Transfer carrier plate, driving back plate and transfer method of light emitting diode chip
By designing highly matched transfer carrier plates and drive backplanes, the problem of low transfer efficiency of LED chips is solved, and efficient production of LED display products is achieved, reducing costs and improving carrier plate utilization.
Patent Information
- Application Number
- CN202310778704.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-28
- Publication Date
- 2024-12-31
AI Technical Summary
The huge transfer technology of LED chips is low, and the yield and accuracy requirements are high, which has hindered the promotion and use of LED display devices.
A transfer carrier plate and a driving backplane are designed, and efficient LED chip transfer is achieved by setting up multiple light emitting diode chipsets of different heights.
It reduces the difficulty of manufacturing LED display products, improves production efficiency, reduces production costs, and improves the utilization rate of transfer carrier plates.
Smart Images
Figure CN119230577A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of display technology, and more specifically, to a method for transferring a carrier plate, a driving backplane, and a light emitting diode chip. Background Art
[0002] As the basic device unit of the information industry, the technology of display devices is constantly evolving and innovating. The performance requirements are getting higher and higher, and new display technologies are constantly developing. At present, light emitting diode (LED) display devices are widely studied. For example, for LED display devices such as mini light emitting diode (Mini Light Emitting Diode, Mini LED) display devices or micro light emitting diode (Micro Light Emitting Diode, Micro LED) display devices, their working principle is to use integrated circuit technology to make a driving circuit to achieve addressing control and individual drive of each sub-pixel.
[0003] A core technical challenge faced in the industrialization process of LED display devices is the mass transfer technology of LED chips. Since LED chips are very small and mass transfer technology requires very high efficiency, yield rate and transfer accuracy, mass transfer technology has become the biggest challenge in the research and development process of LED display devices, hindering the promotion and use of LED display devices. Summary of the invention
[0004] The purpose of the present disclosure is to provide a method for transferring a carrier, a driving backplane and a light emitting diode chip to solve at least one of the problems existing in the prior art.
[0005] In order to achieve the above objectives, the present invention adopts the following technical solutions:
[0006] A first aspect of the present disclosure provides a transfer carrier, comprising a substrate and N first color LED chip groups arranged on the substrate, wherein the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group, N>1, n=1,…,N-1, each first color LED chip group comprises a plurality of first color LED chips arranged in an array, and the distribution positions of the first color LED chips in each first color LED chip group match the distribution positions of the pads of the first color sub-pixels on the driving backplane.
[0007] Optionally, a difference between a height of the first color LED chip in the (n+1)th first color LED chip group and a height of the first color LED chip in the nth first color LED chip group is greater than or equal to 0.5 μm.
[0008] Optionally, the pin height of the first color LED chip in the n+1th first color LED chip group is greater than the pin height of the first color LED chip in the nth first color LED chip group, so that the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group.
[0009] According to a second aspect of the present disclosure, there is provided a driving backplane, comprising a substrate and a first pad group, a second pad group and a third pad group arranged on the substrate, wherein the first pad group comprises a plurality of first pads arranged in an array, the second pad group comprises a plurality of second pads arranged in an array, the third pad group comprises a plurality of third pads arranged in an array, and the driving backplane further comprises a first light-emitting diode chip bonded to the first pad, a second light-emitting diode chip bonded to the second pad and a third light-emitting diode chip bonded to the third pad;
[0010] The height of the first LED chip away from the surface of one side of the substrate is greater than the height of the second LED chip away from the surface of one side of the substrate, and / or the height of the second LED chip away from the surface of one side of the substrate is greater than the height of the third LED chip away from the surface of one side of the substrate.
[0011] Optionally, the pin height of the first LED chip is greater than the pin height of the second LED chip so that the height of the first LED chip away from the surface of one side of the substrate is greater than the height of the second LED chip away from the surface of one side of the substrate, and / or the pin height of the second LED chip is greater than the pin height of the third LED chip so that the height of the second LED chip away from the surface of one side of the substrate is greater than the height of the third LED chip away from the surface of one side of the substrate.
[0012] Optionally, the height of the first solder pad is greater than the height of the second solder pad so that the height of the first LED chip away from the surface of one side of the substrate is greater than the height of the second LED chip away from the surface of one side of the substrate, and / or the height of the second solder pad is greater than the height of the third solder pad so that the height of the second LED chip away from the surface of one side of the substrate is greater than the height of the third LED chip away from the surface of one side of the substrate.
[0013] Optionally, the difference between the height of the first LED chip away from the surface of one side of the substrate and the height of the second LED chip away from the surface of one side of the substrate is greater than or equal to 0.5 μm, and / or the difference between the height of the second LED chip away from the surface of one side of the substrate and the height of the third LED chip away from the surface of one side of the substrate is greater than or equal to 0.5 μm.
[0014] Optionally, the difference between the height of the first LED chip away from the surface of one side of the substrate and the height of the second LED chip away from the surface of one side of the substrate is less than or equal to 50 μm, and / or the difference between the height of the second LED chip away from the surface of one side of the substrate and the height of the third LED chip away from the surface of one side of the substrate is less than or equal to 50 μm.
[0015] Optionally, the first LED chip, the second LED chip and the third LED chip emit different colors of light.
[0016] Optionally, the first LED chip, the second LED chip and the third LED chip emit the same luminous color, the driving backplane further comprises a color conversion layer located on a side of the first LED chip, the second LED chip and the third LED chip away from the substrate, the color conversion layer comprising a plurality of color conversion units arranged in an array.
[0017] A third aspect of the present disclosure provides a method for transferring a light emitting diode chip, comprising:
[0018] Transfer the nth 1,max The first color LED chips in the first color LED chip group are transferred to the driving backplane, wherein the first transfer carrier includes a first substrate and N 1 The first color LED chip group, the nth 1 The height of the first color LED chip in the +1 first color LED chip group is greater than the nth 1 The height of the first color LED chips in the first color LED chip group, N 1 >1,n 1 =1,…,N 1 -1, each first color LED chip group includes a plurality of first color LED chips arranged in an array, and the distribution position of the first color LED chips in each first color LED chip group matches the distribution position of the pads of the first color sub-pixels on the driving backplane, and the nth 1,maxThe first color LED chip group is the first color LED chip group with the largest height that has not been transferred on the first transfer carrier;
[0019] Transfer the nth 2,max The second color LED chips in the second color LED chip group are transferred to the driving backplane, wherein the second transfer carrier includes a second substrate and N 2 The second color LED chip set, the nth 2 The height of the second color LED chip in the +1 second color LED chip group is greater than the nth 2 The height of the second color LED chips in the second color LED chip group, N 2 >1,n 2 =1,…,N 2 -1, each second color LED chip group includes a plurality of second color LED chips arranged in an array, and the distribution positions of the second color LED chips in each second color LED chip group match the distribution positions of the pads of the second color sub-pixels on the driving backplane, and the nth 2,max The nth second color LED chip group is the second color LED chip group with the largest height that has not been transferred on the second transfer carrier, 2,max The height of the second color LED chips in the second color LED chip groups is greater than or equal to the nth 1,max height of the first color LED chips in the first color LED chip groups;
[0020] Transfer the nth 3,max The third color LED chips in the third color LED chip group are transferred to the driving backplane, wherein the third transfer carrier includes a third substrate and N 3 The third color LED chip set, the nth 3 The height of the third color LED chip in the +1 third color LED chip group is greater than the nth 3 The height of the third color LED chips in the third color LED chip group, N 3 >1,n 3 =1,…,N 3 -1, each third color LED chip group includes a plurality of third color LED chips arranged in an array, and the distribution positions of the third color LED chips in each third color LED chip group match the distribution positions of the pads of the third color sub-pixels on the driving backplane, the nth 3,maxThe nth third color LED chip group is the third color LED chip group with the largest height that has not been transferred on the third transfer carrier, 3,max The height of the third color LED chips in the nth third color LED chip group is greater than or equal to 2,max The height of the second color LED chips in the second color LED chip group.
