Modular magnetic confinement device

Abstract

The present disclosure relates to a magnetically confinement device comprising a plurality of modules coupled to one another wherein each module (100) is adapted to conduct an electrical current to form a magnetic field and has:-a first wall (110) having a connection surface (102) adapted to engage a connection surface of another module of the plurality of modules; and-a groove (202) dividing the first wall (110) into at least two different electrically conductive regions.

Description

[0001] This application is based on the European patent application with the invention name “MODULAR MAGNETIC CONFINEMENT DEVICE” and application number 22305446 filed on April 4, 2022 and the European patent application with the invention name “METHODFOR MANUFACTURING SUPERCONDUCTING COILS AND DEVICE” and application number 22305437 filed on April 4, 2022, and claims the priority of the above-mentioned European patent applications, which are hereby incorporated by reference to the maximum extent permitted by law. Technical Field

[0002] Disclosed herein is a modular apparatus for confinement of magnetic fields. In particular, the described modular magnetic confinement apparatus relates to confinement of plasmas and its applications including generation of energy in fusion reactors. Background Art

[0003] The modern world is in urgent need of new energy sources. New energy sources are not only clean but also easily renewed and highly available. Fusion energy obtained from fusion reactions in fusion reactors is an energy source with all these characteristics.

[0004] Currently, the promise of reliable and widely available fusion energy has yet to be realized. One of the biggest obstacles to achieving fusion energy is the construction of fusion reactors. The construction of fusion reactors requires careful selection of materials, complex geometries for magnetic confinement, and careful considerations regarding the extraction of the energy produced.

[0005] Many different geometries for magnetic confinement can be identified in the art, including Tokamaks, spherical Tokamaks, Spheromaks, and Stellarators, each with their own benefits and difficulties. From an engineering perspective, all of these geometries share the same complexity: they all must be achieved by volumetric construction. There is no known way in the art to achieve any possible geometry without constructing the magnets in three dimensions.

[0006] A fusion reactor is described in U.S. Patent No. 9,959,942 to McGuire. The device described by McGuire is compact and can be installed in the interior of an airplane and even a large automobile, but the device described illustrates two major engineering challenges that still require solutions. First, although the device is small, it requires a large number of parts, and the implementation of any embodiment described will require more parts than the parts of an automobile or even an airplane. Second, a large number of different coils and coil arrangements are required to achieve magnetic packaging (which is just another term for magnetic confinement).

[0007] With respect to coils, the prior art teaches several methods for constructing coils (e.g., the superconducting coils described in U.S. Pat. No. 8,655,423 to Miyazaki et al.). Miyazaki describes a superconducting coil formed from several layers of different materials. Groups of these layers are described as constituting superconducting coil sections formed from thin film superconducting wires. The coils described by Miyazaki and coils commonly found in the art are constructed by arranging a superconducting film (also referred to as a superconducting tape) into the shape of a wire, which is then further configured into the shape of a coil. Based on a review of the prior art, a superconducting coil is formed by stacking superconducting films or superconducting layers so that current can flow in a desired direction and produce an appropriate magnetic field configuration. To the best of the inventor's knowledge and understanding, the prior art does not teach any other method by which a superconducting film or tape can be used to conduct current.

[0008] Superconducting tapes themselves are also in short supply, as they are in high demand. There is also the problem of the size and shape of the tapes: they can only be constructed a few centimeters wide. In addition, the process of arranging the tapes into wires and further into coils is long and prone to errors. The field of fusion reactor manufacturing requires cheaper, faster and more reliable solutions.

[0009] Thus, there is still a need for magnetic confinement devices that can have different geometries, different coils and coil arrangements without too many parts.There is also a need for simpler, faster and less error-prone methods for constructing magnetic confinement devices. Summary of the invention

[0010] One embodiment addresses all or some of the disadvantages of known magnetic confinement devices and coils.

