Rapid clamping mechanism for semiconductor cleaning machine

Abstract

The rapid clamping mechanism for the semiconductor cleaning machine comprises a box body, supporting plates are fixedly installed on the two sides of the interior of the box body, and the sides, close to each other, of the supporting plates on the two sides are fixedly connected with a connecting base through telescopic mechanisms. Through cooperative use of a telescopic mechanism and a clamping mechanism, semiconductor plates of different sizes can be clamped and fixed, cleaning liquid is sprayed through a moving mechanism and a spray head mechanism, the spraying angle is adjustable, the spraying range is wider, the surfaces of the semiconductor plates are comprehensively cleaned, water after cleaning falls into the bottom end of the interior of a box body, and the cleaning effect is better. A filter plate is mounted at the bottom end of the interior of the box body, water after cleaning is filtered, and cyclic utilization of water resources can be achieved through the effect of a water pump at the bottom end of the left side of the box body; and then through cooperative use of the moving mechanism and the lifting mechanism, water remaining on the surface of the cleaned semiconductor plate is wiped away, convenience and rapidness are achieved, and the requirements of workers are met.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor cleaning, and in particular to a quick clamping mechanism for a semiconductor cleaning machine. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity is between that of conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement. For example, diodes are devices made of semiconductors. Semiconductors refer to materials whose electrical conductivity can be controlled, ranging from insulators to conductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Semiconductor production includes cleaning, oxidation, chemical vapor deposition, metallization, photolithography, etching, doping, etc. Cleaning semiconductors to remove impurities, semiconductor cleaning and drying after cleaning are of great significance.

[0003] Chinese patent CN201420190299.7 discloses a buckle installed on a cleaning machine for cleaning semiconductor chips, including a support plate and a clamping device, the support plate is provided with a blind hole and a U-shaped groove, a magnet is provided in the blind hole, the clamping device is composed of a rotating plate and a fixed rod, the rotating plate is rotatably installed on the two side walls of the U-shaped groove through a rotating shaft, the top of the side wall of the rotating plate opposite to the U-shaped groove is provided with a groove, the fixed rod passes through the U-shaped groove and is arranged on the rotating plate; two U-shaped grooves are provided on the support plate, and clamping devices are provided in both U-shaped grooves. The beneficial effects of the utility model are: large carrying capacity, firm clamping of the fixed ring of the chip to be cleaned, easy to use, and effective prevention of chips flying out during high-speed rotation, causing damage to products and personnel.

[0004] However, in actual use, the clip device provided in the above document clamps parts through the magnetic force of magnets, and the magnetic force is strictly controlled. If the magnetic force is too small to counteract the centrifugal force caused by high-speed rotation, parts will fly out, causing economic losses or even casualties. If the magnetic force is too large, disassembly and assembly will require overcoming the magnetic force, resulting in low clamping efficiency. Summary of the invention

[0005] In order to solve the above technical problems, a quick clamping mechanism for a semiconductor cleaning machine is provided. This technical solution solves the problem that the clip device provided in the above document proposed in the above background technology clamps parts through the magnetic force of a magnet. The magnetic force is strictly controlled. If the magnetic force is too small to counteract the centrifugal force caused by high-speed rotation, parts may fly out, causing economic losses or even casualties. If the magnetic force is too large, disassembly and assembly require overcoming the magnetic workmanship, resulting in low clamping efficiency.

[0006] In order to achieve the above purpose, the technical solution adopted by the present invention is:

[0007] A quick clamping mechanism for a semiconductor cleaning machine comprises a box body, support plates are fixedly installed on both sides of the interior of the box body, the sides of the support plates on both sides that are close to each other are fixedly connected to a connecting seat through a telescopic mechanism, a clamping mechanism is arranged on the outer side of the connecting seat, the inner top end of the box body is connected to a frame body and a movable plate through a moving mechanism, and a nozzle mechanism is arranged inside the frame body, a first cylinder member is fixedly installed inside the movable plate, a second cylinder member is slidably connected inside the first cylinder member, a third cylinder member is slidably connected inside the second cylinder member, and a fourth cylinder member is slidably connected inside the third cylinder member, the first cylinder member, the second cylinder member, the third cylinder member and the fourth cylinder member are connected by a lifting mechanism, and a cleaning plate is fixedly installed on the bottom end of the fourth cylinder member.

