Abnormity processing method and system for semiconductor equipment

Abstract

The invention discloses an exception handling method and system for semiconductor equipment, and belongs to the technical field of exception handling of multi-cavity semiconductor equipment, and the method comprises the steps: obtaining a first signal type of a first exception signal in response to the obtained set first exception signal of the semiconductor equipment, and generating an exception handling method corresponding to the first signal type, the first signal type comprises one or more combinations of an independent system abnormal signal, a shared system abnormal signal and an environment abnormal signal; and in response to processing the exception of the semiconductor equipment, acquiring a second exception signal of the semiconductor equipment, acquiring a second signal type of the second exception signal, matching the second signal type with the first signal type, acquiring an exception processing method according to a matching result, and performing exception processing on the semiconductor equipment. According to the invention, different processing measures are adopted for different types of abnormities, the substrate is protected to the greatest extent, the processing efficiency is considered, and extra loss is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of abnormality processing of multi-cavity semiconductor equipment, and in particular to an abnormality processing method and system for semiconductor equipment. Background Art

[0002] In order to improve production efficiency, in the epitaxial or oxidation process, semiconductor equipment usually has multiple reaction chambers to process epitaxial or oxidation processes at the same time, and multiple reaction chambers usually share some auxiliary systems, such as gas supply, cooling, substrate transmission, vacuum holding system, etc. Correspondingly, these auxiliary systems and each chamber system are equipped with corresponding sensors to detect the status of different systems, etc. For the above systems, if a certain system is abnormal, how to deal with it under the premise of minimizing losses requires detailed planning.

[0003] For multi-cavity semiconductor equipment, in addition to the reaction chamber, multiple chambers share some auxiliary systems, such as gas supply, cooling, substrate transfer, vacuum holding system, etc. Correspondingly, these auxiliary systems and each chamber system are equipped with corresponding sensors to detect the status of different systems. During the operation, it is inevitable that some systems will have abnormalities. Therefore, how to deal with these abnormalities to ensure the minimum loss requires detailed planning. Summary of the invention

[0004] In order to solve the above problems, the purpose of the present invention is to design an exception handling technology for semiconductor equipment, classify the exceptions, and install different processing strategies to reduce the loss to the entire system.

[0005] In order to achieve the above technical objectives, the present application provides an exception handling method for semiconductor equipment, comprising the following steps: In response to acquiring a first abnormal signal of a set semiconductor device, acquiring a first signal type of the first abnormal signal, and generating an abnormality processing method corresponding to the first signal type, wherein the first signal type includes one or more combinations of independent system abnormal signals, common system abnormal signals, and environmental abnormal signals; In response to processing an abnormality of the semiconductor device, a second abnormal signal of the semiconductor device is collected, a second signal type of the second abnormal signal is obtained, and matched with the first signal type, and an abnormality processing method is obtained according to the matching result to perform abnormal processing on the semiconductor device.

[0006] Preferably, in the process of acquiring the first signal type, the independent system abnormality signal includes: motion abnormality, position abnormality and state abnormality for a single chamber.

[0007] Preferably, in the process of acquiring the first signal type, the common system abnormality signal is an abnormality signal for a common system of the semiconductor device, including: an abnormality for a common gas supply system and an abnormality for a transmission system.

[0008] Preferably, in the process of acquiring the first signal type, the environmental abnormality signal includes: an abnormal signal emitted when the external vacuum degree, temperature or a certain gas concentration exceeds a threshold value, wherein the temperature represents the ambient temperature of the device.

[0009] Preferably, in the process of generating the exception handling method corresponding to the first signal type, in response to an abnormal signal occurring in an independent system, the equipment correction program is first started for this independent system, and the common system is controlled by the control system to skip this independent system, and only the work of other independent systems is processed; at this time, the corresponding processing strategy is started for this abnormal independent system to handle it.

[0010] Preferably, in the process of generating the exception handling method corresponding to the first signal type, in response to the occurrence of the environmental abnormality signal, the emergency handling procedure for each individual system is directly started to keep each system in a closed state to prevent the substrate from being contaminated, and at the same time, the heating system and the radio frequency system are turned off, and the reaction chamber returns to the set state.