[0011] One embodiment provides a magnetic confinement device, comprising a plurality of modules, the plurality of modules being coupled to each other, wherein each module is adapted to conduct current to form a magnetic field and has:

[0012] - a first wall having a connection surface adapted to engage a connection surface of another module of the plurality of modules; and

[0013] - a groove dividing said first wall into at least two different conductive areas.

[0014] In one embodiment, the groove of at least one module of the plurality of modules is adapted to be connected to a groove of another module of the plurality of modules to form a continuous groove.

[0015] In one embodiment, the grooves are adapted to direct current flow through the module in a particular direction or along different paths.

[0016] In one embodiment, at least one module among the multiple modules is mechanically and / or electrically connected to another module among the multiple modules, and the connection surface of the module includes a mechanical connector and / or an electrical connector, which is suitable for connecting to the mechanical connector and / or electrical connector of the other module.

[0017] In one embodiment, the coupled modules each include an electrical connector positioned to allow electrical current to flow between the coupled modules.

[0018] In one embodiment, the at least one module and the further module each comprise an electrical connector positioned to allow electrical current to flow between the modules.

[0019] In one embodiment, at least one module of the plurality of modules comprises at least one channel through the first wall of the module, for example to enable a cooling fluid such as nitrogen or helium to flow through the module.

[0020] In a particular embodiment, each channel is adapted to form a single channel with a channel of another module of the plurality of modules.

[0021] In one embodiment, at least one module of the plurality of modules comprises a second wall assembled to the first wall, the recess of the module being positioned between the first wall and the second wall.

[0022] In one embodiment, the plurality of modules comprises a first module having a first shape and a second module having a second shape, wherein the modules are mechanically coupled to each other, and the first modules are electrically coupled to each other and / or the second modules are electrically coupled to each other.

[0023] In a specific embodiment, the first module and the second module are electrically coupled to each other.

[0024] In one embodiment, the direction and / or strength of the current flowing through the first module and / or the second module determines the shape of the magnetic field in the magnetic confinement device.

[0025] In one embodiment, the modules are arranged in the shape of a torus.

[0026] In one embodiment, the module is configured to have superconducting properties.

[0027] In one embodiment, at least one of the plurality of modules is constructed as a stack formed of different materials, the stack comprising at least a superconducting layer comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide, wherein the grooves of the module are patterned at least in the superconducting layer.

[0028] In one embodiment, the stack comprises:

[0029] a structural layer, which for example consists of or is covered with a material such as Hastelloy;

[0030] - a plurality of buffer layers, the plurality of buffer layers being located on the structural layer;

[0031] - the superconducting layer, the superconducting layer being located on the plurality of buffer layers;

[0032] Wherein, the grooves are patterned in the buffer layer and the superconducting layer.

[0033] In one embodiment, the stack comprises:

[0034] a structural layer, which for example consists of or is covered with a material such as Hastelloy;

[0035] - a plurality of buffer layers, the plurality of buffer layers being located on the structural layer;

[0036] - the superconducting layer, the superconducting layer being on the plurality of buffer layers; and

[0037] - a shunt layer on the superconducting layer and in the groove, the shunt layer being made of a metal such as silver;

[0038] Wherein, the grooves are patterned in the buffer layer and the superconducting layer.

[0039] In one embodiment, the stack includes a repeating portion layer, which is located below the shunt layer, and the repeating portion layer is made of repetitions of the buffer layer and the superconducting layer, preferably multiple repetitions, such as between 4 and 80 repetitions, wherein the grooves are patterned in the buffer layer, the superconducting layer and the repeating portion layer.

[0040] In one embodiment, the stack comprises a further superconducting layer, for example a non-perforated and non-grooved layer, on the shunt layer, the further superconducting layer comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide.

[0041] In one embodiment, each channel of said at least one module passes through said structural layer.

[0042] An embodiment provides a module, which is suitable for the magnetic confinement device according to an embodiment.

[0043] An embodiment provides a module, which is one module among the plurality of modules coupled to each other included in the magnetic confinement apparatus according to the embodiment.