[0008] Preferably, the telescopic mechanism includes a fixed plate, which is fixedly mounted on the inner side of the support plate, the peripheral surface of the fixed plate is rotatably connected to the end face gear through a bearing, and four groups of fixed seats are fixedly connected to the fixed plate, the interior of the fixed seat is rotatably connected to a rotating rod, one end of the rotating rod is fixedly connected to a transmission gear meshing with the end face gear, and the other end of the rotating rod is fixedly connected to a first connecting arm, an end of the first connecting arm away from the rotating rod is rotatably connected to the second connecting arm, and an end of the second connecting arm away from the first connecting arm is rotatably connected to the outer side of the connecting seat.

[0009] Preferably, a motor mounting plate is also fixedly connected to the inner side of the support plate, a transmission motor is fixedly mounted on the motor mounting plate, the output end of the transmission motor passes through the side of the motor mounting plate and is fixedly connected to the outer middle part of one of the transmission gears.

[0010] Preferably, the clamping mechanism includes a first fixed block, a first threaded rod and a movable plate, two groups of first fixed blocks are fixedly connected at upper and lower symmetrical positions on the outer side of the connecting seat, and the inner parts of the two groups of first fixed blocks are fixedly connected to the guide rod, connecting plates are welded at both ends of the guide rod, a rotating plate is rotatably connected to the middle part of the outer side of the connecting seat, a transmission plate and a movable plate are respectively slidably connected at both ends of the outer surface of the guide rod, connecting rods are rotatably connected at both ends of the rotating plate, and the ends of the rotating plate are respectively rotatably connected to the outer surfaces of the transmission plate and the movable plate, and the outer sides of the transmission plate and the movable plate are fixedly connected to the first clamping plate through connecting pieces.

[0011] Preferably, a second fixed block is fixedly connected to the outer side of the connecting seat, a first threaded rod is rotatably connected between the second fixed block and one of the connecting plates, the movable plate is threadedly connected to the surface of the first threaded rod, and a stepper motor is fixedly installed in the middle part of the outer side of one of the connecting plates, and one end of the first threaded rod is fixedly connected to the output end of the stepper motor.

[0012] Preferably, two groups of mounting seats are fixedly installed on the sides of the two first clamping plates that are close to each other, and electric push rods are fixedly installed on the sides of the two groups of mounting seats that are away from each other, and the output ends of the electric push rods pass through the outer sides of the mounting seats and are fixedly connected to the second clamping plates, and several groups of rubber floppy disks are fixedly connected to the inner sides of the two groups of the second clamping plates.

[0013] Preferably, the lifting mechanism includes a servo motor, which is fixedly mounted on the inner wall of the first cylinder, and the inner wall of the first cylinder is also fixedly connected to a cross plate, one end of the first threaded rod is fixedly connected to the output end of the first servo motor, and the other end of the first threaded rod is rotatably connected to the inside of the cross plate, the lifting member is threadedly connected to the outer surface of the first threaded rod, the inner wall of the first cylinder is also fixedly connected to a first fixed shaft, the outer surface of the first fixed shaft is rotatably connected to the first rotating arm and the second rotating arm, and the inner wall of the fourth cylinder is fixedly connected to the second fixed shaft, the outer surface of the second fixed shaft is rotatably connected to the third rotating arm and the fourth rotating arm, two ends of one side of the telescopic member are rotatably connected to the first rotating arm and the second rotating arm respectively, and two ends of the other side of the telescopic member are rotatably connected to the third rotating arm and the fourth rotating arm respectively, and the lifting member is connected to the telescopic member.

[0014] Preferably, the second cylinder member and the third cylinder member are both provided with limiting grooves, the telescopic member is provided with a limiting rod, and the limiting rod is slidably connected to the inside of the limiting groove.

