ABF film curing method

Abstract

The invention relates to a circuit board processing method, in particular to an ABF film curing method, which comprises the following steps of: setting a plurality of comparison first constant temperature stages and comparison second constant temperature stages with different baking temperatures and / or baking time according to an initial first constant temperature stage and an initial second constant temperature stage; combining one comparison first constant-temperature stage with one comparison second constant-temperature stage to form a plurality of different experiment groups, baking according to each experiment group, and comparing the roughness of the baked ABF films of the plurality of experiment groups after the ABF films are eroded by a liquid medicine to obtain a comparison result; and selecting one experimental group with the roughness closest to the preset roughness, and setting the corresponding comparison first constant temperature stage and the comparison second constant temperature stage to be applied to baking of mass-produced ABF films. By means of the structure, the optimal comparison first constant-temperature stage and the optimal comparison second constant-temperature stage can be screened out by arranging a plurality of experimental groups, so that the cured ABF film has good roughness.

Description

Technical Field

[0001] The invention relates to a circuit board processing method, in particular to an ABF film curing method. Background Art

[0002] The description in this section merely provides background information related to the present disclosure and does not constitute prior art.

[0003] In the packaging technology of circuit board processing, ABF (Ajinomoto Build-up Film) substrate refers to a circuit board made of ABF film and substrate, which is widely used in advanced packaging. Among them, the build-up process of ABF substrate is a crucial link in the electronic packaging manufacturing process, which directly affects the electrical performance and reliability of the final product.

[0004] In the ABF film process, the surface roughness of the ABF film, generally referred to as the arithmetic mean roughness (Ra), is a key physical parameter. Controlling the surface roughness of the ABF film can not only improve the physical properties and bonding strength of the material, but also effectively balance the product yield. Too high a surface roughness will cause chemical copper to deposit deep into the pits, and the chemical copper in these deep pits cannot be completely removed in the subsequent etching process, which will lead to the problem of unclean etching. This unclean etching will cause a short circuit during the electrical test of the substrate, seriously affecting the electrical performance and reliability of the product. However, at the same time, too low a surface roughness will lead to insufficient bonding between the ABF film and the substrate, seriously affecting the material strength of the product.

[0005] Therefore, it is worth noting that the thermal process has a significant effect on the degree of curing of polymer materials. After the desmear process of the ABF film lamination process, the surface roughness of the ABF film will change. In order to control the roughness of the ABF film within a suitable range during the production process and ensure the quality stability of the ABF lamination process, it is necessary to find the best ABF film lamination production conditions.

[0006] Currently, there is no ABF film curing method that can solve the above problems. Summary of the invention

[0007] The purpose of the present invention is to provide an ABF film curing method, which is based on the original initial first constant temperature stage and the initial second constant temperature stage. By setting up multiple experimental groups, the optimal first constant temperature stage and the second constant temperature stage can be screened out, so that the cured ABF film has better roughness.

[0008] In order to achieve the above object, the present invention discloses the following ABF film curing method; comprising providing an ABF film, placing the ABF film on a substrate, and baking the ABF film in an oven, wherein the baking step includes an initial first constant temperature stage and an initial second constant temperature stage; wherein the ABF film curing method further comprises: According to the initial first constant temperature stage, a plurality of comparative first constant temperature stages with different baking temperatures and / or baking times are set, wherein the absolute value of the difference between each comparative first constant temperature stage and the initial first constant temperature stage is within a first preset range; according to the initial second constant temperature stage, a plurality of comparative second constant temperature stages with different baking temperatures and / or baking times are set, wherein the absolute value of the difference between each comparative second constant temperature stage and the initial second constant temperature stage is within a second preset range; One of the comparative first constant temperature stages is combined with one of the comparative second constant temperature stages to form a plurality of different experimental groups, and baking is performed separately according to each of the experimental groups. Then, the roughness of the ABF films after baking in the plurality of experimental groups after being etched by chemical solution is compared, and a group of the experimental groups whose roughness is closest to the preset roughness is selected. The corresponding comparative first constant temperature stage and the comparative second constant temperature stage are set and applied in the baking of the ABF films in mass production.