[0021] A fourth aspect of the present disclosure provides a method for transferring a light emitting diode chip, comprising:
[0022] The first color LED chips in the Nth to the 1st first color LED chip groups on the transfer carrier are transferred to the 1st to the Nth driving backplanes in sequence, wherein the transfer carrier includes a substrate and N first color LED chip groups arranged on the substrate, the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group, N>1, n=1,…,N-1, each first color LED chip group includes a plurality of first color LED chips arranged in an array, and the distribution position of the first color LED chips in each first color LED chip group matches the distribution position of the pads of the first color sub-pixels on the driving backplane.
[0023] A fifth aspect of the present disclosure provides a method for transferring a light emitting diode chip, comprising:
[0024] The third color LED chip in a third color LED chip group on the third transfer carrier, the second color LED chip in a second color LED chip group on the second transfer carrier, and the first color LED chip in a first color LED chip group on the first transfer carrier are transferred to the first driving backplane in sequence, wherein the driving backplane includes a first pad group, a second pad group, and a third pad group, the first pad group includes pads of a plurality of first color sub-pixels arranged in an array, the second pad group includes pads of a plurality of second color sub-pixels arranged in an array, the third pad group includes pads of a plurality of third color sub-pixels arranged in an array, the height of the pads in the first pad group is greater than the height of the pads in the second pad group, and the height of the pads in the second pad group is greater than the height of the pads in the third pad group.
[0025] The beneficial effects of the present disclosure are as follows:
[0026] The technical solution provided by the present disclosure can reduce the difficulty of manufacturing light-emitting diode display products, improve production efficiency, reduce production costs, and improve the utilization rate of transfer carriers. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The specific implementation methods of the present disclosure are further described in detail below with reference to the accompanying drawings.
[0028] Figure 1 A schematic diagram showing a driving backplane to which LED chips are to be transferred.
[0029] Figure 2 A schematic diagram of a transfer carrier including three blue LED chip groups of different heights provided in the first embodiment is shown.
[0030] Figure 3 Show Figure 2 A schematic diagram of the AA cross section of the transfer carrier is shown.
[0031] Figure 4 Show Figure 2 Transfer carrier shown to the first Figure 1 The cross-sectional schematic diagram of the driver backplane transferring the third group of blue LED chips is shown.
[0032] Figure 5 Show Figure 2 The transfer carrier shown is to the second Figure 1 The cross-sectional schematic diagram of the driving backplane transferring the second group of blue LED chips is shown.
[0033] Figure 6 Show Figure 2 The transfer carrier shown is to the 3rd Figure 1 The cross-sectional schematic diagram of the driving backplane transferring the first group of blue LED chips is shown.
[0034] Figure 7 The transfer carrier including three green LED chipsets of different heights is shown Figure 1 The cross-sectional schematic diagram of the driving backplane transferring the second group of green LED chips is shown.
[0035] Figure 8 The transfer carrier including three red LED chipsets of different heights is shown. Figure 1 The cross-sectional schematic diagram of the driver backplane transferring the third group of red LED chips is shown.
[0036] Fig. 9 A cross-sectional schematic diagram is shown in an implementation of the driving backplane provided in the fourth embodiment after the LED chip transfer is completed.
[0037] Fig.10 A cross-sectional schematic diagram is shown when an LED chip is to be transferred in another implementation of the driving backplane provided in the fourth embodiment.
[0038] Fig.11 Show Fig.10The cross-sectional schematic diagram of the driving backplane shown is after the LED chip transfer is completed. DETAILED DESCRIPTION
[0039] The terms “on”, “formed on” and “disposed on” in the present disclosure may mean that one layer is directly formed or disposed on another layer, or may mean that one layer is indirectly formed or disposed on another layer, i.e., there are other layers between the two layers.
[0040] It should be noted that, although the terms "first", "second", etc. may be used herein to describe various parts, components, elements, regions, layers and / or parts, these parts, components, elements, regions, layers and / or parts should not be limited by these terms. Instead, these terms are used to distinguish one part, component, element, region, layer and / or part from another. Thus, for example, the first part, first member, first element, first region, first layer and / or first part discussed below may be referred to as the second part, second member, second element, second region, second layer and / or second part without departing from the teachings of the present disclosure.
[0041] In the present disclosure, unless otherwise specified, the term "same-layer arrangement" used refers to two layers, parts, components, elements or parts that can be formed by the same preparation process (such as a patterning process, etc.), and the two layers, parts, components, elements or parts are generally formed of the same material. For example, two or more functional layers are arranged in the same layer, which means that these functional layers arranged in the same layer can be formed using the same material layer and the same preparation process, thereby simplifying the preparation process of the display substrate.
[0042] In the present disclosure, unless otherwise specified, the expression "patterning process" generally includes steps such as photoresist coating, exposure, development, etching, photoresist stripping, etc. The expression "one-time patterning process" means a process of forming patterned layers, components, members, etc. using one mask.
[0043] One of the core technical challenges faced in the industrialization process of LED display devices is the mass transfer technology of LED chips. Since LED chips are very small, and mass transfer technology requires very high efficiency, yield rate and transfer accuracy, mass transfer technology has become the biggest challenge in the development process of LED display devices, hindering the promotion and use of LED display devices. Specifically, in the relevant technology, compared with the sub-pixels on the driving backplane, the arrangement of LED chips on the transfer carrier is more compact. In the mass transfer process, it is difficult and inefficient to transfer them through methods such as chip pick-up and placement technology (Pick & Place). In addition, the utilization rate of the transfer carrier (also called epitaxial wafer) is also low.
[0044] In view of this, the embodiments of the present disclosure provide a method for transferring a carrier, a driving backplane, and a light-emitting diode chip, which will be described below through several embodiments.
[0045] Embodiment 1
[0046] Embodiment 1 provides a transfer carrier, including a substrate and N first color LED chip groups arranged on the substrate, the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group, N>1, n=1,…,N-1, each first color LED chip group includes a plurality of first color LED chips arranged in an array, and the distribution position of the first color LED chips in each first color LED chip group matches the distribution position of the pads of the first color sub-pixels on the driving backplane.