[0015] Preferably, it includes a first stepper motor and a second stepper motor, and the first stepper motor and the second stepper motor are respectively fixedly installed on the right side and the back of the frame, and the output end of the first stepper motor extends to the interior of the frame and is fixedly connected to the first support frame, and the interior of the first support frame is rotatably connected with a rotating shaft on both sides, and the ends of the two groups of rotating shafts close to each other are fixedly connected to the nozzle, and a connecting rod is installed on the left side of the nozzle, and the connecting rod is rotatably connected to the interior of the second support frame, and the second support frame is fixedly connected to the output end of the second stepper motor.

[0016] Preferably, the moving mechanism includes a second threaded rod, which is provided with two groups and is rotatably connected to the inner sides of the box body, the frame body and the movable plate are both threadedly connected to the outer surface of the second threaded rod, and one end of the second threaded rod extends to the outside of the box body and is fixedly connected to the first bevel gear, and a dual-axis motor is fixedly installed on the top right side of the box body, and both output ends of the dual-axis motor are fixedly connected to a second bevel gear meshing with the first bevel gear.

[0017] Compared with the prior art, the present invention provides a quick clamping mechanism for a semiconductor cleaning machine, which has the following beneficial effects:

[0018] The present invention can clamp and fix semiconductor boards of different sizes through the coordinated use of the telescopic mechanism and the clamping mechanism, spray the cleaning liquid through the moving mechanism and the nozzle mechanism, and the spraying angle is adjustable, the spraying range is wider, the surface of the semiconductor board is fully cleaned, and the cleaned water falls on the inner bottom end of the box body, and a filter plate is installed at the inner bottom end of the box body to filter the cleaned water, and the water resource can be recycled through the water pump at the left bottom end of the box body; then, the moving mechanism and the lifting mechanism are used in coordination to wipe off the water retained on the surface of the cleaned semiconductor board, which is convenient and quick and meets the needs of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 It is a structural schematic diagram of the present invention from another perspective;

[0021] Figure 3 For the present invention Figure 2 Schematic diagram of the proposed enlarged structure at A;

[0022] Figure 4 It is a structural schematic diagram of the telescopic mechanism in the present invention;

[0023] Figure 5 It is a structural schematic diagram of the clamping mechanism in the present invention;

[0024] Figure 6 It is a partial structural schematic diagram of the clamping mechanism in the present invention;

[0025] Figure 7 It is a structural schematic diagram of the lifting mechanism in the present invention;

[0026] Figure 8 For the present invention Figure 7 Schematic diagram of the proposed enlarged structure at B;

[0027] Fig. 9 For the present invention Figure 7 Schematic diagram of the proposed enlarged structure at C;

[0028] Fig.10 It is a schematic diagram of the internal structure of the frame in the present invention;

[0029] Fig.11 It is a structural schematic diagram of the nozzle mechanism in the present invention.

[0030] The numbers in the figure are:

[0031] 1. Box body; 101. Support plate; 102. Connecting seat; 103. Sealing door; 104. Frame; 105. Movable plate; 106. First cylinder; 107. Second cylinder; 108. Third cylinder; 109. Fourth cylinder; 110. Cleaning plate;

[0032] 2. telescopic mechanism; 201. fixed plate; 202. bearing; 203. end gear; 204. fixed seat; 205. rotating rod; 206. transmission gear; 207. first connecting arm; 208. second connecting arm; 209. transmission motor;

[0033] 3. Clamping mechanism; 301. First fixed block; 302. Guide rod; 303. Connecting plate; 304. Second fixed block; 305. First threaded rod; 306. Movable plate; 307. Stepping motor; 308. Transmission plate; 309. First clamping plate; 310. Rotating plate; 311. Connecting rod; 312. Mounting seat; 313. Electric push rod; 314. Second clamping plate; 315. Rubber disk;

[0034] 4. Lifting mechanism; 401. servo motor; 402. first threaded rod; 403. horizontal plate; 404. first rotating arm; 405. second rotating arm; 406. lifting member; 407. third rotating arm; 408. fourth rotating arm; 409. telescopic member; 410. limiting groove; 411. limiting rod;

