OLED display panel and manufacturing method thereof

Abstract

The invention discloses an OLED display panel and a manufacturing method thereof, and the manufacturing method of the OLED display panel comprises the steps: providing a substrate; manufacturing a first anode, a second anode and a third anode on the substrate; manufacturing a first OLED layer on the surfaces of the first anode, the second anode and the third anode; etching and removing the first OLED layer on the surfaces of the second anode and the third anode to form a first sub-pixel; manufacturing a second OLED layer on the surfaces of the first OLED layer, the second anode and the third anode; etching and removing the first OLED layer and the second OLED layer on the surface of the third anode to form a first sub-pixel and a second sub-pixel; manufacturing a third OLED layer on the surfaces of the first OLED layer, the second OLED layer and the third anode; and etching to remove the third OLED layer on the surfaces of the first OLED layer and the second OLED layer to form the OLED display panel. Through the structure, the stability of the performance of the display panel is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an OLED display panel and a manufacturing method thereof. Background Art

[0002] Compared with liquid crystal display panels (LCD), organic light emitting diode (OLED) display panels have many advantages such as full solid state, active luminescence, high brightness, high contrast, ultra-thin, low power consumption, no viewing angle limitation, and wide operating temperature range, and are receiving more and more attention.

[0003] Under the new process route of the mask-free overhang structure, the overhang structure needs to be set on the PDL to form an evaporation film layer between each segment of pixels and to form an independent package. In the conventional process route of the overhang structure OLED, the anode of some sub-pixels will undergo one or two etchings. During the etching process, whether acidic or alkaline liquid is used, the properties of the anode surface will be damaged and modified, thereby causing the performance of the OLED device to deteriorate. Summary of the invention

[0004] The main technical problem solved by the present application is to provide an OLED display panel and a method for manufacturing the same, which solves the problem of anode damage caused by etching in the existing OLED manufacturing process, which in turn causes the performance of the display panel to deteriorate.

[0005] To solve the above problems, the first aspect of the present application provides a method for manufacturing an OLED display panel, the manufacturing method comprising: providing a substrate; manufacturing a first anode, a second anode and a third anode on the substrate; wherein the corrosion resistance of the second anode and the third anode is better than that of the first anode; manufacturing a first OLED layer on the surface of the first anode, the second anode and the third anode; etching and removing the first OLED layer on the surface of the second anode and the third anode to form a first sub-pixel; manufacturing a second OLED layer on the surface of the first OLED layer, the second anode and the third anode; etching and removing the second OLED layer on the surface of the first OLED layer and the third anode to form a first sub-pixel and a second sub-pixel; manufacturing a third OLED layer on the surface of the first OLED layer, the second OLED and the third anode; etching and removing the third OLED layer on the surface of the first OLED layer and the second OLED layer to form an OLED display panel including the first sub-pixel, the second sub-pixel and the third sub-pixel.

[0006] In a specific embodiment, the first anode comprises an ITO material, and the second anode and the third anode comprise a corrosion-resistant material; wherein the corrosion-resistant material comprises a metal oxide.

[0007] In a specific embodiment, the second anode and the third anode are multi-layer structures, and the second anode and the third anode include an ITO material and a protective layer disposed on the surface of the ITO material, wherein the protective layer includes molybdenum oxide or tungsten oxide.

[0008] In a specific embodiment, the second anode and the third anode are molybdenum oxide or tungsten oxide.

[0009] In a specific embodiment, the step of forming the first anode, the second anode and the third anode on the substrate includes: forming multiple ITO layers on the surface of the substrate to obtain the first anode; forming the protective layer on the surface of two of the first anodes in each pixel unit to obtain the second anode and the third anode; wherein the protective layer includes molybdenum oxide or tungsten oxide.

[0010] In a specific embodiment, the thickness of the protective layer is between 10 and 200 angstroms.

[0011] In a specific embodiment, the thickness of the protective layer of the third anode is greater than the thickness of the protective layer of the second anode.

