Double-interface module bonding pad ACF conductive adhesive attaching device and technology

Abstract

The invention discloses a double-interface module bonding pad ACF conductive adhesive attaching device and process, and relates to the technical field of conductive adhesive attaching, the device comprises a base, the upper end of the base is provided with a second limiting frame, the upper end of one side wall of the base is vertically provided with a vertical plate, the side wall, away from the base, of the vertical plate is provided with a motor, and the motor is connected with the second limiting frame. A rotating rod is installed at the output end of the motor, a rotating column is installed at the end, away from the motor, of the rotating rod in a manner of penetrating through the vertical plate, a placing groove is formed in the side wall of the rotating column, and through mutual repulsion of a first magnet and a third magnet and mutual attraction of a second magnet and the third magnet, when the rotating column does not convey the conductive adhesive to the lower end, the conductive adhesive is placed in the placing groove; the conductive adhesive is firmly fixed in the placing groove, when the rotating column conveys the conductive adhesive to the lower end, the conductive adhesive is released, so that the conductive adhesive is fixed on the double-interface module strip, and along with rotation of the rotating column, the placing groove can push the conductive adhesive to drive the double-interface module strip to move forwards.

Description

Technical Field

[0001] The invention relates to the technical field of conductive adhesive attachment, in particular to a dual-interface module pad ACF conductive adhesive attachment device and process. Background Art

[0002] With the popularity of dual-interface cards in various smart card applications, such as bank cards, transportation cards, etc., the production efficiency and cost requirements for dual-interface cards are also increasing. ACF conductive adhesive, as a commonly used connection material, plays an important role in the packaging of dual-interface cards.

[0003] The traditional ACF conductive adhesive attaching device and process have the problems of low efficiency and high cost. Therefore, it is particularly important to develop a new, more efficient and economical ACF conductive adhesive attaching device and process.

[0004] In view of the above problems, an improved dual-interface module pad ACF conductive adhesive attaching device and process are now designed. Summary of the invention

[0005] The object of the present invention is to provide a dual-interface module pad ACF conductive adhesive attaching device and process to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A dual-interface module pad ACF conductive adhesive attaching device comprises a base, a second limiting frame for limiting the dual-interface module strip is installed on the upper end of the base, a vertical plate is vertically installed on the upper end of one of the side walls of the base, a motor is installed on the side wall of the vertical plate away from the base, a rotating rod is installed on the output end of the motor, and a rotating column is installed on the end of the rotating rod away from the motor through the vertical plate, a placement groove corresponding to the conductive adhesive attachment position on the dual-interface module strip is opened on the side wall of the rotating column, a heating mechanism for melting the conductive adhesive attachment surface is arranged on the side wall of the vertical plate in the rotation direction of the rotating column, a fixing mechanism for fixing the conductive adhesive inside the placement groove is arranged on the rotating column and the vertical plate, and a conveying mechanism for conveying the conductive adhesive to the placement groove is arranged on the upper end of the vertical plate.

[0008] As a further solution of the present invention: the heating mechanism includes a mounting plate, the mounting plate is mounted on the side wall of the vertical plate in the rotation direction of the rotating column, and an electric heater for melting the conductive adhesive attachment surface is installed on the side wall of the mounting plate close to the rotating column.

[0009] As a further scheme of the present invention: the fixing mechanism includes a first magnet and a second magnet, the first magnet and the second magnet form a circle, and the center of the circle coincides with the axis of the rotating rod, the first magnet and the second magnet are both installed on the side wall of the vertical plate close to the rotating column, the two ends of the first magnet are respectively arranged directly above and directly below the rotating rod, the interior of the rotating column is provided with a chamber corresponding to each row of placement grooves, and the rotating column between the chamber and the placement grooves is provided with a connecting through hole, the placement grooves, the connecting through hole and the chamber are connected to each other, the end of the chamber close to the vertical plate is connected to the outside, a piston block is slidably connected to the inner wall of the chamber, and a third magnet is installed through the chamber at one end of the piston block close to the vertical plate, and a first limit frame for limiting the third magnet is installed on the side wall of the rotating column, the third magnet is slidably connected to the inner wall of the first limit frame, the third magnet and the first magnet repel each other, and the third magnet and the second magnet attract each other.