[0035] 5. Nozzle mechanism; 501. first stepping motor; 502. first support frame; 503. rotating shaft; 504. nozzle; 505. connecting rod; 506. second support frame; 507. second stepping motor;

[0036] 6. Moving mechanism; 601. Second threaded rod; 602. First bevel gear; 603. Dual-axis motor; 604. Second bevel gear. DETAILED DESCRIPTION

[0037] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0038] Example 1

[0039] Please refer to Figure 1-11As shown, a quick clamping mechanism for a semiconductor cleaning machine includes a box body 1, support plates 101 are fixedly installed on both sides of the interior of the box body 1, and the sides of the support plates 101 on both sides that are close to each other are fixedly connected to a connecting seat 102 through a telescopic mechanism 2, and a clamping mechanism 3 is arranged on the outer side of the connecting seat 102, the inner top of the box body 1 is connected to a frame body 104 and a movable plate 105 through a moving mechanism 6, and a nozzle mechanism 5 is arranged inside the frame body 104, a first cylinder member 106 is fixedly installed inside the movable plate 105, a second cylinder member 107 is slidably connected inside the first cylinder member 106, a third cylinder member 108 is slidably connected inside the second cylinder member 107, and a fourth cylinder member 109 is slidably connected inside the third cylinder member 108, the first cylinder member 106, the second cylinder member 107, the third cylinder member 108 and the fourth cylinder member 109 are connected by a lifting mechanism 4, and a cleaning plate 110 is fixedly installed on the bottom end of the fourth cylinder member 109.

[0040] In this solution, the staff opens the sealed door 103, and through the coordinated use of the telescopic mechanism 2 and the clamping mechanism 3, the semiconductor boards of different sizes can be clamped and fixed, and the cleaning liquid is sprayed by the moving mechanism 6 and the nozzle mechanism 5, and the spraying angle is adjustable, the spraying range is wider, and the surface of the semiconductor board is fully cleaned, and the cleaned water falls on the inner bottom end of the box body 1. A filter plate is installed at the inner bottom end of the box body 1 to filter the cleaned water, and the water pump at the left bottom end of the box body 1 can realize the recycling of water resources; then, through the coordinated use of the moving mechanism 6 and the lifting mechanism 4, the water remaining on the surface of the cleaned semiconductor board is wiped off, which is convenient and quick, and meets the needs of the staff.

[0041] Example 2

[0042] Please refer to Figure 4 As shown, the telescopic mechanism 2 includes a fixed plate 201, which is fixedly installed on the inner side of the support plate 101. The circumferential surface of the fixed plate 201 is rotatably connected to the end gear 203 through a bearing 202, and four groups of fixed seats 204 are fixedly connected to the fixed plate 201. The interior of the fixed seat 204 is rotatably connected to a rotating rod 205, one end of the rotating rod 205 is fixedly connected to a transmission gear 206 meshing with the end gear 203, and the other end of the rotating rod 205 is fixedly connected to a first connecting arm 207, and one end of the first connecting arm 207 away from the rotating rod 205 is rotatably connected to the second connecting arm 208, and one end of the second connecting arm 208 away from the first connecting arm 207 is rotatably connected to the outer side of the connecting seat 102.

[0043] Please refer to Figure 4As shown, a motor mounting plate is also fixedly connected to the inner side of the support plate 101 , and a transmission motor 209 is fixedly mounted on the motor mounting plate. The output end of the transmission motor 209 passes through the side of the motor mounting plate and is fixedly connected to the outer middle part of one of the transmission gears 206 .

[0044] In this solution, the principle of the telescopic mechanism 2 is as follows: the output end of the transmission motor 209 drives the transmission gear 206 connected thereto to rotate, so that the end face gear 203 and the other three groups of transmission gears 206 rotate synchronously, thereby driving the first connecting arm 207 to rotate, driving the second connecting arm 208 to rotate, so that the connecting seats 209 on both sides are close to each other, and the spacing of the clamping mechanism 3 can be adjusted according to the length of the semiconductor board.

