Intelligent control box for heat dissipation, ventilation and dehumidification

Abstract

The invention discloses an intelligent control box for heat dissipation, ventilation and dehumidification. The control box comprises a box body and a control assembly arranged in the box body. A water outlet is formed in the bottom of the box body; the control assembly is separated from the water outlet; a heat dissipation structure is further arranged in the box body, and the control assembly is located on the heat absorption side of the heat dissipation structure. The heat absorption side of the heat dissipation structure is further provided with a first medium channel used for communicating with the water drainage opening, and the side, facing the control assembly, of the first medium channel is open so that air can enter the first medium channel. The invention aims to provide the control box which can dehumidify and cool the interior of the control box and prolong the service life of electronic components.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation and dehumidification of control boxes, and in particular to an intelligent control box for heat dissipation, ventilation and dehumidification. Background Art

[0002] The control box used in outdoor switch stations is easily affected by ambient temperature and humidity. When the electronic components in the control box work in a high temperature and humid environment, it is easy to cause short circuits in the electronic components and reduce the service life of the electronic components. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide an intelligent control box for heat dissipation, ventilation and dehumidification, which can dehumidify and cool the control box and extend the service life of electronic components.

[0004] The present invention provides a control box, comprising a box body and a control component arranged in the box body; a drain outlet is provided at the bottom of the box body, and the control component is spaced apart from the drain outlet; a heat dissipation structure is also provided in the box body, and the control component is located on the heat absorption side of the heat dissipation structure; a first medium channel for connecting to the drain outlet is also provided on the heat absorption side of the heat dissipation structure, and the first medium channel is open toward one side of the control component to allow air to enter the first medium channel.

[0005] In some embodiments, an extension direction of the first medium channel is inclined relative to a horizontal plane.

[0006] In some embodiments, an air inlet and a heat dissipation port are provided on the box body, the heat dissipation port is opposite to the heat release side of the heat dissipation structure and is connected to a fan; the first medium channel is connected to the air inlet.

[0007] In some embodiments, a first air passage communicating with the air inlet is enclosed between the control component and the housing.

[0008] In some embodiments, a second air passage communicating with the first air passage is arranged between the heat dissipation structure and the housing, and the second air passage is communicated with the heat dissipation port.

[0009] In some embodiments, the heat dissipation structure includes a first heat sink and a semiconductor refrigeration fin; the first heat sink has a first substrate and a plurality of first fins, the first fins protrude from the side of the first substrate facing the control component, and a first medium channel is formed between two adjacent first fins; at least one side edge of the first substrate is spaced apart from the inner surface of the box body and defines a portion of the second air passage.

[0010] In some embodiments, the heat dissipation structure further includes a second heat sink, and the second heat sink covers the heat dissipation port of the box body; the first heat sink, the semiconductor cooling plate and the second heat sink are stacked in sequence on the same side of the control component.

[0011] In some embodiments, the first fin extends in a vertical direction; the top side of the first substrate abuts against the inner surface of the box body, and a portion of the second air passage is defined between the bottom side of the first substrate and the inner surface of the bottom of the box body; a vent is provided on the second radiator, and the vent is used to connect the second air passage and the heat dissipation port.

[0012] In some embodiments, the first substrate has a vertical section, an inclined section and a split boundary, the split boundary is the connection between the vertical section and the inclined section; the vertical section is arranged opposite to the second heat sink, and the semiconductor cooling plate is arranged between the vertical section and the second heat sink; the inclined section is inclined relative to the vertical section in a direction away from the second heat sink, and a part of the second air passage is defined between the inclined section and the second heat sink; the split boundary extends along a length direction parallel to the vent and is located on the upper side of the vent.

[0013] In some embodiments, the first fin located in the inclined section protrudes from the first substrate by a dimension H1, wherein H1 gradually decreases in a direction away from the vertical section.