[0010] As a further solution of the present invention: the conveying mechanism includes a top plate, which is installed on the upper end of the vertical plate, and a groove is provided on the top plate above the rotating column. The interior of the groove is provided with a storage frame corresponding to each row of placement slots through a detachable component, and a spring is installed on the top of the storage frame, and a push plate for pushing the conductive adhesive downward is installed at the lower end of the spring.

[0011] As a further solution of the present invention: the detachable component includes an elastic telescopic rod, a limit plate is installed at the lower end of the side wall of the storage frame, and limit grooves used in conjunction with the limit plate are provided on two opposite inner walls of the groove. The limit plate is slidably connected to the inner wall of the limit groove, and the elastic telescopic rod is installed on the limit plate. The elastic telescopic rod and the limit groove are parallel to each other, and the output end of the elastic telescopic rod always contracts inwardly. A connecting rod is installed at the output end of the elastic telescopic rod, and a blocking plate for blocking the open end of the storage frame is installed at the lower end of the connecting rod. When the limit plate is inserted into the limit groove, the blocking plate fits against the upper end of the side wall of the rotating column, and a fastening screw for fixing the limit plate inside the limit groove is provided at the upper end of the top plate.

[0012] As a further solution of the present invention: a ball is installed at one end of the first limiting frame close to the vertical plate to facilitate the first limiting frame to roll along the first magnet and the second magnet.

[0013] As a further solution of the present invention: reinforcing ribs are installed on the side walls of the vertical board to improve the structural strength of the vertical board and prevent the vertical board from deforming and bending.

[0014] As a further solution of the present invention: a rubber pad is installed at the lower end of the base to facilitate stable placement of the base.

[0015] As a further solution of the present invention: the top plate and the vertical plate are fixedly connected together by welding.

[0016] A dual-interface module pad ACF conductive adhesive attaching process, comprising the following steps:

[0017] Step 1: According to the size and shape of the LA / LB solder joint, the ACF conductive adhesive is precisely cut through a dedicated grinding and cutting device to ensure that the size and shape of the ACF adhesive perfectly matches the solder joint and improve the fitting accuracy.

[0018] Step 2: Use the ACF conductive adhesive attaching device to attach the cut ACF conductive adhesive to the LA / LB pads of the dual-interface module.

[0019] Step 3: Use hot pressing equipment to process the dual-interface module with ACF glue mounted on it, so that the ACF glue forms a strong bond with the pad. The temperature and time need to be strictly controlled during the hot pressing process to ensure that the ACF glue can fully melt and fill the solder joints to form a stable conductive connection.

[0020] Step 4: After the hot pressing process, the dual-interface module is packaged and subjected to necessary electrical and mechanical performance tests to ensure that its quality meets the requirements.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention delivers the conductive adhesives one by one to the inside of the placement grooves on the rotating column through the storage frame, thereby avoiding manual operation by staff and improving the feeding efficiency of the conductive adhesive.

[0023] The present invention uses the mutual repulsion between the first magnet and the third magnet and the mutual attraction between the second magnet and the third magnet to firmly fix the conductive adhesive inside the placement groove when the rotating column has not transported the conductive adhesive to the lower end, and release the conductive adhesive when the rotating column transports the conductive adhesive to the lower end, so that the conductive adhesive is fixed on the dual-interface module strip. At the same time, as the rotating column rotates, the placement groove can push the conductive adhesive to drive the dual-interface module strip to move forward, thereby improving the efficiency of the conductive adhesive attachment and fixation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the present invention.

[0025] Figure 2 It is a schematic diagram of the structure of the top plate and the electric heater in the present invention.

[0026] Figure 3 It is a structural schematic diagram of the fixing mechanism in the present invention.

[0027] Figure 4 It is a structural schematic diagram of the conveying mechanism in the present invention.