[0009] Furthermore, after the step of "combining one of the comparative first constant temperature stages with one of the comparative second constant temperature stages to form a plurality of different experimental groups, and baking each of the experimental groups separately, and then comparing the roughness of the ABF films of the plurality of experimental groups after baking through chemical etching, and selecting a group of the experimental groups whose roughness is closest to the preset roughness", it also includes performing a reflow test on the basis of the ABF film of the experimental group whose roughness is closest to the preset roughness. If there is no explosion after the reflow test, the step of "and setting the corresponding comparative first constant temperature stage and the comparative second constant temperature stage in the baking of the ABF film in mass production" is performed.

[0010] Furthermore, the reflow test is set to 10 times, and the highest temperature during the reflow test is 260°C.

[0011] Furthermore, after each mass production baking is completed in the step of "and the corresponding comparative first constant temperature stage and the comparative second constant temperature stage are set for application in the mass production baking of the ABF film", the substrate with the ABF film cured is drilled, and then the substrate with the ABF film cured is desmeared after drilling, and then chemical copper deposition is performed on the substrate with the ABF film cured after desmearing.

[0012] Further, in the step of "de-smearing the substrate on which the ABF film is cured", the substrate on which the ABF film is cured is immersed in a de-smearing liquid for ten minutes, and the temperature of the de-smearing liquid is maintained at 70°C-90°C.

[0013] Further, after the step of "then performing chemical copper deposition on the substrate having the ABF film cured thereon after desmearing", a uniform copper layer with a thickness of 0.5±0.3 µm is formed.

[0014] Furthermore, in the step of "selecting a group of the experimental groups whose roughness is closest to the preset roughness", the preset roughness is set to 0.1-0.4 µm. Furthermore, in the step of "combining one of the comparative first constant temperature stages with one of the comparative second constant temperature stages to form a plurality of different experimental groups, and baking each of the experimental groups separately", five points at the four corners and the center of each of the ABF films are selected as positions for temperature detection.

[0015] Furthermore, in the step of "combining one of the comparative first constant temperature stages with one of the comparative second constant temperature stages to form a plurality of different experimental groups, and baking each of the experimental groups separately, and then comparing the roughness of the baked ABF films of the plurality of experimental groups after being etched by chemical solution, and selecting a group of the experimental groups whose roughness is closest to the preset roughness", the comparison of the roughness is performed by visual inspection through a scanning electron microscope and corrosion degree detection by weighing.

[0016] Furthermore, in the step of "selecting a group of experimental groups whose roughness is closest to the preset roughness, and setting the corresponding comparative first constant temperature stage and the comparative second constant temperature stage for application in the mass production of baking the ABF film", the temperature rising slope from room temperature to the temperature of the comparative first constant temperature stage needs to be 7°C-9°C / min, and the temperature rising slope from the temperature of the comparative first constant temperature stage to the temperature of the comparative second constant temperature stage needs to be 3°C-5°C / min, and the total baking time of the ABF film in the oven is 85min-95min.

[0017] By means of the above technical solution, the beneficial effects of the present invention are as follows: The ABF film curing method of the present invention is based on the original initial first constant temperature stage and the initial second constant temperature stage. By setting up multiple experimental groups and conducting baking experiments respectively, after the experiment, the roughness results of the baked ABF films of each group are analyzed, and an experimental group that best meets the preset roughness is screened out, and the optimal first constant temperature stage and the second constant temperature stage of the experimental group are extracted and put into mass production operations, so that the production quality of the ABF carrier board is improved as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 This is a schematic diagram of multi-point baking and heating of the third experimental group of an ABF film curing method provided in an embodiment of this specification; Figure 2 This is a schematic diagram of temperature acquisition of an ABF film curing method provided in an embodiment of this specification; Figure 3 It is a roughness detection schematic diagram of an ABF film curing method provided in an embodiment of this specification; Figure 4 It is a schematic diagram of the results of six experimental groups of an ABF film curing method provided in the embodiments of this specification; Figure 5 This is a schematic diagram of the surface morphology after removing the glue residue in the first experimental group of an ABF film curing method provided in an embodiment of this specification; Figure 6 This is a schematic diagram of the surface morphology after removing the glue residue in the second experimental group of an ABF film curing method provided in an embodiment of this specification; Figure 7 It is a schematic diagram of the surface morphology after removing the glue residue in the third experimental group of an ABF film curing method provided in the embodiment of this specification; Figure 8 This is a schematic diagram of the surface morphology after removing the glue residue in the fourth experimental group of an ABF film curing method provided in the embodiments of this specification; Fig. 9 This is a schematic diagram of the rear surface morphology of chemical copper in the second experimental group of an ABF film curing method provided in an embodiment of this specification; Fig.10 This is a schematic diagram of the surface morphology of the third experimental group of chemical copper in an ABF film curing method provided in an embodiment of this specification; Fig.11 It is a schematic diagram of the surface morphology of the fourth experimental group of chemical copper in an ABF film curing method provided in an embodiment of this specification. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this specification.

