Device for installing pressing die head

Abstract

The invention provides a device for installing a pressing die head. The device for mounting the pressing die head is used for mounting the pressing die head on semiconductor mounting equipment. The device for installing the pressing die head comprises a base, a rotating shaft, a fixing part and a driving part. The rotating shaft is located on the base and can rotate relative to the base. The fixing part is fixed to the end, away from the base, of the rotating shaft and used for bearing and fixing the die pressing head. And the driving part can drive the rotating shaft to rotate, so that the rotating shaft drives the fixing part to rotate, and the fixing part drives the die pressing head to rotate, so that the die pressing head is connected with the semiconductor mounting equipment.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a device for installing a die head. Background Art

[0002] During the preparation of semiconductor structures, wafer loading machines are frequently used equipment. A die head can be installed on the wafer loading machine to shape the solder on the semiconductor structure so as to facilitate welding of the semiconductor structure with other structures.

[0003] At present, the operator usually lifts the die head and rotates the die head to make the die head and the loader threaded connection. However, the temperature of the loading equipment is as high as 400℃ during operation, and the installation space is limited. The operator may touch the loader during the rotation of the die head, which poses a safety hazard. Summary of the invention

[0004] The embodiment of the present application provides a device for installing a die head. The device for installing a die head is used to install the die head on a semiconductor wafer mounting device. The device for installing a die head includes:

[0005] Base;

[0006] A rotating shaft, located on the base and rotatable relative to the base;

[0007] A fixing portion, fixed to an end of the rotating shaft away from the base, for carrying and fixing the die head;

[0008] The driving part can drive the rotating shaft to rotate, so that the rotating shaft drives the fixing part to rotate, and the fixing part drives the die head to rotate, so that the die head is connected to the semiconductor mounting equipment.

[0009] In one embodiment, the side surface of the rotating shaft is provided with a plurality of first meshing teeth arranged along the circumferential direction, and the driving part includes a transmission part and an active part; the transmission part can move relative to the base; one side surface of the transmission part is provided with a second meshing tooth, the other side surface is provided with a third meshing tooth, and the active part is provided with a fourth meshing tooth; the first meshing tooth is meshed with the second meshing tooth, and the third meshing tooth is meshed with the fourth meshing tooth; the active part can rotate relative to the base to drive the rotating shaft to rotate through the transmission part.

[0010] In one embodiment, in the moving direction of the transmission portion, the maximum dimension of the third meshing tooth is greater than the maximum dimension of the second meshing tooth.

[0011] In one embodiment, the device for installing the die head further comprises a slide rail arranged on the base and a slider arranged on the slide rail, and the slider can move along the slide rail; the transmission part is fixed on the slider.

[0012] In one embodiment, the device for mounting the die head comprises at least two sliders, and two opposite ends of the transmission part are respectively fixed on the sliders.

[0013] In one embodiment, the device for installing the die head further comprises an operating part connected to the active part; the operating part is rotatably disposed on the base.

[0014] In one embodiment, the fixing portion includes a fixing plate, an elastic member and a baffle, the fixing plate is fixed to one end of the rotating shaft away from the base, the fixing plate is provided with a receiving groove, and one side surface of the receiving groove is a first abutting surface; the baffle is located in the receiving groove, opposite to the first abutting surface, and can move in the receiving groove; when the baffle moves in a direction away from the first abutting surface, the elastic member is deformed; when the elastic member recovers its deformation, it drives the baffle to move in a direction close to the fixing plate.

[0015] In one embodiment, the fixing portion further includes a connecting rod and an abutting portion arranged on the connecting rod, the connecting rod is connected to the baffle plate and is located on the side of the baffle plate opposite to the first abutting surface; one end of the elastic member abuts against the fixing plate, and the other end abuts against the abutting portion; when the connecting rod pushes the baffle plate to move in a direction away from the first abutting surface, the elastic member is compressed; when the elastic member is stretched, it drives the baffle plate to move toward the first abutting surface.

[0016] In one embodiment, the accommodating groove further includes a second abutting surface arranged opposite to the first abutting surface, and one end of the elastic member abuts against the baffle, and the other end abuts against the second abutting surface.

[0017] In one embodiment, the device for mounting the die head further comprises a gripping portion connected to the base.

