Double-sided chip packaging structure and packaging method

Abstract

The invention relates to the technical field of chip packaging, in particular to a double-sided chip packaging structure and a packaging method. Comprising a substrate, bonding pads are arranged at the upper end and the lower end of the substrate respectively, a packaging plate is arranged on the outer sides of the bonding pads, a chip is arranged on the outer side of the packaging plate, a hot welding mechanism is arranged on the outer side of the chip, a heat conduction groove matched with the hot welding mechanism is formed in the side face of the packaging plate, a plurality of packaging holes are formed in the packaging plate, and tin blocks are arranged in the packaging holes. A plurality of clamping grooves are formed in the side, close to the bonding pad, of the packaging plate, and the packaging plate is connected with the bonding pad through the clamping grooves. Compared with the prior art, the packaging board has the following beneficial effects that the pins of the chip and the bonding pads on the substrate are rapidly connected in a tin soldering manner through the solid tin blocks in the packaging board in cooperation with the hot welding blocks, and when the hot welding blocks move in the heat conduction grooves in a reciprocating manner for heating, the hot welding blocks rapidly perform hot melting on the tin blocks, so that the chip can be rapidly connected; therefore, hot melting of the tin block is facilitated to connect the pin and the bonding pad, and the tin soldering connection efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, in particular to a double-sided chip packaging structure and a packaging method. Background Art

[0002] Chip packaging is the process of laying out, pasting, fixing and connecting the chip on the frame, leading out the wiring terminals and fixing them with plastic insulating medium to form an overall three-dimensional structure. This process not only protects the chip from damage from the external environment, but also enables the chip to be easily connected with other electronic components to form a complete circuit system.

[0003] However, in the double-sided substrate packaging process, when packaging chips on both sides of the substrate, it is necessary to first package the chip on one side of the substrate, and then flip the substrate to package the chip on the other side, which results in low efficiency in double-sided chip packaging of the substrate. In addition, when packaging the chip, it is necessary to align the chip with the substrate first, and align the chip pins with the substrate pads. When welding, it is necessary to use a tin bar to weld each pin and pad in turn, which results in welding the pins and pads in turn, resulting in low welding efficiency. Summary of the invention

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a double-sided chip packaging structure and a packaging method, and solves the problem of low double-sided chip welding efficiency in the prior art.

[0005] To achieve the above purpose, a double-sided chip packaging structure is designed, including a substrate, wherein solder pads are respectively arranged at the upper and lower ends of the substrate, a packaging board is arranged on the outer side of the solder pad, a chip is arranged on the outer side of the packaging board, a heat welding mechanism is arranged on the outer side of the chip, a heat conduction groove matched with the heat welding mechanism is arranged on the side of the packaging board, a plurality of packaging holes are arranged on the packaging board, tin blocks are arranged in the packaging holes, a plurality of snap-fit ​​grooves are arranged on the side of the packaging board close to the solder pad, and the pins of the chip abut the solder pad after passing through the packaging holes and the snap-fit ​​grooves, the heat welding mechanism heats the heat conduction groove to melt the tin block, and the tin block after cooling fixes the solder pad and the pins.

[0006] The hot welding mechanism includes a receiving frame, a picking frame, and a hot welding block. One end of the receiving frame is connected to the mechanical arm, and the inner side walls of the receiving frame are slidably connected to a plurality of telescopic frames. Each telescopic frame is slidably connected to a connecting frame. The inner side of one end of the connecting frame close to the substrate is connected to the hot welding block, and the picking frame is connected to the middle part of the end of the receiving frame close to the substrate.

[0007] The structure of the receiving frame is a rectangular frame structure, and the structure of the connecting frame is an L-shaped structure.

[0008] A plurality of limiting guide bars are evenly arranged in the packaging hole.

[0009] The engaging groove is located at the bottom of the packaging hole and is communicated with the packaging hole.

[0010] A side of the packaging board close to the pad is connected to a limiting convex plate, and a surface of the base plate close to the pad is provided with a limiting groove matched with the limiting convex plate.

[0011] A sealing groove is formed between the central cavity of the limiting convex plate, the outer edge of the limiting convex plate and the inner wall of the packaging plate.

[0012] A sealing groove is provided on one side of the packaging board close to the pad, and a sealing strip matching the sealing groove is provided on the surface of the substrate close to the pad.

