Heat dissipation device

Abstract

The invention provides a heat dissipation device, which is used for heat dissipation of electronic equipment, and comprises a flow guide assembly, the flow guide assembly comprises a plurality of flow guide cavities, the plurality of flow guide cavities are arranged at intervals along the vertical direction, each flow guide cavity is selectively butted with each server in the electronic equipment, each flow guide cavity has a conducting state and a closing state, when the flow guide cavity is in the conducting state, the flow guide cavity is used for guiding the hot air flow emitted by the server; the negative pressure assembly comprises a drainage component and an exhaust channel, the drainage component is arranged at an air inlet of the exhaust channel, the drainage component communicates with the flow guide cavities, and airflow in the flow guide cavities is led out through the drainage component to the exhaust channel to be exhausted; the two ends of the communicating component communicate with the flow guide cavities and the drainage component correspondingly, so that airflow in the flow guide cavities flows into the drainage component through the communicating component. The problem that in the prior art, when air cooling heat dissipation is carried out on electronic equipment, an air cooling heat dissipation module is poor in compatibility with servers of different specifications is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of server cooling, and in particular to a heat dissipation device. Background Art

[0002] In the data center field, servers are the main energy-consuming components. During long-term operation, servers will generate a large amount of heat. If the heat is not dissipated in time, the high temperature environment will affect the electronic components in the server.

[0003] In the prior art, in order to dissipate heat from the server, liquid cooling or air cooling can be used. Liquid cooling means directly immersing the equipment in the coolant. The heat generated when the components are working is quickly absorbed by the coolant and carried away by the circulation of the fluid. However, this method requires the electronic equipment to be placed in a special sealed container filled with a specific coolant, which leads to more restrictions on the server and higher costs.

[0004] Air cooling refers to using a fan to blow air to the server to drive the heat dissipation of the server's heat-generating components. However, existing air cooling equipment has poor compatibility. If the height of the server changes, the corresponding heat dissipation module needs to be replaced as a whole, which makes it difficult to achieve mass operation. Summary of the invention

[0005] The main purpose of the present invention is to provide a heat dissipation device to solve the problem in the prior art that when air-cooling and heat dissipation of electronic equipment is performed, the air-cooling and heat dissipation module has poor compatibility with servers of different specifications.

[0006] In order to achieve the above-mentioned purpose, according to one aspect of the present invention, there is provided a heat dissipation device for dissipating heat from an electronic device, the heat dissipation device comprising: a guide assembly, the guide assembly comprising a plurality of guide cavities, the plurality of guide cavities being arranged at intervals along a vertical direction, each guide cavity being selectively connected to each server in the electronic device, each guide cavity having an on state and a off state, respectively, and when the guide cavity is in the on state, the hot air flow emitted by the server is guided; a negative pressure assembly, comprising a guide component and an exhaust channel, the guide component being arranged at the air inlet of the exhaust channel, the guide component being connected with each guide cavity, respectively, and the airflow in the guide cavity being led out to the exhaust channel through the guide component for discharge; a connecting component, the two ends of the connecting component being connected with each guide cavity and the guide component, respectively, so that the airflow in each guide cavity flows into the guide component through the connecting component.

[0007] Furthermore, the guide assembly also includes: a cover plate, which is arranged at the air inlet opening of the guide cavity, and the position of the cover plate is movably set to block or avoid the guide cavity, so that the guide cavity is in an on state or a closed state; there are multiple cover plates, and the multiple cover plates are arranged one-to-one with the multiple guide cavities.

[0008] Furthermore, the diversion assembly also includes: a diversion box body; a protruding body, which is arranged on the diversion box body, the protruding body protrudes relative to the diversion box body, the diversion cavity is arranged in the protruding body, there are multiple protruding bodies, the multiple protruding bodies are arranged one-to-one with the multiple diversion cavities, and the cover plate is movably arranged relative to the protruding body.

[0009] Furthermore, the electronic device is arranged on the mounting frame, and the guide assembly also includes: a connecting part, which is arranged on the protruding body and connected to the mounting frame; the connecting part is divided into multiple groups, and the multiple groups of connecting parts are arranged in a one-to-one correspondence with the multiple protruding bodies.

[0010] Furthermore, the connecting portion is arranged at the end of the protruding body, and the connecting portion extends from the protruding body toward a direction away from the protruding body; the connecting portion is docked with the mounting frame, and the connecting piece passes through the connecting portion and the mounting frame to connect the protruding body to the mounting frame.