[0018] The device for installing the die head provided in the embodiment of the present application, when used to install the die head on the semiconductor wafer loading equipment, first fix the die head on the fixed part, and align the die head with the installation position of the semiconductor wafer loading equipment, and then control the driving part to drive the rotating shaft to rotate, so that the fixed part drives the die head to rotate, so that the die head is connected to the semiconductor wafer loading equipment. During the installation of the die head, there is no need for the operator to rotate the die head, which can prevent the operator's arm from touching the semiconductor wafer loading equipment, thereby improving the safety of installing the die head; the operation is simple, and the installation efficiency of the die head can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a top view of a device for installing a die head provided by an exemplary embodiment of the present application;

[0020] Figure 2 is a side view of a device for installing a die head provided by an exemplary embodiment of the present application;

[0021] Figure 3 is a side view of a partial structure of a driving part in a device for mounting a die head provided by an exemplary embodiment of the present application;

[0022] Figure 4 is a top view of a device for mounting a die head provided by another exemplary embodiment of the present application;

[0023] Figure 5 is a top view of a die head provided by an exemplary embodiment of the present application when it is fixed to a device for mounting the die head;

[0024] Figure 6 It is a top view of a device for installing a die head provided by an exemplary embodiment of the present application after driving the die head to rotate. Specific embodiments

[0025] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0026] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0027] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0028] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0029] The embodiment of the present application provides a device for installing a die head. The device for installing a die head is used to install the die head on a semiconductor wafer loading device. The die head can be used to shape the solder on the semiconductor structure so that the solder forms a specific shape, such as a cylindrical shape, a cubic shape, etc., so as to facilitate the welding of the semiconductor structure with other structures.

[0030] like Figure 1 and Figure 2 As shown, the device for mounting the die head includes a base 10 , a rotating shaft 20 , a fixing portion 30 and a driving portion 40 .

[0031] The rotating shaft 20 is located on the base 10 and can rotate relative to the base 10. The fixing portion 30 is fixed to one end of the rotating shaft 20 away from the base 10, and is used to carry and fix the die head. The driving portion 40 can drive the rotating shaft 20 to rotate, and the rotating shaft 20 drives the fixing portion 30 to rotate, so that the fixing portion 30 drives the die head to rotate, so that the die head is connected to the semiconductor wafer mounting equipment.

[0032] The device for installing the die head provided in the embodiment of the present application, when used to install the die head on the semiconductor wafer loading equipment, first fix the die head on the fixed part, and align the die head with the installation position of the semiconductor wafer loading equipment, and then control the driving part to drive the rotating shaft to rotate, so that the fixed part drives the die head to rotate, so that the die head is connected to the semiconductor wafer loading equipment. During the installation of the die head, there is no need for the operator to rotate the die head, which can prevent the operator's arm from touching the semiconductor wafer loading equipment, thereby improving the safety of installing the die head; the operation is simple, and the installation efficiency of the die head can be improved.

[0033] In one embodiment, the die head and the semiconductor chip loading device can be connected by a thread. In this way, the die head can be connected to the chip loading device during the process of the die head being driven by the fixed part to rotate. In other embodiments, the die head and the semiconductor chip loading device can be connected by a buckle. During the process of the die head being driven by the fixed part to rotate, the buckles and buckle positions provided on the die head and the semiconductor chip loading device cooperate to realize the connection between the two.

[0034] In one embodiment, Figures 1 to 3As shown, the side of the rotating shaft 20 is provided with a plurality of first meshing teeth 21 arranged in the circumferential direction; the driving part 40 includes a transmission part 41 and an active part 42; the transmission part 41 can move relative to the base 10; the transmission part 41 can include a plurality of side surfaces, one of the plurality of side surfaces is provided with a second meshing tooth 411, and another side surface is provided with a third meshing tooth 412; the active part 42 is provided with a fourth meshing tooth 421. The first meshing tooth 21 meshes with the second meshing tooth 411, and the third meshing tooth 412 meshes with the fourth meshing tooth 421. The active part 42 can rotate relative to the base 10 to drive the rotating shaft 20 to rotate through the transmission part 41. Since the fourth meshing teeth 421 of the active part 42 mesh with the third meshing teeth 412 of the transmission part 41, and the second meshing teeth 411 of the transmission part 41 mesh with the first meshing teeth 21 of the rotating shaft 20, when the active part 42 rotates relative to the base 10, the active part 42 drives the transmission part 41 to move relative to the base 10, and then the movement of the transmission part 41 drives the rotating shaft 20 to rotate. That is, the rotating shaft 20 can be driven to rotate by rotating the active part 42, so as to realize the connection between the die head and the semiconductor wafer mounting equipment, and the operation is relatively simple.