[0012] In a specific embodiment, after the step of manufacturing the first anode, the second anode and the third anode on the substrate, the step further includes: manufacturing a pixel definition layer on the surface of the substrate and exposing the surfaces of the first anode, the second anode and the third anode; manufacturing an overhang structure on the surface of the pixel definition layer to facilitate the evaporation of the OLED layer; wherein the overhang structure includes a metal layer arranged on the surface of the pixel definition layer and an eaves layer arranged on the metal layer away from the surface of the pixel definition layer, and the area of ​​the eaves layer in the stacking direction is larger than the area of ​​the metal layer.

[0013] In a specific embodiment, the first sub-pixel is a green sub-pixel or a blue sub-pixel, and the third sub-pixel is a red sub-pixel.

[0014] To solve the above problems, the second aspect of the present application provides an OLED display panel, which includes: a substrate; a first anode, a second anode and a third anode spaced apart on the surface of the substrate; wherein the second anode and the third anode have better corrosion resistance than the first anode; a pixel definition layer, which is disposed at the interval position between the first anode, the second anode and the third anode, and partially extends to the surfaces of the first anode, the second anode and the third anode; a first OLED layer, a second OLED layer and a third OLED layer, wherein the first OLED layer is disposed on the surface of the first anode, the second OLED layer is disposed on the surface of the second anode, and the third OLED layer is disposed on the surface of the third anode.

[0015] The beneficial effects of the present application are as follows: providing a substrate; manufacturing a first anode, a second anode and a third anode on the substrate; wherein the first anode is different from the second anode and the third anode; manufacturing a first OLED layer on the surface of the first anode, the second anode and the third anode; etching and removing the first OLED layer on the surface of the second anode and the third anode to form a first sub-pixel; manufacturing a second OLED layer on the surface of the first OLED layer, the second anode and the third anode; etching and removing the second OLED layer on the surface of the first OLED layer and the third anode to form a first sub-pixel and a second sub-pixel; manufacturing a third OLED layer on the surface of the first OLED layer, the second OLED and the third anode; etching and removing the third OLED layer on the surface of the first OLED layer and the second OLED layer to form an OLED display panel including the first sub-pixel, the second sub-pixel and the third sub-pixel. By differentially manufacturing the first anode, the second anode and the third anode in each pixel unit, the surface of the second anode and the third anode is made corrosion-resistant, ensuring the normal function of the second anode and the third anode, thereby ensuring the optical performance of each sub-pixel, and also ensuring the stability of the display panel performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a flow chart of an embodiment of a method for manufacturing an OLED display panel of the present application;

[0018] Figure 2 for Figure 1 A structural diagram of a specific embodiment of step S12;

[0019] Figure 3 for Figure 1 A structural diagram of a specific embodiment of step S13;

[0020] Figure 4 for Figure 1 A structural diagram of a specific embodiment of step S14;

[0021] Figure 5 for Figure 1 A structural diagram of a specific embodiment of step S15;

[0022] Figure 6 for Figure 1 A structural diagram of a specific embodiment of step S16;

[0023] Figure 7 for Figure 1 A structural diagram of a specific embodiment of step S17;

[0024] Figure 8 for Figure 1 A structural diagram of a specific embodiment of step S18;

[0025] Fig. 9 It is a structural schematic diagram of a specific embodiment of the OLED display panel of the present application.

[0026] 10 substrate; 111 first anode; 112 second anode; 113 third anode; 121 first OLED layer; 122 second OLED layer; 123 third OLED layer; 131 first sub-pixel; 132 second sub-pixel; 133 third sub-pixel; 20 partition structure; PDL pixel definition layer; 30 encapsulation layer. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said", and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless otherwise clearly indicated above, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0029] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the objects associated with each other are in an "or" relationship. The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0030] It should be understood that the terms "include", "comprises" or any other variations used herein are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "includes..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0031] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The presence of the phrase at each location in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] This application provides a method for manufacturing an OLED display panel. Figure 1 , Figure 1 This is a schematic diagram of a process of an embodiment of a method for manufacturing an OLED display panel of the present application.

[0034] like Figure 1 As shown, the production method includes:

[0035] Step S11: providing a substrate.