[0013] To achieve the above purpose, a double-sided chip packaging method is designed, comprising the following steps: S1: Clean the substrate, chip and packaging plate, and fix the packaging plate on both sides of the outer wall of the substrate; S2: Clamp the substrate by a clamping fixture to keep the substrate in a horizontal state; S3: placing the horizontally clamped substrate between two robotic arms for stable placement; S4: The chips and packaging boards are adsorbed and picked up respectively through the picking racks on both sides of the substrate; S5: By moving and adjusting the robotic arm, the chips picked up by the picking rack are respectively clamped on the packaging plates on both sides of the substrate; S6: Move and adjust the telescopic frame to fit the hot solder block into the heat conduction groove on the side wall of the packaging board. After the hot solder block is well fitted, heat the hot solder block to melt the tin block in the packaging hole through heat transfer. S7: The hot soldering block is moved back and forth in the telescopic frame, and the hot soldering block continues to generate heat, so that the solder blocks in the plurality of packaging holes are heated and melted; S8: After the chip packaging is completed, the hot solder block withdraws, waits for cooling, and finally collects and processes.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. During the production and processing of the substrate, the package board is fixed and sealed on both sides of the substrate, so that the solid tin block in the package board can be used to quickly connect the pins of the chip with the pads on the substrate by soldering with the hot solder block, thereby improving the efficiency of double-sided packaging of the substrate.

[0015] 2. A number of packaging holes are opened on the packaging board, and solid tin blocks are fixedly connected in the packaging holes. When the hot solder block moves back and forth in the heat conduction groove for heating, the hot solder block quickly melts multiple tin blocks, thereby facilitating the hot melting of the tin block to connect the pins and the pads, thereby improving the efficiency of soldering connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The structure of the present invention is schematically shown Figure 1 .

[0017] Figure 2 The structure of the present invention is schematically shown Figure 2 .

[0018] Figure 3 It is a structural schematic diagram of the heat welding mechanism of the present invention.

[0019] Figure 4 It is a schematic diagram of the structure of the chip packaging of the present invention.

[0020] Figure 5 It is a schematic diagram of the structure of the chip after packaging of the present invention.

[0021] Figure 6 It is a schematic diagram of the structure of the chip of the present invention.

[0022] Figure 7 It is a schematic structural diagram of the packaging board of the present invention.

[0023] Figure 8 for Figure 7 A partial enlarged view of point A in the middle.

[0024] Fig. 9 It is a schematic diagram of the structure of the packaging board of the present invention near the pad.

[0025] Fig.10 It is a schematic diagram of the structure of the pad of the present invention. DETAILED DESCRIPTION

[0026] The present invention will be further described below with reference to the accompanying drawings.

[0027] like Figures 1 to 10 As shown, pads 2 are provided at the upper and lower ends of the substrate 1, a packaging board 3 is provided on the outside of the pad 2, a chip 4 is provided on the outside of the packaging board 3, a heat welding mechanism 5 is provided on the outside of the chip 4, a heat conduction groove 3-1 matched with the heat welding mechanism 5 is provided on the side of the packaging board 3, a plurality of packaging holes 3-2 are provided on the packaging board 3, a tin block 3-3 is provided in the packaging hole 3-2, a plurality of snap-fit ​​grooves 3-4 are provided on the side of the packaging board 3 close to the pad 2, and the pin 4-1 of the chip 4 abuts the pad 2 after passing through the packaging hole 3-2 and the snap-fit ​​groove 3-4, the heat welding mechanism 5 heats the heat conduction groove 3-1 to melt the tin block 3-3, and the cooled tin block 3-3 fixes the pad 2 and the pin 4-1.

[0028] The hot welding mechanism 5 includes a receiving frame 5-1, a picking frame 5-2, and a hot welding block 5-3. One end of the receiving frame 5-1 is connected to the mechanical arm 5-4. The inner side walls of the receiving frame 5-1 are slidably connected to a plurality of telescopic frames 5-5. Each telescopic frame 5-5 is slidably connected to a connecting frame 5-6. The inner side of one end of the connecting frame 5-6 close to the substrate 1 is connected to the hot welding block 5-3, and the middle part of the end of the receiving frame 5-1 close to the substrate 1 is connected to the picking frame 5-2.

[0029] During specific use, the heat welding mechanism is movably arranged on both sides of the substrate 1 for welding and packaging.

[0030] The receiving frame 5-1 has a rectangular frame structure, and each of the four sides of the rectangular frame is provided with a sliding connection with a telescopic frame 5-5, and the telescopic frame 5-5 can be slid and telescoped on the inner wall of the receiving frame 2. The connecting frame 5-6 has an L-shaped structure, and the L-shaped bend is inserted into the telescopic frame 5-5. The connecting frame 5-6 can be slid and adjusted in the telescopic frame 5-5, thereby driving the hot solder block 5-3 to move back and forth along the heat conduction groove 3-1. The picking frame 5-2 is used to pick up and adsorb the chip 4. When it is used for packaging, the picking frame 4 adsorbs and picks up the chip 4, and the chip 4 is placed on both sides of the substrate 1 for packaging processing.

