Adhesive removing and recovering equipment and adhesive removing and recovering method for adhesive part

Abstract

The embodiment of the invention provides an adhesive part adhesive removal recovery device and method, an adhesive part comprises a crystal support, an adhesive plate and a crystal bar which are sequentially stacked, bonded and fixed, and the adhesive part adhesive removal recovery device comprises a material preparation platform used for supplying an adhesive part to be subjected to adhesive removal; the adhesive layer stripping device is used for separating and stripping the adhesive plate and the crystal bar; the residual glue cleaning device is used for cleaning residual glue on the crystal bar; and the transfer device is used for carrying the adhesive parts between different positions. The adhesive removing and recovering equipment for the adhesive part is more stable and consistent when being used for recovering the crystal bars, the quality of recovering the crystal bars can be improved, manpower can be replaced for continuously recovering a plurality of crystal bars, and the efficiency of recovering the crystal bars can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal rod slicing processing, and in particular to a device for removing and restoring adhesive parts and a method for removing and restoring adhesive parts. Background Art

[0002] In order to obtain the silicon wafers required in the manufacturing process of photovoltaic modules, the crystal rod, adhesive plate and crystal tray need to be glued together in sequence and then sent to the slicer for cutting. During the process of gluing the crystal rod, due to various factors, it is inevitable that there will be glue anomalies such as empty glue, offset, glue anomalies, etc. Abnormal glue will affect the cutting of the crystal rod, resulting in poor quality of silicon wafers.

[0003] In order to reduce the losses caused by crystal rods with abnormal adhesiveness, currently, when encountering crystal rods with abnormal adhesiveness, workers in the industry usually remove the adhesive plate and crystal tray to restore the crystal rod to its original state.

[0004] However, the manual restoration method by workers can easily cause damage to the crystal rod and has low efficiency. Summary of the invention

[0005] The present invention provides an adhesive removal and restoration device and an adhesive removal and restoration method for an adhesive part, so as to solve the problem that in the existing crystal rod adhesive process, manual restoration of the crystal rod is prone to cause damage to the crystal rod and has low efficiency.

[0006] In order to solve the above problem, the present invention is achieved as follows:

[0007] In a first aspect, an embodiment of the present invention provides an adhesive part adhesive removal and restoration device, wherein the adhesive part comprises a crystal support, an adhesive plate, and a crystal rod which are sequentially stacked and bonded and fixed, and the adhesive part adhesive removal and restoration device comprises:

[0008] A material preparation platform, the material preparation platform is used to supply the adhesive parts to be debonded;

[0009] An adhesive layer peeling device, the adhesive layer peeling device is used to separate and peel the adhesive plate and the crystal rod;

[0010] A residual glue cleaning device, wherein the adhesive layer stripping device is used to clean the residual glue on the crystal rod;

[0011] A transfer device is used to carry the adhesive piece between different locations.

[0012] Optionally, the adhesive layer stripping device comprises:

[0013] A carrying platform, the carrying platform is used to place the adhesive to be peeled off;

[0014] A peeling assembly, the peeling assembly includes a cutting piece, a supporting piece and a feed drive mechanism, the cutting piece is connected to the supporting piece, the supporting piece is arranged on the side of the carrying platform to support the cutting piece so as to be suspended above the carrying platform, the output end of the feed drive mechanism is fixedly connected to the supporting piece, the feed drive mechanism drives the cutting piece to move at least along a first direction to cut and peel off the adhesive piece, wherein the first direction is parallel to the carrying platform.

[0015] Optionally, the adhesive part adhesive removal and restoration device further comprises:

[0016] The adhesive layer softening device is used to soften the adhesive layer in the adhesive part to reduce the viscosity.

[0017] Optionally, the adhesive layer softening device comprises:

[0018] A heating box is used to heat the adhesive member to soften the adhesive plate adhesive 104 between the adhesive plate and the crystal support, or to soften the adhesive rod adhesive 105 between the adhesive plate and the crystal rod.

[0019] Optionally, the adhesive layer softening device further comprises:

[0020] A lifting component is used to lift the crystal tray located in the heating box.

[0021] Optionally, the residual glue cleaning device comprises:

[0022] A debonding agent spraying component, the debonding agent spraying component is used to spray the debonding agent onto the surface of the crystal rod to soften and expand the residual glue;

[0023] A residual glue removal component, which is used to remove the soft and puffed residual glue on the surface of the crystal rod;

[0024] A pure water spray component is used to spray pure water toward the surface of the crystal rod to clean the crystal rod.

[0025] Optionally, the residual glue removal component includes:

[0026] A residual glue cleaning brush, which is used to remove residual glue on the surface of the crystal rod;

[0027] A rotary drive mechanism, wherein the output end of the rotary drive mechanism is fixedly connected to the residual glue cleaning brush to drive the residual glue cleaning brush to rotate.

[0028] Optionally, the residual glue cleaning device further includes:

[0029] A transmission component is used to sequentially transmit the crystal rod between the degumming agent spraying component, the residual glue removing component and the pure water spraying component.

[0030] Optionally, the adhesive part adhesive removal and restoration device further comprises:

[0031] A drying device is used to dry the cleaned crystal rod.

[0032] Optionally, the adhesive part adhesive removal and restoration device further comprises:

[0033] A positioning component is connected to the material preparation platform and / or the carrying platform and protrudes from the surface of the corresponding platform. The positioning component is arranged in the length direction and / or width direction of the corresponding platform.

[0034] In a second aspect, an embodiment of the present invention further provides a method for removing adhesive from an adhesive part, wherein the adhesive part comprises a crystal support, an adhesive plate and a crystal rod which are sequentially stacked and bonded together, and the method comprises:

[0035] Softening the adhesive between the adhesive plate and the crystal support;

[0036] Lifting the crystal tray to separate the crystal tray from the adhesive plate;

[0037] Softening the stick adhesive between the stick plate and the crystal stick;

[0038] Separating the adhesive plate and the crystal rod;

[0039] Cleaning the residual glue on the crystal rod;

[0040] The cleaned crystal rod is dried.