[0021] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "upper", "middle", "lower", "inner", "outer", "front", "back", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. The terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following describes an implementation method of the present invention based on its overall structure.

[0022] An ABF film curing method of the present embodiment includes providing an ABF film, placing the ABF film on a substrate, and baking the ABF film in an oven, wherein the baking step includes an initial first constant temperature stage and an initial second constant temperature stage; the ABF film curing method further includes: According to the initial first constant temperature stage, a plurality of comparative first constant temperature stages with different baking temperatures and / or baking times are set, wherein the absolute value of the difference between each comparative first constant temperature stage and the initial first constant temperature stage is within a first preset range; according to the initial second constant temperature stage, a plurality of comparative second constant temperature stages with different baking temperatures and / or baking times are set, wherein the absolute value of the difference between each comparative second constant temperature stage and the initial second constant temperature stage is within a second preset range; One of the comparative first constant temperature stages is combined with one of the comparative second constant temperature stages to form a plurality of different experimental groups, and each experimental group is baked separately. Then, the roughness of the baked ABF films of the plurality of experimental groups after being etched by chemical solution is compared, and a group of experimental groups whose roughness is closest to the preset roughness is selected. The corresponding comparative first constant temperature stage and comparative second constant temperature stage are set and applied in the baking of the ABF films in mass production.

[0023] In the existing production process of ABF substrates, the production is generally carried out according to the pressing parameters recommended by the raw material factory. Some producers will fine-tune the above pressing parameters, but will not find the best quality solution with the previous and next processes, which often causes the problem of batch scrapping of ABF substrates during the manufacturing process. For the above process, the initial first constant temperature stage and the initial second constant temperature stage of the specific baking time and temperature of the ABF film in the pressing parameters recommended by the raw material factory are extracted, and the initial first constant temperature stage and the initial second constant temperature stage are used as the basis to adjust the temperature and time with adjacent values, thereby generating multiple comparison first constant temperature stages and comparison second constant temperature stages. It is worth noting that the comparison first constant temperature stage is set within the first preset range. The first preset range is a reasonable time collection or temperature collection that includes the specific baking time or temperature of the ABF film in the pressing parameters recommended by the factory. The comparison first constant temperature stage is a combination of several representative time and temperature values ​​evenly selected from the several segments of the above collection. Similarly, the second constant temperature stage is set within the second preset range. The second preset range is a reasonable time collection or temperature collection that includes the specific baking time or temperature of the ABF film in the lamination parameters recommended by the raw material factory. The second constant temperature stage is a combination of several representative time and temperature values ​​evenly selected from the several segments of the above collection. Finally, one of the first constant temperature stage and the second constant temperature stage is selected to form an experimental group waiting for testing. Similarly, repeat several times and select a certain number of experimental groups to improve the coverage of the experiment.

[0024] In the above embodiments, baking needs to follow the following principles. First, compared with the first constant temperature stage, considering the control of reaction kinetics, it is necessary to control at a lower temperature to achieve a slower reaction rate, which helps to prevent uneven curing caused by rapid exothermic reactions and avoid the formation of pores or microcracks. At the same time, in the early stage of curing, residual solvents or volatile by-products need to be discharged from the resin matrix. Low-temperature heating can gradually release these substances to avoid blistering or excessive expansion of the ABF film. On the basis of comparing the first constant temperature stage, semi-curing is achieved, so that the ABF film maintains a certain plasticity, which is convenient for subsequent processing. Then, in comparison with the second constant temperature stage, complete curing is achieved at a higher temperature. By setting a two-stage temperature rise, the risks of cracks caused by a single rapid temperature rise are avoided.

