Electronic packaging module and manufacturing method thereof

Abstract

The invention provides an electronic packaging module and a manufacturing method thereof. The electronic packaging module comprises an embedded element circuit substrate, a plurality of grooves located in the surface of the embedded element circuit substrate and a plurality of welding materials. The embedded element circuit substrate includes at least one electronic element, a plurality of pads on the electronic element, and a sealing material covering the electronic element. The connecting pad is electrically connected with the electronic component, and the sealing material exposes the connecting pad. The bottom surface of each groove exposes the corresponding connecting pad. The welding materials are respectively arranged on the bottom surfaces and are in direct contact with the connecting pads. The interface of the welding material is far away from the connecting pad and does not protrude out of the surface of the embedded element circuit substrate. Therefore, the welding alignment accuracy can be improved by limiting the welding materials in the grooves respectively.

Description

Technical Field

[0001] The invention relates to an electronic packaging module, in particular to an electronic packaging module with embedded electronic components and a manufacturing method thereof. Background Art

[0002] In the electronic component packaging process, when the pitch of the pads used for soldering on the surface of the component is less than 150μm, the ball grid array (BGA) packaging technology is mostly used. However, in the process of setting solder balls on the pads, the uneven surface of the components to be soldered and the circuit board can easily cause the solder balls to be uneven. The uneven height of the solder balls will increase the proportion of empty soldering or cold soldering during the soldering process, thereby reducing the soldering yield.

[0003] On the other hand, when the pad pitch is less than 70 μm, since the distance between adjacent solder balls is too close, bridges are easily formed between the solder balls after the soldering process, thus causing a short circuit. Summary of the invention

[0004] Therefore, the present invention provides an electronic packaging module and a manufacturing method thereof, so as to improve the poor contact and short circuit conditions during the welding process.

[0005] An electronic packaging module provided by an embodiment of the present invention includes an embedded component circuit substrate, and the embedded component circuit substrate includes at least one electronic component; a plurality of first pads located on the electronic component and electrically connected to the electronic component; and a sealing material covering the electronic component, and the sealing material exposes the first pads. The embedded component circuit substrate includes a plurality of grooves located on the first surface of the embedded component circuit substrate, and each of the grooves has a bottom surface, wherein the bottom surface respectively exposes the first pad; and a plurality of welding materials, respectively located on the bottom surface, and directly contacting the first pad, wherein the welding material includes an interface away from the first pad, and the interface does not protrude from the first surface of the embedded component circuit substrate.

[0006] In at least one embodiment of the present invention, the electronic packaging module further includes a circuit substrate disposed on the welding material, wherein the welding material is located between the embedded component circuit substrate and the circuit substrate, and electrically connects the embedded component circuit substrate and the circuit substrate.

[0007] In at least one embodiment of the present invention, the circuit substrate further includes a plurality of second pads located on the second surface of the circuit substrate and respectively disposed on the welding material, wherein the welding material is located between the first pad and the second pad and electrically connects the first pad and the second pad.

[0008] In at least one embodiment of the present invention, the embedded component circuit substrate further includes a dielectric layer located between the first surface of the embedded component circuit substrate and the sealing material, wherein the groove extends from the first surface through the dielectric layer to the first pad.

[0009] In at least one embodiment of the present invention, the interface of the solder material is flush with the first surface of the embedded component circuit substrate.

[0010] The present invention also provides a method for manufacturing an electronic packaging module, comprising providing an initial circuit substrate; arranging an embedded structure in the initial circuit substrate to form an embedded component circuit substrate, wherein the embedded structure comprises at least one electronic component and a plurality of pads arranged on the electronic component, wherein the pads are exposed to the first surface of the embedded structure; removing a portion of the embedded component circuit substrate to form a plurality of grooves, wherein the pads are respectively exposed to the first bottom surface of the grooves; and after forming the grooves, depositing a welding material on each of the first bottom surfaces, wherein the welding material directly contacts the pads, wherein the interface of the welding material is away from the pads, and the interface does not protrude from the second surface of the embedded component circuit substrate.