[0041] Optionally, the softening of the adhesive between the adhesive plate and the crystal support includes:

[0042] The adhesive piece is placed in a first constant temperature environment for softening, and the temperature of the first constant temperature environment is 90°C.

[0043] Optionally, softening the stick adhesive between the adhesive plate and the crystal rod includes:

[0044] The adhesive part after the crystal support is removed is placed in a second constant temperature environment for softening treatment, and the temperature of the second constant temperature environment is 200°C.

[0045] Optionally, the step of separating and peeling the adhesive plate and the crystal rod comprises:

[0046] The adhesive plate and the crystal rod are separated and peeled off by cutting the adhesive between the adhesive plate and the crystal rod through the cutting line.

[0047] Optionally, cleaning the residual glue on the crystal rod includes:

[0048] Performing expansion treatment on the residual glue on the crystal rod;

[0049] Physically brush off the residual glue after expansion treatment;

[0050] Clean the crystal rod after brushing.

[0051] Optionally, the step of performing expansion treatment on the residual glue on the crystal rod includes:

[0052] In a constant temperature environment of 40° C., a lactic acid solution with a concentration of 20% is sprayed on the residual glue on the crystal rod.

[0053] The adhesive removal and restoration equipment of the embodiment of the present invention can transport the adhesive parts among the different workstations of the material preparation platform, the adhesive layer stripping device and the residual adhesive cleaning device by means of a transfer device. The adhesive plate and the crystal rod can be automatically separated and stripped by the adhesive layer stripping device, and the residual adhesive on the crystal rod can be cleaned by the residual adhesive cleaning device. Compared with manual restoration of the crystal rod, the process is more stable and consistent, which helps to improve the quality of crystal rod restoration, and can replace manpower to continuously restore multiple crystal rods, thereby improving the efficiency of crystal rod restoration. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0055] Figure 1 A schematic diagram showing the structure of an adhesive member according to an embodiment of the present invention;

[0056] Figure 2 The embodiment of the present invention Figure 1 A schematic cross-sectional view of a bonded part;

[0057] Figure 3 The embodiment of the present invention Figure 2 A partial enlarged schematic diagram of the middle I position;

[0058] Figure 4 A schematic diagram showing the removal of a wafer support from an adhesive member according to an embodiment of the present invention;

[0059] Figure 5 A schematic diagram showing an adhesive removal and restoration device for adhesive parts according to an embodiment of the present invention;

[0060] Figure 6 A schematic structural diagram showing an adhesive layer stripping device according to an embodiment of the present invention;

[0061] Figure 7 A schematic structural diagram showing a glue layer softening device according to an embodiment of the present invention;

[0062] Figure 8 A schematic structural diagram showing a residual adhesive cleaning device according to an embodiment of the present invention;

[0063] Fig. 9 A schematic diagram showing the structure of a residual adhesive cleaning brush according to an embodiment of the present invention;

[0064] Fig.10 A schematic diagram showing the structure of another residual adhesive cleaning brush according to an embodiment of the present invention;

[0065] Fig.11 Embodiments of the present invention Fig. 9 Schematic diagram of the residual glue cleaning brush working;

[0066] Fig.12 Embodiments of the present invention Fig.10 Schematic diagram of the residual glue cleaning brush working;

[0067] Fig.13 A schematic diagram showing a liquid flow channel and a liquid outlet hole on a residual adhesive cleaning brush according to an embodiment of the present invention;

[0068] Fig.14 A schematic diagram showing a liquid flow channel and a liquid outlet hole on a residual adhesive cleaning brush according to an embodiment of the present invention;

[0069] Fig.15 A schematic diagram showing the structure of a carrying platform according to an embodiment of the present invention;

[0070] Fig.16 A flow chart showing a method for removing and restoring adhesive parts according to an embodiment of the present invention;

[0071] Fig.17 A schematic diagram showing the motion trajectory of a cutting wire during cutting and peeling according to an embodiment of the present invention.

[0072] Description of reference numerals:

[0073] Adhesive part-10, crystal support-101, adhesive plate-102, crystal rod-103, adhesive plate glue-104, adhesive rod glue-105, material preparation platform-20, adhesive layer peeling device-30, carrying platform-301, peeling component-302, cutting part-3021, supporting part-3022, feeding drive mechanism-3023, residual glue cleaning device-40, adhesive remover spray component-401, residual glue removal component-402, residual glue cleaning brush-4021, base Seat-40211, strip brush head-40212, glue discharge space-40213, mounting handle-40214, liquid flow channel-40215, liquid outlet hole-40216, pure water spray component-403, transmission component-404, transfer device-50, glue layer softening device-60, heating box-601, heating component-602, drying device-70, positioning component-80, pushing component-90, pushing frame-901, driving component-902. DETAILED DESCRIPTION

[0074] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0075] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0076] Reference Figures 1 to 5 The embodiment of the present invention provides an adhesive part adhesive removal and restoration device, wherein the adhesive part 10 comprises a crystal support 101, an adhesive plate 102 and a crystal rod 103 which are sequentially stacked and bonded and fixed, and the adhesive part adhesive removal and restoration device comprises:

[0077] A material preparation platform 20, the material preparation platform 20 is used to supply the adhesive part 10 to be debonded;

[0078] An adhesive layer peeling device 30, the adhesive layer peeling device 30 is used to separate and peel the adhesive plate 102 and the crystal rod 103;

[0079] A residual adhesive cleaning device 40, the adhesive layer stripping device 40 is used to clean the residual adhesive on the crystal rod 103;

[0080] The transfer device 50 is used to carry the adhesive piece 10 between different locations.