[0014] Combined with the technical solution, it can be seen that the embodiments provided by the present invention have the following advantages: (1) a heat dissipation structure is provided in the control box, and the heat absorption side of the heat dissipation structure can exchange heat with the air in the box, thereby reducing the temperature inside the box; (2) when the heat absorption side of the heat dissipation structure exchanges heat with the air, the water vapor in the air can enter the first medium channel and condense into water droplets, and the condensed water flows to the drain port through the first medium channel. By providing the first medium channel, the drainage efficiency can be improved, the moisture can be discharged from the inside of the box, and the humidity inside the box can be reduced. In summary, the control box provided by the present invention can dehumidify and cool the inside of the control box, thereby extending the service life of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 is an exploded view of a control box according to an embodiment of the present invention;

[0017] Figure 2 is a schematic structural diagram of a first heat sink according to an embodiment of the present invention, wherein the number of first fins in the first heat sink can be adjusted according to actual needs;

[0018] Figure 3 is a schematic structural diagram of a second radiator according to an embodiment of the present invention;

[0019] Figure 4 is a schematic structural diagram of a second heat sink and a fan according to an embodiment of the present invention;

[0020] Figure 5-Figure 6 is a schematic diagram of the structure of a control box at different viewing angles according to an embodiment of the present invention;

[0021] Figure 7-Figure 8 1 is a schematic diagram of the structure of a control component according to an embodiment of the present invention at different viewing angles.

[0022] Reference numerals:

[0023] Control box 100;

[0024] Box body 1, box body 10, heat dissipation port 11, mounting plate 12, overlap sheet 13, product label 14, water storage tank 15, air inlet 16, power terminal 17;

[0025] Control component 2, housing 21, power module 22, control module 23, display screen 24, touch button 25, waterproof connector 26;

[0026] Heat dissipation structure 3, heat absorption side 30, first heat sink 31, first substrate 311, vertical section 3111, inclined section 3112, split boundary 3113, first fin 312, first medium channel 313, second heat sink 32, vent 320, second substrate 321, second fin 322, semiconductor cooling sheet 33, heat insulation cotton 34;

[0027] Fan 4. DETAILED DESCRIPTION

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Even in high temperature and high humidity environments such as summer and rainy season, the control box as an outdoor switch station remains in operation. The heat in the environment will continue to radiate into the control box, and at the same time, moisture will also take the opportunity to enter the control box. In addition, the heat generated by the control components in the control box during operation will further increase the temperature inside the control box.

[0032] In a high temperature and high humidity environment, the operation of electronic components will have a serious impact on their service life, which will lead to frequent maintenance and overhaul of control components. This will not only increase labor costs, but also increase labor intensity.

[0033] Under this technical background, the present invention proposes a control box 100 that can dehumidify and cool the inside of the control box 100 to extend the service life of the control components.

[0034] Embodiment 1

[0035] like Figure 1 and Figure 2As shown, this embodiment provides a control box 100, including a box body 1 and a control component 2, and the control component 2 is arranged in the box body 1. A drain port (not shown) is provided at the bottom of the box body 1, and the control component 2 is spaced apart from the drain port; a heat dissipation structure 3 is also provided in the box body 1, and the control component 2 is located at the heat absorption side 30 of the heat dissipation structure 3, and the heat absorption side 30 of the heat dissipation structure 3 can absorb the heat of the control component 2 and reduce the temperature in the box body 1.

[0036] The heat absorbing side 30 of the heat dissipation structure 3 is further provided with a first medium channel 313 , which is communicated with the drain port. The first medium channel 313 is open toward one side of the control component 2 to allow air to enter the first medium channel 313 .

[0037] Combined with the technical solution, it can be seen that the control box 100 provided in this embodiment has the following advantages: (1) The heat dissipation structure 3 is arranged in the control box 100, and the heat absorption side 30 of the heat dissipation structure 3 can exchange heat with the air in the box body 1, thereby reducing the temperature inside the box body 1; (2) When the heat absorption side 30 of the heat dissipation structure 3 exchanges heat with the air, the water vapor in the air can enter the first medium channel 313 and condense into water droplets, and the condensed water flows to the drain port through the first medium channel 313. By setting the first medium channel 313, the drainage efficiency can be improved, the moisture can be discharged from the inside of the box body 1, and the humidity inside the box body 1 can be reduced. In summary, the control box 100 provided in this embodiment can dehumidify and cool the inside of the control box 100, thereby extending the service life of electronic components.