[0011] In at least one embodiment of the present invention, an embedded structure is provided in an initial circuit substrate, comprising removing a portion of the initial circuit substrate to form an opening, wherein the opening connects two opposite sides of the initial circuit substrate; after the opening is formed, a covering film is provided on the initial circuit substrate, and the covering film completely covers one end of the opening; an electronic component is provided on the covering film, wherein a pad provided on the electronic component is located between the covering film and the electronic component, and the pad directly contacts the covering film; after the electronic component is provided, a sealing material is provided in the opening, wherein the sealing material covers the electronic component; and after the sealing material is filled, the covering film is removed.

[0012] In at least one embodiment of the present invention, the method further comprises depositing a conductive layer on the first bottom surface of the recess before depositing the solder material, wherein the conductive layer directly contacts the pad.

[0013] In at least one embodiment of the present invention, forming the embedded component circuit substrate further includes disposing a dielectric layer on the first surface of the embedded structure; and disposing a metal layer on the dielectric layer, wherein the dielectric layer is located between the metal layer and the embedded structure.

[0014] In at least one embodiment of the present invention, the above method also includes removing multiple first portions of the metal layer after forming the embedded component circuit substrate to form multiple initial grooves, wherein the first portions overlap with the pads respectively, and the second bottom surface of each of the initial grooves exposes the dielectric layer; and after forming the initial grooves, removing multiple second portions of the dielectric layer, wherein the second portions overlap with the first portions respectively.

[0015] In at least one embodiment of the present invention, the method further includes removing the metal layer after depositing the solder material.

[0016] In at least one embodiment of the present invention, the method further comprises, after depositing the soldering material, disposing a circuit substrate on the embedded component circuit substrate by means of the soldering material, and the soldering material electrically connects the embedded component circuit substrate and the circuit substrate.

[0017] Based on the above, by placing the welding material in the groove and making the welding material not protrude from the groove, the accuracy of welding alignment can be improved. In addition, these grooves can also block adjacent welding materials to prevent the welding materials from contacting each other and causing short circuits, thereby improving the yield of the electronic packaging module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be understood from the following detailed description and the accompanying drawings. It should be noted that various features are not drawn to the standard scale in industry practice. In fact, the size of various features may be arbitrarily increased or decreased for clarity of discussion.

[0019] Figures 1A to 1G A cross-sectional view of a method for manufacturing an electronic packaging module according to an embodiment of the present invention is shown.

[0020] FIG. 2A to FIG. 2C A cross-sectional view of a method for manufacturing an electronic packaging module according to an embodiment of the present invention is shown.

[0021] FIG. 3A to FIG. 3C A cross-sectional view of a method for manufacturing an electronic packaging module according to another embodiment of the present invention is shown.

[0022] Figure 4 A cross-sectional view of an electronic packaging module according to an embodiment of the present invention is shown.

[0023] Figure 5 An electronic packaging module according to an embodiment of the present invention is shown along the Figure 4 Cross-sectional view of line segment AA. DETAILED DESCRIPTION

[0024] The present invention will be described in detail with the following examples. It should be noted that the following description of the embodiments of the present invention is only for illustration and is not intended to exhaustively disclose all implementations or to limit the specific implementations of the present invention. For example, the description of "a first feature formed on a second feature" includes multiple implementations, including the first feature being in direct contact with the second feature, and also including additional features being formed between the first feature and the second feature so that the two are not in direct contact. In addition, the same element symbols used in the drawings and the specification will represent the same or similar elements as much as possible.

[0025] Spatially relative terms, such as "lower," "below," "beneath," "above," and related terms, are used herein to simply describe the relationship of an element or feature as shown in the figures to another element or feature. These spatially relative terms also cover different orientations when using or operating the device in addition to the orientation depicted in the figures. In addition, when the element is rotatable (rotated 90 degrees or other angles), the spatially relative descriptors used herein can also be interpreted accordingly.