[0081] The adhesive removal and restoration device of the embodiment of the present invention can be used to automatically cut and peel off different components in the adhesive 10, so that the different components are separated from each other, and automatically clean the peeled components to restore them to the state before the adhesive is removed. Figure 1 As shown in FIG. 1 , the adhesive member 10 may be a structure in which a crystal support 101, an adhesive plate 102 and a crystal rod 103 used in the production process of a photovoltaic module are bonded together as one body, such as Figure 2 and Figure 3 As shown in the figure, the crystal support 101 and the adhesive plate 102 are bonded and fixed by the adhesive plate adhesive 104, and the adhesive plate 102 and the crystal rod 103 are fixed by the adhesive rod adhesive 105. Figure 4 The figure also shows a schematic diagram of the adhesive member 10 after the crystal holder 101 is removed, and the remaining adhesive plate 102 and the crystal rod 103 are bonded together.

[0082] Figure 5 The adhesive removal and restoration device shown in the figure includes an adhesive layer stripping device 30, which can be used to remove the adhesive layer. Figure 4 The adhesive sheet 102 and the crystal rod 103 in the schematic adhesive part 10 are cut and peeled off to remove the adhesive sheet 102 from the crystal rod 103. Before using the adhesive layer peeling device 30 to separate and peel off the adhesive sheet 102 and the crystal rod 103, the adhesive part 10 to be debonded can be placed on a flat material preparation platform 20 to perform preparatory work before peeling. After using the adhesive layer peeling device 30 to separate and peel off the adhesive sheet 102 and the crystal rod 103, the residual glue cleaning device 40 can be used to clean the residual glue on the crystal rod 103, so that the surface of the crystal rod 103 is in a clean state to ensure that it is not contaminated when re-gluing. It should be noted that the movement of the above-mentioned adhesive part 10 between the positions corresponding to different devices can be achieved by a transfer device 50. By way of example, the above-mentioned transfer device 50 is not limited to structures such as a manipulator or a mechanical suction cup, and can be moved along the adhesive by clamping or adsorbing actions. Figure 5 The movement in the arrow direction is used to transport the adhesive member 10 between different devices. In addition, the transfer device 50 can also automatically remove the adhesive plate 102 from the crystal rod 103 after the adhesive plate 102 is separated from the crystal rod 103.

[0083] The adhesive removal and restoration equipment of the embodiment of the present invention can use a transfer device to carry adhesive parts at different stations of the material preparation platform, the adhesive layer stripping device, and the residual adhesive cleaning device. The adhesive layer stripping device can automatically separate and peel the adhesive plate and the crystal rod, and the residual adhesive on the crystal rod can be cleaned by the residual adhesive cleaning device. Compared with manual restoration of the crystal rod, it is more stable and consistent, which helps to improve the quality of crystal rod restoration, and can replace manual restoration of multiple crystal rods, which can improve the efficiency of crystal rod restoration. In addition, the adhesive removal and restoration equipment can prevent the operator from contacting the high-temperature crystal rod when manually stripping, which can prevent personal injury.

[0084] Optionally, refer to Figure 6 , the adhesive layer stripping device 30 comprises:

[0085] A carrying platform 301, wherein the carrying platform 301 is used to place the adhesive member 10 to be peeled off;

[0086] The peeling component 302 includes a cutting piece 3021, a supporting piece 3022 and a feeding drive mechanism 3023. The cutting piece 3021 is connected to the supporting piece 3022. The supporting piece 3022 is arranged on the side of the carrying platform 301. The supporting piece 3022 supports the cutting piece 3021 to be suspended above the carrying platform 301. The output end of the feeding drive mechanism 3023 is fixedly connected to the supporting piece 3022. The feeding drive mechanism 3023 drives the cutting piece 3021 to move at least along a first direction to cut and peel off the adhesive member 10, wherein the first direction is parallel to the carrying platform 301.

[0087] Specifically, if Figure 6 As shown in the figure, the adhesive layer stripping device of the embodiment of the present invention may include a carrying platform 301 and a stripping component 302. The carrying platform 301 may be a flat-plate-shaped component, which is installed and fixed along a horizontal plane, and the horizontal working surface can be used to place abnormal adhesives 10. For example, after the silicon rod is glued, when the quality inspection finds adhesive abnormalities such as empty glue, offset, and abnormal glue, the abnormal adhesive 10 can be placed on the working surface of the carrying platform 301. The stripping component 302 is used to destroy the adhesive glue 105 between the adhesive plate 102 and the crystal rod 103. After the adhesive glue 105 is destroyed, the adhesive plate 102 can be separated from the crystal rod 103. Figure 6As shown in the figure, the stripping assembly 302 includes a cutting piece 3021, a support piece 3022 and a feed drive mechanism 3023. The support piece 3022 can be arranged on the side of the carrier platform 301, and the cutting piece 3021 is connected to the support piece 3022. The support piece 3022 supports the cutting piece 3021 and suspends it above the carrier platform 301. Exemplarily, the cutting piece 3021 can be a cutting wire used in the silicon rod cutting process, or a cutting tool with a blade-like structure. The support piece 3022 can be two columnar components perpendicular to the carrier platform 301, and the two support pieces 3022 are respectively located on both sides of the carrier platform 301. The cutting piece 3021 is connected to the top of the two support pieces 3022 to form a gate-shaped structure together. In addition, the output end of the feed drive mechanism 3023 is fixedly connected to the support piece 3022, such as Figure 6 As shown in FIG. 1 , when the feed drive mechanism 3023 is activated, the support member 3022 can be driven along the feed drive mechanism 3023. Figure 6 As shown in the schematic X-direction reciprocating motion, the cutting piece 3021 connected to the support piece 3022 also moves along the X-direction. Since the X-direction is parallel to the carrying platform 301 and the adhesive member 10 is placed on the working surface of the carrying platform 301, when the cutting piece 3021 is supported by the support piece 3022 and is at the height position of the adhesive 105, the cutting piece 3021 can cut and destroy the adhesive 105 under the drive of the feed drive mechanism 3023, and cut and peel off the adhesive board 102 and the crystal rod 103.

