Semi-automatic film changing method for thin product and thin product structure

Abstract

The invention discloses a semi-automatic film changing method for a thin product. The semi-automatic film changing method comprises the following steps: (1) preparing a coil stock release film; (2) tearing off the process film on the original thin product; (3) laying the coil release film on the thin product; and (4) the thin product laid with the coil release film is placed on an automatic slicing machine to be sliced, and the thin product laid with the coil release film is cut into multiple sections of product slices. According to the semi-automatic film changing method for the thin product, the release film can be quickly laid on the thin product, manual operation is replaced, and the production efficiency can be improved.

Description

Technical Field

[0001] The invention relates to a semi-automatic film changing method for thin products and a thin product structure, belonging to the technical field of production and processing of thin product materials. Background Art

[0002] Thin products such as double-sided tape slices are used in some electronic products. The double-sided tape is cut into slices for use. In production, several double-sided tape slices may be required to form a product unit for production turnover. In the batch production of double-sided tape slices, the double-sided tape slices are placed on a carrier film, and then the double-sided tape slice product unit is covered with a process film to protect the double-sided tape slices. However, these process films may not meet the customer's usage requirements. When using, the customer has to tear off these process films and re-attach a release film that meets the requirements. The traditional way is to manually tear off the process film and then manually attach the release film. This has low work efficiency and is prone to cause the release film to shift in position, resulting in unsatisfactory results. Summary of the invention

[0003] The object of the present invention is to provide a semi-automatic film changing method for thin products, which can quickly lay a release film on the thin product, replace manual operation, and is conducive to improving production efficiency.

[0004] In order to solve the above technical problems, a technical solution adopted by the present invention is to provide a semi-automatic film changing method for thin products, comprising the following steps:

[0005] (1) Prepare a roll release film;

[0006] (2) Tear off the process film on the original thin product;

[0007] (3) Laying the roll release film onto the thin product;

[0008] (4) placing the thin product covered with the roll release film on an automatic slicer for slicing, and cutting the thin product covered with the roll release film into a plurality of product slices.

[0009] The present invention also provides a thin product structure made by the above-mentioned semi-automatic film changing method for thin products, which includes a carrier film, on which a plurality of thin product units are arranged, and the plurality of thin product units are covered with a release film.

[0010] Preferably, the thin product unit is a double-sided adhesive slice.

[0011] The beneficial effects of the present invention are as follows: the semi-automatic film changing method for thin products of the present invention can quickly lay release film on thin products, use an automatic slicer to slice to form double-sided adhesive slice product units, lay release film in batches, and replace manual film laminating operations one by one, which is beneficial to improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0013] Figure 1 It is a schematic diagram of the semi-automatic film changing method of the thin product of the present invention;

[0014] Figure 2 It is a structural schematic diagram of a thin product structure obtained by adopting a semi-automatic film changing method for thin products of the present invention. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] Embodiments of the present invention:

[0017] The present invention provides a semi-automatic film replacement method for thin products, please refer to Figure 1 , including the following steps:

[0018] (1) preparing a roll release film 1;

[0019] (2) Tear off the process film on the original thin product 2;

[0020] (3) Laying the roll release film 1 onto the thin product 2;

[0021] (4) The thin product 2 covered with the roll release film 1 is placed on an automatic slicer for slicing. The slicing knife 3 of the automatic slicer cuts the thin product 2 covered with the roll release film 1 into multiple product slices such as double-sided tape. Each product slice is a thin product structure.

[0022] Using an automatic slicer to slice into double-sided adhesive slice product units and applying release films in batches replaces manual laminating operations one by one, which is conducive to improving production efficiency.

[0023] The present invention also provides a thin product structure obtained by using the above-mentioned semi-automatic film replacement method for thin products, please refer to Figure 2 It includes a carrier film 4, on which a plurality of thin product units 5 are arranged, and on which a release film 6 is covered, and the release film 6 is consistent with the requirements of customers.

[0024] Preferably, the thin product unit 5 is a double-sided adhesive slice, that is, a double-sided adhesive slice cut into individual double-sided adhesive slices.

[0025] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semi-automatic film changing method for thin products, characterized in that: The following steps are involved: (1) Prepare a roll release film; (2) Tear off the process film on the original thin product; (3) Laying the roll release film onto the thin product; (4) placing the thin product covered with the roll release film on an automatic slicer for slicing, and cutting the thin product covered with the roll release film into a plurality of product slices.

2. A thin product structure obtained by using the semi-automatic film replacement method for thin products according to claim 1, characterized in that: It comprises a carrier film, on which a plurality of thin product units are arranged, and the plurality of thin product units are covered with a release film.

3. The thin product structure according to claim 2, characterized in that: The thin product unit is a double-sided adhesive slice.

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