[0038] like Figure 2 As shown, further, the extension direction of the first medium channel 313 is inclined relative to the horizontal plane. Under the action of gravity, condensed water flows from the first medium channel 313 to the drain port at the bottom of the control box 100, thereby improving the drainage efficiency.

[0039] like Figure 2 As shown, further, the first medium channel 313 is extended substantially in the vertical direction to accelerate the discharge speed of the condensed water.

[0040] Embodiment 2

[0041] like Figure 1 and Figure 5As shown, this embodiment is basically the same as the first embodiment, except that: an air inlet 16 and a heat dissipation port 11 are provided on the housing 1, the heat dissipation port 11 is opposite to the heat release side of the heat dissipation structure 3 and is connected to a fan 4; the first medium channel 313 is connected to the air inlet 16. The fan 4 is installed on the heat release side of the heat dissipation structure 3 to help dissipate heat, further improve the heat absorption efficiency of the heat dissipation structure 3, and improve the cooling effect of the heat dissipation structure 3. Specifically, the first medium channel 313 is connected to the air inlet 16, and the fan 4 drives the airflow to be sucked into the first medium channel 313 from the air inlet 16, accelerates the flow speed of the air on the heat absorption side 30, and improves the cooling effect; at the same time, the airflow can drive the condensed water in the first medium channel 313 to flow, so that the condensed water is discharged to the drain outlet faster, thereby improving the dehumidification efficiency.

[0042] Embodiment 3

[0043] This embodiment is basically the same as the second embodiment, except that: Figure 1 and Figure 2 In combination, a first air passage is formed between the control component 2 and the housing 1, and the first air passage is connected to the air inlet 16. The fan 4 drives the air outside the housing 1 to be sucked into the housing 1, and the air can exchange heat with the control component 2 when passing through the first air passage, so that the first air passage can improve the cooling effect, so that the control component 2 can operate under more suitable temperature conditions, and the service life of the control component 2 can be extended.

[0044] It should be noted that the control component 2 generates heat when it is running, and the air temperature outside the box 1 is lower than the air temperature inside the box 1. Therefore, the fan 4 drives the air outside the box 1 to be sucked into the box 1, and the air can exchange heat with the control component 2 when passing through the first air passage.

[0045] from Figure 1-Figure 3 Taken together, further, a second air passage connected to the first air passage is enclosed between the heat dissipation structure 3 and the box body 1, and the second air passage is connected to the heat dissipation port 11. The second air passage is connected to the first air passage, and the fan 4 drives the airflow to flow through the second air passage, and performs more sufficient heat exchange with the heat dissipation structure 3, further improving the cooling efficiency in the box body 1.

[0046] Specifically, the airflow outside the box 1 enters the inside of the box 1 from the air inlet 16, and the fan 4 drives the airflow to pass through the first air passage. The airflow undergoes a first heat exchange with the control component 2, and the airflow after the first heat exchange is blown to the heat absorption side 30 of the heat dissipation structure 3. The water droplets condensed by the airflow after the first heat exchange flow along the first medium channel 313 to the drain port, and flow through the second air passage, and finally blown out from the heat dissipation port 11.

[0047] Embodiment 4

[0048] like Figure 1 and Figure 2 As shown, this embodiment is basically the same as the third embodiment, and the difference is that the heat dissipation structure 3 includes a first radiator 31 and a semiconductor refrigeration sheet 33, the first radiator 31 has a first substrate 311 and a plurality of first fins 312, the first fins 312 protrude from the side of the first substrate 311 facing the control component 2, a first medium channel 313 is formed between two adjacent first fins 312, and at least one side of the first substrate 311 is spaced apart from the inner surface of the box body 1, that is, the edge of the first substrate 311 and the inner surface of the box body 1 form a part of the second air passage.

[0049] It should be further explained that the semiconductor refrigeration sheet 33 cools on one side and heats on the other side; the side of the first radiator 31 facing the control component 2 is the heat absorption side 30, that is, the cooling end surface of the semiconductor refrigeration sheet 33 and the first radiator 31 together constitute the heat absorption side 30 of the heat dissipation structure 3.