[0088] It should be noted that the feed drive mechanism 3023 can be fixedly mounted on the carrier platform 301 to drive the cutting member 3021 to move relative to the carrier platform 301. The feed drive mechanism 3023 and the carrier platform 301 can also be fixedly mounted on a common mounting base. When the feed drive mechanism 3023 drives the cutting member 3021 to move relative to the mounting base, it also moves relative to the carrier platform 301. It is easy to understand that the feed drive mechanism 3023 can at least drive the cutting member 3021 along the carrier platform 301. Figure 6 The feed drive mechanism 3023 is shown as moving in the X direction, so the feed drive mechanism 3023 can be a mechanism whose output motion form is linear motion, such as a cylinder, a screw slider mechanism, a gear rack mechanism, a synchronous belt mechanism, etc. The embodiment of the present invention does not limit the specific structural form of the feed drive mechanism 3023. Driven by the power source, the above-mentioned feed drive mechanism 3023 can continuously and stably drive the cutting piece to translate, and separate the adhesive sheet from the silicon rod.

[0089] Optionally, refer to Figure 5 The adhesive removal and restoration equipment also includes:

[0090] The adhesive layer softening device 60 is used to soften the adhesive layer in the adhesive member 10 to reduce the viscosity.

[0091] Specifically, if Figure 5 As shown in FIG. 1 , in an embodiment of the present invention, at least one adhesive layer softening device 60 may be arranged in front of the adhesive layer peeling device 30. The adhesive layer in the adhesive part 10 may be softened in advance by the adhesive layer softening device 60, thereby reducing its viscosity, which may make it easier to peel off the various components in the adhesive part 10.

[0092] Optionally, refer to Figure 7 , the adhesive layer softening device 60 comprises:

[0093] The heating box 601 is used to heat the adhesive member 10 to soften the adhesive 104 between the adhesive plate 102 and the crystal support 101 , or to soften the adhesive 105 between the adhesive plate 102 and the crystal rod 103 .

[0094] Specifically, if Figure 7 As shown in the figure, the adhesive layer softening device 60 in the embodiment of the present invention may include a heating box 601, and a heating component 602 is arranged in the heating box 601. The heating component 602 may be an electric heating component, a water bath heating component or a microwave heating component. After the adhesive part 10 is placed in the heating box 601, when the adhesive part 10 is in the environment with a higher temperature, both the adhesive 104 for the board and the adhesive 105 for the stick can be softened.

[0095] like Figure 5 As shown in the figure, two heating boxes 601 are arranged on the material preparation platform 20 and the adhesive layer stripping device 30. The left heating box 601 is used to soften the adhesive board glue 104, and then the crystal tray 101 can be easily removed. Then the adhesive stick glue 105 is softened by the right heating box 601, and the adhesive board 102 can be easily removed.

[0096] Optionally, the adhesive layer softening device further comprises:

[0097] A lifting component is used to lift the wafer tray 101 in the heating box 601 .

[0098] Specifically, in the embodiment of the present invention, the aforementioned transfer device 50 is used not only to carry the adhesive piece 10 between different positions, but also to lift the wafer tray 101 in the heating box 601 during movement to remove the wafer tray 101. In addition, a lifting component can be separately provided at the position of the heating box 601, and the lifting component can clamp and fix the wafer tray 101, drive the wafer tray 101 to move upward, and separate the wafer tray 101 from the adhesive plate 102.

[0099] Optionally, refer to Figure 5 , the residual glue cleaning device 40 comprises:

[0100] A debonding agent spraying component 401, the debonding agent spraying component 401 is used to spray the debonding agent on the surface of the crystal rod 103 to make the residual glue soft and puffy;

[0101] A residual glue removing component 402, the residual glue removing component 402 is used to remove the soft and puffed residual glue on the surface of the crystal rod 103;

[0102] The pure water spray component 403 is used to spray pure water toward the surface of the crystal rod 103 to clean the crystal rod 103 .

[0103] Specifically, if Figure 5 As shown, in the embodiment of the present invention, the residual glue cleaning device 40 uses chemical cleaning and physical brushing to clean the residual glue on the surface of the crystal rod 103. The residual glue cleaning device 40 includes a degumming agent spraying component 401 arranged at the front end of the residual glue removing component 402 and a pure water spraying component 403 at the rear end. The degumming agent spraying component 401 uses a spraying pipeline to spray the degumming agent to the crystal rod 103, and through the expansion reaction, the residual glue becomes soft and easy to detach. Then, the soft residual glue after expansion is removed by the physical brushing action of the residual glue removing component 402, and then the pure water spraying component 403 is used to spray pure water on the crystal rod 103 to clean it, so that there is no residual stain on its surface.

[0104] Optionally, refer to Figure 8 , the residual glue removal component 402 includes:

[0105] A residual glue cleaning brush 4021, which is used to remove residual glue on the surface of the crystal rod 103;

[0106] A rotary drive mechanism, wherein the output end of the rotary drive mechanism is fixedly connected to the residual glue cleaning brush 4021 to drive the residual glue cleaning brush 4021 to rotate.

[0107] Specifically, if Figure 8 As shown in the figure, in one embodiment, the residual glue removing component 402 may include a rotating drive mechanism powered by a motor (not shown) and a residual glue cleaning brush 4021. The output end of the rotating drive mechanism is fixedly connected to the residual glue cleaning brush 4021, which can drive the residual glue cleaning brush 4021 to rotate automatically, thereby realizing continuous and efficient automatic cleaning.

