Adhesive formula for copper-clad plate

Abstract

The invention discloses an adhesive formula for a copper-clad plate, and particularly relates to the technical field of adhesives, the adhesive formula comprises the following components by mass: 100-150 parts of epoxy resin; 5-15 parts of an imidazole curing agent; 20-40 parts of carboxyl-terminated liquid nitrile rubber; 1 to 4 parts of 3, 4-diaminodiphenyl sulfone; 5 to 15 parts of bismaleimide; 20 to 40 parts of tetrabromobisphenol A high brominated epoxy resin; 10 to 20 parts of phosphorus-containing novolac epoxy resin; 5-10 parts of aluminum hydroxide; 10 to 15 parts of a phosphazene flame retardant; the tetrabromobisphenol A high-brominated epoxy resin can be decomposed at high temperature to generate hydrogen bromide, and the hydrogen bromide can capture free radicals in a combustion chain reaction, so that the combustion process is interrupted, and the flame-retardant effect is achieved. According to the invention, the flame retardance can be improved in multiple ways, and the flame-retardant effect is ensured, so that the flame-retardant coating has higher stability when encountering a flame or high-temperature environment, the bonding firmness of a copper-clad plate is ensured, and the actual use effect is relatively good.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesives, and more specifically, to an adhesive formulation for copper-clad boards. Background Art

[0002] Adhesive for copper clad laminate is a material specially used to bond copper foil to substrate. Its performance directly affects the overall quality and performance of copper clad laminate. Although existing adhesives can be used normally, their flame retardant effect is not good. If they encounter flames or high temperature environments, problems are likely to occur, thereby affecting the bonding strength of the copper clad laminate, making the existing adhesives ineffective when applied to copper clad laminate.

[0003] Therefore, there is an urgent need for an adhesive formulation for copper clad laminates to solve the above problems. Summary of the invention

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides an adhesive formulation for copper clad laminates. The present invention can improve the flame retardancy in multiple ways and ensure the flame retardant effect, so that the present invention has higher stability when encountering flames or high temperature environments, thereby ensuring the bonding firmness of the copper clad laminates and having better actual use effects, thereby solving the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: A formulation of an adhesive for copper clad laminates, comprising the following components in parts by mass: Epoxy resin 100-150 parts; 5-15 parts of imidazole curing agent; 20-40 parts of carboxyl-terminated liquid nitrile rubber; 1-4 parts of 3,4-diaminodiphenyl sulfone; 5-15 parts of bismaleimide; 20-40 parts of tetrabromobisphenol A high brominated epoxy resin; 10-20 parts of phosphorus-containing phenolic epoxy resin; 5-10 parts of aluminum hydroxide; 10-15 parts of phosphazene flame retardant.

[0006] In a preferred embodiment, the tetrabromobisphenol A high-brominated epoxy resin can decompose at high temperature to produce hydrogen bromide, which can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect.

[0007] In a preferred embodiment, the bismaleimide can improve the heat resistance and cross-linking density of the adhesive to a certain extent, and enhance the flame retardant effect.

[0008] In a preferred embodiment, the aluminum hydroxide decomposes to produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material.

[0009] In a preferred embodiment, the phosphazene flame retardant contains phosphorus and nitrogen elements in its molecular structure, which can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction.

[0010] In a preferred embodiment, the 3,4-diaminodiphenyl sulfone undergoes a cross-linking reaction with epoxy groups in a resin system such as an epoxy resin to form a stable network structure, thereby curing the adhesive.

[0011] Technical effects and advantages of the present invention: The invention comprises 100-150 parts of epoxy resin, 5-15 parts of imidazole curing agent, 20-40 parts of carboxyl-terminated liquid nitrile rubber, 1-4 parts of 3,4-diaminodiphenyl sulfone, 5-15 parts of bismaleimide, 20-40 parts of tetrabromobisphenol A high-brominated epoxy resin, 10-20 parts of phosphorus-containing phenolic epoxy resin, 5-10 parts of aluminum hydroxide, and 10-15 parts of phosphazene flame retardant. By adding tetrabromobisphenol A high-brominated epoxy resin, it can decompose and generate hydrogen bromide at high temperature. The hydrogen bromide can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect. By adding bismaleimide, the heat resistance and heat resistance of the adhesive can be improved to a certain extent. The cross-linking density is increased, and the flame retardant effect is enhanced. By adding aluminum hydroxide, it will decompose and produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material. By adding phosphazene flame retardant, its molecular structure contains phosphorus and nitrogen elements, which can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction. The present invention can improve the flame retardancy in multiple ways and ensure the flame retardant effect, so that the present invention has higher stability when encountering flames or high temperature environments, ensuring the bonding firmness of the copper clad foil board, and the actual use effect is better. DETAILED DESCRIPTION