[0035] In one embodiment, the rotating shaft 20 may include a bearing and a gear sleeved on the bearing, wherein the gear is provided with a plurality of first meshing teeth 21. The bearing is mounted on the base 10 and can rotate relative to the base 10.

[0036] In one embodiment, Figure 1 and Figure 3 As shown, the transmission part 41 is provided with a plurality of second meshing teeth 411 and a plurality of third meshing teeth 412, wherein the plurality of second meshing teeth 411 are arranged in the length direction of the transmission part 41, and the plurality of third meshing teeth 412 are arranged in the length direction of the transmission part 41. The length direction of the transmission part 41 is the moving direction of the transmission part 41 relative to the base 10.

[0037] In one embodiment, Figure 1 and Figure 3As shown, one of the two adjacent side surfaces of the transmission part 41 is provided with a second meshing tooth 411, and the other side surface is provided with a third meshing tooth 412; the active part 42 includes a main body 422 with a circular cross section, and the fourth meshing tooth 421 is arranged outside the main body 422. The central axis of the main body 422 of the active part 42 is parallel to the surface of the base 10. In this way, the rotation of the active part 42 is facilitated. In other embodiments, the second meshing tooth 411 and the third meshing tooth 412 are arranged on two opposite side surfaces of the transmission part 41, and the central axis of the main body 422 of the active part 42 is perpendicular to the surface of the base 10. Preferably, the second meshing tooth 411 and the third meshing tooth 412 are arranged on two adjacent side surfaces of the transmission part 41, and at this time, the central axis of the main body 422 is parallel to the surface of the base 10, which is convenient for the operator to operate to rotate the main body 422.

[0038] In one embodiment, Figure 1 and Figure 3 As shown, in the direction in which the transmission part 41 moves, the maximum size of the third meshing tooth 412 is greater than the maximum size of the second meshing tooth 411. With such a configuration, the operator saves effort when rotating the active part 42.

[0039] In one embodiment, Figure 1 As shown, the device for installing the die head further includes an operating part 50 connected to the active part 42. The operator can rotate the operating part 50 to drive the active part 42 to rotate, which is convenient for the operator to operate. Figure 1 In the illustrated embodiment, the operating portion 50 includes a first rod portion 51 and a second rod portion 52 connected to one end of the rod portion 51. The end of the first rod portion 51 facing away from the second rod portion 52 is connected to the active portion 42. The length direction of the second rod portion 52 and the length direction of the first rod portion 51 may be perpendicular to each other.

[0040] In one embodiment, the operating part 50 is rotatably disposed on the base 10. In this way, the operating part 50 and the base 10 will not be separated, and the operating part 50 can be prevented from being lost after being separated from the base 10.

[0041] In one embodiment, Figure 1 As shown, the base 10 is provided with a fixing structure 60. The fixing structure 60 is provided with a through hole, and the first rod portion 51 can pass through the through hole and can rotate in the through hole. The size of the through hole can be slightly larger than the outer size of the first rod portion 51, so that the first rod portion 51 can rotate smoothly in the through hole.

[0042] In one embodiment, Figure 2As shown, the device for mounting the die head further comprises a slide rail 71 provided on the base 10 and a slider 72 provided on the slide rail 71, and the slider 72 can move along the slide rail 71; the transmission part 41 is fixed on the slider 72. Since the transmission part 41 is fixed on the slider 72, the slider 72 can drive the transmission part 41 to move along the slide rail 71. By providing the slide rail 71, the moving direction of the transmission part 41 can be guided to avoid the situation where the moving direction of the transmission part 41 is offset and the shaft 20 cannot be driven to rotate.

[0043] In one embodiment, the device for mounting the die head includes at least two sliders 72, and the two opposite ends of the transmission part 41 are respectively fixed on the sliders 72. This ensures that the transmission part 41 is at the same height as a whole, and ensures that the transmission part 41 can smoothly drive the rotating shaft 20 to rotate. When the number of the sliders 72 is greater than two, the other sliders 72 are located between the two ends of the transmission part 41, and the distance between any two adjacent sliders 72 can be the same.

[0044] In one embodiment, the length of the slide rail 71 is greater than the length of the transmission part 41. Thus, after the transmission part 41 moves along the slide rail 71, the end of the transmission part 41 can still be located on the slide rail 71, and the end of the transmission part 41 can be prevented from moving outside the slide rail 71.