[0011] Furthermore, the flow guide component also includes: a flow guide branch pipe, which is arranged in the flow guide box and connected to the protruding body, the flow guide branch pipe is connected to the flow guide cavity, there are multiple flow guide branches, and the multiple flow guide branches are arranged in a one-to-one correspondence with the multiple flow guide cavities, and each flow guide branch pipe is connected to the connecting component respectively; each flow guide branch pipe is respectively provided with a flow detection component, a pressure detection component and a control valve, the flow rate of the airflow in the flow guide branch pipe is detected by the flow detection component, the pressure of the airflow in the flow guide branch pipe is detected by the pressure detection component, and the flow rate of the airflow in the flow guide branch pipe is controlled by the control valve.

[0012] Furthermore, the flow guide component also includes: a confluence chamber, which is arranged in the flow guide box, one end of the confluence chamber is connected to each flow guide branch pipe, and the other end of the confluence chamber is connected to the connecting component, and the airflow in each flow guide branch pipe flows into the connecting component through the confluence chamber.

[0013] Furthermore, the drainage component includes a drainage fan, which is connected to one end of the connecting component away from the guide component, and the drainage fan is arranged at the air inlet of the exhaust channel; the negative pressure component includes: a silencer component, at least part of the silencer component is arranged in the exhaust channel, and the airflow is discharged after passing through the silencer component.

[0014] Furthermore, the flow guide component also includes: a flow guide branch pipe, which is connected to the flow guide cavity, and there are multiple flow guide branches, and the multiple flow guide branches are connected to the flow guide cavity one-to-one, and each flow guide branch is connected to the connecting component; each flow guide branch is respectively provided with a flow detection component, a pressure detection component and a control valve, the flow rate of the airflow in the flow guide branch is detected by the flow detection component, the pressure of the airflow in the flow guide branch is detected by the pressure detection component, and the flow rate of the airflow in the flow guide branch is controlled by the control valve; the negative pressure component also includes: an installation box, the flow guide component and the exhaust channel are respectively arranged in the installation box, and the top of the installation box is provided with an exhaust port connected to the exhaust channel; a display component is arranged on the installation box, and the display component is respectively connected with the flow guide component, the flow detection component, the pressure detection component and the control valve signal to display the operating parameters of the flow guide component, the flow detection component, the pressure detection component and the control valve.

[0015] Furthermore, the connecting component includes: a connecting pipe, both ends of which are respectively connected to the drainage component and each diversion cavity; a supporting component, which is arranged in the connecting pipe and fits with the pipe wall surface of the connecting pipe to support the connecting pipe.

[0016] According to the technical solution of the present invention, a heat dissipation device is used to dissipate heat for an electronic device, wherein the heat dissipation device includes a flow guide component, a negative pressure component and a connecting component, the flow guide component includes a plurality of flow guide chambers, the plurality of flow guide chambers are arranged at intervals along the vertical direction, each flow guide chamber can be selectively connected to each server in the electronic device, each flow guide chamber has an on state and a off state, respectively, when the flow guide chamber is in the on state, the hot air flow emitted by the server is guided; the negative pressure component includes a flow guide component and an exhaust channel, the flow guide component is arranged at the air inlet of the exhaust channel, the flow guide component is connected with each flow guide chamber, respectively, the airflow in the flow guide chamber is led out to the exhaust channel through the flow guide component for discharge; the two ends of the connecting component are respectively connected with each flow guide chamber and the flow guide component, so that the airflow in each guide chamber flows into the flow guide component through the connecting component. This arrangement can utilize multiple guide cavities to connect with servers in electronic equipment. Under the drainage effect of the drainage components, the heat emitted by the server is carried away by the airflow and discharged through the exhaust channel, thereby achieving the purpose of cooling the server. At the same time, since each guide cavity has an on state and a off state respectively, when the specifications of the electronic equipment or the number of servers change, there is no need to replace the entire device, but only need to select the corresponding guide cavity to be turned on or off, so that the heat dissipation device can adapt to electronic equipment of different specifications to dissipate heat, thereby improving the compatibility of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 A schematic structural diagram of an embodiment of a heat dissipation device according to the present invention is shown;

[0019] Figure 2 A schematic structural diagram of a first viewing angle of a flow guide assembly in a heat dissipation device according to the present invention is shown;

[0020] Figure 3 A schematic structural diagram of a second viewing angle of a flow guide assembly in a heat dissipation device according to the present invention is shown;

[0021] Figure 4 It shows the structural principle diagram of each flow guiding branch pipe in the heat dissipation device according to the present invention;

[0022] Figure 5 A schematic structural diagram of a negative pressure assembly in a heat dissipation device according to the present invention is shown;

[0023] Figure 6 A schematic structural diagram of a connecting component in a heat dissipation device according to the present invention is shown;

[0024] Figure 7 The figure shows the use state of the heat dissipation device according to the present invention.