[0012] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0013] Example 1 The present invention provides a formulation of an adhesive for a copper-clad laminate, comprising the following components in parts by weight: Epoxy resin 100 parts; 5 parts of imidazole curing agent; 20 parts of carboxyl-terminated liquid nitrile rubber; 1 part of 3,4-diaminodiphenyl sulfone; 5 parts of bismaleimide; 20 parts of tetrabromobisphenol A high brominated epoxy resin; 10 parts of phosphorus-containing phenolic epoxy resin; 5 parts of aluminum hydroxide; 10 parts of phosphazene flame retardant.

[0014] The tetrabromobisphenol A high-brominated epoxy resin can decompose at high temperature to generate hydrogen bromide, and the hydrogen bromide can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect.

[0015] The bismaleimide can improve the heat resistance and cross-linking density of the adhesive to a certain extent, and enhance the flame retardant effect.

[0016] The aluminum hydroxide will decompose to produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material.

[0017] The phosphazene flame retardant contains phosphorus and nitrogen elements in its molecular structure, and can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction.

[0018] The 3,4-diaminodiphenyl sulfone undergoes a cross-linking reaction with epoxy groups in a resin system such as an epoxy resin to form a stable network structure, thereby curing the adhesive.

[0019] The adhesive for copper clad laminates prepared in this embodiment has better flame retardant effect. By adding tetrabromobisphenol A high-brominated epoxy resin, it can decompose at high temperature to produce hydrogen bromide, which can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect. By adding bismaleimide, the heat resistance and cross-linking density of the adhesive can be improved to a certain extent, and the flame retardant effect can be enhanced. By adding aluminum hydroxide, it will decompose when heated to produce water vapor, which can dilute the concentration of combustible gases and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material. By adding phosphazene flame retardant, its molecular structure contains phosphorus and nitrogen elements, which can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction, multiple improvements in flame retardancy, and ensuring the flame retardant effect.

[0020] Example 2 The present invention provides a formulation of an adhesive for a copper-clad laminate, comprising the following components in parts by weight: Epoxy resin 110 parts; Imidazole curing agent 10 parts; 25 parts of carboxyl-terminated liquid nitrile rubber; 2 parts of 3,4-diaminodiphenyl sulfone; 10 parts of bismaleimide; 25 parts of tetrabromobisphenol A high brominated epoxy resin; 10 parts of phosphorus-containing phenolic epoxy resin; 5 parts of aluminum hydroxide; 10 parts of phosphazene flame retardant.

[0021] The tetrabromobisphenol A high-brominated epoxy resin can decompose at high temperature to generate hydrogen bromide, and the hydrogen bromide can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect.

[0022] The bismaleimide can improve the heat resistance and cross-linking density of the adhesive to a certain extent, and enhance the flame retardant effect.

[0023] The aluminum hydroxide will decompose to produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material.

[0024] The phosphazene flame retardant contains phosphorus and nitrogen elements in its molecular structure, and can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction.

[0025] The 3,4-diaminodiphenyl sulfone undergoes a cross-linking reaction with epoxy groups in a resin system such as an epoxy resin to form a stable network structure, thereby curing the adhesive.

[0026] The adhesive for copper clad laminates prepared in this embodiment has better flame retardant effect. By adding tetrabromobisphenol A high-brominated epoxy resin, it can decompose at high temperature to produce hydrogen bromide, which can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect. By adding bismaleimide, the heat resistance and cross-linking density of the adhesive can be improved to a certain extent, and the flame retardant effect can be enhanced. By adding aluminum hydroxide, it will decompose when heated to produce water vapor, which can dilute the concentration of combustible gases and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material. By adding phosphazene flame retardant, its molecular structure contains phosphorus and nitrogen elements, which can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction, multiple improvements in flame retardancy, and ensuring the flame retardant effect.