[0026] In the following text, in order to clearly present the technical features of the present invention, the dimensions (such as length, width, thickness and depth) of the elements (such as layers, films, substrates and regions, etc.) in the drawings will be enlarged in unequal proportions. Therefore, the description and explanation of the embodiments below are not limited to the dimensions and shapes presented by the elements in the drawings, but should cover the dimensions, shapes and deviations thereof caused by actual processes and / or tolerances. For example, the flat surface shown in the drawings may have rough and / or nonlinear features, and the acute angles shown in the drawings may be replaced with obtuse angles. Therefore, the elements presented in the drawings of the present invention are mainly for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the claims of the present invention.

[0027] Furthermore, the words "about", "approximately" or "substantially" used in the present case not only cover the numerical values ​​and numerical ranges clearly recorded, but also cover the permissible deviation range that can be understood by a person skilled in the art, wherein the deviation range can be determined by the error generated during measurement, and the error is caused by, for example, the limitation of the measurement system or process conditions. In addition, "about" can mean within one or more standard deviations of the above numerical values, such as ±30%, ±20%, ±10% or ±5%. The words "about", "approximately" or "substantially" used in the present case can select the acceptable deviation range or standard deviation according to the optical properties, etching properties, mechanical properties or other properties, and not just one standard deviation can be applied to all the above optical properties, etching properties, mechanical properties and other properties.

[0028] The present invention discloses a method for manufacturing an electronic packaging module. The method may include: Figures 1A to 1G Please refer to Figure 1A In this embodiment, an initial circuit substrate 110 is first provided. In various embodiments of the present invention, the initial circuit substrate 110 may be a general copper clad laminate (CCL). In this embodiment, the initial circuit substrate 110 is a double-layer copper clad laminate including two metal layers (metal layer 104a and metal layer 104b), wherein the metal layer 104a and the metal layer 104b are respectively located on opposite sides of the insulating layer 102.

[0029] Please refer to Figure 1B In the initial circuit substrate 110, an embedded structure 120 is disposed. The embedded structure 120 includes at least one electronic component 122 and a plurality of pads 124 disposed on the electronic component 122, wherein the pads 124 are exposed to a surface 120s of the embedded structure 120. In this embodiment, the method of disposing the embedded structure 120 is shown in FIG. FIG. 2A to FIG. 2C Steps. Figure 2A As shown, a portion of the initial circuit substrate 110 is removed to form an opening 103 , and the opening 103 connects two opposite sides of the initial circuit substrate 110 .

[0030] Please refer to Figure 2B After the opening 103 is formed, a cover film 105 is disposed on the initial circuit substrate 110 (e.g., on the surface 110s of the initial circuit substrate 110), and the cover film 105 completely covers the end surface 103e of the opening 103 (and may even exceed the end surface 103e of the opening 103). Next, an electronic component 122 is disposed on the cover film 105. The pad 124 disposed on the electronic component 122 is located between the cover film 105 and the electronic component 122, and the pad 124 directly contacts the cover film 105. The cover film 105 may be an adhesive film containing a polymer material (e.g., a polyimide tape).

[0031] After the electronic element 122 is disposed, a sealing material 126 is disposed in the opening 103. Figure 2C As shown, the sealing material 126 covers the electronic component 122. In this embodiment, the sealing material 126 can completely cover the electronic component 122 except for the area where the electronic component 122 contacts the pad 124. The sealing material 126 can include an insulating material such as an organic resin (such as epoxy resin) or the like, and can be hardened and formed by, for example, baking, drying or UV irradiation. In addition, after the sealing material 126 is provided, the cover film 105 is removed.

[0032] Please go back Figure 1BIn this embodiment, the metal layer 104a and the metal layer 104b can also be patterned to form the circuit layer 106a and the circuit layer 106b. In other embodiments of the present invention, it is not limited to forming the circuit layer 106a and the circuit layer 106b, that is, this patterning step can be omitted. In addition, the step of forming the circuit layer 106a and the circuit layer 106b is not limited to after the embedded structure 120 is set, and it can also be before the embedded structure 120 is set. The embedded component circuit substrate 130 can also include a plurality of conductive through holes (not shown), and these conductive through holes can electrically connect the circuit layer 106a and the circuit layer 106b. So far, in some embodiments of the present invention, it is sufficient to form the embedded component circuit substrate 130.