[0045] In one embodiment, Figure 1 and Figure 4 As shown, the fixing portion 30 includes a fixing plate 31, an elastic member 32 and a baffle 33. The fixing plate 31 is fixed to the end of the rotating shaft 20 away from the base 10. The fixing plate 31 is provided with a receiving groove 311, and one side of the receiving groove 311 is a first abutting surface 312. The baffle 33 is located in the receiving groove 311, opposite to the first abutting surface 312, and can move in the receiving groove 311. When the baffle 33 moves in a direction away from the first abutting surface 312, the elastic member 32 is deformed, and the die head can be placed between the first abutting surface 312 and the baffle 33 or can be taken out from between the first abutting surface 312 and the baffle 33. When the elastic member 32 recovers its deformation, it drives the baffle 33 to move in a direction close to the fixing plate 31. With such arrangement, when the elastic member 32 is deformed, it is easy to place the die head in the receiving groove 311, and after the die head is mounted on the semiconductor chip mounting equipment, it is convenient to separate the die head from the fixed plate; and when the elastic member 32 recovers its deformation, the die head can be fixed between the first abutting surface 312 and the baffle 33, so that the die head is firmly fixed on the fixed part 30, preventing the die head from rotating relative to the fixed part 30 during the rotation of the fixed part 30, and thus preventing the die head from being connected to the semiconductor chip mounting equipment. In some embodiments, the elastic member 32 can be a spring.

[0046] In one embodiment, Figure 1 As shown, the fixing portion 30 further includes a connecting rod 81 and an abutting portion 82 disposed on the connecting rod 81. The connecting rod 81 is connected to the baffle plate 33 and is located on the side of the baffle plate 33 opposite to the first abutting surface 312. One end of the elastic member 32 abuts against the fixing plate 31, and the other end abuts against the abutting portion 82. When the connecting rod 81 pushes the baffle plate 33 to move away from the first abutting surface 312, the elastic member 32 is compressed, and the die head can be placed between the first abutting surface 312 and the baffle plate 33 or separated from the fixing plate. When the elastic member 32 is stretched, it drives the baffle plate 33 to move toward the first abutting surface 312. Figure 5 As shown, the two opposite sides of the die head 91 are respectively in contact with the first contact surface 312 and the baffle 33. The structure obtained after the fixing part 30 drives the die head 91 to rotate 90° is as shown in FIG. Figure 6 As shown, at this time, the die head 91 is connected to the semiconductor wafer mounting equipment.

[0047] Furthermore, if Figure 3 As shown, the connecting rod 81 includes a third rod portion 811 and a fourth rod portion 812. One end of the third rod portion 811 is connected to the baffle 33, and the other end is connected to the fourth rod portion 812. The length direction of the third rod portion 811 and the length direction of the fourth rod portion 812 can be perpendicular to each other. This makes it easier for operators to operate the connecting rod 81.

[0048] Furthermore, if Figure 1 As shown, the fixing plate 31 is provided with a long strip groove 317, and the groove 317 is partially formed by the bottom surface of the receiving groove 311, and the connecting rod 81 is located in the groove 317. In this way, the connecting rod 81 will not affect the flatness of the bottom surface of the receiving groove 311, and can prevent the die head from being placed in the receiving groove 311. The part of the connecting rod 81 located in the receiving groove 311 makes the die head unstable, thereby affecting the connection between the die head and the semiconductor chip mounting equipment.

[0049] In another embodiment, if Figure 4 As shown, the accommodating groove 311 also includes a second abutting surface 313 arranged opposite to the first abutting surface 312, and one end of the elastic member 32 abuts against the baffle 33, and the other end abuts against the second abutting surface 313. In this arrangement, when a force is applied to the baffle 33 to move the baffle 33 in a direction away from the first abutting surface 312, the elastic member 32 is compressed, and the die head can be placed between the first abutting surface 312 and the baffle 33 or can be separated from the fixed plate 31; after the die head is placed between the first abutting surface 312 and the baffle 33, the force applied to the baffle 33 is stopped, and the elastic member 32 stretches, driving the baffle 33 to move in a direction close to the first abutting surface 312 until the baffle 33 abuts against the die head.

[0050] Furthermore, if Figure 4 As shown, the fixing portion 30 further includes an operating rod 83 , which is connected to the baffle 33 . The operating rod 83 can be used to apply a force to the baffle 33 to facilitate operation. Figure 4 In the illustrated embodiment, the operating rod 83 includes a fifth rod portion 84 and a sixth rod portion 85. One end of the fifth rod portion 84 is connected to the baffle 33, and the other end is connected to the sixth rod portion 85. The length direction of the fifth rod portion 84 and the length direction of the sixth rod portion 85 may be perpendicular to each other.