[0045] Example 3

[0046] Please refer to Figure 5 As shown, the clamping mechanism 3 includes a first fixed block 301, a first threaded rod 305 and a movable plate 306, two groups of first fixed blocks 301 are fixedly connected at upper and lower symmetrical positions on the outer side of the connecting seat 102, and the interiors of the two groups of first fixed blocks 301 are fixedly connected to the guide rod 302, both ends of the guide rod 302 are welded with connecting plates 303, a rotating plate 310 is rotatably connected to the middle part of the outer side of the connecting seat 102, and a transmission plate 308 and a movable plate 306 are slidably connected to the two ends of the outer surface of the guide rod 302 respectively, and connecting rods 311 are rotatably connected to the two ends of the rotating plate 310, and the ends of the two groups of connecting rods 311 away from the rotating plate 310 are rotatably connected to the outer surfaces of the transmission plate 308 and the movable plate 306 respectively, and the outer sides of the transmission plate 308 and the movable plate 306 are fixedly connected to the first clamping plate 309 through connecting pieces.

[0047] Please refer to Figure 5 As shown, a second fixed block 304 is also fixedly connected to the outer side of the connecting seat 102, a first threaded rod 305 is rotatably connected between the second fixed block 304 and one of the connecting plates 303, a movable plate 306 is threadedly connected to the surface of the first threaded rod 305, and a stepper motor 307 is fixedly installed in the middle part of the outer side of one of the connecting plates 303, and one end of the first threaded rod 305 is fixedly connected to the output end of the stepper motor 307.

[0048] Please refer to Figure 6 As shown, two sets of mounting seats 312 are fixedly installed on the sides of the two first clamping plates 309 that are close to each other, and electric push rods 313 are fixedly installed on the sides of the two sets of mounting seats 312 that are away from each other. The output ends of the electric push rods 313 pass through the outer sides of the mounting seats 312 and are fixedly connected to the second clamping plates 314. Several sets of rubber floppy disks 315 are fixedly connected to the inner sides of the two sets of second clamping plates 314.

[0049] In this scheme, the principle of the clamping mechanism 3 is as follows: when the semiconductor board is clamped longitudinally, the first threaded rod 305 is driven to rotate through the output end of the stepping motor 307, so that the movable plate 306 moves, and the rotating plate 310 and the two sets of connecting rods 311 are driven to rotate synchronously, driving the movable plate 306 and the transmission plate 308 to approach or move away from each other, and driving the first clamping plates 309 on both sides to approach or move away from each other, and when approaching, the semiconductor board can be clamped longitudinally, and when moving away, the clamping is released; when the semiconductor board is clamped longitudinally, the two second clamping plates 314 are driven to approach each other through the output ends of the electric push rods 313 on the upper and lower sides, and the rubber soft disk 3204 squeezes the upper and lower surfaces of the semiconductor board to achieve clamping of the upper and lower surfaces of the semiconductor board, and the rubber soft disk 315 increases the friction force, improves the clamping effect, thereby achieving double clamping of the semiconductor board, and the fixing effect is good.

[0050] Example 4

[0051] Please refer to Figure 7 and Figure 8 As shown, the lifting mechanism 4 includes a servo motor 401, which is fixedly mounted on the inner wall of the first cylinder 106. The inner wall of the first cylinder 106 is also fixedly connected to a horizontal plate 403. One end of the first threaded rod 402 is fixedly connected to the output end of the first servo motor 401, and the other end of the first threaded rod 402 is rotatably connected to the inside of the horizontal plate 403. The lifting member 406 is threadedly connected to the outer surface of the first threaded rod 402. The inner wall of the first cylinder 106 is also fixedly connected to a first fixed shaft. The outer surface of the first fixed shaft is rotatably connected to a first rotating arm 404 and a second rotating arm 405. The inner wall of the fourth cylinder 109 is fixedly connected to a second fixed shaft. The outer surface of the second fixed shaft is rotatably connected to a third rotating arm 407 and a fourth rotating arm 408. Two ends of one side of the telescopic member 409 are rotatably connected to the first rotating arm 404 and the second rotating arm 405 respectively, and two ends of the other side of the telescopic member 409 are rotatably connected to the third rotating arm 407 and the fourth rotating arm 408 respectively. The lifting member 406 is connected to the telescopic member 409.