[0044] advantage

[0045] The advantages of the modular magnetic confinement device embodiment can be listed as: simpler and less error-prone construction of the different modules allows faster assembly; high confinement of the magnetic field due to the Meissner effect layer; maintenance of each module is easier and replacement is faster, resulting in a cheaper device and overall cost reduction; the coils can be easily changed and replaced, allowing not only for maintenance of the device but also for testing of the device. Other technical advantages will become apparent to those skilled in the art from the detailed description, drawings and claims. In addition, although specific advantages have been enumerated above, different embodiments may include all, none, or some of the advantages listed. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The foregoing features and advantages and other features and advantages will be detailed in the following description of specific embodiments given by way of illustration and not limitation in the accompanying drawings, in which:

[0047] Figure 1 is an overall perspective view of an embodiment of the disclosed modular magnetic confinement apparatus.

[0048] Figure 2 is an exploded perspective view of an embodiment of the disclosed modular magnetic confinement apparatus.

[0049] Figure 3A is a perspective view of a torus device constructed from modules described by the disclosed modular magnetic confinement device.

[0050] Figure 3B Yes Figure 3A An enlarged stereoscopic view of the two modules of the torus device.

[0051] Figure 3C yes Figure 3A A stereoscopic view of the interior of a torus device.

[0052] Figure 4 is a perspective view of the interior of a wall of a module of the disclosed modular magnetic confinement apparatus. DETAILED DESCRIPTION

[0053] In the various figures, the same features have been designated by the same reference numerals. In particular, structural and / or functional features common to the various embodiments may have the same reference numerals and may employ the same structures, dimensions, and material properties.

[0054] For clarity, only operations and elements useful for understanding the embodiments described herein have been explained and described in detail.

[0055] Unless otherwise indicated, when reference is made to two elements being connected together, this means a direct connection without any intermediate elements except conductors, and when reference is made to two elements being coupled together, this means the two elements may be connected or they may be coupled via one or more other elements.

[0056] In the following disclosure, unless otherwise indicated, when reference is made to absolute position qualifiers (e.g., terms "front", "back", "top", "bottom", "left", "right", etc.) or relative position qualifiers (e.g., terms "above", "below", "higher", "lower", etc.) or orientation qualifiers (e.g., "horizontal", "vertical", etc.), reference is made to the orientation shown in the figures.

[0057] Unless otherwise specified, the expressions "about," "approximately," "substantially," and "approximately" mean within 10% and preferably within 5%.

[0058] When referring to magnetic confinement, magnetic confinement refers to confinement by a magnetic field.

[0059] The drawings are not to scale. It should be noted that when unambiguous is intended, the drawings refer to embodiments of the disclosed modular magnetic confinement device (sometimes also referred to simply as the device). Other embodiments may be possible as can be readily understood by a person with appropriate training. The actual dimensions and / or shape of each of the components of the embodiments may vary. Only the important details of the embodiments are shown, however, a person of ordinary skill in the art can understand how the entire device can be constructed without undue experimentation. Some details have been omitted from the drawings, but the inventors believe that adding these details is unnecessary for a full understanding of the features of the disclosed invention. These omitted details include, in particular, elements for holding or fixing the device or its functional components, etc. Some features of the embodiments appear exaggerated to facilitate understanding. The disclosed embodiments and observed alternatives should not be construed as limiting the present invention in any way.

[0060] The magnetic confinement device is constructed from modules. The modules are interconnected, preferably connected to each other, and the modules are capable of conducting electricity. The conduction of electricity in the modules and the materials used for this may require the modules to operate at a specific temperature, and thus the modules may need to be cooled.

[0061] exist Figure 1An embodiment of a module 100 of a modular magnetic confinement device is shown in FIG. The module conducts electricity so that the module can form an electromagnetic field. The module has an outer wall 112 and an inner wall 110. The inner wall 110 has at least one connection surface 102, and in the embodiment shown, two connection surfaces. At least one pipe, channel or passage can pass through the inner wall 110, or, as in the module shown, several pipes, channels or passages 104 can pass through the inner wall 110. The connection surface of the inner wall 110 has an electrical connector 106 and / or a mechanical connector 108.