[0025] The above drawings include the following reference numerals:

[0026] 100, flow guide assembly; 110, flow guide cavity; 111, air inlet opening; 120, cover plate; 130, flow guide box; 140, protruding body; 150, connecting part; 160, flow guide branch pipe; 161, flow detection component; 162, pressure detection component; 163, control valve; 170, confluence cavity;

[0027] 200, negative pressure assembly; 210, drainage component; 220, exhaust channel; 221, exhaust port; 211, drainage fan; 212, air inlet pipe; 230, silencer component; 240, installation box; 250, display component;

[0028] 300, connecting component; 310, connecting pipe; 320, supporting component;

[0029] 400. Mounting frame. DETAILED DESCRIPTION

[0030] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0031] As mentioned in the background technology, the prior art uses air cooling to dissipate heat for electronic devices. Usually, air is blown directly to the electronic devices to cool the electronic devices. When the specifications of the electronic devices change, or the number of servers in the electronic devices changes, it is necessary to replace the heat dissipation modules of different specifications accordingly. The heat dissipation modules are not compatible with electronic devices of multiple specifications. Therefore, in response to the above technical problems, the heat dissipation device provided in the present application includes a flow guide component 100, a negative pressure component 200 and a connecting component 300. The flow guide component 100 includes a plurality of flow guide cavities 110. Each flow guide cavity 110 corresponds to each server in the electronic device. Each flow guide cavity 110 is connected to the exhaust passage 220 through the connecting component 300. The flow guide component 210 is used to generate negative pressure in the connecting component 300. Therefore, each flow guide cavity 110 is used to introduce the heat generated by each server into the connecting component 300 through airflow, and then through the exhaust passage 220. 0 is discharged, which has a heat dissipation effect on the server, wherein each guide cavity 110 has an on state and a off state respectively, and can be selectively connected to each server in multiple guide cavities 110 according to the number of specific servers. After replacing electronic devices of different specifications, it is only necessary to turn on or off the corresponding guide cavity 110. Alternatively, when the number of guide cavities 110 does not meet the heat dissipation requirements of the electronic equipment, it is only necessary to replace the guide assembly 100 without replacing the entire device. The heat dissipation requirements of electronic devices of various specifications can be met, and the compatibility of the heat dissipation device is improved.

[0032] Please refer to Figures 1 to 7 The present invention provides a heat dissipation device for dissipating heat from an electronic device. The heat dissipation device comprises: a flow guide component 100, the flow guide component 100 comprises a plurality of flow guide cavities 110, the plurality of flow guide cavities 110 are arranged at intervals in the vertical direction, each flow guide cavity 110 can be selectively connected to each server in the electronic device, each flow guide cavity 110 has an on state and a off state, and when the flow guide cavity 110 is in the on state, the hot air flow emitted by the server is guided; a negative pressure component 200 comprises a guide cavity 110, The flow component 210 and the exhaust channel 220, the flow guide component 210 is arranged at the air inlet of the exhaust channel 220, the flow guide component 210 is connected with each guide cavity 110 respectively, and the airflow in the guide cavity 110 is led out to the exhaust channel 220 through the flow guide component 210 and discharged; the connecting component 300, the two ends of the connecting component 300 are respectively connected with each guide cavity 110 and the flow guide component 210, so that the airflow in each guide cavity 110 flows into the flow guide component 210 through the connecting component 300.

[0033] According to the heat dissipation device provided by the present invention, it is used to dissipate heat for electronic equipment, wherein the heat dissipation device includes a flow guide component 100, a negative pressure component 200 and a connecting component 300, the flow guide component 100 includes a plurality of flow guide cavities 110, and the plurality of flow guide cavities 110 are arranged at intervals in the vertical direction, and each flow guide cavity 110 can be selectively connected to each server in the electronic equipment, and each flow guide cavity 110 has an on state and a off state, respectively. When the flow guide cavity 110 is in the on state, the hot air flow emitted by the server is guided. Flow; the negative pressure component 200 includes a guide component 210 and an exhaust channel 220, the guide component 210 is arranged at the air inlet of the exhaust channel 220, the guide component 210 is connected with each guide cavity 110 respectively, and the airflow in the guide cavity 110 is led out to the exhaust channel 220 through the guide component 210 and discharged; the two ends of the connecting component 300 are respectively connected with each guide cavity 110 and the guide component 210, so that the airflow in each guide cavity 110 flows into the guide component 210 through the connecting component 300. Such an arrangement can utilize multiple guide cavities 110 to connect with the server in the electronic device. Under the drainage effect of the guide component 210, the heat emitted by the server is carried away by the airflow and discharged through the exhaust channel 220, thereby achieving the purpose of cooling the server. At the same time, since each guide cavity 110 has an on state and a off state respectively, when the specifications of the electronic device or the number of servers change, there is no need to replace the entire device, only the corresponding guide cavity 110 needs to be selected to be turned on or off, so that the heat dissipation device can adapt to electronic devices of different specifications to dissipate heat, thereby improving the compatibility of the heat dissipation device.