[0027] Example 3 The present invention provides a formulation of an adhesive for a copper-clad laminate, comprising the following components in parts by weight: Epoxy resin 120 parts; Imidazole curing agent 10 parts; 30 parts of carboxyl-terminated liquid nitrile rubber; 3 parts of 3,4-diaminodiphenyl sulfone; 10 parts of bismaleimide; 30 parts of tetrabromobisphenol A high brominated epoxy resin; 15 parts of phosphorus-containing phenolic epoxy resin; 5 parts of aluminum hydroxide; 15 parts of phosphazene flame retardant.

[0028] The tetrabromobisphenol A high-brominated epoxy resin can decompose at high temperature to generate hydrogen bromide, and the hydrogen bromide can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect.

[0029] The bismaleimide can improve the heat resistance and cross-linking density of the adhesive to a certain extent, and enhance the flame retardant effect.

[0030] The aluminum hydroxide will decompose to produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material.

[0031] The phosphazene flame retardant contains phosphorus and nitrogen elements in its molecular structure, and can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction.

[0032] The 3,4-diaminodiphenyl sulfone undergoes a cross-linking reaction with epoxy groups in a resin system such as an epoxy resin to form a stable network structure, thereby curing the adhesive.

[0033] The adhesive for copper clad laminates prepared in this embodiment has better flame retardant effect. By adding tetrabromobisphenol A high-brominated epoxy resin, it can decompose at high temperature to produce hydrogen bromide, which can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect. By adding bismaleimide, the heat resistance and cross-linking density of the adhesive can be improved to a certain extent, and the flame retardant effect can be enhanced. By adding aluminum hydroxide, it will decompose when heated to produce water vapor, which can dilute the concentration of combustible gases and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material. By adding phosphazene flame retardant, its molecular structure contains phosphorus and nitrogen elements, which can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction, multiple improvements in flame retardancy, and ensuring the flame retardant effect.

[0034] Example 4 The present invention provides a formulation of an adhesive for a copper-clad laminate, comprising the following components in parts by weight: Epoxy resin 130 parts; Imidazole curing agent 10 parts; 35 parts of carboxyl-terminated liquid nitrile rubber; 3 parts of 3,4-diaminodiphenyl sulfone; 15 parts of bismaleimide; 35 parts of tetrabromobisphenol A high brominated epoxy resin; 15 parts of phosphorus-containing phenolic epoxy resin; 10 parts of aluminum hydroxide; 10 parts of phosphazene flame retardant.

[0035] The tetrabromobisphenol A high-brominated epoxy resin can decompose at high temperature to generate hydrogen bromide, and the hydrogen bromide can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect.

[0036] The bismaleimide can improve the heat resistance and cross-linking density of the adhesive to a certain extent, and enhance the flame retardant effect.

[0037] The aluminum hydroxide will decompose to produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material.

[0038] The phosphazene flame retardant contains phosphorus and nitrogen elements in its molecular structure, and can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction.

[0039] The 3,4-diaminodiphenyl sulfone undergoes a cross-linking reaction with epoxy groups in a resin system such as an epoxy resin to form a stable network structure, thereby curing the adhesive.

[0040] The adhesive for copper clad laminates prepared in this embodiment has better flame retardant effect. By adding tetrabromobisphenol A high-brominated epoxy resin, it can decompose at high temperature to produce hydrogen bromide, which can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect. By adding bismaleimide, the heat resistance and cross-linking density of the adhesive can be improved to a certain extent, and the flame retardant effect can be enhanced. By adding aluminum hydroxide, it will decompose when heated to produce water vapor, which can dilute the concentration of combustible gases and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material. By adding phosphazene flame retardant, its molecular structure contains phosphorus and nitrogen elements, which can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction, multiple improvements in flame retardancy, and ensuring the flame retardant effect.

[0041] Example 5 The present invention provides a formulation of an adhesive for a copper-clad laminate, comprising the following components in parts by mass: Epoxy resin 150 parts; 15 parts of imidazole curing agent; 40 parts of carboxyl-terminated liquid nitrile rubber; 4 parts of 3,4-diaminodiphenyl sulfone; 15 parts of bismaleimide; 40 parts of tetrabromobisphenol A high brominated epoxy resin; 20 parts of phosphorus-containing phenolic epoxy resin; 10 parts of aluminum hydroxide; 15 parts of phosphazene flame retardant.

[0042] The tetrabromobisphenol A high-brominated epoxy resin can decompose at high temperature to generate hydrogen bromide, and the hydrogen bromide can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect.