[0028] Among them: 1. base; 2. rotating column; 3. placement groove; 4. vertical plate; 5. first limit frame; 6. first magnet; 7. motor; 8. top plate; 9. groove; 10. storage frame; 11. limit plate; 12. limit groove; 13. elastic telescopic rod; 14. connecting rod; 15. blocking plate; 16. mounting plate; 17. electric heater; 18. second limit frame; 19. second magnet; 20. fastening screw; 21. spring; 22. push plate; 23. rotating rod; 24. third magnet; 25. piston block; 26. chamber; 27. connecting through hole. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] See also Figure 1-Figure 4 In an embodiment of the present invention, a dual-interface module pad ACF conductive adhesive attaching device includes a base 1, a second limit frame 18 for limiting the dual-interface module strip is installed on the upper end of the base 1, a vertical plate 4 is vertically installed on the upper end of one of the side walls of the base 1, a motor 7 is installed on the side wall of the vertical plate 4 away from the base 1, a rotating rod 23 is installed on the output end of the motor 7, and a rotating column 2 is installed through the vertical plate 4 at one end of the rotating rod 23 away from the motor 7, a placement groove 3 corresponding to the conductive adhesive attachment position on the dual-interface module strip is opened on the side wall of the rotating column 2, a heating mechanism for melting the conductive adhesive attachment surface is arranged on the side wall of the vertical plate 4 in the rotation direction of the rotating column 2, a fixing mechanism for fixing the conductive adhesive inside the placement groove 3 is arranged on the rotating column 2 and the vertical plate 4, and a conveying mechanism for conveying the conductive adhesive to the placement groove 3 is arranged on the upper end of the vertical plate 4.

[0031] The heating mechanism comprises a mounting plate 16 , which is mounted on the side wall of the vertical plate 4 in the rotation direction of the rotating column 2 . An electric heater 17 for melting the conductive adhesive attachment surface is mounted on the side wall of the mounting plate 16 close to the rotating column 2 .

[0032] The fixing mechanism includes a first magnet 6 and a second magnet 19, the first magnet 6 and the second magnet 19 are assembled into a circle, and the center of the circle coincides with the axis of the rotating rod 23, the first magnet 6 and the second magnet 19 are both mounted on the side wall of the vertical plate 4 close to the rotating column 2, the two ends of the first magnet 6 are respectively arranged just above and just below the rotating rod 23, the interior of the rotating column 2 is provided with a chamber 26 corresponding to each row of placement slots 3, and a connecting through hole 27 is provided on the rotating column 2 between the chamber 26 and the placement slots 3, the placement slots 3, the connecting through hole 27 are provided on the rotating column 2, and the placement slots 3 and the connecting through hole 27 are provided on the rotating column 2. The hole 27 and the chamber 26 are connected to each other, and the end of the chamber 26 close to the vertical plate 4 is connected to the outside. A piston block 25 is slidably connected to the inner wall of the chamber 26, and a third magnet 24 is installed through the chamber 26 at one end of the piston block 25 close to the vertical plate 4. A first limit frame 5 for limiting the third magnet 24 is installed on the side wall of the rotating column 2, and the third magnet 24 is slidably connected to the inner wall of the first limit frame 5. The third magnet 24 and the first magnet 6 repel each other, and the third magnet 24 and the second magnet 19 attract each other.

[0033] When in use, the conductive glue is placed inside the placement groove 3 at the upper end of the rotating column 2. As the rotating column 2 rotates, the rotating column 2 drives the first limit frame 5 to rotate, and the first limit frame 5 drives the third magnet 24 to rotate, so that the third magnet 24 is opposite to the second magnet 19. Under the action of attraction, the third magnet 24 approaches the second magnet 19, and the third magnet 24 drives the piston block 25 to move. Due to the blocking of the conductive glue, the piston block 25 draws the air inside the chamber 26 and uses pressure to adsorb the conductive glue inside the placement groove 3.

[0034] When the conductive glue rotates to the lower end of the rotating column 2, the third magnet 24 faces the first magnet 6. Under the action of the repulsive force, the third magnet 24 moves away from the vertical plate 4, and the third magnet 24 pushes the piston block 25 to move. The piston block 25 pushes the air inside the chamber 26, so that the conductive glue inside the placement groove 3 is separated from the placement groove 3, and the placement groove 3 is attached to the dual-interface module strip. At the same time, as the rotating column 2 rotates, the placement groove 3 will push the conductive glue to move, and the conductive glue drives the dual-interface module strip to move.

[0035] The conveying mechanism includes a top plate 8, which is installed on the upper end of the vertical plate 4. A groove 9 is provided on the top plate 8 above the rotating column 2. A storage frame 10 corresponding to each row of placement slots 3 is provided inside the groove 9 through a detachable component. A spring 21 is installed on the top of the storage frame 10, and a push plate 22 for pushing the conductive glue downward is installed at the lower end of the spring 21.