[0011] Preferably, in the process of generating an exception handling method corresponding to the first signal type, in response to an abnormality in the shared system, the type of abnormality in the shared system is first determined; if an abnormality occurs in the intermittently used system, the reaction process is started to enter the protection model according to the state of the reaction device of the intermittently used system; if a fault occurs in the continuously used shared system, the protection mode is directly entered; the protection mode is as follows: first shut down the gas supply system, then gradually reduce the power of the heating system and the radio frequency system according to the set steps, and finally return to the set state.

[0012] The present invention discloses an abnormality handling system for semiconductor equipment, comprising: A data acquisition and analysis module, used to obtain a first abnormal signal of a set semiconductor device, obtain a first signal type of the first abnormal signal, and generate an abnormality processing method corresponding to the first signal type, wherein the first signal type includes one or more combinations of independent system abnormal signals, common system abnormal signals, and environmental abnormal signals; The abnormality diagnosis and processing module is used to collect the second abnormality signal of the semiconductor device, obtain the second signal type of the second abnormal signal, match it with the first signal type, obtain the abnormality processing method according to the matching result, and perform abnormal processing on the semiconductor device.

[0013] Preferably, the data acquisition and analysis module is also used to treat the signals of motion abnormality, position abnormality and state abnormality of a single chamber as independent system abnormality signals; to treat the signals of abnormality of the common gas supply system and abnormality of the transmission system as common system abnormality signals; and to treat the abnormal signals emitted by the external vacuum degree, temperature or a certain gas concentration exceeding a threshold as environmental abnormality signals, wherein the temperature represents the ambient temperature of the device.

[0014] Preferably, the data acquisition and analysis module is further used for, in the process of generating the exception handling method corresponding to the first signal type, in response to an abnormal signal appearing in the independent system, first starting the equipment correction program for the independent system, and controlling the common system through the control system to skip the independent system, and only processing the work of other independent systems; at this time, starting the corresponding processing strategy for the abnormal independent system to process it; In the process of generating the exception handling method corresponding to the first signal type, in response to the appearance of the environmental abnormality signal, the emergency handling procedure for each individual system is directly started, so that each system is kept in a closed state to prevent the substrate from being contaminated, and the heating system and the radio frequency system are turned off at the same time, and the reaction chamber returns to the set state; In the process of generating the exception handling method corresponding to the first signal type, in response to an abnormality in the shared system, the type of the common system abnormality is first determined. If an abnormality occurs in the intermittently used system, the reaction process is started to enter the protection model according to the state of the reaction device of the intermittently used system; if a fault occurs in the continuously used shared system, the protection mode is directly entered; the protection mode is as follows: first shut down the gas supply system, then gradually reduce the power of the heating system and the radio frequency system according to the set steps, and finally return to the set state.

[0015] The present invention discloses the following technical effects: The present invention adopts different processing measures for different types of abnormalities, thereby protecting the substrate to the greatest extent, taking into account the processing efficiency, and avoiding additional losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the method flow of the present invention. DETAILED DESCRIPTION

[0018] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0019] like Figure 1 As shown, the present invention provides an exception handling method for semiconductor equipment, comprising the following steps: In response to acquiring a first abnormal signal of a set semiconductor device, acquiring a first signal type of the first abnormal signal, and generating an abnormality processing method corresponding to the first signal type, wherein the first signal type includes one or more combinations of independent system abnormal signals, common system abnormal signals, and environmental abnormal signals; In response to processing an abnormality of the semiconductor device, a second abnormal signal of the semiconductor device is collected, a second signal type of the second abnormal signal is obtained, and matched with the first signal type, and an abnormality processing method is obtained according to the matching result to perform abnormal processing on the semiconductor device.

[0020] When the present invention performs exception processing, the second abnormal signal is one or more. When there are multiple abnormal signals, the signal type of each abnormal signal is determined, and whether there is a correlation between the signal types is analyzed. If there is, the execution priority or execution order of the abnormal processing method is determined according to the correlation relationship. If there is no relationship, the abnormal processing is performed according to the response priority of the signal. The process of abnormal processing can also be designed as distributed processing, wherein the first abnormal signal represents one of the three types of signals: independent system abnormality, common system and environmental abnormality signal, and the second abnormal signal represents the abnormal signal emitted by the collected semiconductor setting, including a combination of one or more of the three types of signals: independent system abnormality, common system and environmental abnormality signal. Further, in the abnormal processing, the collected second abnormal signal is matched with the first abnormal signal, that is, the abnormal signal type emitted by the semiconductor setting is obtained, and the abnormal signal is processed according to the abnormal processing means of the first abnormal signal. That is to say, it is also necessary to understand the signal type included in the first abnormal signal as the first signal type, and when performing abnormal signal matching and identification, the signal type of the second abnormal signal can be obtained as the second signal type according to the matching and identification results, thereby achieving accurate matching of the signal types.