[0050] The first heat sink 31 is provided with a plurality of first fins 312 at one end facing the control assembly 2, which increases the heat exchange area and improves the heat exchange efficiency. A first medium channel 313 is formed between two adjacent first fins 312, and the extension direction of the first medium channel 313 is consistent with the extension direction of the first fin 312.

[0051] When the airflow flows to the first fin 312 driven by the fan 4, on the one hand, the air in the box 1 undergoes heat exchange on the first fin 312, condenses into condensed water when it is cold, and flows along the extension direction of the first fin 312; on the other hand, the first fin 312 guides the airflow and water droplets to flow along the first medium channel 313, and the airflow can increase the flow speed of the water droplets in the first medium channel 313.

[0052] The airflow flows from the first medium channel 313 to a portion of the second air passage formed between the first substrate 311 and the inner surface of the housing 1 , and is finally discharged from the heat dissipation port 11 .

[0053] The first radiator 31 provided in this embodiment is configured as a natural convection radiator. Although the first fins 312 are conventionally configured for natural convection radiators to improve the heat exchange function, the first medium channel 313 formed between two adjacent first fins 312 not only guides the airflow, but also guides the directional flow of condensed water, thereby improving the dehumidification efficiency.

[0054] Therefore, the first heat sink 31 is constructed as a natural convection heat sink, and there is no need to additionally provide the first medium channel 313 , thereby reducing the layout cost.

[0055] Embodiment 5

[0056] This embodiment is basically the same as the fourth embodiment, with the difference that: the heat dissipation structure 3 also includes a second radiator 32, which covers the heat dissipation port 11 of the box body 1; the heat dissipation structure 3 also includes a second radiator 32, which covers the heat dissipation port 11 of the box body 1; the first radiator 31, the semiconductor cooling plate 33 and the second radiator 32 are stacked in sequence on the same side of the control component 2.

[0057] It can be understood that the heating end surface of the semiconductor refrigeration plate 33 and the second radiator 32 together complete the heat dissipation function of the heat dissipation structure 3, and the second radiator 32 can further increase the power of the semiconductor refrigeration plate 33 without causing the semiconductor refrigeration plate 33 to be damaged by excessive cooling power.

[0058] The control assembly 2, the first heat sink 31, the semiconductor cooling plate 33, and the second heat sink 32 are stacked in sequence, and a modular stacking design is adopted, which greatly simplifies the assembly difficulty of the control box 100 and improves the installation efficiency.

[0059] Furthermore, the first fin 312 extends in the vertical direction; the top side of the first substrate 311 abuts against the inner surface of the box body 1, and a portion of the second air passage is defined between the bottom side of the first substrate 311 and the inner surface of the bottom of the box body 1; a vent 320 is provided on the second radiator 32, and the vent 320 is used to connect a portion of the second air passage and the heat dissipation port 11. The second radiator 32 is covered at the heat dissipation port 11, and the airflow flows to the heat dissipation port 11 through the vent 320 on the second radiator 32, so that most of the airflow passes through the second radiator 32 and takes away the heat of the second radiator 32, thereby improving the cooling power of the semiconductor cooling plate 33.

[0060] At the same time, the fan 4 drives the airflow to pass through the bottom of the first heat sink 31, and the airflow passes through at least a portion of the first fins 312 and enters the first medium channel 313, thereby improving the heat exchange efficiency and the dehumidification effect.

[0061] Furthermore, the first substrate 311 has a vertical section 3111, an inclined section 3112 and a split boundary 3113, the split boundary 3113 is the connection between the vertical section 3111 and the inclined section 3112; the vertical section 3111 is arranged opposite to the second heat sink 32, and the semiconductor cooling plate 33 is arranged between the vertical section 3111 and the second heat sink 32; the inclined section 3112 is inclined relative to the vertical section 3111 in a direction away from the second heat sink 32, and another part of the second air passage is defined between the inclined section 3112 and the second heat sink 32; the split boundary 3113 is extended along a length direction parallel to the vent 320 and is located on the upper side of the vent 320.