[0108] Fig. 9 and Fig.10 Two different structures and shapes of residual glue cleaning brushes 4021 of the embodiments of the present invention are shown respectively. The residual glue cleaning brush 4021 can replace the traditional brush tool to clean the residual glue stains on the surface of the object by physical cleaning. Fig. 9 or Fig.10As shown in the figure, the residual adhesive cleaning brush 4021 includes a base 40211 and a strip brush head 40212. The base 40211 has a flat or curved cleaning working surface. The strip brush head 40212 can be fixed to the cleaning working surface by bonding, or a hole groove structure is pre-processed on the cleaning working surface, and the strip brush head 40212 is embedded in the hole groove to have an interference fit with the base 40211. After the strip brush head 40212 is fixedly connected to the base 40211, it protrudes from the cleaning working surface and is arranged along the curve shape on the cleaning working surface, combined with Fig. 9 As shown in the figure, the base 40211 may be a disc-shaped structure, the cleaning working surface is a circular plane on the base 40211, and when the strip brush head 40212 is arranged on the flat cleaning working surface, the strip brush head 40212 is in a flat curved shape. Fig.10 As shown in the figure, the base 40211 can also be a cylindrical drum-shaped structure, and its cleaning working surface is the cylindrical surface on the base 40211. When the strip brush head 40212 is arranged on the cleaning working surface with a curved surface, the strip brush head 40212 is in the shape of a spatial curve. Fig. 9 still Fig.10 On the cleaning brush shown in the figure, glue discharge spaces 40213 are formed between adjacent strip-shaped brush heads 40212 .

[0109] Combination Fig.11 and Fig.12 As shown in the figure, when the residual glue cleaning brush 4021 of the embodiment of the present invention is used to clean the glue stains on the surface of the crystal rod 103, as the strip brush head 40212 rotates, under the repeated friction between the strip brush head 40212 and the residual glue, after the glue stains are brushed off, the glue stain particles can be accommodated by the glue discharge space 40213, and then as the cleaning brush repeatedly moves, the residual glue is discharged through the glue discharge space 40212. Therefore, the residual glue cleaning brush of the embodiment of the present invention can prevent the residual glue from being repeatedly squeezed and rubbed on the surface of the crystal rod 103 by the strip brush head 40212, thereby reducing the contamination of the surface of the crystal rod 103. In addition, the curved strip brush head also extends the length of the strip brush head and increases the cleaning area of ​​the brush head, which helps to improve the cleaning efficiency.

[0110] In addition, if Fig. 9 and Fig.10As shown in the figure, the residual glue cleaning brush 4021 of the embodiment of the present invention also includes a mounting handle 40214, and the mounting handle 40214 can be bonded and fixed to the base 40211 or injection molded as one body, and the mounting handle 40214 protrudes and extends from the axial direction of the base 40211, and the mounting handle 40214 can be used to connect to an external driving motor. When the motor rotates, the base 40211 and the strip brush head 40212 can be driven to rotate around the axis of the base 40211 through the mounting handle 40214, thereby realizing automatic rotation cleaning of the cleaning brush, reducing the intervention of human operation behavior, and improving the residual glue cleaning efficiency.

[0111] Combination Fig.13 and Fig.14 As shown in the figure, in the residual glue cleaning brush 4021 of the embodiment of the present invention, in addition to using the friction between the strip brush head 40212 and the surface of the crystal rod 103 to clean and remove glue, a liquid flow channel 40215 that is interconnected can be opened on the base 40211 and the mounting handle 40214, and a liquid outlet 40216 that is connected to the liquid flow channel 40215 can be opened on the cleaning work surface. The position of the mounting handle 40214 is the entrance of the liquid flow channel 40215. The entrance of the liquid flow channel 40215 can be connected to the cleaning liquid pumping device, and the cleaning liquid can be pumped into the base 40211. The residual glue particles between the strip brush head 40212 and the surface of the crystal rod 103 can be quickly washed away by the high-pressure flushing effect of the cleaning liquid. In particular, when the cleaning liquid is a chemical reagent that dissolves the residual glue, the resistance of the base 40211 to rotating and brushing will be smaller.

[0112] Optionally, refer to Figure 8 , the residual glue cleaning device 40 also includes:

[0113] The transmission component 404 is used to sequentially transmit the crystal rod 103 between the debonding agent spraying component 401 , the residual glue removing component 402 and the pure water spraying component 403 .

[0114] Specifically, if Figure 8 In one embodiment, the above-mentioned adhesive remover spray component 401, residual adhesive removal component 402 and pure water spray component 403 can also be integrated into a cleaning unit, and the three components in the cleaning unit can be connected through a transmission component 404, and the transmission component 404 can automatically transmit the crystal rod 103 that needs to be cleaned between the three components in sequence. Exemplarily, the transmission component 404 can be a conveyor belt or a conveyor roller with a length covering the three components.

[0115] Optionally, refer to Figure 5 The adhesive removal and restoration equipment also includes:

[0116] The drying device 70 is used to dry the cleaned crystal rod 103 .

[0117] Specifically, if Figure 5 As shown in the figure, in one embodiment, a drying device 70 is arranged behind the residual glue cleaning device 40. The drying device 70 can be dried by air cooling or heating. The drying device 70 can remove the residual water stains on the surface of the crystal rod 103, thereby reducing the waiting time for subsequent re-gluing.

[0118] Optionally, the adhesive part adhesive removal and restoration device further comprises:

[0119] A positioning component 80 is connected to the material preparation platform 20 and / or the carrying platform 301 and protrudes from the surface of the corresponding platform. The positioning component 80 is arranged in the length direction and / or width direction of the corresponding platform.