[0047] In a specific example, the driving backplane of the LED chip to be transferred is as follows: Figure 1 As shown, it includes a total of 12 pixels arranged in an array of 3 rows and 4 columns, each pixel includes a red sub-pixel 101, a green sub-pixel 102 and a blue sub-pixel 103 arranged in the column direction, each red sub-pixel 101 is provided with a pair of pads 1011, each green sub-pixel 102 is provided with a pair of pads (Pad) 1021, and each blue sub-pixel 103 is provided with a pair of pads 1031. The pads 1011, 1021 and 1031 have the same height, and the bottom of the pads 1011, 1021 and 1031 is connected to the driving circuit layer in the driving backplane, such as a thin film transistor (TFT), and the top of the pads 1011, 1021 and 1031 is used for bonding a pair of pins of the transferred LED chip, wherein the LED chip can be a Mini LED chip or a Micro LED chip. It should be noted that Figure 1 In the driving backplane of the LED chip to be transferred shown, the number and size of the three primary color sub-pixels in the pixel are the same, and the distribution morphology of each color sub-pixel is the same. This design is only for illustration, and the embodiments of the present disclosure are not limited thereto. In addition, Figure 1 Each pixel in the driving backplane of the LED chip to be transferred shown includes one red sub-pixel 101, one green sub-pixel 102 and one blue sub-pixel 103 arranged in the column direction. The column direction arrangement of the sub-pixels in this pixel is only for illustration and can be designed and selected according to the requirements of the display product and optical indicators. For example, a triangular arrangement can be adopted.
[0048] Continuing with the previous example, Figure 2 and Figure 3As shown, the transfer carrier provided by the embodiment of the present disclosure includes a substrate 201 and three blue LED chip groups arranged on the substrate 201, the height of the blue LED chip 2023 in the third blue LED chip group is greater than the height of the blue LED chip 2022 in the second blue LED chip group, the height of the blue LED chip 2022 in the second blue LED chip group is greater than the height of the blue LED chip 2021 in the first blue LED chip group, each blue LED chip group includes a plurality of blue LED chips arranged in an array, and the distribution positions of the blue LED chips in each blue LED chip group match Figure 1 The distribution positions of the pads 1031 of the blue sub-pixel 103 on the driving backplane are shown.
[0049] Exemplarily, the substrate 201 can be made of sapphire, silicon wafer, glass and the like, and the substrate material can be selected according to the LED chip manufacturing process.
[0050] It should be noted that:
[0051] (1) Figure 2 As shown, the transfer carrier includes three blue LED chip groups, that is, the transfer carrier is a single-color LED chip transfer carrier.
[0052] (2) Figure 2 As shown, the transfer carrier includes 3 blue LED chipsets that can be transferred to 3 Figure 1 The driver backplane shown transfers the blue LED chips. However, the present disclosure is not limited thereto, and the transfer carrier may also include 4 blue LED chip groups, 5 blue LED chip groups, etc., as long as the distribution position of the blue LED chips in each blue LED chip group matches the Figure 1 The distribution position of the pad 1031 of the blue sub-pixel 103 on the driving backplane shown in the figure can be sufficient, and the gap between the multiple blue LED chip groups can be appropriately reduced under the premise of satisfying the matching distribution, so as to achieve a high density distribution of the blue LED chips on the transfer carrier. One transfer carrier can be used to transfer more Figure 1 The driver backplane shown transfers the blue LED chips.
[0053] (3) Figure 2 As shown, the blue LED chips in the three blue LED chip groups included in the transfer carrier are arranged crosswise with each other. The advantage of this design is that it is conducive to better utilizing the space of the transfer carrier and facilitating the transfer carrier to set more blue LED chip groups. Figure 2 The transfer carrier layout shown in the figure can be used as long as the distribution position of the blue LED chips in each blue LED chip group included in the transfer carrier matches the distribution position of the blue LED chips in each blue LED chip group included in the transfer carrier. Figure 1 The distribution position of the pad 1031 of the blue sub-pixel 103 on the driving backplane shown in the figure is sufficient.
[0054] (4) In addition to the distribution position of the blue LED chips in each blue LED chip group matching Figure 1 The distribution positions of the pads 1031 of the blue sub-pixels 103 on the driving backplane are shown, and the size of the pin (Pin, or electrode) of each blue LED chip also matches the size of the pad 1031 .
[0055] In summary, the transfer carrier provided in the first embodiment customizes the distribution position of the first color LED chips in each first color LED chipset on the transfer carrier according to the distribution position of the pads of the first color sub-pixels of the driving backplane, which is conducive to accurately and efficiently transferring a group of first color LED chips to the driving backplane through alignment bonding on the transfer carrier, and can be made through integrated LED display products, thereby reducing the difficulty of making LED display products, improving production efficiency, and reducing production costs. In addition, the transfer carrier adopts a design including multiple first color LED chipsets of different heights, which can realize a single transfer of a first color LED chipset, so that a transfer carrier can transfer the first color LED chips to multiple driving backplanes through multiple alignment bonding, thereby improving the utilization rate of the transfer carrier.
[0056] In a possible implementation, in Embodiment 1, the height difference between the first color LED chip in the n+1th first color LED chip group and the first color LED chip in the nth first color LED chip group is greater than or equal to 0.5 μm. In this implementation, the minimum height difference is designed according to the specific LED display product manufacturing process, which can ensure the stability of the process.
[0057] In a possible implementation, in Embodiment 1, the height difference between the first color LED chip in the n+1th first color LED chip group and the first color LED chip in the nth first color LED chip group is less than or equal to 50 μm. The maximum height difference designed in this implementation can ensure that the maximum height of the first color LED chip after transfer does not affect the packaging and display of the driver backplane, and even if the heights of the transferred three-primary color LED chips are different, the packaging and display of the driver backplane are not affected.
[0058] Continuing with the previous example, Figure 2 and Figure 3 As shown, the height difference Δh between the blue LED chip 2023 in the third blue LED chip group and the blue LED chip 2022 in the second blue LED chip group is 1The value range of is [0.5 μm, 50 μm], and the height difference Δh between the blue LED chip 2022 in the second blue LED chip group and the blue LED chip 2021 in the first blue LED chip group 2 The value range of is [0.5μm, 50μm]. For example, it can be set to Δh 1 =Δh 2 .
[0059] In one possible implementation, in Example 1, the pin height of the first color LED chip in the n+1th first color LED chip group is greater than the pin height of the first color LED chip in the nth first color LED chip group, so that the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group.
[0060] Continuing with the previous example, Figure 2 and Figure 3 As shown, the height of a pair of pins 20231 of the blue LED chip 2023 in the third blue LED chipset is greater than the height of a pair of pins 20221 of the blue LED chip 2022 in the second blue LED chipset, and the height of a pair of pins 20221 of the blue LED chip 2022 in the second blue LED chipset is greater than the height of a pair of pins 20211 of the blue LED chip 2021 in the first blue LED chipset. The thickness of the epitaxial layer 20232 of the blue LED chip 2023, the epitaxial layer 20222 of the blue LED chip 2022 and the epitaxial layer 20212 of the blue LED chip 2021 are consistent. By making pins or electrodes of different heights, different heights of the blue LED chips 2023, 2022 and 2021 are achieved. Exemplarily, the pins or electrodes of the LED chips can be realized by electroplating, evaporation and other processes, and the material of the pins or electrodes of the LED chips can be selected from one or an alloy of at least two metal materials such as gold (Au), platinum (Pt) and copper (Cu).
[0061] The above example is an example in which the first color is blue, that is, an example for a blue LED chip transfer carrier. It can be understood that for a green LED chip transfer carrier and a red LED chip transfer carrier, a design similar to the above example can be adopted, and Example 1 will not be described in detail.