[0036] The substrate includes a substrate layer, a driving layer, and a flat layer arranged on the driving layer away from the substrate layer, which is not limited here.

[0037] Step S12: manufacturing a first anode, a second anode and a third anode on a substrate.

[0038] The first anode, the second anode and the third anode are arranged at intervals. The first anode is an anode forming a first sub-pixel, the second anode is an anode forming a second sub-pixel, and the third anode is an anode forming a third sub-pixel. Each pixel unit includes the first sub-pixel, the second sub-pixel and the third sub-pixel.

[0039] The first anode is made of a different material from the second anode and the third anode. The corrosion resistance of the second anode and the third anode is better than that of the first anode. That is, the second anode and the third anode are more corrosion resistant. The materials of the second anode and the third anode can be the same or different. Specifically, the second anode and the third anode include a corrosion resistant material, and the corrosion resistant material is preferably a conductive metal oxide. In this embodiment, the corrosion resistant material is preferably molybdenum oxide or tungsten oxide.

[0040] In a specific embodiment, the surface of the first anode is ITO, and the surfaces of the second anode and the third anode are molybdenum oxide or tungsten oxide. This step S12 specifically includes: making the first anode, the second anode and the third anode on the substrate respectively. In this embodiment, the first anode is an ITO electrode layer, and the second anode and the third anode are electrodes formed of corrosion-resistant materials, wherein the corrosion-resistant materials include molybdenum oxide (MoOx) or tungsten oxide (WOx) and the like. Among them, ITO has a high work function required for high transparency, high conductivity, and low hole transport barrier in the visible light region, and is widely used in display electrodes of display panels. Among them, the first anode specifically includes AL / ITO, Ag / ITO, etc., and the second anode and the third anode specifically include AL / WOx, Ag / WOx, Ag / MoOx, etc.

[0041] In another specific embodiment, the surface of the first anode is ITO, and the second anode includes ITO and a protective layer arranged on the surface of ITO, and the protective layer includes molybdenum oxide or tungsten oxide. This step S12 specifically includes: making a patterned ITO layer on the substrate to obtain multiple first anodes; making a protective layer on the surface of two of the ITO layers (or first anodes) in each pixel unit (each three sub-pixels form a pixel unit) to obtain a second anode and a third anode. In this embodiment, the first anode includes an ITO layer, and the second anode and the third anode include an ITO layer and a protective layer arranged on the surface of the ITO layer; wherein the protective layer is formed by corrosion-resistant materials such as molybdenum oxide or tungsten oxide. Specifically, the second anode and the third anode can be ITO / Ag / WOx, ITO / Ag / MoOx, etc. In this embodiment, this step specifically includes: forming an entire surface of an ITO layer on the substrate, patterning and etching the ITO layer into multiple spaced first anodes, and making protective layers on the surfaces of two of the first anodes in each pixel unit to form a second anode and a third anode. In this embodiment, the protective layers in the second anode and the third anode can be different or the same. Preferably, the thickness of the protective layer in the third anode is greater than the thickness of the protective layer in the second anode, because the third anode needs to be etched twice, while the second anode only needs to be etched once.

[0042] It should be noted that, because adding a protective layer is equivalent to adding a microcavity variable film layer between the anode / cathode, this is not good for the microcavity stability of the film layer. Therefore, in this embodiment, the anode of the first sub-pixel is not protected by a protective layer, and only the second / third sub-pixels are protected by a protective layer.

[0043] Since the thickness of the protective layer will affect the length of the microcavity of the OLED device, the thickness of the protective layer is preferably between 10 Å and 200 Å. Furthermore, according to the process capability, the thickness of the protective layer is preferably between 75 Å and 150 Å.

[0044] Compared with the second embodiment, the first embodiment can solve the problem of thickening of the microcavity caused by adding a protective layer on the surface of the ITO anode, but the manufacturing process is more complicated and more difficult than the second embodiment.

[0045] After step S12, the method further includes: forming a pixel definition layer on the surface of the substrate, exposing the surfaces of the first anode, the second anode and the third anode; and forming an overhang structure on the surface of the pixel definition layer to facilitate the evaporation of the OLED layer. The overhang structure includes a support portion and an eave portion having an area larger than the support portion.