[0025] Specifically, according to the glass transition temperature (Tg) of the ABF film and the manufacturer's recommended oven temperature range, the first constant temperature stage for preheating needs to control the temperature between 70℃ and 130℃, and the baking time is between 15 and 30 minutes. The second constant temperature stage for complete curing needs to control the temperature between 130℃ and 200℃, and the baking time is between 15 and 30 minutes.

[0026] Among them, Figure 4 As shown, in this embodiment, the number of experimental groups is six, namely the first experimental group (compared with the first constant temperature stage with a baking temperature of 130°C and a baking time of 30 minutes, compared with the second constant temperature stage with a baking temperature of 160°C and a baking time of 30 minutes), the second experimental group (compared with the first constant temperature stage with a baking temperature of 130°C and a baking time of 30 minutes, compared with the second constant temperature stage with a baking temperature of 165°C and a baking time of 30 minutes), and the third experimental group (compared with the first constant temperature stage with a baking temperature of 130°C and a baking time of 30 minutes, compared with the second constant temperature stage with a baking temperature of 170°C , baking time 30min), the fourth experimental group (compared with the first constant temperature stage with a baking temperature of 130℃ and a baking time of 30min, and the second constant temperature stage with a baking temperature of 175℃ and a baking time of 30min), the fifth experimental group (compared with the first constant temperature stage with a baking temperature of 130℃ and a baking time of 30min, and the second constant temperature stage with a baking temperature of 180℃ and a baking time of 30min), and the sixth experimental group (compared with the first constant temperature stage with a baking temperature of 130℃ and a baking time of 30min, and the second constant temperature stage with a baking temperature of 190℃ and a baking time of 30min). For the above six experimental groups, after baking under the condition of controlling the temperature floating range of the oven within 5℃, the surface of the ABF film was sprayed with liquid medicine, so that the surface of the ABF film was corroded by the liquid medicine and roughness was generated. Among them, the amount of liquid medicine sprayed and the observation time for each experimental group were the same, and the surface of the corroded ABF film was visually inspected by scanning electron microscope (SEM), and the results of sampling and analysis were obtained. Specifically, the produced samples were observed under a scanning electron microscope at a magnification of 5000 times to analyze their roughness levels.

[0027] Specifically, in Figure 4 The experimental results shown in the figure show the roughness, reliability and other characteristics of the ABF film under different conditions in different experimental groups after the experiment. Figure 5-8 , respectively, are the schematic diagrams of the surface morphology of the first, second, third and fourth experimental groups after desmearing. It can be seen that the above four groups basically meet the production requirements without any breakage. Figure 9-11 , respectively, are the schematic diagrams of the surface morphology of the second, third and fourth experimental groups after chemical copper treatment. It can be seen that the above three groups basically meet the production requirements without any breakage, while the first experimental group, although it passed the desmearing step, was obviously broken after chemical copper treatment. Therefore, the first experimental group with cracks was discarded. Figure 4, keep the experimental variables uniform, keep the high-temperature manganese tank temperature in the desmear at 82±2℃, and keep the deposition thickness in the chemical copper at 0.5±0.3um. At the same time, weigh the ABF film of each experimental group after the bite, and judge the degree of corrosion of the ABF carrier by the weight change of the ABF carrier. Finally, combining the above visual inspection and weighing test results, such as Figure 4 As shown, the third experimental group is closest to the arithmetic mean roughness (Ra) value of the preset roughness of 0.1~0.4µm. Although the fourth experimental group is also within the preset roughness range of 0.1~0.4µm, according to the observation effect and weighing results, Figure 3 As shown, the third experimental group has better data aggregation. Specifically, the roughness area in the range of 0.1~0.4µm is the largest, that is, the ABF substrate of the third experimental group is more uniform in roughness than other experimental groups. It is not easy to cause the problem of excessive roughness causing copper to be deposited deep into the pits during the chemical copper deposition process, and the chemical copper in these deep pits cannot be completely removed in the subsequent etching process, thus leading to the problem of unclean etching. It will not cause the problem of insufficient bonding between the ABF film and the substrate due to too low roughness, which seriously affects the material strength of the product. It can be put into further mass production with the best quality.