[0062] The specific working principle of the transfer carrier provided in the first embodiment can refer to the transfer method of the light emitting diode chip provided in the second and third embodiments.
[0063] Embodiment 2
[0064] Embodiment 2 provides a method for transferring a light emitting diode chip, comprising:
[0065] The first color LED chips in the Nth to the 1st first color LED chip groups on the transfer carrier are transferred to the 1st to the Nth driving backplanes in sequence, wherein the transfer carrier includes a substrate and N first color LED chip groups arranged on the substrate, the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group, N>1, n=1,…,N-1, each first color LED chip group includes a plurality of first color LED chips arranged in an array, and the distribution position of the first color LED chips in each first color LED chip group matches the distribution position of the pads of the first color sub-pixels on the driving backplane.
[0066] Embodiment 2 provides a method for transferring first color LED chips to multiple driving backplanes through multiple alignment bonding of a transfer carrier including multiple first color LED chip groups with different heights, which is described below through a specific example.
[0067] For example, in this example, the driver backplane is Figure 1 As shown. The blue LED chip transfer carrier is as follows Figure 2 and Figure 3 As shown, it includes a substrate 201 and three blue LED chip groups arranged on the substrate 201, the height of the blue LED chip 2023 in the third blue LED chip group is greater than the height of the blue LED chip 2022 in the second blue LED chip group, the height of the blue LED chip 2022 in the second blue LED chip group is greater than the height of the blue LED chip 2021 in the first blue LED chip group, each blue LED chip group includes a plurality of blue LED chips arranged in an array, and the distribution positions of the blue LED chips in each blue LED chip group match Figure 1 The distribution position of the pad 1031 of the blue sub-pixel 103 on the driving backplane is shown. The blue LED chip 2023 includes an epitaxial layer 20232 and a pin 20231 stacked in sequence on the substrate 201, the blue LED chip 2022 includes an epitaxial layer 20222 and a pin 20221 stacked in sequence on the substrate 201, and the blue LED chip 2021 includes an epitaxial layer 20212 and a pin 20211 stacked in sequence on the substrate 201, wherein dissociation layers (not shown in the figure) are respectively arranged between the epitaxial layers 20232, 20222 and 20212 and the substrate 201.
[0068] In this example, the LED chip transfer method includes steps S21-S23, which are as follows:
[0069] S21, such as Figure 4 As shown, the blue LED chip 2023 in the third blue LED chip group of the blue LED chip transfer carrier is transferred to the first driving backplane.
[0070] Exemplarily, S21 includes sub-steps S211-S213, and the specific process is as follows:
[0071] S211, aligning the blue LED chip transfer carrier with the first driver backplane.
[0072] S212, bonding the blue LED chip 2023 to the pad 1031 of the blue sub-pixel 103 of the first driving backplane. For example, heating, mechanical pressure or vacuum pressure on the box can be used in an environment with set temperature and other conditions to complete the bonding of the pin 20231 of the blue LED chip 2023 in the third blue LED chipset and the pad 1031 of the blue sub-pixel 103 on the first driving backplane.
[0073] S213, performing substrate peeling, for example, laser or mask plate mask light can be used to irradiate the dissociation layer between the epitaxial layer 20232 of the blue LED chip 2023 and the substrate 201, so as to achieve the dissociation of the bonded blue LED chip 2023 and the substrate 201.
[0074] S22, such as Figure 5 As shown, the blue LED chip 2022 in the second blue LED chip group of the blue LED chip transfer carrier is transferred to the second driving backplane. The specific process is similar to S21 and will not be repeated here.
[0075] S23, such as Figure 6 As shown, the blue LED chip 2021 in the first blue LED chipset of the blue LED chip transfer carrier is transferred to the third driving backplane. The specific process is similar to S21 and will not be repeated here.
[0076] In summary, the LED chip transfer method provided in Example 2 can realize a single transfer of a first color LED chip group based on the design that the transfer carrier includes multiple first color LED chip groups with different heights, so that a transfer carrier can transfer the first color LED chips to multiple driving backplanes in the order of high to low through multiple alignment bonding, thereby improving the utilization rate of the transfer carrier.
[0077] Embodiment 3
[0078] Embodiment 3 provides a method for transferring a light emitting diode chip, comprising:
[0079] Transfer the nth1,max The first color LED chips in the first color LED chip group are transferred to the driving backplane, wherein the first transfer carrier includes a first substrate and N 1 The first color LED chip group, the nth 1 The height of the first color LED chip in the +1 first color LED chip group is greater than the nth 1 The height of the first color LED chips in the first color LED chip group, N 1 >1,n 1 =1,…,N 1 -1, each first color LED chip group includes a plurality of first color LED chips arranged in an array, and the distribution position of the first color LED chips in each first color LED chip group matches the distribution position of the pads of the first color sub-pixels on the driving backplane, and the nth 1,max The first color LED chip group is the first color LED chip group with the largest height that has not been transferred on the first transfer carrier;
[0080] Transfer the nth 2,max The second color LED chips in the second color LED chip group are transferred to the driving backplane, wherein the second transfer carrier includes a second substrate and N 2 The second color LED chip set, the nth 2 The height of the second color LED chip in the +1 second color LED chip group is greater than the nth 2 The height of the second color LED chips in the second color LED chip group, N 2 >1,n 2 =1,…,N 2 -1, each second color LED chip group includes a plurality of second color LED chips arranged in an array, and the distribution positions of the second color LED chips in each second color LED chip group match the distribution positions of the pads of the second color sub-pixels on the driving backplane, and the nth 2,max The nth second color LED chip group is the second color LED chip group with the largest height that has not been transferred on the second transfer carrier, 2,max The height of the second color LED chips in the second color LED chip groups is greater than or equal to the nth 1,max height of the first color LED chips in the first color LED chip groups;
[0081] Transfer the nth 3,maxThe third color LED chips in the third color LED chip group are transferred to the driving backplane, wherein the third transfer carrier includes a third substrate and N 3 The third color LED chip set, the nth 3 The height of the third color LED chip in the +1 third color LED chip group is greater than the nth 3 The height of the third color LED chips in the third color LED chip group, N 3 >1,n 3 =1,…,N 3 -1, each third color LED chip group includes a plurality of third color LED chips arranged in an array, and the distribution positions of the third color LED chips in each third color LED chip group match the distribution positions of the pads of the third color sub-pixels on the driving backplane, the nth 3,max The nth third color LED chip group is the third color LED chip group with the largest height that has not been transferred on the third transfer carrier, 3,max The height of the third color LED chips in the nth third color LED chip group is greater than or equal to 2,max The height of the second color LED chips in the second color LED chip group.
[0082] Embodiment three provides a method for sequentially transferring first color LED chips, second color LED chips and third color LED chips to a driving backplane through three-step alignment bonding, by using a transfer carrier including a plurality of first color LED chip groups with different heights, a transfer carrier including a plurality of second color LED chip groups with different heights and a transfer carrier including a plurality of third color LED chip groups with different heights. This method is explained below through a specific example.