[0033] However, the present invention is not limited thereto. Figure 1C In this embodiment, the step of forming the embedded component circuit substrate 130 further includes: a dielectric layer 132a is disposed on the surface 120f of the embedded structure 120, and a metal layer 134a is disposed on the dielectric layer 132a, and the dielectric layer 132a is located between the metal layer 134a and the embedded structure 120. On the other hand, a dielectric layer 132b is disposed on the surface 120s of the embedded structure 120, and a metal layer 134b is disposed on the dielectric layer 132b, and the dielectric layer 132b is located between the metal layer 134b and the embedded structure 120. The materials of the dielectric layer 132a and the dielectric layer 132b can be a composite material including glass fiber and resin, such as prepreg, or other similar insulating materials.

[0034] Please refer to Figure 1D as well as Figure 1E , removing a portion of the embedded component circuit substrate 130 to form a plurality of grooves 140. Each of the pads 124 is exposed at the bottom surface 140d of the groove 140. In other words, the bottom surface 140d of a groove 140 exposes a pad 124. In this embodiment, the steps of forming the groove 140 include: Figure 1D As shown, multiple portions 134p of the metal layer 134b can be removed by photolithography and etching to form multiple initial grooves 140'. Since these removed portions 134p overlap with the pads 124 respectively, the initial grooves 140' overlap with the pads 124 respectively, and the bottom surface (not shown) of each initial groove 140' exposes the dielectric layer 132b.

[0035] Next, multiple portions 132p of the dielectric layer 132b are removed by laser drilling or routing to form multiple grooves 140. Figure 1E, these removed portions 132p overlap with portions 134p respectively, and portion 132p of dielectric layer 132b substantially completely overlaps portion 134p of metal layer 134b. It is worth mentioning that, although in the present embodiment, bottom surface 140d of groove 140 completely exposes pad 124, the present invention is not limited thereto. In other embodiments of the present invention, bottom surface 140d of groove 140 may also only expose a portion of pad 124.

[0036] Please refer to Figure 1F After the grooves 140 are formed, a soldering material 160 is deposited on the bottom surface 140d of each groove 140 by, for example, electroplating. The soldering material 160 directly contacts the pad 124 so that the soldering material 160 can be electrically connected to the electronic component 122. The soldering material 160 can include materials for soldering, such as solder paste, copper paste, or silver paste. It is particularly noted that the interface 160i of the soldering material 160 is away from the pad 124, and the interface 160i does not protrude from the surface 130s of the embedded component circuit substrate 130 (the surface 130s at this time is equivalent to the surface of the metal layer 134b). In other words, the thickness T of the soldering material 160 does not exceed the depth D of the groove 140.

[0037] In this embodiment, after the solder material 160 is deposited, the metal layer 134b can be removed by, for example, chemical-mechanical polishing (CMP). It should be noted that the removal of the metal layer 134b will change the depth D of the groove 140, so that the depth D of the groove 140 is reduced. Even so, the interface 160i of the solder material 160 still does not protrude from the surface 130s of the embedded component circuit substrate 130 (the surface 130s at this time is equivalent to the surface of the dielectric layer 132b).

[0038] Please refer to FIG. 3A to FIG. 3B In another embodiment of the present invention, before depositing the solder material 160, a conductive layer 180 may be deposited on the bottom surface 140d of the groove 140, and the conductive layer 180 directly contacts the pad 124. The material of the conductive layer 180 may include, for example, copper or a similar alloy material, and the material of the conductive layer 180 may be the same as that of the pad 124.

