal conductivity and good temperature uniformity performance.
[0004] The above scheme also has the following technical defects. The above scheme only uses one VC heat spreader for heat dissipation, and its main heat dissipation device is still the heat sink. Due to the limited thermal conductivity of the heat sink, the heat dissipation efficiency of the above scheme is limited. At the same time, the above convenient VC heat spreader is flat, which is difficult to manufacture and the coolant reflux speed is slow. Based on this, an efficient heat dissipation module is proposed in which VC replaces traditional fins. Summary of the invention
[0005] 1. Technical issues to be resolved
[0006] In view of the shortcomings of the prior art, the present invention provides a high-efficiency heat dissipation module in which VC replaces traditional fins, which has the advantages of using VC heat sink instead of heat dissipation fins for heat dissipation and accelerating the return of coolant, thereby solving the problems of low heat dissipation efficiency of heat dissipation fins and slow return of coolant.
[0007] (II) Technical solution
[0008] In order to achieve the purpose of using VC heat spreader to replace heat sink fins to dissipate heat and accelerate the reflux of coolant, the present invention provides the following technical solution: comprising a base and a heat conducting plate, a mounting mechanism is provided on the top side of the base and the bottom side of the heat conducting plate, a plurality of VC heat spreaders are provided on the mounting mechanism, a fixing assembly is provided on the top side of the heat conducting plate, four pairs of mounting plates are abutted on the top side of the heat conducting plate, a fan is fixed on the opposite side of each pair of mounting plates, a heat source groove is provided inside the top side of the base, and four through holes are provided around the inside of the base;
[0009] The VC heat spreader includes an outer shell, a capillary structure is fixed to the inner wall of the outer shell, a capillary plate is fixed between the left and right sides of the capillary structure, two first capillaries are fixed between the bottom side of the inner wall of the capillary structure and the bottom side of the capillary plate, two second capillaries are fixed between the top side of the inner wall of the capillary structure and the top side of the capillary plate, two supporting columns are fixed to both the top and bottom sides of the inner wall of the capillary structure, two air holes are provided inside the capillary plate, and the interior of the capillary structure constitutes a vacuum cavity.
[0010] Preferably, the mounting mechanism includes a plurality of connecting plates fixed to the top side of the base and the bottom side of the heat conducting plate, two vertical plates fixed to the front side of the VC heat spreader and abutment grooves provided inside the front side walls of the connecting plates, a spring is fixed inside the vertical plate, an elastic block is fixed to the front side of the spring, the elastic block can abut in the abutment groove, two connecting rods are fixed to the rear side of the elastic block, two limit blocks are fixed to the rear side of the connecting rods, and the VC heat spreader is inserted into two corresponding upper and lower connecting plates.
[0011] Preferably, the fixing assembly is fixed to four first fixing plates on the top side of the heat conducting plate and four second fixing plates fixed to the top side of the heat conducting plate and located on the corresponding side of the corresponding first fixing plates, the internal thread of the first fixing plate is connected with a screw, an abutment plate is fixed to the outer surface of the screw, and a handle is fixed to the side of the screw away from the first fixing plate.
[0012] Preferably, the upper ends of the first capillary tube and the second capillary tube are inclined toward a corresponding side of the left and right sides of the capillary structure, and the lower ends of the first capillary tube and the second capillary tube are inclined toward a middle of the capillary structure.
[0013] Preferably, the top end of the upper support column is fixed to the bottom side of the capillary plate, and the bottom side of the lower support column is fixed to the top side of the capillary plate.
[0014] Preferably, the top side and the bottom side of the connecting plate are both open, the top side of the VC heat spreader can abut against the top side of the heat conducting plate, and the bottom side of the VC heat spreader can abut against the top side of the base.
[0015] Preferably, both upper and lower sides of the inner wall of the vertical plate are provided with limiting grooves, and the two limiting blocks slide in the corresponding limiting grooves.
[0016] Preferably, a connecting hole is opened inside the mounting plate, and the screw rod passes through the connecting hole.
[0017] Preferably, the width of the VC heat spreaders at the front and rear sides is smaller than the width of the VC heat spreader at the middle, and a side of the abutting plate close to the second fixing plate abuts against a side corresponding to the second fixing plate.
[0018] (III) Beneficial effects
[0019] Compared with the prior art, the present invention provides a high-efficiency heat dissipation module in which VC replaces traditional fins, and has the following beneficial effects:
[0020] 1. The high-efficiency heat dissipation module using VC to replace traditional fins can improve the heat dissipation efficiency of the heat dissipation module by installing a VC heat spreader on the top, and using the VC heat spreader to replace traditional fins for heat dissipation. At the same time, the capillary is used to guide the coolant, which increases the return path of the coolant and shortens the return distance, thereby further improving the heat dissipation efficiency.