[0083] For example, in this example, the driver backplane is Figure 1 As shown. The blue LED chip transfer carrier is as follows Figure 2 and Figure 3 As shown, it includes a substrate 201 and three blue LED chip groups arranged on the substrate 201, the height of the blue LED chip 2023 in the third blue LED chip group is greater than the height of the blue LED chip 2022 in the second blue LED chip group, the height of the blue LED chip 2022 in the second blue LED chip group is greater than the height of the blue LED chip 2021 in the first blue LED chip group, each blue LED chip group includes a plurality of blue LED chips arranged in an array, and the distribution positions of the blue LED chips in each blue LED chip group match Figure 1The distribution position of the pad 1031 of the blue sub-pixel 103 on the driving backplane shown. The blue LED chip 2023 includes an epitaxial layer 20232 and a pin 20231 stacked in sequence on the substrate 201, the blue LED chip 2022 includes an epitaxial layer 20222 and a pin 20221 stacked in sequence on the substrate 201, and the blue LED chip 2021 includes an epitaxial layer 20212 and a pin 20211 stacked in sequence on the substrate 201, wherein dissociation layers (not shown in the figure) are respectively arranged between the epitaxial layers 20232, 20222 and 20212 and the substrate 201. Similar to the blue LED chip transfer carrier, the green LED chip transfer carrier includes 3 groups of green LED chips with different heights, and the red LED chip transfer carrier includes 3 groups of red LED chips with different heights. Here, for the sake of convenience of explanation, it is assumed that the blue LED chip 2023 in the 3rd blue LED chipset group of the blue LED chip transfer carrier, the green LED chips in the 3rd green LED chipset group of the green LED chip transfer carrier, and the red LED chips in the 3rd red LED chipset group of the red LED chip transfer carrier are of the same height, the blue LED chip 2022 in the 2nd blue LED chipset group of the blue LED chip transfer carrier, the green LED chips in the 2nd green LED chipset group of the green LED chip transfer carrier, and the red LED chips in the 2nd red LED chipset group of the red LED chip transfer carrier are of the same height, and the blue LED chip 2021 in the 1st blue LED chipset group of the blue LED chip transfer carrier, the green LED chips in the 1st green LED chipset group of the green LED chip transfer carrier, and the red LED chips in the 1st red LED chipset group of the red LED chip transfer carrier are of the same height. It can be understood that the above assumptions are for the purpose of convenience of explanation and the present disclosure is not limited thereto.
[0084] In this example, the LED chip transfer method includes steps S31-S34, which are as follows:
[0085] S31, such as Figure 6 As shown, the blue LED chips in the first blue LED chipset on the blue LED chip transfer carrier are transferred to the driving backplane. The specific transfer process is similar to step S21 in the second embodiment and will not be described again.
[0086] S32, such as Figure 7 As shown, the green LED chips in the second green LED chipset on the green LED chip transfer carrier are transferred to the driving backplane. The specific transfer process is similar to step S21 in the second embodiment and will not be described again.
[0087] S33, such as Figure 8As shown, the red LED chips in the third red LED chipset on the red LED chip transfer carrier are transferred to the driving backplane. The specific transfer process is similar to step S21 in the second embodiment and will not be described again.
[0088] S34. The driver backplane is packaged. For example, according to product requirements, packaging solutions such as black plastic packaging, black plastic plus lens packaging, etc. can be used to complete the production of LED display products.
[0089] It should be noted that the above order of transferring the blue LED chip, the green LED chip, and the red LED chip to the driver backplane is only for illustration, and the order of transferring the red LED chip, the blue LED chip, and the green LED chip may also be adopted, and the present disclosure does not limit this. In addition, the order of the height of the LED chips from low to high when the driver backplane sequentially transfers the three primary color LED chips is also only for illustration, and the height of the LED chips transferred three times may be the same or the height of the LED chips transferred two adjacent times in the three transfers may be the same. In addition, the above is an explanation based on the RGB pixel design adopted by the driving backplane (i.e., one pixel includes one red sub-pixel, one green sub-pixel and one blue sub-pixel). For pixel designs in other forms such as RRGB (i.e., one pixel includes two red sub-pixels, one green sub-pixel and one blue sub-pixel), RGBB (i.e., one pixel includes one red sub-pixel, one green sub-pixel and two blue sub-pixels), the method provided in this embodiment can also be used for transfer. Taking the driving backplane adopting the RRGB pixel design as an example, the driving backplane includes four groups of pads, and four transfers can be performed in sequence using a blue LED chip transfer carrier, a green LED chip transfer carrier and two red LED chip transfer carriers. Among them, when the distribution positions of the two groups of red sub-pixels are the same, four transfers can also be performed in sequence using a blue LED chip transfer carrier, a green LED chip transfer carrier and a red LED chip transfer carrier (the red LED chip transfer carrier is transferred twice).
[0090] Embodiment 4
[0091] Embodiment 4 provides a driving backplane, comprising a substrate and a first pad group, a second pad group and a third pad group arranged on the substrate, wherein the first pad group comprises a plurality of first pads arranged in an array, the second pad group comprises a plurality of second pads arranged in an array, the third pad group comprises a plurality of third pads arranged in an array, the driving backplane further comprises a first color light emitting diode chip bonded to the first pad, a second color light emitting diode chip bonded to the second pad and a third color light emitting diode chip bonded to the third pad;
[0092] The height of the first color LED chip away from the surface of one side of the substrate is greater than the height of the second color LED chip away from the surface of one side of the substrate, and the height of the second color LED chip away from the surface of one side of the substrate is greater than the height of the third color LED chip away from the surface of one side of the substrate.
[0093] The driving backplane that has completed the LED chip transfer provided in Example 4 may also be called a light-emitting substrate, an array substrate, etc. The design of different top surface heights of LED chips of different colors can achieve sequential bonding of LED chips of different colors during production. In addition, a monochrome LED chip transfer carrier including multiple monochrome LED chip groups can transfer one monochrome LED chip group at a time, thereby achieving a monochrome LED chip transfer carrier that can transfer monochrome LED chips to multiple driving backplanes through multiple alignment bondings, thereby improving the utilization rate of the transfer carrier.
[0094] Exemplarily, in the fourth embodiment, the first color, the second color and the third color are respectively one of blue, green and red. Subsequently, the first color, the second color and the third color are respectively blue, green and red as an example for explanation.
[0095] In a possible implementation, in Embodiment 4, the difference between the height of the first color LED chip away from the surface of one side of the substrate and the height of the second color LED chip away from the surface of one side of the substrate is greater than or equal to 0.5 μm, and the difference between the height of the second color LED chip away from the surface of one side of the substrate and the height of the third color LED chip away from the surface of one side of the substrate is greater than or equal to 0.5 μm. In this implementation, the minimum height difference is designed according to the specific LED display product manufacturing process, which can ensure the stability of the process.
[0096] In a possible implementation, in Embodiment 4, the difference between the height of the first color LED chip away from the surface of one side of the substrate and the height of the second color LED chip away from the surface of one side of the substrate is less than or equal to 50 μm, and / or the difference between the height of the second color LED chip away from the surface of one side of the substrate and the height of the third color LED chip away from the surface of one side of the substrate is less than or equal to 50 μm. The maximum value of the height difference designed in this implementation can ensure that the top surface height of the first color LED chip does not affect the packaging and display of the driver backplane, and the different heights of the three primary color LED chips do not affect the packaging and display of the driver backplane.