[0021] Further preferably, in the abnormality handling method for semiconductor equipment proposed by the present invention, in the process of acquiring the first signal type, the independent system abnormality signal includes: motion abnormality, position abnormality and state abnormality for a single chamber.

[0022] Further preferably, in the abnormality handling method for semiconductor equipment proposed by the present invention, in the process of obtaining the first signal type, the common system abnormality signal is an abnormality signal for the common system of the semiconductor equipment, including: abnormalities for the common gas supply system and abnormalities for the transmission system.

[0023] Further preferably, in the abnormality handling method for semiconductor equipment proposed by the present invention, in the process of obtaining the first signal type, the environmental abnormality signal includes: an abnormal signal emitted when the external vacuum degree, temperature or a certain gas concentration exceeds a threshold, wherein the temperature represents the ambient temperature of the device.

[0024] Further preferably, in the exception handling method for semiconductor equipment proposed in the present invention, in the process of generating the exception handling method corresponding to the first signal type, in response to an abnormal signal occurring in an independent system, a device correction program is first started for this independent system, and the common system is controlled by the control system to skip this independent system, and only the work of other independent systems is processed; at this time, the corresponding processing strategy is started for this abnormal independent system to process it.

[0025] Further preferably, the exception handling method for semiconductor equipment proposed in the present invention, in the process of generating the exception handling method corresponding to the first signal type, directly starts the emergency handling procedure for each individual system in response to the occurrence of an environmental abnormality signal, so that each system remains in a closed state to prevent the substrate from being contaminated, and at the same time shuts down the heating system and the radio frequency system, and returns the reaction chamber to the set state.

[0026] Further preferably, in the exception handling method for semiconductor equipment proposed in the present invention, in the process of generating the exception handling method corresponding to the first signal type, in response to an abnormality in the common system, the type of the abnormality in the common system is first determined; if the abnormality occurs in the intermittently used system, the reaction process is started to enter the protection mode according to the state of the reaction device of the intermittently used system; if the common system that is continuously used fails, the protection mode is directly entered; wherein the protection mode is: first shut down the gas supply system, and then gradually reduce the power of the heating system and the radio frequency system according to the set steps, and finally return to the set state.

[0027] In order to implement the above-mentioned exception handling method for semiconductor equipment, the present invention discloses an exception handling system for semiconductor equipment, including: A data acquisition and analysis module, used to obtain a first abnormal signal of a set semiconductor device, obtain a first signal type of the first abnormal signal, and generate an abnormality processing method corresponding to the first signal type, wherein the first signal type includes one or more combinations of independent system abnormal signals, common system abnormal signals, and environmental abnormal signals; The abnormality diagnosis and processing module is used to collect the second abnormality signal of the semiconductor device, obtain the second signal type of the second abnormal signal, match it with the first signal type, obtain the abnormality processing method according to the matching result, and perform abnormal processing on the semiconductor device.

[0028] Further preferably, the data acquisition and analysis module of the system is also used to treat the signals of motion abnormality, position abnormality and state abnormality of a single chamber as independent system abnormality signals; to treat the signals of abnormality of the common gas supply system and abnormality of the transmission system as common system abnormality signals; and to treat the abnormal signals emitted by the external vacuum degree, temperature or a certain gas concentration exceeding a threshold as environmental abnormality signals, wherein the temperature represents the ambient temperature of the device.