[0036] The detachable component includes an elastic telescopic rod 13, a limit plate 11 is installed at the lower end of the side wall of the storage frame 10, and two opposite inner walls of the groove 9 are provided with limit grooves 12 used in conjunction with the limit plate 11, and the limit plate 11 is slidably connected to the inner wall of the limit groove 12, and the elastic telescopic rod 13 is installed on the limit plate 11, and the elastic telescopic rod 13 and the limit groove 12 are parallel to each other, and the output end of the elastic telescopic rod 13 always shrinks inward, and a connecting rod 14 is installed at the output end of the elastic telescopic rod 13, and a blocking plate 15 for blocking the open end of the storage frame 10 is installed at the lower end of the connecting rod 14, and when the limit plate 11 is inserted into the limit groove 12, the blocking plate 15 is fitted with the upper end of the side wall of the rotating column 2, and the upper end of the top plate 8 is provided with a fastening screw 20 for fixing the limit plate 11 inside the limit groove 12.

[0037] Before use, the processed conductive adhesives are placed into the storage frame 10 one by one, and then the open end of the storage frame 10 is sealed by the sealing plate 15 .

[0038] When in use, the limit plate 11 is inserted into the inner wall of the limit groove 12. At this time, the blocking plate 15 is pressed against the upper end of the side wall of the rotating column 2, so that the blocking plate 15 opens the open end of the storage frame 10. The blocking plate 15 drives the connecting rod 14 to move, and the connecting rod 14 stretches the elastic telescopic rod 13. After the limit plate 11 is fully inserted into the limit groove 12, the fastening screw 20 is rotated to fix the limit plate 11 inside the limit groove 12.

[0039] A dual-interface module pad ACF conductive adhesive attaching process, comprising the following steps:

[0040] Step 1: According to the size and shape of the LA / LB solder joint, the ACF conductive adhesive is precisely cut through a dedicated grinding and cutting device to ensure that the size and shape of the ACF adhesive perfectly matches the solder joint and improve the fitting accuracy.

[0041] Step 2: Use the ACF conductive adhesive attaching device to attach the cut ACF conductive adhesive to the LA / LB pads of the dual-interface module.

[0042] Step 3: Use hot pressing equipment to process the dual-interface module with ACF glue mounted on it, so that the ACF glue forms a strong bond with the pad. The temperature and time need to be strictly controlled during the hot pressing process to ensure that the ACF glue can fully melt and fill the solder joints to form a stable conductive connection.

[0043] Step 4: After the hot pressing process, the dual-interface module is packaged and subjected to necessary electrical and mechanical performance tests to ensure that its quality meets the requirements.

[0044] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

Claims

1. A dual-interface module pad ACF conductive adhesive attaching device, comprising a base (1), a second limit frame (18) for limiting the position of a dual-interface module strip is installed at the upper end of the base (1), a vertical plate (4) is vertically installed at the upper end of one of the side walls of the base (1), a motor (7) is installed on the side wall of the vertical plate (4) away from the base (1), and a rotating rod (23) is installed at the output end of the motor (7), characterized in that: The end of the rotating rod (23) away from the motor (7) passes through the vertical plate (4) and is equipped with a rotating column (2); a placement groove (3) corresponding to the conductive glue attachment position on the dual-interface module strip is opened on the side wall of the rotating column (2); a heating mechanism for melting the conductive glue attachment surface is arranged on the side wall of the vertical plate (4) in the rotation direction of the rotating column (2); a fixing mechanism for fixing the conductive glue inside the placement groove (3) is arranged on the rotating column (2) and the vertical plate (4); and a conveying mechanism for conveying the conductive glue to the placement groove (3) is arranged on the upper end of the vertical plate (4).

2. A dual-interface module pad ACF conductive adhesive attaching device according to claim 1, characterized in that: The heating mechanism comprises a mounting plate (16), wherein the mounting plate (16) is mounted on the side wall of the vertical plate (4) in the rotation direction of the rotating column (2), and an electric heater (17) for melting the conductive adhesive attachment surface is mounted on the side wall of the mounting plate (16) close to the rotating column (2).