[0028] The scanning electron microscope used to detect the arithmetic mean roughness value of the ABF carrier board mentioned above uses Bruker's Wyko series optical machine. Its principle is to use white light interferometry technology to regress the actual 3D graphics / contour conditions of the ABF carrier board surface, from which the arithmetic mean roughness value can be directly generated. Of course, other regular optical instruments on the market can be used as substitutes to detect the arithmetic mean roughness, which can also realize the detection of the arithmetic mean roughness.

[0029] Please continue reading Figure 4In the above experiment, after desmearing and chemical copper treatment, the reliability test includes two steps: multiple reflow soldering test and hot plate test. Among them, the purpose of multiple reflow soldering is to test the aging condition of the ABF carrier board after multiple thermal shocks to confirm whether the ABF carrier board has any abnormalities under specific time and conditions. The steps are to heat the ABF carrier board coated with solder paste to 260°C (the purpose of this temperature setting is to melt the solder paste), melt the solder paste and form a welding connection, and repeat 10 times, and then observe the cracks. The hot plate test is used to evaluate the performance and stability of the ABF carrier board at high temperatures to help determine whether the ABF carrier board will fail under extreme temperature conditions. The specific steps in this embodiment are to place the ABF carrier board on a heatable hot plate, set the hot plate to 280°C (this temperature setting is far higher than the temperature of the normal circuit board use environment), and keep it for 5 minutes. After heating, it is naturally cooled, and then the cracks are observed. After any of the above-mentioned multiple reflow tests and hot plate tests, if no cracks or the like occur on the ABF carrier board, the ABF carrier board of the corresponding experimental group is deemed to be qualified.

[0030] Of course, it is worth noting that the baking temperature of the second constant temperature stage of the third experimental group preferred by the above six experimental groups is between 165°C and 175°C. If the temperature floats within a reasonable range and is close to 170°C from the equipment perspective, the substrate can still maintain a good roughness. Therefore, this embodiment also introduces a high-precision oven, such as a Taiwanese upright nitrogen oven with better precision, so that the baking temperature of the second constant temperature stage in the subsequent mass production process is as close to 170°C as possible to achieve the best production quality.

[0031] At the same time, in this embodiment, after the step of "combining one of the first constant temperature stages with one of the second constant temperature stages to form a plurality of different experimental groups, and baking each experimental group separately, and then comparing the roughness of the baked ABF films of the plurality of experimental groups after being etched by the liquid medicine, and selecting a group of experimental groups with the roughness closest to the preset roughness", it also includes a reflow test based on the ABF film of a group of experimental groups with the roughness closest to the preset roughness. If there is no explosion after the reflow test, the step of "and setting the corresponding first constant temperature stage and the second constant temperature stage in the baking of the ABF film in mass production" is performed again. Specifically, the reflow test is set to 10 times, and the highest temperature during the reflow test is 260°C. After multiple high-temperature reflow tests, the ABF carrier board of the third experimental group did not have the problem of explosion, indicating that the structure and bonding force of the carrier board remain stable under high-temperature cycle conditions, and the substrate does not delaminate or crack in multiple heating and cooling cycles, thereby avoiding potential hidden dangers in the mass production link.

[0032] Further, after each mass production baking is completed in the step of "and the corresponding comparative first constant temperature stage and comparative second constant temperature stage are set for application in the mass production baking of the ABF film", the substrate with the ABF film cured is drilled, and then the substrate with the ABF film cured is desmeared after drilling, and then the substrate with the ABF film cured is subjected to chemical copper deposition after desmearing. At the same time, the substrate with the ABF film cured is immersed in the desmearing liquid for ten minutes, and the temperature of the desmearing liquid is maintained at 70℃-90℃, specifically, the temperature of the high-temperature manganese tank is maintained at 82±2℃, and chemical copper deposition forms a uniform copper layer with a thickness of 0.5±0.3µm. Through the above method, the cured ABF carrier treated with the corresponding comparative first constant temperature stage and comparative second constant temperature stage has a better desmear removal effect under the cooperation of the above-mentioned desmearing liquid temperature and immersion time. In the existing process, due to the interaction of temperature, pressure, solution concentration, and line speed factors in the desmearing process, slight differences will affect the quality. If there is a slight change, it may also cause stability problems. Therefore, on the basis of maintaining the above-mentioned desmearing temperature and duration, by changing the ABF film baking time, find the best matching comparison of the first constant temperature stage and the second constant temperature stage. In other words, in the comparison of the roughness after the above-mentioned multiple experimental groups are cured and etched by the solution, the solution model, duration, and holding temperature of the solution etch test are consistent with those in the subsequent desmearing link in mass production, so as to match the best degree of process coordination between the baking and desmearing links. Similarly, in the process of chemical copper deposition in mass production, the copper layer thickness of 0.5±0.3µm is maintained consistently, so that the coordination between the overall links can achieve the best effect, so that the ABF carrier board can obtain the best conductivity and mechanical strength.

