Semiconductor chip cleaning machine

Abstract

The invention belongs to the technical field of semiconductors, and discloses a semiconductor chip cleaning machine which comprises two supporting plates, rotating discs are rotationally installed on the inner sides of the two supporting plates, a rotating motor is fixedly connected to the right side of the right rotating disc, and a supply mechanism is fixedly installed in the center of the interior of each rotating disc. The side, away from the supporting plate, of the supply mechanism communicates with a distribution valve assembly. The communication state between the first connecting shell and the supply mechanism is changed through the distribution valve assembly, so that the supporting plates move outwards or inwards, the distance between the supporting plates is adjusted to be matched with the size of a semiconductor chip to be cleaned, then a motor is controlled to work, a double-end lead screw is driven to rotate, and the semiconductor chip is cleaned. Therefore, the left clamping block and the right clamping block move close to the semiconductor chip, the semiconductor chip is clamped, and the problem that an existing fixing die can only be used for fixing the semiconductor chip of a certain specification and cannot fix the semiconductor chips of other specifications is solved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors, and in particular relates to a semiconductor chip cleaning machine. Background Art

[0002] Semiconductor chips, also often referred to as silicon chips or chips, are vital basic materials in the modern electronics industry and are used to manufacture various electronic devices, especially integrated circuits (ICs). Semiconductor chips are thin sheets made of semiconductor materials (the most common is silicon, but there are also other compound semiconductors such as gallium arsenide, silicon carbide, etc.), with conductivity properties between conductors and insulators. Its purity is extremely high, usually reaching more than 99.9999%, to ensure that electronic behavior at the microscopic scale is stable and predictable.

[0003] During the manufacturing process of wafers, it is necessary to sample and inspect the wafers. This is also a method of randomly selecting samples of wafers produced in the semiconductor manufacturing process for quality inspection. During the inspection process, wafers of different specifications need to be fixed and cleaned for subsequent testing. The existing cleaning method uses a specific fixed mold to fix multiple semiconductor chips at equal distances, and then puts the mold and the semiconductor chip into the cleaning tank to complete the simultaneous cleaning of multiple semiconductor chips. The existing fixed mold can only be used to fix semiconductor chips of a certain specification, and cannot be used to clean semiconductor chips of other specifications. Moreover, the fixed position of the existing fixed mold and the semiconductor chip cannot be contacted by the cleaning liquid, so it will not be cleaned by the cleaning liquid, and there will still be a small amount of chemical solution or impurities remaining, which will affect the subsequent work. In the process of semiconductor product production and processing, the wafer must be loaded and unloaded from the mold. The present invention can be considered as a dedicated cleaning of wafers of different specifications; secondly, there is no adjustability control of the fixed mold in the industry, but the present invention can theoretically control the adjustability of the mold, and the patent application needs to have a certain degree of creativity and novelty under the condition that the theory is feasible, which can be different from the actual production. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor chip cleaning machine to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor chip cleaning machine, comprising two support plates, rotating disks are rotatably installed on the inner sides of the two support plates, a rotating motor is fixedly connected to the right side of the rotating disk on the right side, a supply mechanism is fixedly installed on the inner center of the rotating disk, a distribution valve assembly is connected to the side of the supply mechanism away from the support plate, a connecting shell 1 is rotatably connected to the side of the distribution valve assembly away from the supply mechanism, a plurality of connecting columns are fixedly connected between the distribution valve assembly and the supply mechanism, a connecting shell 2 is rotatably connected to the side of the connecting shell 1 away from the distribution valve assembly, a plurality of adjusting rods are arranged on the curved surfaces of the connecting shell 1 and the connecting shell 2, a plurality of clamping mechanisms are fixedly connected between the two adjusting rods at the same horizontal position, a connecting pipe is fixedly connected to the rear side and the lower side of the distribution valve assembly, an arc tube is fixedly connected to the outer end of the connecting pipe, push rods are movably sleeved at both ends of the inner side of the arc tube, and a driving mechanism is arranged inside the rotating disk on the right side.

[0006] Preferably, the adjusting rod includes a rod body, a sliding block is slidably connected to the middle part of the rod body, T-shaped rods are fixedly connected to both sides of the sliding block, a compression spring is fixedly connected between the outer T-shaped rod and the rod body, a semi-arc plate is fixedly connected to the inner end of the rod body, a rotating rod is rotatably connected to the middle part of the sliding block, and a sealing movable plate is fixedly connected to the end of the rotating rod away from the support plate.