[0097] In a first possible implementation, the pin height of the first color LED chip is greater than the pin height of the second color LED chip so that the height of the first color LED chip away from the surface of one side of the substrate is greater than the height of the second color LED chip away from the surface of one side of the substrate, and the pin height of the second color LED chip is greater than the pin height of the third color LED chip so that the height of the second color LED chip away from the surface of one side of the substrate is greater than the height of the third color LED chip away from the surface of one side of the substrate.
[0098] In a specific example, if Fig. 9 As shown, in the first implementation of the fourth embodiment, the driving backplane that has completed the transfer of the LED chip includes a substrate 901 and a first pad group, a second pad group and a third pad group arranged on the substrate 901, the first pad group includes a plurality of first pads 9021 arranged in an array, the second pad group includes a plurality of second pads 9022 arranged in an array, the third pad group includes a plurality of third pads 9023 arranged in an array, and the driving backplane also includes a blue LED chip bonded to the first pad 9021, a green LED chip bonded to the second pad 9022 and a red LED chip bonded to the third pad 9023; wherein The first solder pad 9021, the second solder pad 9022 and the third solder pad 9023 have the same height, the height of the pin 90311 of the blue LED chip is greater than the height of the pin 90321 of the green LED chip, and the height of the pin 90321 of the green LED chip is greater than the height of the pin 90331 of the red LED chip, so that the height of the surface of the blue LED chip away from the substrate 901 is greater than the height of the surface of the green LED chip away from the substrate 901, and the height of the surface of the green LED chip away from the substrate 901 is greater than the height of the surface of the red LED chip away from the substrate 901.
[0099] Regarding the first possible implementation manner of the fourth embodiment, the corresponding method for transferring the LED chip may refer to the third embodiment.
[0100] In a second possible implementation, the height of the first solder pad is greater than the height of the second solder pad so that the height of the first color LED chip away from the surface of one side of the substrate is greater than the height of the second color LED chip away from the surface of one side of the substrate, and the height of the second solder pad is greater than the height of the third solder pad so that the height of the second color LED chip away from the surface of one side of the substrate is greater than the height of the third color LED chip away from the surface of one side of the substrate.
[0101] Therefore, by designing and manufacturing pads of RGB sub-pixels of different heights on the driving backplane, the height difference of the top surfaces of the three-primary color LED chips after bonding can be met, so that the LED chips can be bonded in sequence.
[0102] In a specific example, in the second implementation of Embodiment 4:
[0103] like Fig.10 As shown, the driving backplane of the LED chip to be transferred includes a substrate 1001 and a first pad group, a second pad group and a third pad group arranged on the substrate 1001, the first pad group includes a plurality of first pads 10021 arranged in an array corresponding to blue sub-pixels, the second pad group includes a plurality of second pads 10022 arranged in an array corresponding to green sub-pixels, the third pad group includes a plurality of third pads 10023 arranged in an array corresponding to red sub-pixels, the height of the first pad 10021 is greater than the height of the second pad 10022, and the height of the second pad 10022 is greater than the height of the third pad 10023.
[0104] like Fig.11 As shown, the driving backplane after the LED chip transfer is completed includes a substrate 1001 and a first pad group, a second pad group and a third pad group arranged on the substrate 1001, the first pad group includes a plurality of first pads 10021 corresponding to blue sub-pixels arranged in an array, the second pad group includes a plurality of second pads 10022 corresponding to green sub-pixels arranged in an array, the third pad group includes a plurality of third pads 10023 corresponding to red sub-pixels arranged in an array, the driving backplane also includes a blue LED chip bonded to the first pad 10021, a green LED chip bonded to the second pad 10022 and a third pad group. A red LED chip bonded to the pad 10023; wherein the blue LED chip, the green LED chip and the red LED chip have the same height, the height of the first pad 10021 is greater than the height of the second pad 10022, and the height of the second pad 10022 is greater than the height of the third pad 10023, so that the height of the surface of the blue LED chip away from the substrate 1001 is greater than the height of the surface of the green LED chip away from the substrate 1001, and the height of the surface of the green LED chip away from the substrate 1001 is greater than the height of the surface of the red LED chip away from the substrate 1001.
[0105] Corresponding to the second possible implementation manner of the fourth embodiment, the method for transferring the light emitting diode chip is:
[0106] The third color LED chip in a third color LED chip group on the third transfer carrier, the second color LED chip in a second color LED chip group on the second transfer carrier, and the first color LED chip in a first color LED chip group on the first transfer carrier are transferred to the first driving backplane in sequence, wherein the driving backplane includes a first pad group, a second pad group, and a third pad group, the first pad group includes pads of a plurality of first color sub-pixels arranged in an array, the second pad group includes pads of a plurality of second color sub-pixels arranged in an array, the third pad group includes pads of a plurality of third color sub-pixels arranged in an array, the height of the pads in the first pad group is greater than the height of the pads in the second pad group, and the height of the pads in the second pad group is greater than the height of the pads in the third pad group.
[0107] In a specific example, the LED transfer method corresponding to the second possible implementation of the fourth embodiment includes steps S41-S44, which are as follows:
[0108] S41. Transfer a red LED chip in a red LED chipset group on a red LED chip transfer carrier to the driver backplane, specifically bond the red LED chip to the third solder pad 10023 in the third solder pad group of the driver backplane. The transfer process is similar to step S21 in Example 2 and will not be repeated here. For example, the red LED chip transfer carrier includes a plurality of red LED chipsets, and the heights of the red LED chips in each red LED chipset are the same, and the distribution positions of the red LED chips in each red LED chipset match the distribution positions of the third solder pad 10023 on the driver backplane.
[0109] S42, transferring a green LED chip in a green LED chipset group on the green LED chip transfer carrier to the driving backplane, specifically bonding the green LED chip to the second pad 10022 in the second pad group of the driving backplane, the transfer process is similar to step S21 in Example 2 and will not be repeated here, wherein the height of the second pad 10022 is greater than the height of the third pad 10023, and the height of the green LED chip is the same as the height of the red LED chip. For example, in this example, the overall height of the third pad after bonding the red LED chip obtained in step S41 (i.e., the height of the surface of the red LED chip transferred to the driving backplane away from the substrate) should be less than or equal to the height of the second pad, so that the green LED chip can be transferred in step S42. For example, the green LED chip transfer carrier includes a plurality of green LED chipsets, the height of the green LED chips in each green LED chipset is the same, and the distribution position of the green LED chips in each green LED chipset matches the distribution position of the second pad 10022 on the driving backplane.
[0110] S43, transferring a blue LED chip in a blue LED chipset on a blue LED chip transfer carrier to a driving backplane, Fig.11 The driving backplane shown, step S43 specifically is to bond the blue LED chip 10031 to the first pad 10021 of the first pad of the driving backplane, the specific transfer process is similar to step S21 in embodiment 2, and will not be repeated here, wherein the height of the first pad 10021 is greater than the height of the second pad 10022, and the height of the blue LED chip is the same as the height of the green LED chip. For example, in this example, the overall height of the second pad 10022 obtained in step S42 after bonding the green LED chip (that is, the height of the surface of the green LED chip transferred to the driving backplane away from the substrate side) should be less than or equal to the height of the first pad, so that step S43 can transfer the blue LED chip. For example, the blue LED chip transfer carrier includes a plurality of blue LED chip groups, the height of the blue LED chips in each blue LED chip group is the same, and the distribution position of the blue LED chips in each blue LED chip group matches the distribution position of the first pad 10021 on the driving backplane.