[0034] Specifically, Figures 1 to 4 The air guide assembly 100 further includes: a cover plate 120, which is arranged at the air inlet opening 111 of the air guide cavity 110. The position of the cover plate 120 is movably arranged to block or avoid the air guide cavity 110, so that the air guide cavity 110 is in a conducting state or a closed state; there are multiple cover plates 120, and the multiple cover plates 120 are arranged one by one corresponding to the multiple air guide cavities 110. In this way, the cover plate 120 is used to realize the opening or closing of the air guide cavity 110. When the cover plate 120 blocks the air inlet opening 111, the air guide cavity 110 is in a closed state. When the air guide cavity 110 avoids the air inlet opening 111, the air guide cavity 110 is in a conducting state. At this time, the hot air flow emitted by the server is sucked into the air guide cavity 110 through the air inlet opening 111.

[0035] In the specific implementation process, the air guide assembly 100 also includes: an air guide box 130; a protruding body 140, which is arranged on the air guide box 130, the protruding body 140 protrudes relative to the air guide box 130, the air guide cavity 110 is arranged in the protruding body 140, there are multiple protruding bodies 140, and the multiple protruding bodies 140 are arranged one-to-one with the multiple air guide cavities 110, and the cover plate 120 is movably arranged relative to the protruding body 140. In this way, the air guide cavity 110 is arranged in the protruding body 140, and the protruding body 140 protrudes relative to the air guide box 130. When docking with the server, a certain distance can be generated between the air guide box 130 and the electronic device, thereby providing more flow space for the airflow, and each protruding body 140 can also be used to make it cooperate more closely with each server to improve the heat dissipation effect of the server.

[0036] In one embodiment provided in the present application, the cover plate 120 is hinged to the protruding body 140, and the cover plate 120 is flippably arranged relative to the protruding body 140 to open or close the air inlet opening 111, wherein the flipping angle of the cover plate 120 is greater than or equal to 270°, so that the cover plate 120 can be flipped to the top surface of the protruding body 140, thereby keeping the air inlet opening 111 in an open state.

[0037] In another embodiment provided in the present application, the cover plate 120 is detachably connected to the protruding body 140. Specifically, a rubber ring is provided in the protruding body 140, and the rubber ring extends along the circumferential direction of the protruding body 140. A plug-in board is provided on the cover plate 120, and the plug-in board protrudes relative to the cover plate 120. The plug-in board extends along the circumferential direction of the cover plate 120. At least part of the plug-in board is inserted in the protruding body 140 and has an interference fit with the rubber ring. By utilizing the elastic force of the rubber ring, the cover plate 120 can be separated from the protruding body 140 to avoid the air inlet opening 111, or inserted in the protruding body 140 to block the air inlet opening 111.

[0038] In the present application, the electronic device is arranged on the mounting frame 400, and the guide assembly 100 further includes: a connecting portion 150, which is arranged on the protruding body 140, and the connecting portion 150 is connected to the mounting frame 400; the connecting portion 150 is a plurality of groups, and the plurality of groups of connecting portions 150 are arranged one-to-one corresponding to the plurality of protruding bodies 140. By arranging the connecting portion 150, the heat dissipation device is fixedly connected to the mounting frame 400 during operation, so as to ensure the stability of the heat dissipation device, and avoid the vibration generated during the operation of the electronic device causing an increase in the distance between the heat dissipation device and the heat dissipation device, thereby affecting the heat dissipation effect.

[0039] Specifically, the connecting portion 150 is provided at the end of the protruding body 140, and the connecting portion 150 extends from the protruding body 140 toward a direction away from the protruding body 140; the connecting portion 150 is docked with the mounting frame 400, and the connecting member passes through the connecting portion 150 and the mounting frame 400, so that the protruding body 140 is connected to the mounting frame 400. Preferably, the connecting portion 150 includes a connecting hole, and the mounting frame 400 is provided with a fixing hole corresponding to the connecting hole. The connecting bolts pass through the connecting hole and the fixing hole in sequence and are locked by nuts to connect each protruding body 140 to the mounting frame 400. The bolt connection method is simple and convenient to operate, and is easy to disassemble and assemble.