[0062] When reference is made to a passageway, this also includes a duct, tunnel or channel.

[0063] The inner wall may be referred to as a "first wall" and the outer wall may be referred to as a "second wall".

[0064] The outer wall 112 may be electrically conductive since it may represent a shunt layer, or the outer wall 112 may be electrically insulating or a poor conductor.

[0065] exist Figure 2 1 shows an expanded view of the module 100. In this expanded view, the outer wall 112 has been separated from the inner wall 110. The inner wall 110 has a ridge, wedge or groove 202. The groove 202 divides the inner wall 110 into at least two conductive areas so that current can flow in a specific direction or in different paths as required for a specific application. The electrical connector 106 is positioned to allow current to flow to other modules.

[0066] When referring to grooves, this also includes ridges or wedges.

[0067] According to an embodiment, the mechanical connector may also be used as an electrical connector. Similarly, the electrical connector may also be used as a mechanical connector. The connection surface may include a connector that allows both mechanical and electrical connection. Preferably, there is an electrical connector that connects each conductive area from either side of the groove.

[0068] The modules are assembled into a device suitable for confining a magnetic field. The modules are assembled together with a mechanical connector 108. In an embodiment, the device can be described as a torus 300, such as Figure 3A To construct the torus 300 from modules, different module shapes can be used. Figure 3B As shown, the upper module 100b is separated from the lower module 100a. Electrically, the modules can be coupled together, preferably connected together, by using an electrical connector 106. When these modules are coupled together, current can flow from one module to another, resulting in a magnetic field 302 formed around the modules, such as Figure 3C Any number of modules can be interconnected, and in fact, the magnetic confinement device can have any shape.

[0069] The lower module may be referred to as a "first module" and the upper module may be referred to as a "second module".

[0070] Example of operation

[0071] Figure 3C 1 shows an internal view of the torus 300 during operation. The lower modules 100a are electrically interconnected. The lower modules can also be connected to other modules (e.g., Figure 3B The current flows through the modules, and this causes a magnetic field 302 to be formed inside the torus 300. The shape of the magnetic field 302 can be configured by changing the direction and strength of the current flowing through the lower module 100a or the upper module 100b.

[0072] In order to confine the magnetic field 302 to the interior of the magnetic confinement device, whether in the torus 300 configuration or other configurations, the construction of the module can at least partially use the Meissner effect. The Meissner effect is the phenomenon that a magnetic field may not exist inside an ideal conductor or superconductor. The Meissner effect is observed in superconducting materials. For certain materials, in order to have superconducting properties, they must operate within certain temperature limits. In order to ensure that the module operates within this temperature range, a cooling fluid can be flowed through the channel 104.

[0073] Example of module construction

[0074] exist Figure 4 An embodiment of the internal structure of a module is shown in FIG. A module can be constructed as a stack formed of several layers. Starting from the bottom, which can be closest to the side where the magnetic field will be formed, the stack includes a first structural layer 414, which can be composed of a material such as Hastelloy or covered by a material such as Hastelloy. The channel 104 for cooling fluid can pass through the first structural layer 414. Several buffer layers are deposited on top of the first structural layer 414. Sputtered on top of the first structural layer 414 is a layer of material such as aluminum oxide, referred to as the first buffer layer 412. A second buffer layer 410 is sputtered on top of the first buffer layer 412. The second buffer layer 410 is composed of a material such as yttrium oxide. The third buffer layer 408 is composed of a material such as magnesium oxide and can be deposited by metal organic chemical vapor deposition MOCVD or ion beam assisted deposition IBAD. A superconducting layer 406 is deposited on top of the third buffer layer 408. The superconducting layer 406 can be deposited by MOCVD and can be composed of a material such as REBCO or YBCO or other suitable superconducting material. Material from the first buffer layer 412, the second buffer layer 410, the third buffer layer 408, and the superconducting layer 406 may be removed to create a structure described as follows: Figure 2The pattern of grooves 202 in the inner wall 110 of the module is shown. To remove material, techniques such as laser patterning can be used. Other techniques such as mechanical techniques or photolithography can be used to remove material.