[0120] Specifically, if Figure 5 As shown in the figure, in one embodiment, the above-mentioned adhesive removal and restoration equipment also includes a positioning component 80, which can be installed on at least one platform of the material preparation platform 20 and the supporting platform 301 for positioning during the material preparation stage or the peeling stage.

[0121] Taking the installation of the positioning component 80 on the carrying platform 301 as an example, the carrying platform 301 can be a rectangular flat plate. The positioning component 80 is connected to the carrying platform 301 and protrudes from the surface of the carrying platform 301. When the adhesive 10 is placed on the carrying platform 301, the positioning component 80 can contact the side of the adhesive 10, blocking the adhesive 10 from the side to prevent the adhesive 10 from moving on the carrying platform 301, thereby playing a positioning role.

[0122] When the adhesive member 10 is pushed to contact the positioning assembly 80, on the one hand, the transfer device 50 of the above-mentioned embodiment can be used to clamp and drive the adhesive member 10 to stop at the position in contact with the positioning assembly 80. Fig.15 As shown in FIG. 1 , a fixed pushing assembly 90 may also be installed on the side of the carrying platform 301. The pushing assembly 90 may include a pushing frame 901 that can drive the pushing frame 901 along the Fig.15The driving member 902 shown in the schematic Y direction movement can be a power source such as a cylinder or a linear motor. Therefore, under the action of the transfer device 50 or the push assembly 90, the adhesive member 10 can be driven to move on the working plane of the carrier platform 301 until it contacts the positioning assembly 80 and then is blocked by the positioning assembly 80 for positioning. Of course, in addition to using the transfer device 50 or the push assembly 90, a conveyor belt or a conveyor roller that can be lifted and lowered and is slightly higher than the working plane of the carrier platform 301 or embedded in the working plane of the carrier platform 301 can also be installed on the carrier platform 301, which can also make the adhesive member 10 automatically move to the position where it contacts and is positioned with the positioning assembly 80.

[0123] Combination Fig.15 As shown in the schematic diagram, it is easy to understand that when the adhesive 10 is placed on the carrier platform 301, the crystal rod 203 is parallel to the length direction X of the carrier platform 301. When the positioning component 80 is set along the length direction X of the carrier platform 301, the positioning component 80 can stop and position the adhesive 10 from the longer side. When the positioning component 80 is set along the width direction Y of the carrier platform 301, the positioning component 80 can stop and position the adhesive 10 from the short side, that is, stop and position the adhesive 10 from the end. In addition, the above-mentioned positioning component 80 can also be set in the length direction Y and the width direction X of the carrier platform 301 at the same time, so that the adhesive 10 can be accurately positioned in two mutually perpendicular directions in the horizontal plane. After the positioning component 80 is used to position the adhesive 10, for adhesives 10 of the same specifications and shapes, there is no need to repeatedly adjust the position of the stripping component 302, which can improve the smoothness and continuity of the cooperation between the stripping component 302 and the adhesive 10, and can improve the working efficiency of the stripping component 302.

[0124] The specific structure of the positioning component 80 installed on the material preparation platform 20 can refer to the above-mentioned example of the positioning component 80 being installed on the supporting platform 301, and will not be described in detail here.

[0125] Reference Fig.16 The embodiment of the present invention further provides a method for removing adhesive from an adhesive part. The adhesive part 10 includes a crystal support 101, an adhesive plate 102 and a crystal rod 103 which are stacked and fixed in sequence. The method includes the following steps:

[0126] S101 , softening the adhesive 104 between the adhesive plate 102 and the wafer holder 101 .

[0127] After the adhesive part 10 to be debonded is pre-positioned by the material preparation platform 20 , the adhesive 104 coated between the adhesive plate 102 and the wafer support 101 can be softened by heating or chemical treatment to reduce the viscosity of the adhesive 104 .

[0128] S102 , lifting the wafer tray 101 to separate the wafer tray 101 from the adhesive plate 102 .

[0129] When the viscosity of the adhesive 104 is reduced to the extent that the crystal tray 101 and the adhesive plate 102 can be freely separated, a pulling force is applied to the crystal tray 101 to pull the crystal tray 101 upward. Since the adhesive plate 102 and the crystal rod 103 are still adhered together and have a large weight, the crystal tray can be smoothly separated from the adhesive plate 102 as the crystal tray 101 moves upward.

[0130] S103 , softening the stick adhesive 105 between the adhesive plate 102 and the crystal stick 103 .

[0131] After the crystal tray 103 is separated and removed, the stick adhesive 105 coated between the adhesive plate 102 and the crystal rod 103 may be softened by heating or chemical treatment to reduce the viscosity of the stick adhesive 105 .

[0132] S104, the adhesive plate 102 and the crystal rod 103 are separated and peeled off.

[0133] Similar to the process of separating the crystal tray 101, when the viscosity of the adhesive 105 is reduced to the extent that the adhesive plate 102 and the crystal rod 103 can be freely separated, the transfer device 50 in the adhesive removal and restoration equipment can be used to drive the adhesive plate 102 to move upward and away from the surface of the crystal rod 103, so that the two can be separated smoothly.

[0134] S105 , cleaning the residual glue on the crystal rod 103 .

[0135] After the adhesive sheet 102 is removed, there are still traces of glue on the surface of the crystal rod 103, which can be further cleaned by chemical cleaning and physical scrubbing to restore the surface to a clean and traceless state. Fig. 9 or Fig.10 The residual adhesive cleaning brush 4021 shown in the figure is used according to Fig.11 and Fig.12 The crystal rod 103 is brushed and cleaned in the manner shown in the figure. Fig.11 In the embodiment, the base 40211 of the residual glue cleaning brush 4021 is a disc-shaped structure, and the axis of the base 40211 is perpendicular to the surface of the crystal rod 103. When the rotary drive mechanism drives the base 40211 to rotate around its axis, the base 40211 drives the connected strip-shaped brush head 40212 to rub on the surface of the crystal rod 103, thereby removing the traces of glue stains. Fig.12In the figure, the base 40211 of the residual glue cleaning brush 4021 is a roller-shaped structure, and the axis of the base 40211 is parallel to the surface of the crystal rod 103. When the rotary drive mechanism drives the base 40211 to rotate around its axis, the base 40211 drives the connected strip brush head 40212 to rub on the surface of the crystal rod 103, so as to remove the glue stains.