[0046] The OLED layer includes an organic light emitting layer, a cathode layer, an encapsulation layer, etc. The organic light emitting layer includes a blue organic light emitting layer, a green organic light emitting layer, and a red organic light emitting layer, etc.

[0047] For details on this step, see Figure 2 , Figure 2 for Figure 1 FIG. 1 is a schematic diagram of the structure of the first specific embodiment of step S12. Figure 2 As shown, the OLED display panel includes a substrate 10, and a pixel unit on the substrate 10 includes a first anode 111, a second anode 112, and a third anode 113. Figure 2 As shown in a, the first anode 111 is an ITO anode, and the second anode 112 and the third anode 113 are anodes made of corrosion-resistant materials.

[0048] like Figure 2As shown in b, the first anode 111 is an ITO anode, and the second anode 112 and the third anode 113 are anodes formed by ITO + protective layer. The protective layer is an oxidized metal with corrosion resistance. Among them, a pixel definition layer PDL is arranged between the first anode 111, the second anode 112 and the third anode 113, and a partition structure 20 is arranged on the surface of the pixel definition layer. Among them, the partition structure 20 includes a metal layer arranged on the surface of the pixel definition layer PDL, and an eaves layer arranged on the metal layer away from the surface of the pixel definition layer PDL, wherein the area of ​​the eaves layer in the stacking direction is larger than the area of ​​the metal layer to form a partition structure 20. In other embodiments, the partition structure 20 can also be other inverted trapezoidal structures, etc., which are not limited here.

[0049] Step S13: forming a first OLED layer on the surfaces of the first anode, the second anode and the third anode.

[0050] Specifically, the method comprises evaporating a first OLED layer on the entire surface of the substrate, wherein the first OLED layer comprises a first organic light-emitting layer and a cathode layer, and the first organic light-emitting layer is one of a blue organic light-emitting layer, a green organic light-emitting layer or a red organic light-emitting layer.

[0051] This step specifically includes: sequentially evaporating a first organic light-emitting layer and a first cathode layer on the surface of the entire substrate to form a first OLED layer on the surfaces of the first anode, the second anode and the third anode. The first anode and the first OLED layer form a first sub-pixel.

[0052] This step also includes: forming an encapsulation layer on the surface of the first OLED layer on the surface of the first anode, so that the first OLED layer is not etched in step S14.

[0053] Please refer to Figure 3 , Figure 3 for Figure 1 FIG. 1 is a schematic diagram of a specific embodiment of step S13 in FIG. Figure 3 As shown, the first OLED layer 121 is disposed on the surfaces of the first anode 111 , the second anode 112 and the third anode 113 .

[0054] Step S14: etching and removing the first OLED layer on the surfaces of the second anode and the third anode to form a first sub-pixel.

[0055] In this step, the first OLED layer covering the surface of the second anode and the third anode is removed by an etching solution using an etching process; wherein the etching solution includes an acidic solution or an alkaline solution, which is not limited here. In this embodiment, since the second anode and the third anode include a corrosion-resistant protective layer, the corrosion resistance of the second anode and the third anode can be improved to prevent the second anode and the third anode from being etched away.

[0056] This step also includes removing part of the first OLED layer on the surface of the overhang structure to prevent the OLED layer on the surface of the overhang structure from being too thick and causing adverse effects. Specifically, the first OLED layer on the surface of the overhang structure close to the second anode and the third anode is removed.

[0057] Furthermore, before this step, the method further includes: performing anti-etching protection on the first OLED layer on the surface of the first anode, and then etching the first OLED layer on the surfaces of the second anode and the third anode. An encapsulation layer is formed on the surface of the first OLED layer, so that the cathode on the surface of the first OLED layer is not etched. The cathode is made of ITO material. The encapsulation layer is preferably made of an encapsulation material, so that it is convenient to integrate with the encapsulation layer when the encapsulation layer is subsequently formed on the surface of the OLED layer or the cathode layer.