[0062] In summary, the second air passage between the heat dissipation structure 3 and the housing 1 includes (1) an area enclosed between the bottom side of the first radiator 31 and the inner surface of the housing 1; and (2) an area enclosed between the inclined section 3112, the inner surface of the housing 1 and the second radiator 32.

[0063] The inclined section 3112 can guide more airflow to flow toward the vent 320 and then pass through the second radiator 32, thereby improving the heat exchange efficiency and dehumidification effect.

[0064] Furthermore, the second heat sink 32 includes a second substrate 321 and a plurality of second fins 322; each second fin 322 extends upward from bottom to top, and the plurality of second fins 322 are arranged along the length direction of the vent 320; the vent 320 is provided on the second substrate 321 and communicates with the second medium channel formed by two adjacent second fins 322. The airflow flows through the second fins 322 through the vent 320, takes away the heat on the second fins 322, and improves the cooling efficiency of the semiconductor cooling plate 33.

[0065] Furthermore, the first fin 312 located in the inclined section 3112 protrudes from the first substrate 311 by a dimension H1, wherein H1 gradually decreases in a direction away from the vertical section 3111. Thus, condensed water formed on the end surface of the first fin 312 protruding from the first substrate 311 can be guided to the drain port, further improving the dehumidification efficiency.

[0066] According to the following Figure 1-Figure 8 A specific embodiment will be described below.

[0067] The control box 100 includes a box body 1 , a control component 2 and a heat dissipation structure 3 .

[0068] The box body 1 includes a box body 10 , a mounting plate 12 , a lap joint 13 , a product label 14 , a water storage tank 15 and an electrical terminal 17 .

[0069] The box body 10 has an installation cavity, and a heat dissipation port 11 is provided on the rear side of the box body 10. The installation plate 12 is used to install the fan 4 so that the fan 4 is placed at the heat dissipation port 11, and the installation plate 12 is provided with an air outlet grille connected to the fan 4; the water tank 15 is connected to the lower side of the box body 10 through a lap plate 13, and the water tank 15 is connected to the box body 10 through a drain port. The water box is transparent and has scale lines, and the dehumidification amount in different time periods can be read on the spot; the water box is fixed by a lap plate 13, which is convenient for disassembly, replacement and transfer of the drain pipe. The water tank 15 can check the dehumidification effect during the test phase of the control box 100. When the control box 100 is officially put into use, a drain pipe is connected to the drain port.

[0070] The box body 10 may be made of stainless steel; or the box body 10 may be made of an aluminum shell; or the box body 10 may be made of a plastic shell.

[0071] The box body 10 is also provided with air inlets 16, which are arranged on the upper side, left side and right side of the box body 10. The bottom side of the box body 10 is also provided with a waterproof connector 26 for electrically connecting the control assembly 2.

[0072] The control assembly 2 includes a housing 21 and electronic components disposed in the housing 21; the housing 21 includes a first side and a second side facing each other, the first side facing the front side of the box body 10, the first side of the housing 21 has an opening and is used to be sealed and connected with the product label 14, and the housing 21 is sealed after being connected with the product label 14. The internal space of the housing 21 is isolated from dust and water vapor, making the operation of the electronic components safer and more reliable;. The second side is provided with studs for mounting the first radiator 31 and the second radiator 32.

[0073] The heat dissipation structure 3 includes a first heat sink 31, a semiconductor cooling sheet 33, and a second heat sink 32. A heat insulation cotton 34 is also provided between the first heat sink 31 and the second heat sink 32. The heat insulation cotton 34 is provided with a mounting hole in the same shape as the semiconductor cooling sheet 33. The mounting hole is used to place the semiconductor cooling sheet 33. The heat insulation cotton 34 is installed between the first heat sink 31 and the second heat sink 32 for heat insulation to prevent the cold air and hot air of the two heat sinks from convection.

[0074] The first heat sink 31 , the semiconductor cooling sheet 33 , the second heat sink 32 , the fan 4 and the mounting structure of the mounting plate 12 are stacked in sequence on the second side of the housing 21 .