[0136] Whether using Fig. 9 still Fig.10 The schematic residual glue cleaning brush 4021 has strip-shaped brush heads 40212 arranged along a curve on the cleaning work surface, and glue discharge spaces 40213 are formed between adjacent strip-shaped brush heads 40212, so the cleaning efficiency and quality can be more effectively improved.

[0137] S106, drying the cleaned crystal rod 103.

[0138] Finally, the crystal rod 103 washed and cleaned by the liquid is dried by the drying device 70 to remove the water stains remaining on the surface of the crystal rod 103, thereby reducing the waiting time for subsequent re-gluing. The drying method can be air cooling or heating.

[0139] The adhesive removal and restoration method of the embodiment of the present invention can use the adhesive removal and restoration equipment to pre-soften the adhesive before each separation operation, and then automatically transfer to the adhesive stripping device and the residual adhesive cleaning device for separation and cleaning operations. Compared with manual restoration of the crystal rod, it is more stable and consistent, which helps to improve the quality of crystal rod restoration, and can replace manual restoration of multiple crystal rods, which can improve the efficiency of crystal rod restoration. In addition, the adhesive removal and restoration equipment can prevent the operator from contacting the high-temperature crystal rod when manually stripping, which can prevent personal injury.

[0140] Optionally, step S101 specifically includes:

[0141] The adhesive piece 10 is placed in a first constant temperature environment for softening, and the temperature of the first constant temperature environment is 90°C.

[0142] When softening the adhesive 104, the adhesive part 10 can be placed in the heating box 601 of the adhesive layer softening device 60, and the heat-sensitive adhesive 104 can be heated at a constant temperature of 90°C by water bath heating, heating tube heating, microwave heating, etc. and maintained for a period of time. Then the adhesive 104 can be softened, thereby promoting the separation of the adhesive board 102 and the crystal support 101.

[0143] Optionally, step S103 specifically includes:

[0144] The adhesive member 10 after the wafer support 101 is removed is placed in a second constant temperature environment for softening treatment. The temperature of the second constant temperature environment is 200°C.

[0145] When softening the stick glue 105, the adhesive part 10 can be placed in a heating box 601 of another adhesive layer softening device 60, and the heat-sensitive board glue 104 can be heated at a constant temperature of 200°C by water bath heating, heating tube heating, microwave heating, etc., and maintained for a period of time, and then the stick glue 105 can be softened, thereby promoting the separation of the adhesive board 102 and the crystal rod 103.

[0146] Optionally, step S104 specifically includes:

[0147] The adhesive plate 102 and the crystal rod 103 are separated and peeled off by cutting the adhesive 105 between the adhesive plate 102 and the crystal rod 103 through the cutting line.

[0148] When a cutting line is used as the cutting piece 3021 in the adhesive stripping device 30 in the embodiment of the present invention, after the adhesive 105 has been softened, the cutting line can be driven by the feed drive mechanism 3023 to move in the plane formed by the adhesive 105, thereby destroying the adhesive 105 with lower viscosity after softening, thereby invalidating the bonding effect between the adhesive plate 102 and the crystal rod 103, and then the adhesive plate 102 can be removed to separate it from the crystal rod 103 and stripped.

[0149] Fig.17 The diagram also shows the movement trajectory of the cutting line during cutting and peeling. The cutting line is parallel to the end face of the crystal rod 103 (that is, perpendicular to the illustrated paper surface). The cutting line starts at position A on the end face of the crystal rod 103 and moves upward toward the adhesive plate 102 until it reaches position B and stops after it contacts the adhesive plate 102. Then, it feeds a short distance in a direction parallel to the axis of the crystal rod 103 to position C, and then moves away from the adhesive plate 102 to position D close to the side of the crystal rod 103. After reaching position D, the cutting line continues to feed in a direction parallel to the axis of the crystal rod 103 until position E or moves to the other end of the crystal rod 103, thereby destroying and cutting the adhesive 105. Fig.13 It is easy to understand that the frictional contact between the cutting line and the crystal rod 103 can be avoided by controlling the distance between the C position and the D position to be slightly smaller than the thickness of the stick adhesive 105, thereby preventing the crystal rod 103 from being damaged.

[0150] Optionally, step S105 specifically includes:

[0151] Performing expansion treatment on the residual glue on the crystal rod 103;

[0152] Physically brush off the residual glue after expansion treatment;

[0153] The brushed crystal rod 103 is cleaned.

[0154] When cleaning the residual glue on the crystal rod 103, first, the glue remover spraying component 401 can be used to spray the glue remover on the surface of the crystal rod 103, and the residual glue can be softened and easily removed by the swelling reaction. Then, the residual glue cleaning brush 4021 in the residual glue removal component 402 is continuously rotated and rubbed on the surface of the crystal rod 103, and then the loose residual glue after swelling is brushed off and wiped off. Finally, the pure water spraying component 403 is used to spray pure water on the crystal rod 103 to clean it, so that there is no residual stain on its surface.

[0155] Optionally, the step of performing expansion treatment on the residual adhesive on the crystal rod 103 includes:

[0156] In a constant temperature environment of 40° C., a lactic acid solution with a concentration of 20% is sprayed on the residual glue on the crystal rod.