[0007] Preferably, the clamping mechanism includes a double-headed screw, a left slider and a right slider are threadedly connected to the middle part of the double-headed screw, a left clamping block is fixedly connected to the right side of the left slider, a right clamping block is fixedly connected to the left side of the right slider, and a limit rod is provided for the curved sliding connection between the right slider and the left slider. Multiple double-headed screws are fixedly connected head to tail, the rightmost double-headed screw and the leftmost double-headed screw are fixedly connected to the rotating rod, multiple limit rods are fixedly connected head to tail, and the rightmost limit rod and the leftmost limit rod are fixedly connected to the sealing movable sheet.

[0008] Preferably, the driving mechanism comprises a plurality of control motors, the output shafts of the control motors are fixedly connected to synchronous wheels, the control motors are slidably connected to the inner wall of the rotating disk, and the synchronous wheels are fixedly connected to one end of the rotating rod close to the support plate.

[0009] Preferably, the interiors of the connecting shell one and the connecting shell two are connected to the inner sides of the rod bodies, a group of two rod bodies on the same line are fixedly connected and connected to the connecting shell one, another group of two rod bodies on the same line are fixedly connected and connected to the connecting shell two, the rod bodies are slidably connected to the inner wall of the rotating disk, and the push rod is fixedly connected to the curved surface of the rod body.

[0010] Preferably, the threads on the left and right sides of the double-ended screw have opposite rotation directions, the left slider and the right slider are both adapted to the double-ended screw, and the left clamping block is adapted to the right clamping block.

[0011] The beneficial effects of the present invention are as follows:

[0012] 1. The present invention changes the connection state between the connecting shell 1 and the supply mechanism through the distribution valve assembly, so that the support plate moves outward or inward, thereby adjusting the spacing of the support plates to adapt to the size of the semiconductor chip to be cleaned, and controlling the motor to work, thereby driving the double-headed screw to rotate, so that the left clamping block and the right clamping block move close to the semiconductor chip, thereby clamping the semiconductor chip, thereby solving the problem that the existing fixed mold can only be used to fix semiconductor chips of a certain specification, and cannot fix semiconductor chips of other specifications.

[0013] 2. The present invention makes a part of the clamping mechanism no longer clamp the semiconductor chip during the cleaning process, changes the angle between the clamping mechanism and the clamping mechanism that clamps the semiconductor chip, and then clamps the semiconductor chip, thereby changing the position of the clamping mechanism that clamps the semiconductor chip. Similarly, the clamping position of another clamping mechanism is changed, so that the surface of the semiconductor chip is in contact with the cleaning liquid to complete the cleaning, thereby solving the problem that the fixed position of the existing fixed mold and the semiconductor chip cannot be contacted by the cleaning liquid, and thus will not be cleaned by the cleaning liquid, and a small amount of chemical solution or impurities will still remain.

[0014] 3. After cleaning, the present invention is taken out and located directly above the cleaning tank. The present invention works by rotating the motor to drive the rotating disk to rotate, the rotating disk drives the clamping mechanism to rotate, and the clamping mechanism drives the semiconductor chip to rotate. The centrifugal force generated during rotation will dry the cleaning liquid remaining on the semiconductor chip, and finally the cleaning liquid will fall into the cleaning tank. While the semiconductor chip is dried, the cleaning liquid brought out is recovered, thereby avoiding the waste of the cleaning liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure appearance of the present invention;

[0016] Figure 2 A half-section schematic diagram of a support plate of the present invention;

[0017] Figure 3 A half-section schematic diagram of a rotating disk of the present invention;

[0018] Figure 4 A half-section schematic diagram of the adjusting rod of the present invention;

[0019] Figure 5 It is a schematic diagram of the structure of the adjusting rod of the present invention;

[0020] Figure 6This is a structural schematic diagram of a connecting shell of the present invention;

[0021] Figure 7 It is a schematic diagram of the structure of the clamping mechanism of the present invention.