[0058] Please refer to Figure 4 , Figure 4 for Figure 1 FIG. 1 is a schematic diagram of a specific embodiment of step S14. Figure 4 As shown, the first OLED layer on the surface of the second anode 112 and the third anode 113 is removed by etching to expose the second anode 112 and the third anode 113. Further, the first OLED layer on the side of the overhang structure 20 close to the second anode 112 and the third anode 113 is removed.

[0059] Step S15: forming a second OLED layer on the surface of the first OLED layer, the second anode and the third anode.

[0060] The organic light-emitting layer of the second OLED layer is different from the organic light-emitting layer of the first OLED layer, so that the second sub-pixel formed with the second anode emits light of a different color from the first sub-pixel. Specifically, the second OLED layer includes a second organic light-emitting layer and a cathode layer. The second organic light-emitting layer is one of a blue organic light-emitting layer, a green organic light-emitting layer or a red organic light-emitting layer, and is not the same as the first organic light-emitting layer.

[0061] This step specifically includes: sequentially evaporating the second OLED layer on the entire surface of the substrate, so that the second OLED layer is evaporated on the surface of the first OLED layer, the second anode and the third anode.

[0062] Please refer to Figure 5 , Figure 5 for Figure 1 FIG. 1 is a schematic diagram of a specific embodiment of step S15 in FIG. Figure 5 As shown, the second OLED layer 122 covers the surfaces of the first OLED layer 121 and the second anode 112 and the third anode 113 .

[0063] Step S16: etching and removing the first OLED layer and the second OLED layer on the surface of the third anode to form a first sub-pixel and a second sub-pixel.

[0064] This step also includes: firstly making an etching-resistant protective layer on the second OLED layer on the surface of the second anode, then etching the second OLED layer on the surface of the first OLED layer, and etching the second OLED layer on the surface of the third anode. The protective layer on the surface of the second OLED layer may be an encapsulation layer, which is not limited here.

[0065] The etching process also includes etching the second OLED layer on the overhang structure, specifically, etching the second OLED layer on the side of the overhang structure close to the first anode and etching the second OLED layer on the overhang structure close to the third anode.

[0066] Please refer to the etched graphics for further information. Figure 6 , Figure 6 for Figure 1 FIG. 1 is a schematic diagram of a specific embodiment of step S16 in FIG. Figure 6 As shown, a first OLED layer is disposed on the first anode 111 of the OLED display panel to form a first sub-pixel; a second OLED layer is disposed on the second anode 112 to form a second sub-pixel; and the surface of the third anode 113 is exposed to facilitate subsequent production of the third OLED layer.

[0067] Step S17: forming a third OLED layer on the first OLED layer, the second OLED layer and the third anode surface.

[0068] This step specifically includes: evaporating the third OLED layer on the entire surface of the substrate, so that the third OLED layer covers the surface of the first OLED layer, the surface of the second OLED layer and the surface of the third anode.

[0069] The organic light-emitting layer of the third OLED layer is different from the organic light-emitting layers of the second OLED layer and the first OLED layer. Specifically, the third OLED layer includes a third organic light-emitting layer and a cathode layer. The third organic light-emitting layer is one of a blue organic light-emitting layer, a green organic light-emitting layer or a red organic light-emitting layer, and is different from the first organic light-emitting layer and the second organic light-emitting layer.

[0070] Please refer to Figure 7 , Figure 7 for Figure 1 FIG. 1 is a schematic diagram of a specific embodiment of step S17 in FIG. Figure 7 As shown, the third OLED layer 123 covers the first OLED layer 121 , the second OLED layer 122 and the third anode 113 . The third OLED layer 123 also covers the surface of the overhang structure 20 .

[0071] Step S18: etching and removing the third OLED layer on the surface of the first OLED layer and the second OLED layer to form an OLED display panel including the first sub-pixel, the second sub-pixel and the third sub-pixel.

[0072] This step specifically includes: firstly performing anti-etching protection on the third OLED layer on the surface of the third anode, and then etching the third OLED layer on the surface of the first OLED layer and the second OLED layer. Specifically includes: making an encapsulation layer on the surface of the third OLED layer on the third anode, wherein the encapsulation layer is preferably made of an encapsulation material, so as to facilitate integration with the encapsulation layer when the encapsulation layer is subsequently made on the surface of the OLED layer or the cathode layer.