[0052] Please refer to Fig. 9 As shown, the second cylinder 107 and the third cylinder 108 are both provided with a limiting groove 410 , and the telescopic member 409 is provided with a limiting rod 411 , and the limiting rod 411 is slidably connected to the inside of the limiting groove 410 .

[0053] In this scheme, the principle of the lifting mechanism 4 is as follows: the first threaded rod 402 is driven to rotate through the output end of the first servo motor 401, so that the lifting member 406 moves downward, and the telescopic member 409 is in an extended state, driving the second cylinder member 413, the third cylinder member 414 and the fourth cylinder member 415 to slide downward, thereby driving the cleaning plate 110 to move downward; and when the lifting member 406 moves upward, the telescopic member 409 is in a retracted state, driving the second cylinder member 413, the third cylinder member 414 and the fourth cylinder member 415 to slide upward, thereby driving the cleaning plate 110 to move upward.

[0054] Example 5

[0055] Please refer to Fig.10 and Fig.11 As shown, the nozzle mechanism 5 includes a first stepper motor 501 and a second stepper motor 507, and the first stepper motor 501 and the second stepper motor 507 are respectively fixedly installed on the right side and the back of the frame 104, and the output end of the first stepper motor 501 extends to the inside of the frame 105 and is fixedly connected to the first support frame 502, and the inside of the first support frame 502 is rotatably connected with a rotating shaft 505 on both sides, and the ends of the two sets of rotating shafts 505 close to each other are fixedly connected to the nozzle 504, and a connecting rod 505 is installed on the left side of the nozzle 504, and the connecting rod 505 is rotatably connected to the inside of the second support frame 506, and the second support frame 506 is fixedly connected to the output end of the second stepper motor 507.

[0056] In this scheme, the principle of the nozzle mechanism 5 is as follows: under the action of the output end of the first stepper motor 301, the first support frame 302, the two sets of rotating shafts 303 and the nozzle 304 rotate as a whole, changing the spraying angle of the nozzle 304 on the front and rear sides; and the second support frame 306 is driven to rotate by the output end of the second stepper motor 307, and then the second support frame 306, the connecting rod 305 and the two sets of rotating shafts 303 rotate as a whole, changing the spraying angle of the nozzle 304 on the left and right sides.

[0057] Example 6

[0058] Please refer to Figure 2 As shown, the moving mechanism 6 includes a second threaded rod 601, which is provided with two groups and is rotatably connected to the inner sides of the box body 1 respectively, the frame body 104 and the movable plate 105 are both threadedly connected to the outer surface of the second threaded rod 601, and one end of the second threaded rod 601 extends to the outside of the box body 1 and is fixedly connected to the first bevel gear 602, and a dual-axis motor 603 is fixedly installed on the top right side of the box body 1, and both output ends of the dual-axis motor 603 are fixedly connected to the second bevel gear 604 meshing with the first bevel gear 602.

[0059] In this solution, the principle of the moving mechanism 6 is as follows: the two output ends of the dual-axis motor 603 synchronously drive the two sets of second bevel gears 604 to rotate, and then the first bevel gear 602 and the second threaded rod 601 rotate as a whole, thereby realizing the reciprocating motion of the frame 104 and the movable plate 105 in the horizontal direction.

[0060] The working principle and use process of this device are as follows: the staff opens the sealing door 103, and through the coordinated use of the telescopic mechanism 2 and the clamping mechanism 3, the semiconductor boards of different sizes can be clamped and fixed, and the cleaning liquid is sprayed through the moving mechanism 6 and the nozzle mechanism 5, and the spraying angle is adjustable, the spraying range is wider, and the surface of the semiconductor board is fully cleaned, and the cleaned water falls on the inner bottom end of the box body 1. A filter plate is installed at the inner bottom end of the box body 1 to filter the cleaned water, and the water pump at the left bottom end of the box body 1 can realize the recycling of water resources; then, through the coordinated use of the moving mechanism 6 and the lifting mechanism 4, the water remaining on the surface of the cleaned semiconductor board is wiped off, which is convenient and quick and meets the needs of the staff.