[0075] The electronic components consist of a power module 22, a control module 23, a display screen 24, touch buttons 25 and a waterproof connector 26; the power module 22, the control module 23, the display screen 24, the touch buttons 25 are installed inside the housing 21, and the signal line and the power line are led out through the waterproof connector 26 and connected to the control terminal.

[0076] This control box 100 is mainly used in outdoor switch stations and has two major functions: dehumidification and ventilation. When the air humidity in the switch station reaches the dehumidification preset value, the dehumidification function is started, and the moisture is converted into liquid water and discharged. When the moisture drops to a preset range, the dehumidification function is automatically stopped; when the temperature in the switch station reaches the preset value, the ventilation function is started, and the hot air is discharged out of the station through the device. When the temperature in the station drops to a preset range, the ventilation function is automatically stopped; through the dehumidifier ventilation function, the temperature and humidity values ​​of the switch station are guaranteed to be within an ideal range.

[0077] Other structures and operations of the control box 100 according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here. In the description of the present invention, "first feature" and "second feature" may include one or more of these features. Among them, the up-down direction, left-right direction and front-back direction are based on the up-down direction, left-right direction and front-back direction shown in the figure.

[0078] In the description of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.

[0079] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0080] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An intelligent control box for heat dissipation, ventilation and dehumidification, comprising a box body and a control component arranged in the box body, characterized in that: A drain port is provided at the bottom of the box body, and the control component is spaced apart from the drain port; The box body is also provided with a heat dissipation structure, and the control component is located on the heat absorption side of the heat dissipation structure; The heat absorbing side of the heat dissipation structure is further provided with a first medium channel for communicating with the drain port, and the first medium channel is open toward one side of the control component to allow air to enter the first medium channel.

2. The control box according to claim 1, characterized in that: An extension direction of the first medium channel is inclined relative to a horizontal plane.

3. The control box according to claim 1, characterized in that: The box body is provided with an air inlet and a heat dissipation port, the heat dissipation port is opposite to the heat release side of the heat dissipation structure and is connected to a fan; The first medium channel is communicated with the air inlet.

4. The control box according to claim 3, characterized in that: A first air passage communicating with the air inlet is arranged between the control component and the box body.

5. The control box according to claim 4, characterized in that: A second air passage communicating with the first air passage is arranged between the heat dissipation structure and the box body, and the second air passage is communicated with the heat dissipation port.

6. The control box according to claim 5, characterized in that: The heat dissipation structure includes a first heat sink and a semiconductor refrigeration sheet; The first heat sink comprises a first substrate and a plurality of first fins, wherein the first fins protrude from a side of the first substrate facing the control assembly, and a first medium channel is formed between two adjacent first fins; At least one side edge of the first substrate is spaced apart from the inner surface of the box body and defines a portion of the second air passage.

7. The control box according to claim 6, characterized in that: The heat dissipation structure further comprises a second heat sink, and the second heat sink covers the heat dissipation opening of the box body; The first radiator, the semiconductor cooling plate and the second radiator are stacked in sequence on the same side of the control component.

8. The control box according to claim 7, characterized in that: The first fin extends in a vertical direction; the top side of the first substrate abuts against the inner surface of the box body, and a portion of the second air passage is defined between the bottom side of the first substrate and the inner surface of the bottom of the box body; A vent is provided on the second radiator, and the vent is used to connect the second air passage and the heat dissipation port.

9. The control box according to claim 8, characterized in that: The first substrate has a vertical section, an inclined section and a split boundary, and the split boundary is a connection point between the vertical section and the inclined section; The vertical section is arranged opposite to the second radiator, and the semiconductor cooling sheet is arranged between the vertical section and the second radiator; The inclined section is inclined relative to the vertical section in a direction away from the second radiator, and a portion of the second air passage is defined between the inclined section and the second radiator; The splitting seam boundary is extended and arranged in parallel with the length direction of the vent and is located at the upper side of the vent.

10. The control box according to claim 8, characterized in that: The first fin located in the inclined section protrudes from the first substrate by a dimension H1; Wherein, H1 gradually decreases in the direction away from the vertical segment.

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