[0073] Please refer to Figure 8 , Figure 8 for Figure 1 FIG. 1 is a schematic diagram of a specific embodiment of step S18 in FIG. Figure 8 As shown, the OLED display panel includes a substrate 10, and a first anode 111, a second anode 112, and a third anode 113 disposed on the surface of the substrate 10. The surface of the first anode 111 is covered with a first OLED layer 121 to form a first sub-pixel 131. The surface of the second anode 112 is covered with a second OLED layer 122 to form a second sub-pixel 132. The surface of the third anode 113 is covered with a third OLED layer 123 to form a third sub-pixel 133.

[0074] The first sub-pixel 131 , the second sub-pixel 132 , and the third sub-pixel 133 have different colors.

[0075] In a specific embodiment, according to the effect of process fluctuations on the R / G / B microcavities (color points), the first sub-pixel 131 and the second sub-pixel 132 are green sub-pixels G or blue sub-pixels B, and the third sub-pixel 133 is a red sub-pixel R.

[0076] Considering that the second anode 112 and the third anode 113 are made of a protective layer on the surface of the ITO layer, the thickness of the second anode 112 and the third anode 113 is increased. The thickness of the second anode 112 and the third anode 113 is thicker than the thickness of the first anode 111. Furthermore, the thickness of the organic light-emitting layer of the first OLED layer is thicker than the thickness of the organic light-emitting layer of the second OLED layer and the third OLED layer, so that the cathode layer of each sub-pixel can be located at the same horizontal plane. Further preferably, the first sub-pixel 131 is a blue sub-pixel, the second sub-pixel 132 is a green sub-pixel, and the third sub-pixel 133 is a red sub-pixel. This is because the luminous efficiency of the blue sub-pixel is low, and thickening the organic light-emitting layer of the blue sub-pixel can improve the luminous efficiency.

[0077] Furthermore, considering that the thickness of the second anode 112 and the third anode 113 may be higher than that of the first anode 111, in a further embodiment, a groove may be made on the surface of the flat layer of the substrate corresponding to the second anode 112 and the third anode 113, so that the surface of the second anode 112 and the third anode 113 is located at the same level as the surface of the first anode 111, thereby eliminating the height difference between the second anode 112 and the third anode 113 and the first anode 111. The depth of the groove may be set according to the thickness difference between the second anode 112 and the third anode 113 and the first anode 111. Specifically, the depth of the groove corresponding to the second anode 112 and the groove corresponding to the third anode 113 may also be different, which may be specifically designed according to the thickness of the protective layer set on the surface thereof, and is not limited here.

[0078] After step S18, the method further includes: making an encapsulation layer on the surface of the substrate to form an OLED panel. The encapsulation layer covers the surfaces of the first OLED layer, the second OLED layer, the third OLED layer and the surface of the partition layer, and the encapsulation layer may include a first encapsulation layer, an organic encapsulation layer and a second encapsulation layer, etc., which are not limited here.

[0079] The present application also provides an OLED display panel, wherein the OLED display panel is manufactured using the manufacturing method of the OLED display panel described in the above method embodiment. Fig. 9 , Fig. 9 This is a schematic diagram of the structure of a specific embodiment of the OLED display panel of the present application. Fig. 9 As shown, the OLED display panel includes a substrate 10 .

[0080] The surface of the substrate 10 is provided with a first anode 111, a second anode 112 and a third anode 113. A pixel definition layer PDL and a partition structure 20 provided on the pixel definition layer PDL are provided between every two of the first anodes 111, the second anodes 112 and the third anodes 113.

[0081] A first OLED layer 121 is disposed on the surface of the first anode 111 to form a first sub-pixel 131 ; a second OLED layer 122 is disposed on the second anode 112 to form a second sub-pixel 132 ; a third OLED layer 123 is disposed on the third anode 113 to form a third sub-pixel 133 .

[0082] The first sub-pixel 131, the second sub-pixel 132, the third sub-pixel 133 and the partition structure 20 are further provided with an encapsulation layer 30. The encapsulation layer 30 may include multiple layers, which is not limited here.