[0029] Further preferably, the data acquisition and analysis module of the system is also used for, in the process of generating the exception handling method corresponding to the first signal type, in response to an abnormal signal appearing in the independent system, first starting the equipment correction program for the independent system, and controlling the common system through the control system to skip the independent system, and only processing the work of other independent systems; at this time, starting the corresponding processing strategy for the abnormal independent system to process it; In the process of generating the exception handling method corresponding to the first signal type, in response to the appearance of the environmental abnormality signal, the emergency handling procedure for each individual system is directly started, so that each system is kept in a closed state to prevent the substrate from being contaminated, and the heating system and the radio frequency system are turned off at the same time, and the reaction chamber returns to the set state; In the process of generating the exception handling method corresponding to the first signal type, in response to an abnormality in the shared system, the type of the common system abnormality is first determined. If an abnormality occurs in the intermittently used system, the reaction process is started to enter the protection model according to the state of the reaction device of the intermittently used system; if a fault occurs in the continuously used shared system, the protection mode is directly entered; the protection mode is as follows: first shut down the gas supply system, then gradually reduce the power of the heating system and the radio frequency system according to the set steps, and finally return to the set state.

[0030] The focus of the present invention is on the setting of exception handling rules.

[0031] Abnormal signals are divided into three categories: independent system abnormalities, shared system abnormalities and environmental abnormalities.

[0032] Independent system abnormality signals include abnormalities for a single chamber, including movement abnormalities for a single chamber (detected by position switches, etc., such as detecting whether it is rotating), position abnormalities (detected by position sensors to determine whether the rising or falling position is normal), and state abnormalities (detection signals obtained by temperature, pressure and other sensors).

[0033] The common system abnormal signals are mainly for the abnormal signals of the common system, such as the abnormalities of the common gas supply system (such as air pressure) and the abnormalities of the transmission system (robotic arm) (such as abnormal functions of the robotic arm, such as failure of the robotic arm control motor or sensor).

[0034] Environmental abnormality signals, such as abnormal signals emitted by external vacuum (for example, the entire system is in an environment that requires a certain vacuum), temperature (the ambient temperature of the device), or a certain gas concentration exceeding a threshold (such as toxic gas leakage).

[0035] If an abnormal signal appears in an independent system, the equipment correction program will be started for this independent system. If the abnormality still exists after exceeding the set time threshold or the correction program is completed, the control system will control the common system to skip this independent system (or control the switch connected to this independent system to close, which will isolate the independent system from the entire system, such as the gas supply system does not supply gas to this system, or the manipulator no longer moves to this reaction chamber), and only process the work of other independent systems. At this time, for this abnormal independent system, the corresponding processing strategy will be started for processing (such as adjusting the working status of related systems according to the status of this independent system, such as shutting down the heating system and the radio frequency system, and maintaining a certain vacuum degree).

[0036] If an abnormal environmental signal appears, the emergency treatment procedure for each individual system is directly activated to keep each system in a closed state (i.e., the action of opening the chamber is prohibited) to prevent the substrate from being contaminated. At the same time, the heating system and the RF system are turned off, and the reaction chamber returns to the set state (such as the state at the beginning of the reaction).

[0037] If a common system has an abnormality, first determine the type of common system abnormality. If the robot arm has an abnormality (intermittent system use), check the state of the reaction chamber. After the reaction process is completed, enter the protection mode, and the chamber protection is closed and not opened to protect the substrate. If a common system that is used continuously (such as a gas supply system) fails, go directly to the protection mode. The protection mode is: first turn off the gas supply system, then gradually reduce the power of the heating system and the RF system according to the set steps, and finally return to the set state (such as the state at the beginning of the reaction), so as to protect the substrate to the greatest extent and prevent stress caused by rapid temperature changes.

[0038] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0039] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An abnormality handling method for semiconductor equipment, characterized in that: The following steps are involved: In response to acquiring a first abnormal signal of a set semiconductor device, acquiring a first signal type of the first abnormal signal, and generating an abnormality processing method corresponding to the first signal type, wherein the first signal type includes one or more combinations of independent system abnormal signals, common system abnormal signals, and environmental abnormal signals; In response to processing an abnormality of a semiconductor device, a second abnormal signal of the semiconductor device is collected, a second signal type of the second abnormal signal is obtained, and matched with the first signal type, and based on the matching result, the abnormality processing method is obtained to perform abnormal processing on the semiconductor device.

2. The method for handling an abnormality of a semiconductor device according to claim 1, characterized in that: In the process of acquiring the first signal type, the independent system abnormality signal includes: motion abnormality, position abnormality and state abnormality for a single chamber.