3. A dual-interface module pad ACF conductive adhesive attaching device according to claim 1, characterized in that: The fixing mechanism comprises a first magnet (6) and a second magnet (19), the first magnet (6) and the second magnet (19) are assembled into a circle, and the center of the circle coincides with the axis of the rotating rod (23), the first magnet (6) and the second magnet (19) are both mounted on the side wall of the vertical plate (4) close to the rotating column (2), the two ends of the first magnet (6) are respectively arranged directly above and directly below the rotating rod (23), the interior of the rotating column (2) is provided with a chamber (26) corresponding to each row of placement slots (3), the rotating column (2) between the chamber (26) and the placement slots (3) is provided with a connecting through hole (27), the placement slots (3), the connecting through hole (27) and the rotation column (2) are connected to each other. The hole (27) and the chamber (26) are connected to each other, and one end of the chamber (26) close to the vertical plate (4) is connected to the outside. A piston block (25) is slidably connected to the inner wall of the chamber (26), and one end of the piston block (25) close to the vertical plate (4) is installed with a third magnet (24) through the chamber (26). A first limiting frame (5) for limiting the third magnet (24) is installed on the side wall of the rotating column (2), and the third magnet (24) is slidably connected to the inner wall of the first limiting frame (5). The third magnet (24) and the first magnet (6) repel each other, and the third magnet (24) and the second magnet (19) attract each other.

4. A dual-interface module pad ACF conductive adhesive attaching device according to claim 1, characterized in that: The conveying mechanism comprises a top plate (8), the top plate (8) being mounted on the upper end of the vertical plate (4), a groove (9) being provided on the top plate (8) above the rotating column (2), a storage frame (10) corresponding to each row of placement slots (3) being arranged inside the groove (9) through a detachable component, a spring (21) being mounted on the top of the storage frame (10), and a push plate (22) for pushing the conductive adhesive downward being mounted on the lower end of the spring (21).

5. A dual-interface module pad ACF conductive adhesive attaching device according to claim 4, characterized in that: The detachable component comprises an elastic telescopic rod (13), a limiting plate (11) is installed at the lower end of the side wall of the storage frame (10), and limiting grooves (12) used in conjunction with the limiting plate (11) are opened on two opposite inner walls of the groove (9), the limiting plate (11) is slidably connected to the inner wall of the limiting groove (12), the elastic telescopic rod (13) is installed on the limiting plate (11), the elastic telescopic rod (13) and the limiting groove (12) are parallel to each other, and the elastic telescopic rod (13) is arranged on the limiting plate (11). The output end of the elastic telescopic rod (13) is always retracted inwards, a connecting rod (14) is installed at the output end of the elastic telescopic rod (13), a blocking plate (15) for blocking the open end of the storage frame (10) is installed at the lower end of the connecting rod (14), when the limiting plate (11) is inserted into the limiting groove (12), the blocking plate (15) is fitted with the upper end of the side wall of the rotating column (2), and a fastening screw (20) for fixing the limiting plate (11) inside the limiting groove (12) is arranged at the upper end of the top plate (8).

6. A dual-interface module pad ACF conductive adhesive attaching device according to claim 3, characterized in that: A ball bearing is installed at one end of the first limiting frame (5) close to the vertical plate (4) to facilitate the first limiting frame (5) to roll along the first magnet (6) and the second magnet (19).

7. The dual-interface module pad ACF conductive adhesive attaching device according to claim 1, characterized in that: Reinforcing ribs are installed on the side walls of the vertical plate (4) for improving the structural strength of the vertical plate (4) and preventing the vertical plate (4) from deforming and bending.

8. The dual-interface module pad ACF conductive adhesive attaching device according to claim 1, characterized in that: A rubber pad is installed at the lower end of the base (1) to facilitate stable placement of the base (1).

9. The dual-interface module pad ACF conductive adhesive attaching device according to claim 4, characterized in that: The top plate (8) and the vertical plate (4) are fixedly connected together by welding.

10. A dual-interface module pad ACF conductive adhesive attachment process, characterized in that: The following steps are involved: Step 1: According to the size and shape of the LA / LB solder joint, the ACF conductive adhesive is precisely cut through a dedicated grinding and cutting device; Step 2: attach the cut ACF conductive adhesive to the LA / LB pads of the dual-interface module using the ACF conductive adhesive attaching device; Step 3: Use hot pressing equipment to process the dual-interface module with ACF glue mounted on it, so that the ACF glue forms a strong bond with the pad. The temperature and time need to be strictly controlled during the hot pressing process to ensure that the ACF glue can fully melt and fill the solder joints to form a stable conductive connection; Step 4: After the hot pressing process, the dual-interface module is packaged and subjected to necessary electrical and mechanical performance tests to ensure that its quality meets the requirements.

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