[0061] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A quick clamping mechanism for a semiconductor cleaning machine, characterized in that: The invention comprises a box body (1), wherein support plates (101) are fixedly installed on both sides of the box body (1), and the sides of the support plates (101) on both sides that are close to each other are fixedly connected to a connecting seat (102) through a telescopic mechanism (2), and a clamping mechanism (3) is arranged on the outside of the connecting seat (102), and the top of the box body (1) is connected to a frame body (104) and a movable plate (105) through a moving mechanism (6), and a nozzle mechanism (5) is arranged inside the frame body (104), and the movable plate (105) is fixedly installed inside. A first cylinder (106) is provided, wherein the first cylinder (106) is internally slidably connected to a second cylinder (107), the second cylinder (107) is internally slidably connected to a third cylinder (108), and the third cylinder (108) is internally slidably connected to a fourth cylinder (109). The first cylinder (106), the second cylinder (107), the third cylinder (108) and the fourth cylinder (109) are connected via a lifting mechanism (4), and a cleaning plate (110) is fixedly mounted on the bottom end of the fourth cylinder (109).

2. A quick clamping mechanism for a semiconductor cleaning machine according to claim 1, characterized in that: The telescopic mechanism (2) comprises a fixed plate (201), wherein the fixed plate (201) is fixedly mounted on the inner side of the support plate (101), the peripheral surface of the fixed plate (201) is rotatably connected to an end face gear (203) via a bearing (202), and four groups of fixed seats (204) are fixedly connected to the fixed plate (201), the interior of the fixed seat (204) is rotatably connected to a rotating rod (205), one end of the rotating rod (205) is fixedly connected to a transmission gear (206) meshing with the end face gear (203), and the other end of the rotating rod (205) is fixedly connected to a first connecting arm (207), one end of the first connecting arm (207) away from the rotating rod (205) is rotatably connected to a second connecting arm (208), and one end of the second connecting arm (208) away from the first connecting arm (207) is rotatably connected to the outer side of the connecting seat (102).

3. A quick clamping mechanism for a semiconductor cleaning machine according to claim 2, characterized in that: The inner side of the support plate (101) is also fixedly connected to a motor mounting plate, on which a transmission motor (209) is fixedly mounted, and an output end of the transmission motor (209) passes through the side of the motor mounting plate and is fixedly connected to the outer middle part of one of the transmission gears (206).

4. A quick clamping mechanism for a semiconductor cleaning machine according to claim 2, characterized in that: The clamping mechanism (3) comprises a first fixed block (301), a first threaded rod (305) and a movable plate (306); two groups of first fixed blocks (301) are fixedly connected at upper and lower symmetrical positions on the outer side of the connecting seat (102); the interiors of the two groups of first fixed blocks (301) are fixedly connected to the guide rod (302); both ends of the guide rod (302) are welded with a connecting plate (303); and a rotating plate (310) is rotatably connected to the middle part of the outer side of the connecting seat (102). The two ends of the outer surface of the guide rod (302) are respectively slidably connected to a transmission plate (308) and a movable plate (306), and the two ends of the rotating plate (310) are both rotatably connected to connecting rods (311), and the ends of the two groups of connecting rods (311) away from the rotating plate (310) are respectively rotatably connected to the outer surfaces of the transmission plate (308) and the movable plate (306), and the outer sides of the transmission plate (308) and the movable plate (306) are fixedly connected to the first clamping plate (309) through connecting pieces.