[0021] 2. The high-efficiency heat dissipation module that uses VC to replace traditional fins has a mounting mechanism on the top side of the base and the bottom side of the heat conduction plate. The VC heat spreader can be fixed by abutting the vertical plate against the connecting plate and the elastic block against the abutting groove. At the same time, the VC heat spreader can be easily taken out of the connecting groove to facilitate replacement of the VC heat spreader. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a schematic diagram of the structure of a high-efficiency heat dissipation module proposed by the present invention, in which VC replaces traditional fins;
[0023] Figure 2 A schematic diagram of the side structure of a high-efficiency heat dissipation module proposed by the present invention in which VC replaces traditional fins;
[0024] Figure 3 A schematic cross-sectional view of a VC vapor chamber of a high-efficiency heat dissipation module proposed by the present invention in which VC replaces traditional fins;
[0025] Figure 4 It is a cross-sectional structural schematic diagram of a high-efficiency heat dissipation module installation mechanism proposed by the present invention, in which VC replaces traditional fins;
[0026] Figure 5 A three-dimensional schematic diagram of an elastic block connection structure of an efficient heat dissipation module proposed by the present invention in which VC replaces traditional fins;
[0027] Figure 6 The invention proposes a high-efficiency heat dissipation module in which VC replaces traditional fins Figure 1 Schematic diagram of the enlarged structure at A in the middle;.
[0028] In the figure: 1 base, 200 mounting mechanism, 201 connecting plate, 202 vertical plate, 203 spring, 204 elastic block, 205 connecting rod, 206 limit block, 207 abutment groove, 300VC heat spreader, 301 shell, 302 capillary structure, 303 capillary plate, 304 first capillary, 305 second capillary, 306 support column, 307 air hole, 308 vacuum chamber, 4 heat conducting plate, 500 fixing component, 501 first fixing plate, 502 second fixing plate, 503 screw, 504 abutment plate, 505 handle, 6 mounting plate, 7 fan, 8 heat source groove, 9 through hole. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0030] See also Figures 1 to 6 In this embodiment, a high-efficiency heat dissipation module using VC to replace traditional fins includes a base 1 and a heat conducting plate 4. A mounting mechanism 200 is provided on the top side of the base 1 and the bottom side of the heat conducting plate 4. A plurality of VC heat spreaders 300 are provided on the mounting mechanism 200. The width of the VC heat spreaders 300 located at the front and rear sides is smaller than the width of the VC heat spreader 300 located in the middle. A fixing assembly 500 is provided on the top side of the heat conducting plate 4. Four pairs of mounting plates 6 are abutted against the top side of the heat conducting plate 4. A fan 7 is fixed on the opposite side of each pair of mounting plates 6. A heat source groove 8 is provided inside the top side of the base 1, and four through holes 9 are provided around the inside of the base 1.
[0031] The fixing assembly 500 in this embodiment is fixed to four first fixing plates 501 on the top side of the heat conducting plate 4 and four second fixing plates 502 fixed to the top side of the heat conducting plate 4 and located on the corresponding side of the first fixing plate 501. The internal thread of the first fixing plate 501 is connected with a screw rod 503. A connecting hole is opened inside the mounting plate 6. The screw rod 503 passes through the connecting hole. An abutment plate 504 is fixed to the outer surface of the screw rod 503. A handle 505 is fixed to the side of the screw rod 503 away from the first fixing plate 501. The side of the abutment plate 504 close to the second fixing plate 502 abuts against the corresponding side of the second fixing plate 502.
[0032] It should be noted that the mounting mechanism 200 is used to facilitate the installation and disassembly of the VC heat spreader 300, the fixing assembly 500 is used to facilitate the fixing of the mounting plate 6 and the fan 7 on the heat conducting plate 4, the fan 7 is used to dissipate heat from the heat conducting plate 4, the heat conducting plate 4 is used for heat conduction, the heat source groove 8 is used to place the heat source, and the through hole 9 is used to facilitate the fixing of the heat dissipation module. By using multiple VC heat spreaders 300, the heat dissipation efficiency can be improved.
[0033] See also Figures 1 to 3 In order to increase the reflux speed of the coolant, the VC heat spreader 300 in this embodiment includes a shell 301, a capillary structure 302 is fixed to the inner wall of the shell 301, a capillary plate 303 is fixed between the left and right sides of the capillary structure 302, two first capillaries 304 are fixed between the bottom side of the inner wall of the capillary structure 302 and the bottom side of the capillary plate 303, two second capillaries 305 are fixed between the top side of the inner wall of the capillary structure 302 and the top side of the capillary plate 303, and the upper ends of the first capillary 304 and the second capillary 305 are fixed to the capillary plate 303. The first capillary 304 and the second capillary 305 are inclined toward the middle of the capillary structure 302, and the lower ends of the first capillary 304 and the second capillary 305 are inclined toward the middle of the capillary structure 302. Two support columns 306 are fixed on both sides of the top and bottom of the inner wall of the capillary structure 302. The top of the upper support column 306 is fixed to the bottom side of the capillary plate 303, and the bottom side of the lower support column 306 is fixed to the top side of the capillary plate 303. Two air holes 307 are provided inside the capillary plate 303, and the interior of the capillary structure 302 constitutes a vacuum cavity 308.