[0040] In the embodiment provided in the present application, the flow guide component 100 also includes: a flow guide branch pipe 160, which is arranged in the flow guide box 130 and connected to the protruding body 140, the flow guide branch pipe 160 is connected to the flow guide cavity 110, there are multiple flow guide branch pipes 160, and the multiple flow guide branch pipes 160 are arranged one-to-one with the multiple flow guide cavities 110, and each flow guide branch pipe 160 is respectively connected to the connecting component 300; each flow guide branch pipe 160 is respectively provided with a flow detection component 161, a pressure detection component 162 and a control valve 163, the flow detection component 161 is used to detect the flow rate of the airflow in the flow guide branch pipe 160, the pressure detection component 162 is used to detect the pressure of the airflow in the flow guide branch pipe 160, and the control valve 163 is used to control the flow rate of the airflow in the flow guide branch pipe 160. Preferably, the flow detection component 161 is a flow sensor, and the pressure detection component 162 is a pressure sensor, thereby realizing the pressure and flow parameter adjustment function in each guide cavity 110. Different models of servers correspond to different heat dissipation parameters. The parameters are matched by identifying the server model, and then the flow and pressure at each air inlet opening 111 are changed through the control valve 163.

[0041] Furthermore, the flow guide assembly 100 also includes: a confluence chamber 170, which is arranged in the flow guide box 130, one end of the confluence chamber 170 is connected to each flow guide branch pipe 160, and the other end of the confluence chamber 170 is connected to the connecting component 300, and the airflow in each flow guide branch pipe 160 flows into the connecting component 300 through the confluence chamber 170.

[0042] By providing the confluence chamber 170, the overall pipeline structure can be made simpler. The airflow in each diversion branch pipe 160 does not need to be directly introduced into the connecting component 300. This also avoids the phenomenon of airflows in different directions colliding with each other. The airflow in each diversion branch pipe 160 is merged in the confluence chamber 170 and then introduced into the connecting component 300. The air outlet of each diversion branch pipe 160 can be directly provided in the diversion box body 130, and the size requirement of the diversion branch pipe 160 is relatively low. At the same time, the airflow in each diversion branch pipe 160 also plays a buffering role in the confluence chamber 170, so that it is guided into the connecting component 300.

[0043] In the specific implementation process, Figure 5 As shown, the drainage component 210 includes a drainage fan 211, which is connected to one end of the connecting component 300 away from the guide component 100, and the drainage fan 211 is arranged at the air inlet of the exhaust channel 220; the negative pressure component 200 includes: a silencer component 230, at least part of which is arranged at the air outlet of the exhaust channel 220, and the airflow is discharged after passing through the silencer component 230. Among them, the drainage fan 211 includes a fan and a volute, the fan is arranged in the volute, and a guide channel is arranged in the volute, and the guide channel is connected with the exhaust channel 220. During the operation of the fan, after the airflow is introduced into the guide channel, the airflow flows into the exhaust channel 220 under the guide effect of the guide channel. In order to avoid generating a large noise during the exhaust process, the silencer component 230 is arranged in the exhaust channel 220. Preferably, the silencer component 230 is a silencer cotton, which is used to absorb sound waves to achieve the purpose of reducing the noise of heart sounds.

[0044] In the specific implementation process, the flow guide component 100 also includes: a flow guide branch 160, which is connected to the flow guide cavity 110, and there are multiple flow guide branches 160, and the multiple flow guide branches 160 are connected to the flow guide cavity 110 one by one, and each flow guide branch 160 is connected to the connecting component 300; each flow guide branch 160 is respectively provided with a flow detection component 161, a pressure detection component 162 and a control valve 163, and the flow detection component 161 is used to detect the flow of the airflow in the flow guide branch 160, and the pressure detection component 162 is used to detect the pressure of the airflow in the flow guide branch 160, and the control valve 163 is used to control the flow of the flow guide branch 160. The negative pressure assembly 200 further includes: an installation box 240, in which the drainage component 210 and the exhaust passage 220 are respectively arranged, and an exhaust port 221 connected to the exhaust passage 220 is arranged on the top of the installation box 240; a display component 250 is arranged on the installation box 240, and the display component 250 is respectively connected to the drainage component 210, the flow detection component 161, the pressure detection component 162 and the control valve 163 by signal to display the operating parameters of the drainage component 210, the flow detection component 161, the pressure detection component 162 and the control valve 163. Preferably, the display component 250 is a touch screen, which is combined with a PLC controller and touch screen technology to display the operating status, system parameters and alarm information of the device in real time, and can also directly set parameters for the PLC and upload the operating data information to the cloud.

[0045] In this application, if Figure 6As shown, the connecting component 300 includes: a connecting pipe 310, the two ends of which are respectively connected to the drainage component 210 and each diversion cavity 110; and a supporting component 320, which is arranged in the connecting pipe 310, and the supporting component 320 is in contact with the pipe wall surface of the connecting pipe 310 to support the connecting pipe 310. The connecting pipe 310 is supported by the supporting component 320 to prevent the connecting pipe 310 from being deformed when negative pressure is generated in the connecting pipe 310, thereby affecting the circulation of airflow. Preferably, the connecting pipe 310 is a bellows, and the supporting component 320 is a negative pressure ring, which is in contact with the pipe wall of the bellows.