[0022] In the figure: 1. support plate; 2. rotating disk; 3. rotating motor; 4. supply mechanism; 5. distribution valve assembly; 6. connecting shell 1; 7. connecting column; 8. connecting shell 2; 9. adjusting rod; 91. rod body; 92. sliding block; 93. T-shaped rod; 94. compression spring; 95. semi-arc sheet; 96. sealing movable sheet; 97. rotating rod; 10. clamping mechanism; 101. double-headed screw; 102. left slider; 103. left clamping block; 104. right slider; 105. right clamping block; 106. limiting rod; 11. connecting pipe; 12. arc pipe; 13. pushing rod; 14. driving mechanism; 141. control motor; 142. synchronous wheel. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] like Figures 1 to 7As shown, an embodiment of the present invention provides a semiconductor chip cleaning machine, comprising two support plates 1, a rotating disk 2 is rotatably installed on the inner side of the two support plates 1, a rotating motor 3 is fixedly connected to the right side of the right rotating disk 2, a supply mechanism 4 is fixedly installed at the inner center of the rotating disk 2, a distribution valve assembly 5 is connected to the side of the supply mechanism 4 away from the support plate 1, a connecting shell 1 6 is rotatably connected to the side of the distribution valve assembly 5 away from the supply mechanism 4, a plurality of connecting columns 7 are fixedly connected between the distribution valve assembly 5 and the supply mechanism 4, a connecting shell 2 8 is rotatably connected to the side of the connecting shell 1 6 away from the distribution valve assembly 5, a plurality of adjusting rods 9 are arranged on the curved surfaces of the connecting shell 1 6 and the connecting shell 2 8, and a plurality of clamping rods 9 are fixedly connected between the two adjusting rods 9 at the same horizontal position. Mechanism 10, the rear side and the lower side of the distribution valve assembly 5 are fixedly connected with a connecting pipe 11, the outer end of the connecting pipe 11 is fixedly connected with an arc tube 12, and the inner ends of the arc tube 12 are movably sleeved with push rods 13. A driving mechanism 14 is arranged inside the right rotating disk 2, and its function is that after cleaning, the present invention is taken out and located directly above the cleaning pool. The present invention works by rotating the motor 3, driving the rotating disk 2 to rotate, the rotating disk 2 drives the clamping mechanism 10 to rotate, and the clamping mechanism 10 drives the semiconductor chip to rotate. The centrifugal force generated during rotation will dry the cleaning liquid remaining on the semiconductor chip, and finally the cleaning liquid will fall into the cleaning tank. While completing the drying of the semiconductor chip, the cleaning liquid brought out is recovered, thereby avoiding the waste of the cleaning liquid.

[0025] The adjusting rod 9 includes a rod body 91, a sliding block 92 is slidably connected to the middle of the rod body 91, T-shaped rods 93 are fixedly connected to both sides of the sliding block 92, a compression spring 94 is fixedly connected between the outer T-shaped rod 93 and the rod body 91, a semi-arc piece 95 is fixedly connected to the inner end of the rod body 91, a rotating rod 97 is rotatably connected to the middle of the sliding block 92, and a sealing movable piece 96 is fixedly connected to the end of the rotating rod 97 away from the support plate 1, whose function is that when the distribution valve assembly 5 connects the connecting shell 6 with the oil supply pipe of the supply mechanism 4, the hydraulic oil will enter the connecting shell 6 and the interior of the connecting column 7, and finally enter the inner end of the rod body 91, from The T-rod 93 and the sliding block 92 are pushed to move outward, and the outer T-rod 93 squeezes the compression spring 94, thereby increasing the distance between the clamping mechanisms 10; when the distribution valve assembly 5 connects the connecting shell 6 with the return oil pipe of the supply mechanism 4, the compression spring 94 stretches, thereby pushing the T-rod 93 and the sliding block 92 to move inward, thereby decreasing the distance between the clamping mechanisms 10, and the inner T-rod 93 squeezes the hydraulic oil out, and finally causes the internal hydraulic oil of the connecting shell 6 and the connecting column 7 to flow back into the supply mechanism 4, and the control motor 141 slides accordingly according to the changes of the clamping mechanism 10.

[0026] Among them, the clamping mechanism 10 includes a double-headed screw rod 101, a left slider 102 and a right slider 104 are threadedly connected in the middle part of the double-headed screw rod 101, a left clamping block 103 is fixedly connected to the right side of the left slider 102, and a right clamping block 105 is fixedly connected to the left side of the right slider 104. The right slider 104 and the left slider 102 are connected to a limit rod 106 in a curved sliding connection, and multiple double-headed screw rods 101 are fixedly connected at the head and tail, the rightmost double-headed screw rod 101 and the leftmost double-headed screw rod 101 are fixedly connected to the rotating rod 97, and multiple limit rods 106 are fixedly connected at the head and tail, and the rightmost limit rod 106 and the leftmost limit rod 106 are It is fixedly connected to the sealing movable sheet 96, and its function is, during the cleaning process, to make a part of the clamping mechanism 10 no longer clamp the semiconductor chip, and to change the angle between it and the clamping mechanism 10 that clamps the semiconductor chip, so as to clamp the semiconductor chip again, thereby changing the position of the clamping mechanism 10 that clamps the semiconductor chip, and similarly changing the clamping position of another clamping mechanism 10, so that the surface of the semiconductor chip is in contact with the cleaning liquid, and the cleaning is completed, thereby solving the problem that the fixed position of the existing fixed mold and the semiconductor chip cannot be contacted by the cleaning liquid, and thus will not be cleaned by the cleaning liquid, and there will still be a small amount of chemical solution or impurities.