[0039] FIG. 3A to FIG. 3B This is the step of depositing the conductive layer 180. Please refer to Figure 3A In this embodiment, an initial conductive layer 180' is deposited on the bottom surface 140d of the groove 140, the sidewall 140w of the groove 140 and the surface (not shown) of the metal layer 134b by electroplating. Figure 3BAs shown, a photoresist material 190 such as a dry film photoresist is disposed on the initial conductive layer 180', and the photoresist material 190 is patterned by, for example, photolithography and etching. After the photoresist material 190 is patterned, the portion of the initial conductive layer 180' located on the bottom surface 140d of the groove 140 is thickened by electroplating (i.e., the portion of the initial conductive layer 180' located on the pad 124) to form a conductive layer 180.

[0040] Please refer to Figure 3C In this embodiment, after the conductive layer 180 is formed, the photoresist material 190 is removed, and a plurality of solder materials 160 are deposited on the conductive layer 180, and the solder materials 160 are respectively located in the grooves 140. Since the conductive layer 180 is electrically connected to the pad 124, the conductive layer 180 located in the groove 140 can be substantially regarded as an extension of the pad 124. Furthermore, the provision of the conductive layer 180 can substantially increase the thickness of the pad 124, so that the pad 124 extends and protrudes from the surface 120s of the buried structure 120.

[0041] Please go back Figure 1G In the embodiment, after the soldering material 160 is deposited, the circuit substrate 150 is disposed on the embedded component circuit substrate 130 through the soldering material 160. The soldering material 160 is located between the embedded component circuit substrate 130 and the circuit substrate 150, and electrically connects the embedded component circuit substrate 130 and the circuit substrate 150.

[0042] It is worth mentioning that the circuit substrate 150 includes a plurality of pads 154. When the circuit substrate 150 is disposed on the embedded component circuit substrate 130, each pad 154 is disposed corresponding to each groove 140. For example, one pad 154 is disposed in one groove 140 and directly contacts the soldering material 160 in the groove 140. The soldering material 160 is located between the pad 124 and the pad 154, and electrically connects the embedded component circuit substrate 130 and the circuit substrate 150 through the pad 124 and the pad 154, respectively.

[0043] Through the above Figures 1A to 1G The various steps can be formed as follows Figure 4 The electronic packaging module 40 shown in FIG. 4 includes a circuit substrate 130 with embedded components, a plurality of grooves 140 located on a surface 130s of the circuit substrate 130 with embedded components, and a plurality of solder materials 160 .

[0044] Please refer to Figure 4The embedded component circuit substrate 130 includes at least one electronic component 122, a plurality of pads 124, and a sealing material 126. The pads 124 are located on the electronic component 122 and are electrically connected to the electronic component 122. The electronic component 122 of the present invention may be a packaged chip or an unpackaged die, and the pads 124 may include metal materials, such as copper, nickel, etc.

[0045] The sealing material 126 covers the electronic component 122 and exposes the pad 124. In other words, the pad 124 is not completely covered by the sealing material 126. In the present embodiment, the embedded component circuit substrate 130 further includes a dielectric layer 132a and a dielectric layer 132b, wherein the dielectric layer 132b is located between the surface 130s of the embedded component circuit substrate 130 and the sealing material 126. In the present embodiment, the distance between two adjacent pads 124 is less than 70 μm, but the present invention is not limited thereto, and the distance between two adjacent pads 124 may also be greater than or equal to 70 μm.

[0046] Each groove 140 of the electronic packaging module 40 has a bottom surface 140d, and these bottom surfaces 140d respectively expose the pads 124. Specifically, the groove 140 extends from the surface 130s of the embedded component circuit substrate 130 through the dielectric layer 132b to the pad 124, and exposes the surface (not shown) of the pad 124. Figure 4 From the cross-sectional view of FIG. 1 , the welding material 160 is in direct contact with the side wall 140w of the groove 140, but the present invention is not limited thereto. Figure 5 , along Figure 4 In the cross-sectional view taken along line segment AA, the soldering material 160 does not completely cover the pads 124 , and the overlapping ranges and positions of each soldering material 160 and the pads 124 may be different.