[0046] In a specific implementation, an air inlet pipe 212 opposite to and connected to the guide component 210 is provided on the installation box 240, and an air outlet pipe connected to the confluence chamber 170 is provided on the guide box 130. Both ends of the connecting pipe 310 are connected to the air inlet pipe and the air outlet pipe through clamps respectively. This arrangement is convenient for disassembly and assembly. If the guide component 100 needs to be replaced, it is only necessary to remove the connecting pipe 310 and the air outlet pipe without replacing the entire heat dissipation device, and the operation is convenient.

[0047] The heat dissipation device of the present application aims at the prior art, which uses a heat dissipation fan module to take away the heat dissipated by the heat-generating components of the server, thereby achieving the purpose of heat dissipation. However, the prior art has the following disadvantages:

[0048] (1) The compatibility of the heat dissipation module is poor. If the height of the server changes, the corresponding heat dissipation module needs to be replaced as a whole, which makes it difficult to achieve batch operation;

[0049] (2) Since the replacement process of the heat dissipation module is relatively complicated and requires a lot of manual involvement, the application cost of the heat dissipation module increases, resulting in reduced profits;

[0050] (3) The heat dissipation module does not have the function of self-regulation and cannot automatically adjust the system according to the actual operation of the heat dissipation module, including but not limited to the determination of the equipment operation parameter settings;

[0051] (4) The heat dissipation module needs to be fixed on the aging rack to occupy the test aging position. If the air-cooled server or cold plate liquid-cooled server is tested, it must be completely dismantled to ensure the normal operation of the aging test, resulting in a huge waste of manpower and material resources.

[0052] In response to the above-mentioned technical problems, the heat dissipation device of the present application, by setting up a plurality of guide cavities 110, achieves compatibility with electronic equipment of different numbers of servers. If the electronic equipment is too high or there are too many servers, it is only necessary to replace the guide assembly 100 without replacing the entire device. The pipes are connected by clamps, which are convenient for disassembly and assembly. By respectively setting a flow detection component 161, a pressure detection component 162 and a control valve 163 on each guide branch pipe 160, the entire system has a self-regulating function, and can adjust and determine parameters such as the flow rate and pressure of the airflow according to actual operating conditions. By setting a connecting portion 150 on the protruding body 140, the protruding body 140 is connected to the mounting frame 400 for placing the electronic equipment through the connecting portion 150, which will not affect the normal operation of the electronic equipment and will not occupy the space on the mounting frame 400.

[0053] The present application sets a flow guide component 100 to connect the server and the negative pressure component 200, and utilizes the principle of air convection of the flow guide fan 211 to cool down and dissipate heat for the server, and can also achieve the effect of dust removal for the server, and quickly remove the heat generated by the server's heating components through each flow guide cavity 110, with a cooling effect of about 80%, and the device of the present application can automatically adjust the heat dissipation parameters according to the actual operating conditions, without manual intervention, avoiding waste of manpower and material resources. In addition, the device of the present application can cool down and dissipate heat for multiple servers at the same time, effectively improving production efficiency, greatly improving the practicality of the equipment, and facilitating low-cost, high-quality, and rapid mass production. After heat dissipation simulation calculation, the flow rate reaches 400m 3 / h, and a pressure of 4kPa can meet the heat dissipation needs of a 1U high immersion liquid cooling server.

[0054] By setting a flow detection component 161, a pressure detection component 162 and a control valve 163 on each diversion branch pipe 160, the pressure and flow parameter adjustment function of each air inlet opening 111 is realized. Different types of servers correspond to different heat dissipation parameters. The parameters are matched by identifying the model and then the regulating valve is controlled to change the flow and pressure of each air inlet opening 111. The working pressure and flow of each branch pipe can be read and set on the touch screen. Each guide cavity 110 is distributed along a vertical linear array, preferably with ten interfaces. After double verification by experiments and simulations, if the number of interfaces is too small, the work efficiency will be reduced and rapid batch production cannot be achieved. If the number of interfaces is too large, some interfaces will not be able to reach the set heat dissipation parameters, affecting the heat dissipation effect. There are barcodes and indicator lights at appropriate positions near each interface, preferably set on the side of each protruding body 140, and the interface identification and the association binding between the interface and the server are performed by scanning the barcode. The working status of the corresponding interface is intuitively displayed through the different states of the indicator light. Each interface is connected to a server through bolts, and the heat emitted by the server's heating components is collected and concentrated in the guide branch pipe 160, and transferred to the guide fan 211 through the connecting pipe 310. The cover plate 120 is a quick-change cover plate to meet the use requirements of good sealing, opening the cover and opening, and frequent switching, etc., and can also ensure that each interface can independently perform heat dissipation and heat dissipation related parameter settings and other operations. If the heat dissipation device of the present application needs to dissipate heat and cool servers at different heights, it only needs to replace the corresponding air guide structure and remove the clamp to replace it. It can be completed by one person and is simple to operate.