[0083] The beneficial effect of this embodiment is that the anodes of the three sub-pixels in each pixel unit are manufactured in a differentiated manner, so that the anodes of two of the sub-pixels are corrosion-resistant, thereby ensuring the optical performance of each sub-pixel and also ensuring the stability of the performance of the OLED device.

[0084] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for manufacturing an OLED display panel, characterized in that: The production method comprises: providing a substrate; Manufacturing a first anode, a second anode and a third anode on the substrate; wherein the second anode and the third anode have better corrosion resistance than the first anode; Fabricate a first OLED layer on the surfaces of the first anode, the second anode and the third anode; Etching and removing the first OLED layer on the surface of the second anode and the third anode to form a first sub-pixel; Fabricate a second OLED layer on the surfaces of the first OLED layer, the second anode and the third anode; Etching and removing the first OLED layer and the second OLED layer on the surface of the third anode to form a first sub-pixel and a second sub-pixel; Fabricate a third OLED layer on the surface of the first OLED layer, the second OLED and the third anode; The third OLED layer on the surface of the first OLED layer and the second OLED layer is etched away to form an OLED display panel including a first sub-pixel, a second sub-pixel and a third sub-pixel.

2. The method for manufacturing an OLED display panel according to claim 1, characterized in that: The first anode comprises an ITO material, and the second anode and the third anode comprise a corrosion-resistant material; wherein the corrosion-resistant material comprises a metal oxide.

3. The method for manufacturing an OLED display panel according to claim 2, characterized in that: The second anode and the third anode are multi-layer structures, and the second anode and the third anode include an ITO material and a protective layer disposed on the surface of the ITO material, wherein the protective layer includes molybdenum oxide or tungsten oxide.

4. The method for manufacturing an OLED display panel according to claim 2, wherein: The second anode and the third anode are molybdenum oxide or tungsten oxide.

5. The method for manufacturing an OLED display panel according to claim 1, characterized in that: The step of manufacturing the first anode, the second anode and the third anode on the substrate comprises: Forming a plurality of ITO layers on the surface of the substrate to obtain a first anode; The protective layer is formed on the surface of two first anodes of each pixel unit to obtain the second anode and the third anode; wherein the protective layer comprises molybdenum oxide or tungsten oxide.

6. The method for manufacturing an OLED display panel according to claim 5, characterized in that: The thickness of the protective layer is between 10 and 200 angstroms.

7. The method for manufacturing an OLED display panel according to claim 5, characterized in that: The thickness of the protective layer of the third anode is greater than the thickness of the protective layer of the second anode.

8. The method for manufacturing an OLED display panel according to claim 1, characterized in that: After the step of manufacturing the first anode, the second anode and the third anode on the substrate, the method further includes: A pixel definition layer is formed on the surface of the substrate, and surfaces of the first anode, the second anode and the third anode are exposed; An overhang structure is made on the surface of the pixel definition layer to facilitate the evaporation of the OLED layer; wherein the overhang structure includes a metal layer arranged on the surface of the pixel definition layer and an eaves layer arranged on the metal layer away from the surface of the pixel definition layer, and the area of ​​the eaves layer in the stacking direction is larger than the area of ​​the metal layer.

9. The method for manufacturing an OLED display panel according to claim 1, characterized in that: The first sub-pixel is a green sub-pixel or a blue sub-pixel, and the third sub-pixel is a red sub-pixel.

10. An OLED display panel, characterized in that: The OLED display panel comprises: substrate; A first anode, a second anode and a third anode are arranged at intervals on the surface of the substrate; wherein the corrosion resistance of the second anode and the third anode is better than that of the first anode; A pixel definition layer is disposed at an interval between the first anode, the second anode and the third anode, and partially extends to the surfaces of the first anode, the second anode and the third anode; A first OLED layer, a second OLED layer and a third OLED layer, wherein the first OLED layer is disposed on a surface of the first anode, the second OLED layer is disposed on a surface of the second anode, and the third OLED layer is disposed on a surface of the third anode.

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