[0075] Alternatively, material may be removed only from superconducting layer 406 to create recess 202 .

[0076] The buffer layer may form a suitable template for forming the superconducting layer.There may be only one buffer layer, rather than multiple buffer layers.

[0077] Other suitable materials may be used in place of the materials described herein.

[0078] The groove 202 may be filled with a metal, which may be silver, to form a shunt layer 404 that may also cover the superconducting layer 406. The shunt layer provides a path in the event that the superconducting layer 406 is quenched. The shunt layer 404 is optional. There are other solutions to the quenching problem (e.g., operating at sufficiently low current, temperature, and / or magnetic field). Quenching is generally a problem for superconductivity, which is not related to the problem solved by the embodiments.

[0079] The described sequence of buffer layers and superconducting layers can be repeated several times (forming a repeating layer) before the grooves are formed, wherein the best results are achieved with a layer sequence repetition of between 4 and 80 times (e.g., for a magnetic field of approximately 10 Tesla, with a layer sequence repetition of between 20 and 40 times). Grooves can also be formed in the repeating layer.

[0080] For example, for one sequence of buffer layers and superconducting layers, the depth of the grooves 202 is comprised between 3 μm and 5 μm. If the sequence is repeated, the depth of the grooves can be multiplied by the number of sequences. For example, the depth of the grooves is comprised between 3×N μm and 5×N μm, where N is the number of sequences.

[0081] The repeating sequence of layers may include a silver layer 305 on a superconducting layer 406 or another material suitable for forming another sequence of buffer layers and superconducting layers on the stack.

[0082] In order to at least partially exploit the Meissner effect or similar effect whereby a superconductor partially or completely expels a magnetic field, a single, preferably non-perforated (and non-grooved) layer of superconducting material should be placed on top of all other layers. This layer is the Meissner effect layer 402 and is composed of a superconducting material such as YBCO or REBCO.

[0083] The proper operation of the device may require other material layers above or below the described layers, however, it should be apparent to one of ordinary skill in the art how to achieve the functions described herein with different layer configurations. As an example of this, a stabilization layer composed of silver, copper, and other metals may be placed below the first structural layer 414.

[0084] The inner wall 110 may include Figure 4 The layers 414, 412, 410, 408, 406, 404 and the groove 202, and the outer wall 112 may include Figure 4 Layer 402.

[0085] According to an embodiment, the module is a modular coil.

[0086] Other layer configurations and / or methods for constructing or manufacturing modules (e.g., modular coils) should be apparent to those of ordinary skill in the art. Another example of a method for manufacturing a superconducting coil that may be a modular coil and an example of an apparatus are given in European patent application number EP22305437 filed on April 4, 2022 by the same applicant "RENAISSANCE FUSION" and entitled "METHOD FOR MANUFACTURING SUPERCONDUCTING COILS AND DEVICE", which is hereby incorporated by reference to the maximum extent permitted by law.

[0087] Example embodiments of the present invention are summarized herein. Other embodiments may also be understood from the complete specification and claims submitted herein.

[0088] Example 1. A magnetic confinement device (300), comprising a plurality of modules, the plurality of modules being interconnected, wherein each module (100; 100a, 100b) is adapted to conduct an electric current to form a magnetic field, and each module (100; 100a, 100b) has:

[0089] - a first wall (110) having a connection surface (102) adapted to engage with a connection surface of another module of the plurality of modules; and

[0090] - a groove (202), said groove (202) dividing said first wall (110) into at least two different conductive areas.

[0091] Example 2. A magnetic confinement device as described in Example 1, wherein the groove of at least one of the plurality of modules is suitable for connecting to the groove of another module of the plurality of modules to form a continuous groove.

[0092] Example 3. A magnetic confinement device as described in Example 1 or 2, wherein the groove (202) is suitable for guiding the current to flow through the module in a specific direction or along different paths.