[0033] It is worth noting that the combination of the corresponding fixed desmear process and the chemical copper deposition process needs to be consistent and coordinated with each other. If any smear remains on the hole wall during the desmear process, it will affect the adhesion of the subsequent copper layer, thereby affecting the conductivity and reliability. In general, the present invention achieves the optimal value of coordination between the desmear and chemical copper deposition processes by fine-tuning the baking process.

[0034] Furthermore, if Figure 2As shown, in the step of "combining one of the first constant temperature stages for comparison with one of the second constant temperature stages for comparison to form a plurality of different experimental groups, and baking each experimental group separately", the four corners and five points in the center of each ABF film are selected as positions for temperature detection. Specifically, the cured ABF carrier to be detected is set as a regular rectangular geometric plate structure. In the oven, three identical ABF carriers are set for each experimental group, and are respectively placed on the test plates at the corresponding positions of the front / middle / rear of the tin frame (rack) in the oven, wherein a temperature sensor is placed at each of the four corners and five positions in the center of each of the front / middle / rear plates. That is to say, each experimental group can obtain 15 temperature data. If the 15 temperature data are equivalent and float within a controllable range, the data is valid, such as Figure 1 The temperature curves of the 15 data in the baking curve diagram of the third experimental group shown remain consistent, and the data is valid, making the coverage of the temperature data more accurate and eliminating contingency.

[0035] Further, in the baking process of the ABF film in the third experimental group of this embodiment, on the basis of maintaining the baking temperature of 130°C and the baking time of 30min in the first constant temperature stage, and the baking temperature of 170°C and the baking time of 30min in the second constant temperature stage, the time is controlled at 90min, and the temperature rise slope from room temperature to the temperature of the first constant temperature stage is controlled to be 7°C-9°C / min, and the temperature rise slope from the temperature of the first constant temperature stage to the temperature of the second constant temperature stage is controlled to be 3°C-5°C / min. By controlling the temperature rise slope, the accumulation of thermal stress caused by too fast temperature rise between the ABF film and the substrate is avoided, and the risks of delamination and cracking are eliminated, while ensuring a relatively uniform curing effect and improving process stability. Of course, although a slow temperature rise slope can make the temperature rise more uniform and avoid internal stress and defects, it is also necessary to control the time at 85min-95min to achieve a certain balance in processing efficiency.

[0036] It is worth noting that in this embodiment, the oven is set as a Taiwan-made nitrogen baking device, and the temperature accuracy of its temperature control constant temperature is ±5°C. The ABF membrane uses the Japanese Ajinomoto GL type membrane (please refer to Figure 4 ), through precise temperature control and matching of corresponding membrane types to improve actual production capacity.

[0037] Although different specific embodiments are mentioned in the content of this application, this application is not limited to the situations described in the industry standards or embodiments, etc. Some industry standards or slightly modified implementation plans based on the implementation of the custom methods or embodiments can also achieve the same, equivalent or similar, or predictable implementation effects after deformation of the above embodiments. The embodiments of data acquisition, processing, output, judgment methods, etc. after these modifications or deformations can still fall within the scope of the optional implementation plans of this application.

[0038] Although the present application has been described through embodiments, those skilled in the art will appreciate that there are many modifications and changes to the present application without departing from the spirit of the present application. It is intended that the attached embodiments include these modifications and changes without departing from the present application.