[0027] The driving mechanism 14 includes a plurality of control motors 141, the output shaft of the control motor 141 is fixedly connected to the synchronous wheel 142, the control motor 141 is slidably connected to the inner wall of the rotating disk 2, the synchronous wheel 142 is fixedly connected to one end of the rotating rod 97 close to the support plate 1, the interior of the connecting shell 1 6 and the connecting shell 2 8 are connected to the inner side of the rod body 91, a group of two rod bodies 91 on the same line are fixedly connected and connected to the connecting shell 1 6, and another group of two rod bodies 91 on the same line are fixedly connected and connected to the connecting shell 2 8, the rod body 91 is slidably connected to the inner wall of the rotating disk 2, and a push rod 13 is fixedly connected to the curved surface of the rod body 91, the left and right sides of the double-headed screw 101 have opposite threads, and the left slider 102 The right slider 104 is adapted to the double-headed screw 101, and the left clamping block 103 is adapted to the right clamping block 105. Its function is to change the connection state between the connecting shell 6 and the supply mechanism 4 through the distribution valve assembly 5, so that the clamping mechanism 10 moves outward or inward, so as to adjust the spacing of the clamping mechanism 10 to adapt to the size of the semiconductor chip to be cleaned, and control the motor 141 to work, thereby driving the double-headed screw 101 to rotate, so that the left clamping block 103 and the right clamping block 105 move close to the semiconductor chip, thereby clamping the semiconductor chip, thereby solving the problem that the existing fixed mold can only be used to fix semiconductor chips of a certain specification, and cannot fix semiconductor chips of other specifications.

[0028] Working principle:

[0029] Before the present invention is used, the interior of the connecting shell 1 6 and the connecting shell 2 8, the inner end of the rod body 91, and the interior of the arc tube 12 are all filled with hydraulic oil, and the distribution valve assembly 5 makes the two connecting pipes 11 and the supply mechanism 4 in a disconnected state, so that the supply mechanism 4 is disconnected from the interior of the connecting shell 1 6;

[0030] When the present invention is used, the connection state between the connection shell 6 and the supply mechanism 4 is changed by the distribution valve assembly 5, so that the clamping mechanism 10 moves outward or inward, so that the spacing of the clamping mechanism 10 is adjusted to fit the size of the semiconductor chip to be cleaned. After the adjustment is completed, the distribution valve assembly 5 disconnects the supply mechanism 4 from the inside of the connection shell 6, and then the semiconductor chip is placed between the left slider 102 and the right slider 104, and the control motor 141 works, and the synchronous wheel 142 on the output shaft of the control motor 141 rotates. The rotation of the synchronous wheel 142 causes the rotating rod 97 to rotate, and the rotation of the rotating rod 97 drives the double-headed screw 101 to rotate. Due to the limitation of the limit rod 106, the left clamping block 103 and the right clamping block 105 move close to the semiconductor chip, thereby clamping the semiconductor chip;

[0031] The present invention is placed in a cleaning tank through an existing device, and the support plate 1 contacts the bottom of the cleaning tank, so that the clamped semiconductor chip is cleaned. During the cleaning process, the two adjusting rods 9 fixedly connected to the connecting shell 2 8 control the motor 141 to reverse, thereby driving the corresponding left slider 102 and right slider 104 away from the semiconductor chip, and then the distribution valve assembly 5 connects one of the connecting pipes 11 with the oil supply pipe of the supply mechanism 4, and connects the other connecting pipe 11 with the oil return pipe of the supply mechanism 4. The hydraulic oil in the supply mechanism 4 will enter the interior of the connecting pipe 11 connected thereto, thereby pushing the push rod 13 to extend, so that the connecting shell 1 6, the connecting shell 2 8, the adjusting rod 9, and the clamping mechanism 10 rotate, so that the corresponding left clamping block 1 03 and the right clamping block 105 rotate relative to the semiconductor chip, and the control motor 141 on the two adjusting rods 9 fixedly connected to the connecting shell 2 8 rotates forward, so that the corresponding left clamping block 103 and the right clamping block 105 clamp the semiconductor chip again, but the clamping position is changed from the previous clamping position, and then the control motor 141 on the two adjusting rods 9 fixedly connected to the connecting shell 1 6 is reversed, and then the distribution valve assembly 5 connects one of the connecting pipes 11 with the return oil pipe of the supply mechanism 4, and connects the other connecting pipe 11 with the inlet oil pipe of the supply mechanism 4, thereby adjusting the position of the left clamping block 103 and the right clamping block 105 on the two adjusting rods 9 fixedly connected to the connecting shell 1 6, so that the clamping part of the semiconductor chip is also cleaned;