[0043] The bismaleimide can improve the heat resistance and cross-linking density of the adhesive to a certain extent, and enhance the flame retardant effect.

[0044] The aluminum hydroxide will decompose to produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material.

[0045] The phosphazene flame retardant contains phosphorus and nitrogen elements in its molecular structure, and can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction.

[0046] The 3,4-diaminodiphenyl sulfone undergoes a cross-linking reaction with epoxy groups in a resin system such as an epoxy resin to form a stable network structure, thereby curing the adhesive.

[0047] The adhesive for copper clad laminates prepared in this embodiment has better flame retardant effect. By adding tetrabromobisphenol A high-brominated epoxy resin, it can decompose at high temperature to produce hydrogen bromide, which can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect. By adding bismaleimide, the heat resistance and cross-linking density of the adhesive can be improved to a certain extent, and the flame retardant effect can be enhanced. By adding aluminum hydroxide, it will decompose when heated to produce water vapor, which can dilute the concentration of combustible gases and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material. By adding phosphazene flame retardant, its molecular structure contains phosphorus and nitrogen elements, which can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction, multiple improvements in flame retardancy, and ensuring the flame retardant effect.

[0048] The invention comprises 100-150 parts of epoxy resin, 5-15 parts of imidazole curing agent, 20-40 parts of carboxyl-terminated liquid nitrile rubber, 1-4 parts of 3,4-diaminodiphenyl sulfone, 5-15 parts of bismaleimide, 20-40 parts of tetrabromobisphenol A high-brominated epoxy resin, 10-20 parts of phosphorus-containing phenolic epoxy resin, 5-10 parts of aluminum hydroxide, and 10-15 parts of phosphazene flame retardant. By adding tetrabromobisphenol A high-brominated epoxy resin, it can decompose and generate hydrogen bromide at high temperature. The hydrogen bromide can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect. By adding bismaleimide, the heat resistance and heat resistance of the adhesive can be improved to a certain extent. The cross-linking density is increased, and the flame retardant effect is enhanced. By adding aluminum hydroxide, it will decompose and produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material. By adding phosphazene flame retardant, its molecular structure contains phosphorus and nitrogen elements, which can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction. The present invention can improve the flame retardancy in multiple ways and ensure the flame retardant effect, so that the present invention has higher stability when encountering flames or high temperature environments, ensuring the bonding firmness of the copper clad foil board, and the actual use effect is better.

[0049] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A copper-clad laminate adhesive formulation, characterized in that: The composition includes the following components in parts by weight: Epoxy resin 100-150 parts; 5-15 parts of imidazole curing agent; 20-40 parts of carboxyl-terminated liquid nitrile rubber; 1-4 parts of 3,4-diaminodiphenyl sulfone; 5-15 parts of bismaleimide; 20-40 parts of tetrabromobisphenol A high brominated epoxy resin; 10-20 parts of phosphorus-containing phenolic epoxy resin; 5-10 parts of aluminum hydroxide; 10-15 parts of phosphazene flame retardant.

2. The adhesive formulation for copper clad laminate according to claim 1, characterized in that: The tetrabromobisphenol A high-brominated epoxy resin can decompose at high temperature to generate hydrogen bromide, and the hydrogen bromide can capture free radicals in the combustion chain reaction, thereby interrupting the combustion process and achieving a flame retardant effect.

3. The adhesive formulation for copper clad laminate according to claim 1, characterized in that: The bismaleimide can improve the heat resistance and cross-linking density of the adhesive to a certain extent, and enhance the flame retardant effect.

4. The adhesive formulation for copper clad laminate according to claim 1, characterized in that: The aluminum hydroxide will decompose to produce water vapor when heated. The water vapor can dilute the concentration of combustible gas and reduce the combustion temperature, thereby playing a flame retardant role. The decomposition product of aluminum hydroxide, aluminum oxide, is also a good refractory material, which can further improve the flame retardancy of the material.

5. The adhesive formulation for copper clad laminate according to claim 1, characterized in that: The phosphazene flame retardant contains phosphorus and nitrogen elements in its molecular structure, and can form stable phosphates and nitrides during the combustion process, thereby blocking the combustion chain reaction.

6. The adhesive formulation for copper clad laminate according to claim 1, characterized in that: The 3,4-diaminodiphenyl sulfone undergoes a cross-linking reaction with epoxy groups in a resin system such as an epoxy resin to form a stable network structure, thereby curing the adhesive.