[0093] Example 4. A magnetic confinement device as described in any one of Examples 1 to 3, wherein at least one module (100) among the multiple modules is mechanically and / or electrically connected to another module among the multiple modules, and the connection surface of the module includes a mechanical connector (108) and / or an electrical connector (106), and the mechanical connector (108) and / or the electrical connector (106) are suitable for connecting to the mechanical connector and / or electrical connector of the other module.

[0094] Example 5. A magnetic confinement apparatus as described in Example 4, wherein the connected modules each include an electrical connector, and the electrical connector is positioned to allow current to flow between the connected modules.

[0095] Example 6. A magnetic confinement device as described in any of Examples 1 to 5, wherein at least one module (100) of the plurality of modules includes at least one channel (104), and the at least one channel (104) passes through the first wall (110) of the module, for example to enable a cooling fluid such as nitrogen or helium to flow through the module.

[0096] Example 7. A magnetic confinement apparatus as described in Example 6, wherein each channel is suitable for forming a single channel with a channel of another module of the plurality of modules.

[0097] Example 8. A magnetic confinement device as described in any of Examples 1 to 7, wherein the first wall (110) of at least one module (100) among the plurality of modules includes at least two connecting surfaces (102), each of the at least two connecting surfaces (102) being suitable for joining a connecting surface of another module among the plurality of modules.

[0098] Example 9. A magnetic confinement device as described in any one of Examples 1 to 8, wherein at least one module (100) among the plurality of modules includes a second wall (112), the second wall (112) is assembled to the first wall (110), and the groove (202) of the module is positioned between the first wall and the second wall.

[0099] Example 10. A magnetic confinement device as described in any of Examples 1 to 9, wherein at least two modules (100a, 100b) among the plurality of modules have different shapes.

[0100] Example 11. A magnetic confinement device as described in any one of Examples 1 to 10, wherein the plurality of modules include a first module (110a) and a second module (110b), the first module (110a) having a first shape, the second module (110b) having a second shape, wherein the modules are mechanically connected to each other, and the first modules are electrically connected to each other and / or the second modules are electrically connected to each other.

[0101] Example 12. The magnetic confinement device of Example 11, wherein the first module and the second module are electrically connected to each other.

[0102] Example 13. A magnetic confinement device as described in Example 11 or 12, wherein the direction and / or intensity of the current flowing through the first module (100a) and / or the second module (100b) determines the shape of the magnetic field (302) in the magnetic confinement device.

[0103] Example 14. A magnetic confinement device as described in any one of Examples 1 to 13, wherein the modules are arranged in the shape of a torus.

[0104] Example 15. A magnetic confinement device as described in any of Examples 1 to 14, wherein the module is constructed to have superconducting properties.

[0105] Example 16. A magnetic confinement device as described in any of Examples 1 to 15, wherein at least one of the multiple modules is constructed as a stack formed by different materials, the stack including at least a superconducting layer, the superconducting layer including a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide, wherein the groove (202) of the module is patterned at least in the superconducting layer.

[0106] Example 17. The magnetic confinement apparatus of Example 16, wherein the stack comprises:

[0107] a structural layer (414), which for example consists of or is covered by a material such as Hastelloy;

[0108] - a plurality of buffer layers, the plurality of buffer layers being located on the structural layer;

[0109] - the superconducting layer (406), the superconducting layer (406) being located on the plurality of buffer layers; and

[0110] - a shunt layer (404) on the superconducting layer and in the groove, the shunt layer being made of a metal such as silver;

[0111] Wherein, the grooves are patterned in the buffer layer and the superconducting layer.

[0112] Example 18. The magnetic confinement device of Example 17, wherein the plurality of buffer layers comprises:

[0113] - a first buffer layer (412), the first buffer layer (412) being on the structural layer, the first buffer layer (412) being, for example, a layer of a material such as aluminum oxide;

[0114] - a second buffer layer (410), said second buffer layer (410) being on said first buffer layer, said second buffer layer (410) being, for example, a layer of a material such as yttrium oxide;

[0115] - a third buffer layer (408) located on the second buffer layer, the third buffer layer (408) being, for example, a layer of a material such as magnesium oxide.