[0055] The heat dissipation device of the present application is suitable for servers in a production test environment. In actual application, the operation process is as follows: the employee scans the server barcode, and the heat dissipation device allocates an interface to it (i.e., the diversion chamber 110 allocation), the indicator light of the corresponding interface lights up, and a pop-up window appears on the device touch screen to prompt the employee to connect the server back window and the allocation interface. After the connection is completed, the employee scans the device interface barcode to bind the server to the corresponding interface. The heat dissipation device starts working, and the drainage fan starts to extract the heat emitted by the various heating components of the server. After passing through the diversion chamber 110, the confluence chamber 170, the connecting pipe 310, and the drainage fan 211, the heat is discharged from the exhaust port 221 to achieve the purpose of heat dissipation, cooling and dust removal. After the aging test is completed, a pop-up window appears on the device touch screen to indicate that the test heat dissipation is completed and prompt the employee to disconnect the relevant connections.

[0056] In addition, in another embodiment provided in the present application, a filter is provided at the connection point between the connecting pipe 310 and the confluence chamber 170 for filtering impurities in the airflow. The connecting pipe 310 can be removed by removing the clamp to achieve replacement of the filter, which is simple and convenient to operate.

[0057] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0058] (1) The present application provides a novel air-cooled heat dissipation and temperature reduction device for an immersion liquid-cooled server in a production test environment, which can generate different wind speeds in different areas and has a good cooling effect;

[0059] (2) The present application provides a novel air-cooled heat dissipation and temperature reduction device for an immersion liquid-cooled server in a production test environment, which integrates cooling, ventilation, and dust removal, and has low energy consumption;

[0060] (3) The present application provides a novel air-cooled heat dissipation and temperature reduction device for an immersion liquid-cooled server in a production test environment, which replaces the immersion heat dissipation technology and eliminates the need to use expensive coolant for heat dissipation during production aging testing, thereby reducing heat dissipation costs;

[0061] (4) The present application provides a novel air-cooled heat dissipation and temperature reduction device for an immersion liquid-cooled server in a production test environment, which has a simple overall structure, is easy to operate, replace and maintain, and is easy to industrialize;

[0062] (5) The present application provides a novel air-cooled heat dissipation and temperature reduction device for immersion liquid-cooled servers in a production test environment, which can simultaneously dissipate heat, cool and remove dust from multiple servers, improve heat dissipation efficiency, reduce the operation time of a single workstation, and facilitate mass production;

[0063] (6) The present application provides a novel air-cooled heat dissipation and temperature reduction device for immersion liquid-cooled servers in production test environments, which has system self-sensing and automatic adjustment functions. When servers of different models and configurations need heat dissipation, the system can be automatically adjusted according to actual operating conditions to meet the heat dissipation requirements of the servers.

[0064] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0065] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0066] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0067] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0068] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation device for dissipating heat from an electronic device, characterized in that: The heat dissipation device comprises: A flow guide component (100), the flow guide component (100) comprising a plurality of flow guide cavities (110), the plurality of flow guide cavities (110) being arranged at intervals in a vertical direction, each of the flow guide cavities (110) being selectively connected to each server in the electronic device, each of the flow guide cavities (110) having an on state and a off state, respectively, and when the flow guide cavity (110) is in the on state, it guides the hot air flow emitted by the server; A negative pressure component (200) comprises a flow guide component (210) and an exhaust channel (220), wherein the flow guide component (210) is arranged at the air inlet of the exhaust channel (220), the flow guide component (210) is communicated with each of the flow guide cavities (110), and the airflow in the flow guide cavity (110) is guided through the flow guide component (210) to be discharged into the exhaust channel (220); A connecting component (300), wherein two ends of the connecting component (300) are respectively connected to each of the flow guide cavities (110) and the flow guide component (210), so that the airflow in each of the flow guide cavities (110) flows into the flow guide component (210) through the connecting component (300).

2. The heat dissipation device according to claim 1, characterized in that: The flow guide assembly (100) further comprises: A cover plate (120) is arranged at the air inlet opening (111) of the guide cavity (110), and the position of the cover plate (120) is movably arranged to block or avoid the guide cavity (110), so that the guide cavity (110) is in the on state or the off state; There are a plurality of cover plates (120), and the plurality of cover plates (120) are arranged in a one-to-one correspondence with the plurality of flow guide cavities (110).