[0032] After cleaning is completed, the present invention is taken out and placed directly above the cleaning pool, and the rotating motor 3 is operated to drive the rotating disk 2 to rotate, thereby drying the residual cleaning liquid on the semiconductor chip.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip cleaning machine, comprising two support plates (1), wherein a rotating disk (2) is rotatably mounted on the inner side of the two support plates (1), a rotating motor (3) is fixedly connected to the right side of the right rotating disk (2), a supply mechanism (4) is fixedly mounted at the inner center of the rotating disk (2), and a distribution valve assembly (5) is connected to the side of the supply mechanism (4) away from the support plate (1), characterized in that: The distribution valve assembly (5) is rotatably connected to a connection shell (6) at a side away from the supply mechanism (4), and a plurality of connection columns (7) are fixedly connected between the distribution valve assembly (5) and the supply mechanism (4). The connection shell (6) is rotatably connected to a connection shell (8) at a side away from the distribution valve assembly (5). The curved surfaces of the connection shell (6) and the connection shell (8) are provided with a plurality of adjustment rods (9), and a plurality of clamping mechanisms (10) are fixedly connected between two adjustment rods (9) at the same horizontal position. The rear side and the lower side of the distribution valve assembly (5) are fixedly connected to a connection pipe (11), and the outer end of the connection pipe (11) is fixedly connected to an arc-shaped pipe (12), and the inner ends of the arc-shaped pipe (12) are movably sleeved with push rods (13), and a driving mechanism (14) is provided inside the rotating disk (2) on the right side.

2. A semiconductor chip cleaning machine according to claim 1, characterized in that: The adjusting rod (9) comprises a rod body (91), a sliding block (92) is slidably connected to the middle of the rod body (91), T-shaped rods (93) are fixedly connected to both sides of the sliding block (92), a compression spring (94) is fixedly connected between the outer side of the T-shaped rod (93) and the rod body (91), a semi-arc sheet (95) is fixedly connected to the inner end of the rod body (91), a rotating rod (97) is rotatably connected to the middle of the sliding block (92), and a sealing movable sheet (96) is fixedly connected to the end of the rotating rod (97) away from the support plate (1).

3. A semiconductor chip cleaning machine according to claim 2, characterized in that: The clamping mechanism (10) comprises a double-ended screw (101), the middle part of which is threadedly connected to a left slider (102) and a right slider (104), the right side of the left slider (102) is fixedly connected to a left clamping block (103), the left side of the right slider (104) is fixedly connected to a right clamping block (105), the curved surface sliding connection between the right slider (104) and the left slider (102) is provided with a limit rod (106), a plurality of the double-ended screws (101) are fixedly connected head to tail, the rightmost double-ended screw (101) and the leftmost double-ended screw (101) are fixedly connected to a rotating rod (97), a plurality of the limit rods (106) are fixedly connected head to tail, and the rightmost limit rod (106) and the leftmost limit rod (106) are fixedly connected to a sealing movable sheet (96).

4. A semiconductor chip cleaning machine according to claim 3, characterized in that: The driving mechanism (14) comprises a plurality of control motors (141), the output shafts of the control motors (141) are fixedly connected to synchronous wheels (142), the control motors (141) are slidably connected to the inner wall of the rotating disk (2), and the synchronous wheels (142) are fixedly connected to one end of the rotating rod (97) close to the support plate (1).

5. A semiconductor chip cleaning machine according to claim 4, characterized in that: The interiors of the connecting shell 1 (6) and the connecting shell 2 (8) are connected to the inner side of the rod body (91); two rod bodies (91) on a same line are fixedly connected to and connected to the connecting shell 1 (6); and two rod bodies (91) on a different line are fixedly connected to and connected to the connecting shell 2 (8); the rod bodies (91) are slidably connected to the inner wall of the rotating disk (2); and the push rod (13) is fixedly connected to the curved surface of the rod body (91).

6. A semiconductor chip cleaning machine according to claim 5, characterized in that: The threads on the left and right sides of the double-ended screw (101) are in opposite directions, the left slider (102) and the right slider (104) are both adapted to the double-ended screw (101), and the left clamping block (103) and the right clamping block (105) are adapted to each other.

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