[0111] S44. The driver backplane is packaged. For example, according to product requirements, packaging solutions such as black plastic packaging, black plastic plus lens packaging, etc. can be used to complete the production of LED display products.
[0112] It is understandable that, referring to the LED chip transfer method introduced in Example 3, when the top surface heights of the three color LED chips in the driving backplane are the same or the top surface heights of two of the three color LED chips are the same, the different color LED chips can be bonded in sequence through the design of the manufacturing process. In addition, a monochrome LED chip transfer carrier including multiple monochrome LED chip groups can be transferred one monochrome LED chip group at a time, so that a monochrome LED chip transfer carrier can transfer monochrome LED chips to multiple driving backplanes through multiple alignment bonding, thereby improving the utilization rate of the transfer carrier.
[0113] In addition, the above is an explanation based on the RGB pixel design of the driving backplane. For pixel designs in other forms such as RRGB, RGBB, etc., the above method can also be used for transfer. Taking the driving backplane using the RRGB pixel design as an example, the driving backplane includes four groups of pads with different heights, and four transfers can be performed in sequence using a blue LED chip transfer carrier, a green LED chip transfer carrier and two red LED chip transfer carriers.
[0114] Embodiment 5
[0115] Embodiment 5 provides a driving backplane, comprising a substrate and a first pad group, a second pad group and a third pad group arranged on the substrate, wherein the first pad group comprises a plurality of first pads arranged in an array, the second pad group comprises a plurality of second pads arranged in an array, the third pad group comprises a plurality of third pads arranged in an array, the driving backplane further comprises a first first color light emitting diode chip bonded to the first pad, a second first color light emitting diode chip bonded to the second pad and a third first color light emitting diode chip bonded to the third pad;
[0116] The height of the first first color LED chip away from the surface of one side of the substrate is greater than the height of the second first color LED chip away from the surface of one side of the substrate, and the height of the second first color LED chip away from the surface of one side of the substrate is greater than the height of the third first color LED chip away from the surface of one side of the substrate;
[0117] The driving backplane also includes a color conversion layer located on a side of the first first color LED chip, the second first color LED chip and the third first color LED chip away from the substrate, and the color conversion layer includes a plurality of color conversion units arranged in an array.
[0118] The driving backplane provided with a color conversion layer provided in the fifth embodiment can realize color display by using a single-color LED chip such as blue or white, which can further reduce the technical difficulty of transferring the LED chip, improve production efficiency, and reduce production costs.
[0119] In a specific example, the driving backplane provided in Embodiment 5 includes a substrate and a first pad group, a second pad group and a third pad group arranged on the substrate, the first pad group includes a plurality of first pads corresponding to blue sub-pixels arranged in an array, the second pad group includes a plurality of second pads corresponding to green sub-pixels arranged in an array, the third pad group includes a plurality of third pads corresponding to red sub-pixels arranged in an array, and the driving backplane also includes a first blue LED chip bonded to the first pad, a first blue LED chip bonded to the second pad and a third blue LED chip bonded to the third pad;
[0120] The height of the surface of the first blue LED chip away from the substrate is greater than the height of the surface of the second blue LED chip away from the substrate, and the height of the surface of the second blue LED chip away from the substrate is greater than the height of the surface of the third blue LED chip away from the substrate;
[0121] The driving backplane also includes a color conversion layer located on the side of the first blue LED chip, the second blue LED chip and the third blue LED chip away from the substrate, the color conversion layer includes a plurality of color conversion units arranged in an array, specifically including a blue-green conversion unit corresponding to the second blue LED chip and a blue-red conversion unit corresponding to the third blue LED chip.
[0122] Exemplarily, the material of the color conversion unit may be a quantum dot (QD) material or an organic fluorescent dye, wherein the quantum dot material is a nano-semiconductor material, and specifically may include acrylate and quantum dot material.
[0123] Corresponding to the transfer method of the LED chip of the driving backplane provided in Example 5, three blue LED chip transfer carriers can be used for transfer three times, wherein the distribution positions of the blue LED chips in the blue LED chips group on the first blue LED chip transfer carrier match the distribution positions of the first solder pads on the driving backplane, the distribution positions of the blue LED chips in the blue LED chips group on the second blue LED chip transfer carrier match the distribution positions of the second solder pads on the driving backplane, and the distribution positions of the blue LED chips in the blue LED chips group on the third blue LED chip transfer carrier match the distribution positions of the third solder pads on the driving backplane. If the distribution positions of the first solder pad, the second solder pad and the third solder pad on the driving backplane are determined, three transfers can also be performed using a blue LED chip transfer carrier including multiple blue LED chips groups.
[0124] In a possible implementation, the height of the first first color LED chip away from the surface of one side of the substrate can be greater than the height of the second first color LED chip away from the surface of one side of the substrate, and the height of the second first color LED chip away from the surface of one side of the substrate can be greater than the height of the third first color LED chip away from the surface of one side of the substrate by designing the first first color LED chip, the second first color LED chip and the second first color LED chip to have different pin heights, or the first pad, the second pad and the third pad to have different pad heights.
[0125] In a possible implementation, in Embodiment 4, the difference between the height of the first first color LED chip away from the surface of one side of the substrate and the height of the second first color LED chip away from the surface of one side of the substrate is greater than or equal to 0.5 μm, and the difference between the height of the second first color LED chip away from the surface of one side of the substrate and the height of the third first color LED chip away from the surface of one side of the substrate is greater than or equal to 0.5 μm.
[0126] In a possible implementation, in Embodiment 4, the difference between the height of the first first color LED chip away from the surface of one side of the substrate and the height of the second first color LED chip away from the surface of one side of the substrate is less than or equal to 50 μm, and the difference between the height of the second first color LED chip away from the surface of one side of the substrate and the height of the third first color LED chip away from the surface of one side of the substrate is less than or equal to 50 μm.
[0127] Another embodiment of the present disclosure provides a display device, including the driver backplane to which the LED chip transfer has been completed in the above-mentioned embodiment 4 or embodiment 5. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc., and this embodiment does not limit this.
[0128] Obviously, the above embodiments of the present disclosure are merely examples for clearly illustrating the present disclosure, and are not limitations on the implementation methods of the present disclosure. For ordinary technicians in this field, other different forms of changes or modifications can be made on the basis of the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present disclosure are still within the protection scope of the present disclosure.
Claims
1. A transfer carrier, characterized in that: The invention comprises a substrate and N first color LED chip groups arranged on the substrate, wherein the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group, N>1, n=1,…,N-1, each first color LED chip group comprises a plurality of first color LED chips arranged in an array, and the distribution positions of the first color LED chips in each first color LED chip group match the distribution positions of the pads of the first color sub-pixels on the driving backplane.
2. The transfer carrier according to claim 1, characterized in that: A difference between a height of the first color LED chip in the (n+1)th first color LED chip group and a height of the first color LED chip in the nth first color LED chip group is greater than or equal to 0.5 μm.