3. The heat dissipation device according to claim 2, characterized in that: The flow guide assembly (100) further comprises: A flow guide box (130); A protruding body (140) is arranged on the flow guide box (130), the protruding body (140) protrudes relative to the flow guide box (130), the flow guide cavity (110) is arranged in the protruding body (140), there are multiple protruding bodies (140), the multiple protruding bodies (140) and the multiple flow guide cavities (110) are arranged one by one, and the cover plate (120) is movably arranged relative to the protruding body (140).

4. The heat dissipation device according to claim 3, characterized in that: The electronic device is arranged on a mounting frame (400), and the flow guide assembly (100) further comprises: A connecting portion (150) is disposed on the protruding body (140), and the connecting portion (150) is connected to the mounting frame (400); The connecting parts (150) are multiple groups, and the multiple groups of connecting parts (150) are arranged in a one-to-one correspondence with the multiple protruding bodies (140).

5. The heat dissipation device according to claim 4, characterized in that: The connecting portion (150) is arranged at the end of the protruding body (140), and the connecting portion (150) extends from the protruding body (140) in a direction away from the protruding body (140); The connecting portion (150) is butted against the mounting frame (400), and a connecting piece passes through the connecting portion (150) and the mounting frame (400), so that the protruding body (140) is connected to the mounting frame (400).

6. The heat dissipation device according to claim 3, characterized in that: The flow guide assembly (100) further comprises: a flow guiding branch pipe (160), arranged in the flow guiding box (130) and connected to the protruding body (140), the flow guiding branch pipe (160) being in communication with the flow guiding cavity (110), the flow guiding branch pipe (160) being in plurality, the plurality of the flow guiding branch pipes (160) being arranged in one-to-one correspondence with the plurality of the flow guiding cavities (110), and each of the flow guiding branch pipes (160) being in communication with the communication component (300); Each of the flow guiding branch pipes (160) is provided with a flow detection component (161), a pressure detection component (162) and a control valve (163), respectively. The flow detection component (161) is used to detect the flow rate of the airflow in the flow guiding branch pipe (160), the pressure detection component (162) is used to detect the pressure of the airflow in the flow guiding branch pipe (160), and the control valve (163) is used to control the flow rate of the airflow in the flow guiding branch pipe (160).

7. The heat dissipation device according to claim 6, characterized in that: The flow guide assembly (100) further comprises: A confluence chamber (170) is arranged in the flow guide box (130); one end of the confluence chamber (170) is connected to each of the flow guide branch pipes (160); the other end of the confluence chamber (170) is connected to the connecting component (300); the airflow in each of the flow guide branch pipes (160) flows into the connecting component (300) through the confluence chamber (170).

8. The heat dissipation device according to claim 1, characterized in that: The flow guiding component (210) comprises a flow guiding fan (211), the flow guiding fan (211) being connected to an end of the connecting component (300) away from the flow guiding assembly (100), and the flow guiding fan (211) being arranged at the air inlet of the exhaust channel (220); The negative pressure component (200) comprises: A silencer component (230), at least a portion of which is disposed in the exhaust passage (220), and the airflow is discharged after passing through the silencer component (230).

9. The heat dissipation device according to claim 1, characterized in that: The flow guide assembly (100) further comprises: a diversion branch pipe (160) connected to the diversion cavity (110); the diversion branch pipe (160) is multiple, the multiple diversion branch pipes (160) are connected to the diversion cavity (110) in a one-to-one correspondence, and each of the diversion branch pipes (160) is connected to the connecting component (300); Each of the flow guiding branch pipes (160) is respectively provided with a flow detection component (161), a pressure detection component (162) and a control valve (163); the flow rate of the airflow in the flow guiding branch pipe (160) is detected by the flow detection component (161); the pressure of the airflow in the flow guiding branch pipe (160) is detected by the pressure detection component (162); and the flow rate of the airflow in the flow guiding branch pipe (160) is controlled by the control valve (163); The negative pressure component (200) further comprises: An installation box (240), wherein the flow guide component (210) and the exhaust passage (220) are respectively arranged in the installation box (240), and an exhaust port (221) communicating with the exhaust passage (220) is arranged at the top of the installation box (240); A display component (250) is arranged on the installation box (240), and the display component (250) is respectively connected to the drainage component (210), the flow detection component (161), the pressure detection component (162) and the control valve (163) through signals to display the operating parameters of the drainage component (210), the flow detection component (161), the pressure detection component (162) and the control valve (163).

10. The heat dissipation device according to claim 1, characterized in that: The communication component (300) comprises: A connecting pipe (310), wherein two ends of the connecting pipe (310) are respectively connected to the flow guide component (210) and each of the flow guide chambers (110); A supporting component (320) is arranged in the connecting pipe (310), and the supporting component (320) is in contact with the pipe wall surface of the connecting pipe (310) to support the connecting pipe (310).

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