[0034] The VC heat spreader 300 in this embodiment can facilitate the reflux of the coolant through the capillary structure 302. The capillary plate 303 is used to evaporate the coolant that has refluxed into the capillary plate 303 again, thereby achieving evaporative heat dissipation on the two surfaces of the capillary plate 303 and the top side of the capillary structure 302, which can improve the efficiency of evaporative heat dissipation. By arranging the first capillary tube 304 and the second capillary tube 305 at an angle, the path for the coolant to reflux to the bottom side of the capillary structure 302 can be shortened, and at the same time, the path for the coolant to reflux is increased compared to using the capillary structure 302 alone.
[0035] It should be noted that the air holes 307 are used to facilitate the hot steam to rise, and the support column 306 is used to support the capillary structure 302 and the shell 301 .
[0036] See also Figure 1 , Figure 4 and Figure 5 In order to facilitate the installation and replacement of the VC heat spreader 300, the installation mechanism 200 in this embodiment includes a plurality of connecting plates 201 fixed to the top side of the base 1 and the bottom side of the heat conducting plate 4, two vertical plates 202 fixed to the front side of the VC heat spreader 300, and abutment grooves 207 opened inside the front side walls of the connecting plates 201. The top and bottom sides of the connecting plates 201 are both open. The top side of the VC heat spreader 300 can be abutted against the top side of the heat conducting plate 4, and the bottom side of the VC heat spreader 300 can be abutted against the top side of the heat conducting plate 4, and the bottom side of the VC heat spreader 300 can be abutted against the The top sides are abutted against each other, a spring 203 is fixed inside the vertical plate 202, an elastic block 204 is fixed on the front side of the spring 203, the elastic block 204 can abut against the abutment groove 207, two connecting rods 205 are fixed on the rear side of the elastic block 204, two limit blocks 206 are fixed on the rear side of the connecting rod 205, and limit grooves are provided on the upper and lower sides of the inner wall of the vertical plate 202, the two limit blocks 206 slide in the corresponding limit grooves, and the VC heat spreader 300 is inserted into the two corresponding upper and lower connecting plates 201.
[0037] The mounting mechanism 200 in this embodiment can fix the VC heat spreader 300 by the elastic block 204 abutting against the abutting groove 207 and the vertical plate 202 abutting against the connecting plate 201. The spring 203 is used to facilitate the elastic block 204 to temporarily move into the vertical plate 202 when entering the connecting plate 201.
[0038] It should be noted that the openings on the top and bottom sides of the connection plate 201 can prevent the connection plate 201 itself from affecting the heat dissipation efficiency of the VC heat spreader 300 , and the limit block 206 can limit the elastic block 204 by sliding in the limit groove.
[0039] The electrical components appearing in the text are all electrically connected to the controller and the power supply. The control method of the present invention is controlled by the controller. The control circuit of the controller can be implemented by simple programming by technicians in this field. The provision of power supply is also common knowledge in this field. The present invention is mainly used to protect mechanical devices, so the present invention will no longer explain the control method and circuit connection in detail.
[0040] When in use, the base 1 introduces the heat generated by the heat source into the VC heat spreader 300, and the cooling liquid in the capillary structure 302 is heated and evaporated, and the cooling liquid becomes hot steam and moves out from the top side of the bottom end of the capillary structure 302. After reaching the top side of the capillary structure 302, the hot steam is cooled and turned into cooling liquid. Part of the cooling liquid flows back to the bottom end of the capillary structure 302 along the left and right sides of the capillary structure 302, and at the same time, part of the cooling liquid flows into the capillary plate 303 along the second capillary tube 305, and the remaining cooling liquid flows back to the bottom side of the capillary structure 302 along the first capillary tube 304. After being heated, the cooling liquid in the capillary plate 303 becomes hot steam and rises to the top side of the capillary structure 302. This cycle is used to achieve heat dissipation. The VC heat spreader 300 transfers the heat to the heat conducting plate 4, and the fan 7 further removes the heat from the heat conducting plate 4. When the VC heat spreader 300 needs to be replaced, the heat conducting plate 4 and the connecting plate 201 located above are removed from the VC heat spreader 300, and the elastic block 204 moves backward under the pressure of the connecting plate 201. The elastic block 204 squeezes the spring 203 to deform it, and the elastic block 204 enters the vertical plate 202. The elastic block 204 and the VC heat spreader 300 are pulled out of the connecting plate 201, and then the VC heat spreader 300 that needs to be replaced is taken out for replacement, and then the connecting plate 201 located above is installed on the corresponding VC heat spreader 300.