3. The transfer carrier according to claim 2, characterized in that: A difference between a height of the first color LED chip in the (n+1)th first color LED chip group and a height of the first color LED chip in the nth first color LED chip group is less than or equal to 50 μm.
4. The transfer carrier according to claim 1, characterized in that: The pin height of the first color LED chip in the n+1th first color LED chip group is greater than the pin height of the first color LED chip in the nth first color LED chip group, so that the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group.
5. A driving backplane, characterized in that: The invention comprises a substrate and a first pad group, a second pad group and a third pad group arranged on the substrate, wherein the first pad group comprises a plurality of first pads arranged in an array, the second pad group comprises a plurality of second pads arranged in an array, the third pad group comprises a plurality of third pads arranged in an array, and the driving backplane further comprises a first light-emitting diode chip bonded to the first pad, a second light-emitting diode chip bonded to the second pad and a third light-emitting diode chip bonded to the third pad; The height of the first LED chip away from the surface of one side of the substrate is greater than the height of the second LED chip away from the surface of one side of the substrate, and / or the height of the second LED chip away from the surface of one side of the substrate is greater than the height of the third LED chip away from the surface of one side of the substrate.
6. The driving backplane according to claim 5, characterized in that: The pin height of the first LED chip is greater than the pin height of the second LED chip so that the height of the first LED chip away from the surface of one side of the substrate is greater than the height of the second LED chip away from the surface of one side of the substrate, and / or the pin height of the second LED chip is greater than the pin height of the third LED chip so that the height of the second LED chip away from the surface of one side of the substrate is greater than the height of the third LED chip away from the surface of one side of the substrate.
7. The driving backplane according to claim 5, characterized in that: The height of the first solder pad is greater than the height of the second solder pad so that the height of the first light-emitting diode chip away from the surface of one side of the substrate is greater than the height of the second light-emitting diode chip away from the surface of one side of the substrate, and / or the height of the second solder pad is greater than the height of the third solder pad so that the height of the second light-emitting diode chip away from the surface of one side of the substrate is greater than the height of the third light-emitting diode chip away from the surface of one side of the substrate.
8. The driving backplane according to any one of claims 5 to 7, characterized in that: The difference between the height of the first LED chip away from the surface of one side of the substrate and the height of the second LED chip away from the surface of one side of the substrate is greater than or equal to 0.5 μm, and / or the difference between the height of the second LED chip away from the surface of one side of the substrate and the height of the third LED chip away from the surface of one side of the substrate is greater than or equal to 0.5 μm.
9. The driving backplane according to claim 8, characterized in that: The difference between the height of the first LED chip away from the surface of one side of the substrate and the height of the second LED chip away from the surface of one side of the substrate is less than or equal to 50 μm, and / or the difference between the height of the second LED chip away from the surface of one side of the substrate and the height of the third LED chip away from the surface of one side of the substrate is less than or equal to 50 μm.
10. The driving backplane according to claim 5, characterized in that: The first LED chip, the second LED chip and the third LED chip emit different colors of light.
11. The driving backplane according to claim 5, characterized in that: The first LED chip, the second LED chip and the third LED chip emit light of the same color, the driving backplane also includes a color conversion layer located on a side of the first LED chip, the second LED chip and the third LED chip away from the substrate, and the color conversion layer includes a plurality of color conversion units arranged in an array.
12. A method for transferring a light emitting diode chip, characterized in that: include: Transfer the nth 1,max The first color LED chips in the first color LED chip groups are transferred to the driving backplane, wherein the first transfer carrier includes a first substrate and N1 first color LED chip groups arranged on the first substrate, the height of the first color LED chip in the n1+1th first color LED chip group is greater than the height of the first color LED chip in the n1th first color LED chip group, N1>1, n1=1,…,N1-1, each first color LED chip group includes a plurality of first color LED chips arranged in an array, the distribution position of the first color LED chips in each first color LED chip group matches the distribution position of the pads of the first color sub-pixels on the driving backplane, and the n1th 1,max The first color LED chip group is the first color LED chip group with the largest height that has not been transferred on the first transfer carrier; Transfer the nth 2,max The second color LED chips in the second color LED chip groups are transferred to the driving backplane, wherein the second transfer carrier includes a second substrate and N2 second color LED chip groups arranged on the second substrate, the height of the second color LED chip in the n2+1th second color LED chip group is greater than the height of the second color LED chip in the n2th second color LED chip group, N2>1, n2=1,…,N2-1, each second color LED chip group includes a plurality of second color LED chips arranged in an array, the distribution position of the second color LED chips in each second color LED chip group matches the distribution position of the pads of the second color sub-pixels on the driving backplane, and the nth 2,max The nth second color LED chip group is the second color LED chip group with the largest height that has not been transferred on the second transfer carrier, 2,max The height of the second color LED chips in the second color LED chip groups is greater than or equal to the nth 1,max height of the first color LED chips in the first color LED chip groups; Transfer the nth 3,max The third color LED chips in the third color LED chip groups are transferred to the driving backplane, wherein the third transfer carrier includes a third substrate and N3 third color LED chip groups arranged on the third substrate, the height of the third color LED chip in the n3+1th third color LED chip group is greater than the height of the third color LED chip in the n3th third color LED chip group, N3>1, n3=1,…,N3-1, each third color LED chip group includes a plurality of third color LED chips arranged in an array, the distribution position of the third color LED chips in each third color LED chip group matches the distribution position of the pads of the third color sub-pixels on the driving backplane, and the n3+1th third color LED chip group has a height greater than the height of the third color LED chip in the n3th third color LED chip group. 3,max The nth third color LED chip group is the third color LED chip group with the largest height that has not been transferred on the third transfer carrier, 3,max The height of the third color LED chips in the nth third color LED chip group is greater than or equal to 2,max The height of the second color LED chips in the second color LED chip group.
13. A method for transferring a light emitting diode chip, characterized in that: include: The first color LED chips in the Nth to the 1st first color LED chip groups on the transfer carrier are transferred to the 1st to the Nth driving backplanes in sequence, wherein the transfer carrier includes a substrate and N first color LED chip groups arranged on the substrate, the height of the first color LED chip in the n+1th first color LED chip group is greater than the height of the first color LED chip in the nth first color LED chip group, N>1, n=1,…,N-1, each first color LED chip group includes a plurality of first color LED chips arranged in an array, and the distribution position of the first color LED chips in each first color LED chip group matches the distribution position of the pads of the first color sub-pixels on the driving backplane.
14. A method for transferring a light emitting diode chip, characterized in that: include: The third color LED chip in a third color LED chip group on the third transfer carrier, the second color LED chip in a second color LED chip group on the second transfer carrier, and the first color LED chip in a first color LED chip group on the first transfer carrier are transferred to the first driving backplane in sequence, wherein the driving backplane includes a first pad group, a second pad group, and a third pad group, the first pad group includes pads of a plurality of first color sub-pixels arranged in an array, the second pad group includes pads of a plurality of second color sub-pixels arranged in an array, the third pad group includes pads of a plurality of third color sub-pixels arranged in an array, the height of the pads in the first pad group is greater than the height of the pads in the second pad group, and the height of the pads in the second pad group is greater than the height of the pads in the third pad group.