Claims

1. A method for curing an ABF film, comprising providing an ABF film, placing the ABF film on a substrate, and baking the ABF film in an oven, wherein: The baking step includes an initial first constant temperature stage and an initial second constant temperature stage; characterized in that the ABF film curing method also includes: According to the initial first constant temperature stage, a plurality of comparative first constant temperature stages with different baking temperatures and / or baking times are set, wherein the absolute value of the difference between each comparative first constant temperature stage and the initial first constant temperature stage is within a first preset range; according to the initial second constant temperature stage, a plurality of comparative second constant temperature stages with different baking temperatures and / or baking times are set, wherein the absolute value of the difference between each comparative second constant temperature stage and the initial second constant temperature stage is within a second preset range; One of the comparative first constant temperature stages is combined with one of the comparative second constant temperature stages to form a plurality of different experimental groups, and baking is performed separately according to each of the experimental groups. Then, the roughness of the ABF films after baking in the plurality of experimental groups after being etched by chemical solution is compared, and a group of the experimental groups whose roughness is closest to the preset roughness is selected. The corresponding comparative first constant temperature stage and the comparative second constant temperature stage are set and applied in the baking of the ABF films in mass production.

2. The ABF film curing method according to claim 1, characterized in that: After the step of "combining one of the comparative first constant temperature stages with one of the comparative second constant temperature stages to form a plurality of different experimental groups, and baking each of the experimental groups separately, and then comparing the roughness of the ABF films of the plurality of experimental groups after baking through liquid etching, and selecting a group of the experimental groups whose roughness is closest to the preset roughness", it also includes performing a reflow test on the basis of the ABF films of the experimental groups whose roughness is closest to the preset roughness. If there is no explosion after the reflow test, the step of "and setting the corresponding comparative first constant temperature stage and the comparative second constant temperature stage in the baking of the ABF films in mass production" is performed.

3. The ABF film curing method according to claim 2, characterized in that: The reflow test was set to 10 times, and the highest temperature during the reflow test was 260°C.

4. The ABF film curing method according to claim 1, characterized in that: After each mass production baking in the step "and setting the corresponding comparative first constant temperature stage and the comparative second constant temperature stage for application in the mass production baking of the ABF film" is completed, the substrate with the ABF film cured is drilled, and then the substrate with the ABF film cured is desmeared after drilling, and then chemical copper deposition is performed on the substrate with the ABF film cured after desmearing.

5. The ABF film curing method according to claim 4, characterized in that: In the step of "de-smearing the substrate on which the ABF film is cured", the substrate on which the ABF film is cured is immersed in a de-smearing liquid for ten minutes, and the temperature of the de-smearing liquid is maintained at 70°C-90°C.

6. The ABF film curing method according to claim 4, characterized in that: After the step of "then performing chemical copper deposition on the substrate having the ABF film cured thereon after desmearing", a uniform copper layer with a thickness of 0.5±0.3 µm is formed.

7. The ABF film curing method according to claim 1, characterized in that: In the step of "selecting a group of experimental groups whose roughness is closest to the preset roughness", the preset roughness is set to 0.1-0.4 µm. The ABF film curing method according to claim 1 is characterized in that: in the step of "combining one of the first constant temperature comparison stages with one of the second constant temperature comparison stages to form a plurality of different experimental groups, and baking is performed separately according to each of the experimental groups", five points at the four corners and the center of each of the ABF films are selected as positions for temperature detection.

8. The ABF film curing method according to claim 1, characterized in that: In the step of "combining one of the first constant temperature comparison stages with one of the second constant temperature comparison stages to form a plurality of different experimental groups, and baking each of the experimental groups separately, and then comparing the roughness of the baked ABF films of the plurality of experimental groups after being etched by chemical solution, and selecting a group of experimental groups whose roughness is closest to the preset roughness", the comparison of the roughness is performed by visual inspection through a scanning electron microscope and corrosion degree detection by weighing.

9. The ABF film curing method according to claim 1, characterized in that: In the selected experimental group in the step of "selecting a group of experimental groups whose roughness is closest to the preset roughness, and setting the corresponding comparative first constant temperature stage and the comparative second constant temperature stage for application in the baking of the ABF film in mass production", the temperature rising slope from room temperature to the temperature of the comparative first constant temperature stage needs to be 7°C-9°C / min, the temperature rising slope from the temperature of the comparative first constant temperature stage to the temperature of the comparative second constant temperature stage needs to be 3°C-5°C / min, and the total baking time of the ABF film in the oven is 85min-95min.

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