[0047] The soldering material 160 of the electronic packaging module 40 is respectively located on the bottom surface 140d and directly contacts the pad 124. The soldering material 160 includes an interface 160i away from the pad 124, and the interface 160i does not protrude from the surface 130s of the embedded component circuit substrate 130. For example, in this embodiment, the interface 160i of the soldering material 160 is located in the groove 140 and is recessed in the surface 130s of the embedded component circuit substrate 130, but the present invention is not limited thereto. In other embodiments of the present invention, the interface 160i of the soldering material 160 is flush with the surface 130s of the embedded component circuit substrate 130.

[0048] The electronic packaging module 40 further includes a circuit substrate 150, and the circuit substrate 150 is disposed on the welding material 160. Figure 4As shown, the solder material 160 is located between the embedded component circuit substrate 130 and the circuit substrate 150, and electrically connects the embedded component circuit substrate 130 and the circuit substrate 150. The circuit substrate 150 further includes a plurality of pads 154, which are located on the surface 150s of the circuit substrate 150 and protrude from the surface 150s of the circuit substrate 150. The pads 154 are respectively disposed on the solder material 160. For example, one solder material 160 is located between one pad 124 and one pad 154, and electrically connects the pad 124 and the pad 154.

[0049] Although not shown in Figure 4 However, in other embodiments of the present invention, the circuit substrate 150 may further include a solder mask (not shown). For example, the solder mask may partially cover the surface 150s of the circuit substrate 150 and expose the pads 154. On the other hand, the circuit substrate 150 further includes a plurality of conductive vias (not shown), and these conductive vias are located between various circuit layers (not shown) of the circuit substrate 150 and electrically connect these circuit layers.

[0050] In addition, although Figure 4 In the embodiment, the embedded component circuit substrate 130 includes two circuit layers (circuit layer 106a and circuit layer 106b) and two metal layers (metal layer 134a and metal layer 134b), but the number of circuit layers and metal layers in the present invention is not limited thereto. In other words, the circuit layers and metal layers of the embedded component circuit substrate 130 can be any number of more than one layer, for example, four layers.

[0051] In summary, when the soldering material is heated and melted during the soldering process, the grooves above each pad will limit the flow of the soldering material to prevent each soldering material from contacting each other and causing a short circuit. In addition, since the soldering material is disposed in the groove and does not protrude from the groove, the alignment accuracy between the pad on the circuit substrate and the soldering material can be improved to avoid poor contact between the soldering material and the pad, thereby improving the yield of the electronic packaging module.

[0052] Although the embodiments of the present invention have been disclosed above, they are not intended to limit the embodiments of the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the embodiments of the present invention. Therefore, the protection scope of the embodiments of the present invention shall be determined by the definition of the attached claims.

[0053]

Explanation of symbols

[0054] 102: Insulation layer

[0055] 103: Opening

[0056] 103e: End face

[0057] 104a, 104b, 134a, 134b: metal layer

[0058] 105: Covering film

[0059] 106a, 106b: Circuit layer

[0060] 110: Initial circuit substrate

[0061] 120: Embedded structure

[0062] 110s,120s,120f,130s,150s:Surface

[0063] 122: Electronic components

[0064] 124,154:Pad

[0065] 126: Sealing material

[0066] 130: Embedded component circuit substrate

[0067] 132a, 132b: dielectric layer

[0068] 132p,134p:Part

[0069] 140: Groove

[0070] 140': Initial groove

[0071] 140d: bottom

[0072] 140w: Sidewall

[0073] 150: Circuit board

[0074] 160: Welding materials

[0075] 160i: Interface

[0076] 180: Conductive layer

[0077] 180': Initial conductive layer

[0078] 190: Photoresist

[0079] 40:Electronic packaging module

[0080] A: Line segment

[0081] T:Thickness

[0082] D:Depth.