[0051] In one embodiment, Figure 1 As shown, the device for installing the die head further includes a gripping portion 90 connected to the base 10. The gripping portion 90 may be connected to the side of the base 10. When installing the die head using the device for installing the die head, the operator adjusts the position of the die head by holding the gripping portion 90 so that the die head contacts the semiconductor wafer mounting device.

[0052] Furthermore, the gripping portion 90 and the operating portion 50 may be located on the same side or on two adjacent sides of the fixing plate 31. In this way, the gripping portion 90 and the operating portion 50 are close to each other, and the operator can hold the gripping portion 90 with one hand and rotate the operating portion 50 with the other hand, thereby reducing the difficulty of operation.

[0053] The device for installing the die head provided in the embodiment of the present application can also be used to remove the die head from the semiconductor loading equipment. For example, when the active part 42 is rotated in a first direction to connect the die head to the semiconductor loading equipment, the active part 42 can be rotated in a second direction opposite to the first direction to separate the die head from the semiconductor loading equipment. In the process of removing the die head from the semiconductor loading equipment using the device for installing the die head, there is no need for the operator to rotate the die head, which can prevent the operator from touching the semiconductor loading equipment, thereby improving the safety of the operation.

[0054] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0055] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0056] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A device for mounting a die head, used for mounting a die head on a semiconductor wafer mounting device; characterized in that: The device for installing the die head comprises: Base; A rotating shaft, located on the base and rotatable relative to the base; A fixing portion, fixed to an end of the rotating shaft away from the base, for carrying and fixing the die head; The driving part can drive the rotating shaft to rotate, so that the rotating shaft drives the fixing part to rotate, and the fixing part drives the die head to rotate, so that the die head is connected to the semiconductor mounting equipment.

2. The device for installing a die head according to claim 1, characterized in that: The side surface of the rotating shaft is provided with a plurality of first meshing teeth arranged along the circumferential direction, and the driving part includes a transmission part and an active part; the transmission part can move relative to the base; one side surface of the transmission part is provided with a second meshing tooth, the other side surface is provided with a third meshing tooth, and the active part is provided with a fourth meshing tooth; the first meshing tooth is meshed with the second meshing tooth, and the third meshing tooth is meshed with the fourth meshing tooth; the active part can rotate relative to the base to drive the rotating shaft to rotate through the transmission part.

3. The device for installing a die head according to claim 2, characterized in that: In the moving direction of the transmission portion, the maximum dimension of the third meshing tooth is greater than the maximum dimension of the second meshing tooth.

4. The device for installing a die head according to claim 2, characterized in that: The device for installing the die head also includes a slide rail arranged on the base and a slider arranged on the slide rail, and the slider can move along the slide rail; the transmission part is fixed on the slider.

5. The device for installing a die head according to claim 4, characterized in that: The device for installing the die head comprises at least two sliders, and two opposite ends of the transmission part are respectively fixed on the sliders.

6. The device for installing a die head according to claim 2, characterized in that: The device for installing the die head also includes an operating part connected to the active part; the operating part is rotatably arranged on the base.

7. The device for installing a die head according to claim 1, characterized in that: The fixing portion includes a fixing plate, an elastic member and a baffle, wherein the fixing plate is fixed to one end of the rotating shaft away from the base, and the fixing plate is provided with a receiving groove, and one side surface of the receiving groove is a first abutting surface; the baffle is located in the receiving groove, opposite to the first abutting surface, and can move in the receiving groove; when the baffle moves in a direction away from the first abutting surface, the elastic member is deformed; when the elastic member recovers its deformation, it drives the baffle to move in a direction close to the fixing plate.

8. The device for mounting a die head according to claim 7, characterized in that: The fixing portion also includes a connecting rod and an abutment portion arranged on the connecting rod, the connecting rod is connected to the baffle plate and is located on the side of the baffle plate opposite to the first abutment surface; one end of the elastic member abuts against the fixing plate, and the other end abuts against the abutment portion; when the connecting rod pushes the baffle plate to move in a direction away from the first abutment surface, the elastic member is compressed; when the elastic member stretches, it drives the baffle plate to move toward the first abutment surface.

9. The device for installing a die head according to claim 7, characterized in that: The accommodating groove further includes a second abutting surface arranged opposite to the first abutting surface. One end of the elastic member abuts against the baffle, and the other end abuts against the second abutting surface.

10. The device for installing a die head according to claim 1, characterized in that: The device for mounting the die head also includes a gripping portion connected to the base.

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