3. The method for handling an abnormality of a semiconductor device according to claim 2, characterized in that: In the process of acquiring the first signal type, the common system abnormality signal is an abnormality signal for the common system of the semiconductor device, including: an abnormality for a common gas supply system and an abnormality for a transmission system.

4. The method for handling an abnormality of a semiconductor device according to claim 3, characterized in that: In the process of acquiring the first signal type, the abnormal environment signal includes: an abnormal signal emitted when the external vacuum degree, temperature or a certain gas concentration exceeds a threshold, wherein the temperature represents the ambient temperature of the device.

5. The method for handling an abnormality of a semiconductor device according to claim 4, characterized in that: In the process of generating the exception handling method corresponding to the first signal type, in response to an abnormal signal occurring in an independent system, the equipment correction program is first started for this independent system, and the common system is controlled by the control system to skip this independent system, and only the work of other independent systems is processed; at this time, the corresponding processing strategy is started for this abnormal independent system to handle it.

6. The abnormality handling method for semiconductor equipment according to claim 5, characterized in that: In the process of generating the exception handling method corresponding to the first signal type, in response to the occurrence of the environmental abnormality signal, the emergency handling procedure for each individual system is directly started to keep each system in a closed state to prevent the substrate from being contaminated. At the same time, the heating system and the radio frequency system are turned off, and the reaction chamber returns to the set state.

7. The abnormality handling method for semiconductor equipment according to claim 6, characterized in that: In the process of generating the exception handling method corresponding to the first signal type, in response to an abnormality in the shared system, the type of the common system abnormality is first determined. If an abnormality occurs in the intermittently used system, the reaction process is started to enter the protection model according to the state of the reaction device of the intermittently used system; if a fault occurs in the continuously used shared system, the protection mode is directly entered; the protection mode is as follows: first shut down the gas supply system, then gradually reduce the power of the heating system and the radio frequency system according to the set steps, and finally return to the set state.

8. An abnormality handling system for semiconductor equipment, characterized in that: include: a data acquisition and analysis module, configured to acquire a first abnormal signal of a set semiconductor device, acquire a first signal type of the first abnormal signal, and generate an abnormality processing method corresponding to the first signal type, wherein the first signal type includes one or more combinations of an independent system abnormal signal, a common system abnormal signal, and an environmental abnormal signal; The abnormality diagnosis and processing module is used to collect the second abnormal signal of the semiconductor device, obtain the second signal type of the second abnormal signal, match it with the first signal type, obtain the abnormality processing method according to the matching result, and perform abnormal processing on the semiconductor device.

9. The abnormality handling system for semiconductor equipment according to claim 8, characterized in that: The data acquisition and analysis module is also used to use the signals of motion abnormality, position abnormality and state abnormality of a single chamber as independent system abnormality signals; use the signals of abnormality of the common gas supply system and abnormality of the transmission system as common system abnormality signals; use the abnormal signals emitted by the external vacuum degree, temperature or a certain gas concentration exceeding the threshold as environmental abnormality signals, wherein the temperature represents the ambient temperature of the device.

10. The abnormality handling system for semiconductor equipment according to claim 9, characterized in that: The data acquisition and analysis module is further used for, in the process of generating the exception handling method corresponding to the first signal type, in response to an abnormal signal appearing in the independent system, first starting the equipment correction program for the independent system, and controlling the common system through the control system to skip the independent system, and only processing the work of other independent systems; at this time, starting the corresponding processing strategy for the abnormal independent system to process it; In the process of generating the exception handling method corresponding to the first signal type, in response to the appearance of the environmental abnormality signal, the emergency handling procedure for each individual system is directly started, so that each system is kept in a closed state to prevent the substrate from being contaminated, and the heating system and the radio frequency system are turned off at the same time, and the reaction chamber returns to the set state; In the process of generating the exception handling method corresponding to the first signal type, in response to an abnormality in the shared system, the type of the common system abnormality is first determined. If an abnormality occurs in the intermittently used system, the reaction process is started to enter the protection model according to the state of the reaction device of the intermittently used system; if a fault occurs in the continuously used shared system, the protection mode is directly entered; the protection mode is as follows: first shut down the gas supply system, then gradually reduce the power of the heating system and the radio frequency system according to the set steps, and finally return to the set state.

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