[0116] Example 19. A magnetic confinement device as described in Example 17 or 18, wherein the stack includes a repeating portion layer, the repeating portion layer is located below the shunt layer (404), the repeating portion layer is made of repetitions of the buffer layer and the superconducting layer, preferably multiple repetitions, such as between 4 and 80 repetitions, wherein the grooves are patterned in the buffer layer, the superconducting layer and the repeating portion layer.

[0117] Example 20. A magnetic confinement device as described in any of Examples 17 or 19, wherein the stack includes another superconducting layer (402), the other superconducting layer (402) being, for example, a non-perforated and non-grooved layer, the other superconducting layer being on the shunt layer (404), the other superconducting layer comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide.

[0118] Example 21. The magnetic confinement device of any one of Examples 17 to 20 in combination with Example 6 or 7, wherein each channel (104) of the at least one module passes through the structural layer (414).

[0119] Example 22. A module (100), wherein the module (100) is suitable for a magnetic confinement device according to any one of Examples 1 to 21.

[0120] Example 23. A method for manufacturing the module (100) of Example 22, the method comprising:

[0121] - providing a structural layer (414);

[0122] - forming a plurality of buffer layers, wherein the plurality of buffer layers are located on the structural layer;

[0123] - depositing a superconducting layer (406) on the plurality of buffer layers, for example by metal organic chemical vapor deposition; and

[0124] - removing material from at least the superconducting layer, for example using a laser patterning technique, to form grooves (202);

[0125] - depositing a layer of metal on said superconducting layer, comprising: filling said grooves with said metal, such as silver, to form a shunt layer (404).

[0126] Example 24. The method of Example 23 further includes:

[0127] - before forming the groove and forming the shunt layer (404), repeating the buffer layer and the superconducting layer, preferably repeating a plurality of times, for example, between 4 and 80 repetitions.

[0128] Example 25. The method of Example 23 or 24, wherein forming the plurality of buffer layers comprises:

[0129] - sputtering a first buffer layer (412) on the structural layer, the first buffer layer (412) being, for example, a layer of a material such as aluminum oxide;

[0130] - sputtering a second buffer layer (410) on said first buffer layer, said second buffer layer (410) being, for example, a layer of a material such as yttrium oxide;

[0131] - depositing a third buffer layer (408) on said second buffer layer, for example by metal organic chemical vapor deposition or ion beam assisted deposition, said third buffer layer (408) being for example a layer of a material such as magnesium oxide.

[0132] Example 26. The method of any one of Examples 23 to 25, further comprising:

[0133] - depositing a further superconducting layer (402) on the shunt layer (404), the further superconducting layer (402) being, for example, a non-perforated and non-grooved layer, the further superconducting layer (402) comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide.

[0134] Various embodiments and variations have been described. Those skilled in the art will appreciate that the specific features of these embodiments can be combined, and that other variations will readily occur to those skilled in the art.

[0135] Finally, actual implementation of the embodiments and variations described herein is within the capabilities of those skilled in the art based on the functional description provided above.

[0136] List of acronyms:

[0137] MOCVD Metal-organic chemical vapor deposition

[0138] IBAD (Ion beam assisted deposition)

[0139] REBCO Rare-earth barium copper oxide

[0140] YBCO Yttrium barium copper oxide

Claims

1. A magnetic confinement device (300), comprising a plurality of modules, the plurality of modules being interconnected, wherein: Each module (100; 100a, 100b) is adapted to conduct electric current to form a magnetic field, and each module (100; 100a, 100b) has: - a first wall (110) having a connection surface (102) adapted to engage a connection surface of another module of the plurality of modules; and - a groove (202), said groove (202) dividing said first wall (110) into at least two different conductive areas; wherein at least one module (100) of the plurality of modules comprises a second wall (112) assembled to the first wall (110) of the module, the groove (202) of the module being positioned between the first wall and the second wall; and At least one module (100) of the plurality of modules is constructed as a stack of different materials, the stack comprising at least a superconducting layer (406), the superconducting layer (406) comprising a superconducting material, wherein the groove (202) of the module is patterned at least in the superconducting layer.