Claims

1. An electronic packaging module, characterized in that: Include: Embedded component circuit substrate, comprising: at least one electronic component; A plurality of first pads, located on the electronic component and electrically connected to the electronic component; as well as A sealing material covers the electronic component, and the sealing material exposes the first pad; a plurality of grooves are located on the first surface of the embedded component circuit substrate, and each of the grooves has a bottom surface, wherein the bottom surface respectively exposes the first pad; as well as A plurality of welding materials are respectively located on the bottom surface and directly contact the first pad, wherein the welding material includes an interface away from the first pad, and the interface does not protrude from the first surface of the embedded component circuit substrate.

2. The electronic packaging module according to claim 1, characterized in that: Also includes: The circuit substrate is arranged on the welding material, wherein the welding material is located between the embedded component circuit substrate and the circuit substrate, and electrically connects the embedded component circuit substrate and the circuit substrate.

3. The electronic packaging module according to claim 2, characterized in that: The circuit substrate further comprises: A plurality of second pads are located on the second surface of the circuit substrate and are respectively disposed on the welding material, wherein the welding material is located between the first pad and the second pad and electrically connects the first pad and the second pad.

4. The electronic packaging module according to claim 1, characterized in that: The embedded component circuit substrate further comprises: The dielectric layer is located between the first surface of the embedded component circuit substrate and the sealing material, wherein the groove extends from the first surface through the dielectric layer to the first pad.

5. The electronic packaging module according to claim 2, characterized in that: The interface of the soldering material is flush with the first surface of the embedded component circuit substrate.

6. A method for manufacturing an electronic packaging module, characterized in that: Include: Providing an initial circuit substrate; In the initial circuit substrate, an embedded structure is arranged to form an embedded component circuit substrate, wherein the embedded structure comprises at least one electronic component and a plurality of pads arranged on the electronic component, wherein the pads are exposed on a first surface of the embedded structure; Removing a portion of the embedded component circuit substrate to form a plurality of grooves, wherein the pads are respectively exposed at the first bottom surfaces of the grooves; as well as After forming the groove, a soldering material is deposited on each of the first bottom surfaces, and the soldering material directly contacts the pad, wherein the interface of the soldering material is away from the pad and does not protrude from the second surface of the embedded component circuit substrate.

7. The method according to claim 6, characterized in that The embedded structure is provided in the initial circuit substrate, comprising: Removing a portion of the initial circuit substrate to form an opening, wherein the opening communicates with two opposite sides of the initial circuit substrate; After forming the opening, a covering film is provided on the initial circuit substrate, and the covering film completely covers one end of the opening; The electronic component is arranged on the cover film, wherein the pad arranged on the electronic component is located between the cover film and the electronic component, and the pad directly contacts the cover film; After the electronic component is arranged, a sealing material is arranged in the opening, wherein the sealing material covers the electronic component; as well as After the sealing material is filled in, the cover film is removed.

8. The method according to claim 6, characterized in that Also includes: Before depositing the solder material, a conductive layer is deposited on the first bottom surface of the groove, wherein the conductive layer directly contacts the pad.

9. The method according to claim 6, characterized in that The formation of the embedded component circuit substrate further comprises: Disposing a dielectric layer on the first surface of the embedded structure; and A metal layer is disposed on the dielectric layer, wherein the dielectric layer is located between the metal layer and the embedded structure.

10. The method according to claim 9, characterized in that Also includes: After forming the embedded component circuit substrate, removing a plurality of first portions of the metal layer to form a plurality of initial grooves, wherein the first portions overlap the pads respectively, and a second bottom surface of each of the initial grooves exposes the dielectric layer; as well as After forming the initial groove, a plurality of second portions of the dielectric layer are removed, wherein the second portions overlap the first portions respectively.

11. The method according to claim 10, characterized in that Also includes: After depositing the solder material, the metal layer is removed.

12. The method according to claim 6, characterized in that Also includes: After the soldering material is deposited, a circuit substrate is disposed on the embedded component circuit substrate by means of the soldering material, wherein the soldering material electrically connects the embedded component circuit substrate and the circuit substrate.

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