[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An efficient heat dissipation module using VC to replace traditional fins, comprising a base (1) and a heat conducting plate (4), characterized in that: A mounting mechanism (200) is provided on the top side of the base (1) and the bottom side of the heat conducting plate (4), a plurality of VC heat spreaders (300) are provided on the mounting mechanism (200), a fixing assembly (500) is provided on the top side of the heat conducting plate (4), four pairs of mounting plates (6) are abutted against the top side of the heat conducting plate (4), a fan (7) is fixed on the opposite side of each pair of mounting plates (6), a heat source groove (8) is provided inside the top side of the base (1), and four through holes (9) are provided around the inside of the base (1); The VC heat spreader (300) comprises an outer shell (301), a capillary structure (302) is fixed on the inner wall of the outer shell (301), a capillary plate (303) is fixed between the left and right sides of the capillary structure (302), two first capillaries (304) are fixed between the bottom side of the inner wall of the capillary structure (302) and the bottom side of the capillary plate (303), two second capillaries (305) are fixed between the top side of the inner wall of the capillary structure (302) and the top side of the capillary plate (303), two support columns (306) are fixed on both the top and bottom sides of the inner wall of the capillary structure (302), two air holes (307) are provided inside the capillary plate (303), and the interior of the capillary structure (302) forms a vacuum cavity (308).
2. According to claim 1, a high-efficiency heat dissipation module using VC to replace traditional fins is characterized by: The mounting mechanism (200) comprises a plurality of connecting plates (201) fixed to the top side of the base (1) and the bottom side of the heat conducting plate (4), two vertical plates (202) fixed to the front side of the VC heat spreader (300), and abutment grooves (207) provided inside the front side walls of the connecting plates (201); a spring (203) is fixed inside the vertical plates (202); an elastic block (204) is fixed to the front side of the spring (203); the elastic block (204) can be abutted in the abutment groove (207); two connecting rods (205) are fixed to the rear side of the elastic block (204); two limit blocks (206) are fixed to the rear side of the connecting rods (205); and the VC heat spreader (300) is plugged into two corresponding upper and lower connecting plates (201).
3. According to claim 1, a high-efficiency heat dissipation module using VC to replace traditional fins is characterized by: The fixing assembly (500) is fixed to four first fixing plates (501) on the top side of the heat conducting plate (4) and four second fixing plates (502) fixed to the top side of the heat conducting plate (4) and located on the corresponding side of the first fixing plates (501); the first fixing plates (501) are internally threadedly connected to a screw rod (503); an abutment plate (504) is fixed to the outer surface of the screw rod (503); and a handle (505) is fixed to the side of the screw rod (503) away from the first fixing plate (501).
4. According to claim 1, a high-efficiency heat dissipation module using VC to replace traditional fins is characterized by: The upper ends of the first capillary tube (304) and the second capillary tube (305) are inclined toward a corresponding side of the left and right sides of the capillary structure (302), and the lower ends of the first capillary tube (304) and the second capillary tube (305) are inclined toward the middle of the capillary structure (302).
5. According to claim 1, a high-efficiency heat dissipation module using VC to replace traditional fins is characterized by: The top end of the upper support column (306) is fixed to the bottom side of the capillary plate (303), and the bottom side of the lower support column (306) is fixed to the top side of the capillary plate (303).
6. The high-efficiency heat dissipation module according to claim 2, wherein VC replaces traditional fins, characterized in that: The top side and the bottom side of the connecting plate (201) are both open, the top side of the VC heat spreader (300) can abut against the top side of the heat conducting plate (4), and the bottom side of the VC heat spreader (300) can abut against the top side of the base (1).
7. The high-efficiency heat dissipation module according to claim 2, wherein VC replaces traditional fins, characterized in that: Limiting grooves are provided on both upper and lower sides of the inner wall of the vertical plate (202), and the two limiting blocks (206) slide in the corresponding limiting grooves.
8. The high-efficiency heat dissipation module according to claim 3, wherein VC replaces traditional fins, characterized in that: A connecting hole is provided inside the mounting plate (6), and the screw rod (503) passes through the connecting hole.
9. The high-efficiency heat dissipation module according to claim 3, wherein VC replaces traditional fins, characterized in that: The width of the VC heat spreader (300) at the front and rear sides is smaller than the width of the VC heat spreader (300) at the middle, and the side of the abutment plate (504) close to the second fixed plate (502) abuts against the side corresponding to the second fixed plate (502).