2. The magnetic confinement device according to claim 1, wherein: The groove of at least one module of the plurality of modules is adapted to be connected to a groove of another module of the plurality of modules to form a continuous groove.

3. The magnetic confinement device according to claim 1 or 2, wherein: The grooves (202) are adapted to direct current flow through the module in a particular direction or along different paths.

4. The magnetic confinement device according to any one of claims 1 to 3, wherein: At least one module (100) among the plurality of modules is mechanically and / or electrically connected to another module among the plurality of modules, and the connection surface of the at least one module includes a mechanical connector (108) and / or an electrical connector (106), and the mechanical connector (108) and / or the electrical connector (106) are suitable for connecting to the mechanical connector and / or the electrical connector of the other module.

5. The magnetic confinement device according to claim 4, wherein: The at least one module and the other module each include an electrical connector positioned to allow electrical current to flow between the modules.

6. The magnetic confinement apparatus according to any one of claims 1 to 5, wherein: At least one module (100) of the plurality of modules comprises a channel (104) passing through the first wall (110) of the module, for example to enable a cooling fluid such as nitrogen or helium to flow through the module.

7. The magnetic confinement device according to claim 6, wherein: The channel is adapted to form a single channel with a channel of another module of the plurality of modules.

8. The magnetic confinement apparatus according to any one of claims 1 to 7, wherein: The plurality of modules comprises a first module (100a) having a first shape and a second module (100b) having a second shape, wherein the modules are mechanically coupled to each other, and: - the first modules are electrically interconnected; and / or - said second modules are electrically interconnected.

9. The magnetic confinement apparatus according to claim 8, wherein: The first module and the second module are electrically coupled to each other.

10. The magnetic confinement device according to claim 8 or 9, wherein: The direction and / or strength of the current flowing through the first module (100a) and / or the second module (100b) determines the shape of the magnetic field (302) in the magnetic confinement device.

11. The magnetic confinement apparatus according to any one of claims 1 to 10, wherein: The modules are arranged in the shape of a torus.

12. The magnetic confinement apparatus according to any one of claims 1 to 11, wherein: The modules are constructed to have superconducting properties.

13. The magnetic confinement apparatus according to any one of claims 1 to 12, wherein: The superconducting material is yttrium barium copper oxide or rare earth barium copper oxide.

14. The magnetic confinement apparatus according to any one of claims 1 to 13, wherein: The stack comprises: a structural layer (414), which for example consists of or is covered by a material such as Hastelloy; - a plurality of buffer layers, the plurality of buffer layers being located on the structural layer; - the superconducting layer (406), the superconducting layer (406) being located on the plurality of buffer layers; Wherein, the grooves (202) are patterned in the buffer layer and the superconducting layer.

15. The magnetic confinement apparatus according to claim 14, wherein: The stack further comprises: - a shunt layer (404) on the superconducting layer and in the groove, the shunt layer being made of a metal such as silver.

16. The magnetic confinement apparatus according to claim 15, wherein: The stack comprises a repeating portion layer below the shunt layer (404), the repeating portion layer being made of a repetition of the buffer layer and the superconducting layer, preferably a plurality of repetitions, for example between 4 and 80 repetitions, wherein the grooves are patterned in the buffer layer, the superconducting layer and the repeating portion layer.

17. The magnetic confinement apparatus according to claim 15 or 16, wherein: The stack includes another superconducting layer (402), which is, for example, a non-perforated and non-grooved layer, located on the shunt layer (404), and the other superconducting layer includes a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide.

18. A magnetic confinement apparatus according to any one of claims 14 to 17 as appended to claim 6 or 7, wherein: The passage (104) of the at least one module passes through the structural layer (414).

19. A module (100; 100a; 100b), the module (100; 100a; 100b) being one of the plurality of interconnected modules comprised in the magnetic confinement apparatus according to any one of claims 1 to 18.

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