[0157] In one method, when the residual glue is expanded, based on the commonly used stick glue 105 type, the crystal rod 103 after removing the adhesive plate 102 is placed in a constant temperature environment of 40°C, and a 20% lactic acid solution is continuously sprayed, and the lactic acid solution is used to expand and dissolve the residual glue stains on the surface of the crystal rod 103. Of course, with different types of stick glue 105, other different temperatures and expansion solutions can also be selected.

[0158] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0159] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. An adhesive removal and restoration device for adhesive parts, wherein the adhesive parts include a crystal support, an adhesive plate and a crystal rod which are stacked and fixed in sequence, characterized in that: The adhesive part adhesive removal and restoration equipment comprises: A material preparation platform, the material preparation platform is used to supply the adhesive parts to be debonded; An adhesive layer peeling device, the adhesive layer peeling device is used to separate and peel the adhesive plate and the crystal rod; A residual glue cleaning device, wherein the adhesive layer stripping device is used to clean the residual glue on the crystal rod; A transfer device is used to carry the adhesive piece between different locations.

2. The adhesive removal and restoration equipment according to claim 1, characterized in that: The adhesive layer stripping device comprises: A carrying platform, the carrying platform is used to place the adhesive to be peeled off; A peeling assembly, the peeling assembly includes a cutting piece, a supporting piece and a feed drive mechanism, the cutting piece is connected to the supporting piece, the supporting piece is arranged on the side of the carrying platform, the supporting piece supports the cutting piece to be suspended above the carrying platform, the output end of the feed drive mechanism is fixedly connected to the supporting piece, the feed drive mechanism drives the cutting piece to move at least along a first direction to cut and peel off the adhesive piece, wherein the first direction is parallel to the carrying platform.

3. The adhesive removal and restoration equipment according to claim 1, characterized in that: The adhesive part adhesive removal and restoration equipment also includes: The adhesive layer softening device is used to soften the adhesive layer in the adhesive part to reduce the viscosity.

4. The adhesive removal and restoration equipment according to claim 3, characterized in that: The adhesive layer softening device comprises: A heating box is used to heat the adhesive member to soften the adhesive between the adhesive plate and the crystal support, or to soften the adhesive between the adhesive plate and the crystal rod.

5. The adhesive removal and restoration equipment according to claim 4, characterized in that: The adhesive layer softening device also includes: A lifting component is used to lift the crystal tray located in the heating box.

6. The adhesive removal and restoration equipment according to claim 1, characterized in that: The residual glue cleaning device comprises: A debonding agent spraying component, the debonding agent spraying component is used to spray the debonding agent onto the surface of the crystal rod to soften and expand the residual glue; A residual glue removal component, which is used to remove the soft and puffed residual glue on the surface of the crystal rod; A pure water spray component is used to spray pure water toward the surface of the crystal rod to clean the crystal rod.

7. The adhesive removal and restoration equipment according to claim 6, characterized in that: The residual glue removal component comprises: A residual glue cleaning brush, which is used to remove residual glue on the surface of the crystal rod; A rotary drive mechanism, wherein the output end of the rotary drive mechanism is fixedly connected to the residual glue cleaning brush to drive the residual glue cleaning brush to rotate.

8. The adhesive removal and restoration equipment according to claim 6, characterized in that: The residual glue cleaning device also includes: A transmission component is used to sequentially transmit the crystal rod between the degumming agent spraying component, the residual glue removing component and the pure water spraying component.

9. The adhesive removal and restoration equipment according to claim 1, characterized in that: The adhesive part adhesive removal and restoration equipment also includes: A drying device is used to dry the cleaned crystal rod.

10. The adhesive removal and restoration equipment according to claim 2, characterized in that: The adhesive part adhesive removal and restoration equipment also includes: A positioning component is connected to the material preparation platform and / or the carrying platform and protrudes from the surface of the corresponding platform. The positioning component is arranged in the length direction and / or width direction of the corresponding platform.

11. A method for removing adhesive from an adhesive part, wherein the adhesive part comprises a crystal support, an adhesive plate and a crystal rod which are stacked and fixed in sequence, characterized in that: The method comprises: Softening the adhesive between the adhesive plate and the crystal support; Lifting the crystal tray to separate the crystal tray from the adhesive plate; Softening the stick adhesive between the stick plate and the crystal stick; Separating the adhesive plate and the crystal rod; Cleaning the residual glue on the crystal rod; The cleaned crystal rod is dried.

12. The adhesive removal and restoration method of adhesive parts according to claim 11, characterized in that: The softening of the adhesive between the adhesive plate and the crystal support comprises: The adhesive piece is placed in a first constant temperature environment for softening, and the temperature of the first constant temperature environment is 90°C.

13. The adhesive removal and restoration method of adhesive parts according to claim 11, characterized in that: The softening of the stick adhesive between the adhesive plate and the crystal rod comprises: The adhesive part after the crystal support is removed is placed in a second constant temperature environment for softening treatment, and the temperature of the second constant temperature environment is 200°C.

14. The adhesive removal and restoration method of adhesive parts according to claim 11, characterized in that: The step of separating and peeling the adhesive plate and the crystal rod comprises: The adhesive plate and the crystal rod are separated and peeled off by cutting the adhesive between the adhesive plate and the crystal rod through the cutting line.

15. The adhesive removal and restoration method of adhesive parts according to claim 11, characterized in that: Cleaning the residual glue on the crystal rod includes: Performing expansion treatment on the residual glue on the crystal rod; Physically brush off the residual glue after expansion treatment; Clean the crystal rod after brushing.

16. The adhesive removal and restoration method of adhesive parts according to claim 15, characterized in that: The step of performing expansion treatment on the residual glue on the crystal rod comprises: In a constant temperature environment of 40° C., a lactic acid solution with a concentration of 20% is sprayed on the residual glue on the crystal rod.

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