5. A quick clamping mechanism for a semiconductor cleaning machine according to claim 4, characterized in that: A second fixed block (304) is also fixedly connected to the outer side of the connecting seat (102); a first threaded rod (305) is rotatably connected between the second fixed block (304) and one of the connecting plates (303); the movable plate (306) is threadedly connected to the surface of the first threaded rod (305); a stepper motor (307) is fixedly installed in the middle part of the outer side of one of the connecting plates (303); and one end of the first threaded rod (305) is fixedly connected to the output end of the stepper motor (307).

6. A quick clamping mechanism for a semiconductor cleaning machine according to claim 4, characterized in that: Two groups of mounting seats (312) are fixedly installed on the sides of the two first clamping plates (309) that are close to each other, and electric push rods (313) are fixedly installed on the sides of the two groups of mounting seats (312) that are away from each other, and the output ends of the electric push rods (313) pass through the outer sides of the mounting seats (312) and are fixedly connected to the second clamping plates (314), and a plurality of groups of rubber soft disks (315) are fixedly connected to the inner sides of the two groups of the second clamping plates (314).

7. A quick clamping mechanism for a semiconductor cleaning machine according to claim 1, characterized in that: The lifting mechanism (4) comprises a servo motor (401), the servo motor (401) is fixedly mounted on the inner wall of the first cylinder (106), the inner wall of the first cylinder (106) is also fixedly connected to a transverse plate (403), one end of the first threaded rod (402) is fixedly connected to the output end of the first servo motor (401), and the other end of the first threaded rod (402) is rotatably connected to the inside of the transverse plate (403), the lifting member (406) is threadedly connected to the outer surface of the first threaded rod (402), the inner wall of the first cylinder (106) is also fixedly connected to a first fixed shaft, and the first fixed The outer surface of the fixed shaft is rotatably connected to the first rotating arm (404) and the second rotating arm (405), and the inner wall of the fourth cylinder (109) is fixedly connected to the second fixed shaft, and the outer surface of the second fixed shaft is rotatably connected to the third rotating arm (407) and the fourth rotating arm (408), and the two ends of one side of the telescopic member (409) are rotatably connected to the first rotating arm (404) and the second rotating arm (405), and the two ends of the other side of the telescopic member (409) are rotatably connected to the third rotating arm (407) and the fourth rotating arm (408), and the lifting member (406) is connected to the telescopic member (409).

8. A quick clamping mechanism for a semiconductor cleaning machine according to claim 7, characterized in that: The second cylinder member (107) and the third cylinder member (108) are both provided with a limiting groove (410), the telescopic member (409) is provided with a limiting rod (411), and the limiting rod (411) is slidably connected to the inside of the limiting groove (410).

9. The quick clamping mechanism for a semiconductor cleaning machine according to claim 1, characterized in that: The nozzle mechanism (5) comprises a first stepper motor (501) and a second stepper motor (507), wherein the first stepper motor (501) and the second stepper motor (507) are respectively fixedly mounted on the right side and the back of the frame (104), wherein the output end of the first stepper motor (501) extends to the interior of the frame (105) and is fixedly connected to the first support frame (502), wherein both sides of the interior of the first support frame (502) are rotatably connected with rotating shafts (505), and the ends of the two groups of rotating shafts (505) close to each other are fixedly connected to the nozzle (504), and a connecting rod (505) is mounted on the left side of the nozzle (504), wherein the connecting rod (505) is rotatably connected to the interior of the second support frame (506), and the second support frame (506) is fixedly connected to the output end of the second stepper motor (507).

10. The quick clamping mechanism for a semiconductor cleaning machine according to claim 1, characterized in that: The moving mechanism (6) comprises a second threaded rod (601), wherein the second threaded rod (601) is provided with two groups and is rotatably connected to the inner sides of the box body (1), respectively; the frame body (104) and the movable plate (105) are both threadedly connected to the outer surface of the second threaded rod (601), and one end of the second threaded rod (601) extends to the outside of the box body (1) and is fixedly connected to the first bevel gear (602); a double-axis motor (603) is fixedly installed at the top right side of the box body (1), and both output ends of the double-axis motor (603) are fixedly connected to a second bevel gear (604) meshing with the first bevel gear (602).

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