[0031] When used specifically, the heat soldering block 5-3 can be heated for soldering. When the heat soldering block 5-3 slides back and forth in the heat conducting groove 3-1, the heat soldering block 5-3 heats the heat conducting groove 3-1, and transmits the heat of the heat soldering block 5-3 to the packaging hole 3-2, and heats the tin block 3-3 in the packaging hole 3-2, so that the tin block 3-3 melts, and after the tin block 3-3 cools down, the pad 2 and the pin 4-1 are fixedly connected, thereby improving the efficiency of the pin 4-1 packaging and the stability of the packaging connection.

[0032] The widths between several heat soldering blocks 5-3 can be adjusted through the telescopic frame 5-5, and the heat soldering blocks 5-3 can be slid back and forth through the connecting frame 5-6, so that the heat soldering blocks 5-3 are suitable for heating and soldering chips 4 of various sizes.

[0033] A plurality of limiting guide bars 3-5 are evenly arranged in the packaging hole 3-2. The limiting guide bars 3-5 can limit the pin 4-1 so that after the pin 4-1 is engaged in the packaging hole 3-2, it can be limited by the limiting guide bars 3-5 to prevent the pin 4-1 from shaking, thereby preventing the chip 4 from shifting after installation.

[0034] The snap-fit ​​groove 3-4 is located at the bottom of the packaging hole 3-2 and is connected to the packaging hole 3-2. When the packaging board 3 is fixedly connected to both sides of the outer wall of the substrate 1, the pad 2 can be snap-fitted into the snap-fit ​​groove 3-4 and connected to the packaging hole 3-2 in the packaging board 3, so that the pin 4-1 can be snap-fitted into the packaging hole 3-2 and can be quickly connected to the pad 2.

[0035] The side of the packaging board 3 close to the pad 2 is connected to the limiting convex plate 3-6, and the surface of the substrate 1 close to the pad 2 is provided with a limiting groove 2-1 that matches the limiting convex plate 3-6. The limiting groove 2-1 and the limiting convex plate 3-6 can be engaged with each other, so that the packaging board 3 is quickly engaged and connected to the side wall of the substrate 1, which is convenient for improving the installation efficiency of the packaging board 3.

[0036] A sealing groove 3 - 7 is formed between the central cavity of the limiting protrusion 3 - 6 , the outer edge of the limiting protrusion 3 - 6 and the inner wall of the packaging plate 3 .

[0037] A sealing groove 3-7 is provided on one side of the packaging board 3 close to the pad 2, and a sealing strip 2-2 matching the sealing groove 3-7 is provided on the surface of the substrate 1 close to the pad 2. The sealing groove 3-7 matches the sealing strip 2-2, so that when the packaging board 3 is fixedly connected to both sides of the outer wall of the substrate 1, the sealing groove 3-7 and the sealing strip 2-2 are mutually engaged and connected, and a sealing and fixed connection is performed, so as to prevent the tin block 3-3 in the packaging hole 3-2 from leaking after hot melting.

[0038] The packaging method of the double-sided chip packaging structure comprises the following steps: S1: Clean the substrate 1, chip 4 and packaging board 3, and fix the packaging board 3 on both sides of the outer wall of the substrate 1; this facilitates dust-free packaging of the chip 4 and prevents dust and other debris from affecting the effect of the chip 4 after packaging. The installation methods of the packaging board 3 and the substrate 1 include but are not limited to welding and screw fixing.

[0039] S2: Clamp the substrate 1 by a clamping fixture to keep the substrate 1 in a horizontal state; thereby facilitating the two receiving frames 5 - 1 to be located at the upper and lower sides of the substrate 1 respectively, so as to install and use the chip 4 .

[0040] S3: placing the horizontally clamped substrate 1 between the two robot arms 5 - 4 to stably place it; preventing the substrate 1 from flipping over and causing packaging failure when packaging the chip 4 .

[0041] S4: The chip 4 and the packaging board 3 are adsorbed and picked up respectively through the picking racks 5-2 on both sides of the substrate 1; dust is prevented from contaminating the chip 4 when the chip 4 is picked up manually, and the efficiency of picking up the chip 4 and the subsequent docking and installation can be improved by picking up the chip 4 through the picking racks 5-2.

[0042] S5: By moving and adjusting the robot arm 1, the chip 4 adsorbed and picked up by the picking rack 5-2 is respectively engaged with the packaging plates 3 on both sides of the substrate 1 for position limiting engagement and fixing.

[0043] S6: Move and adjust the telescopic frame 5-5 to fit the heat soldering block 5-3 into the heat conducting groove 3-1 on the side wall of the packaging board 3. After the heat soldering block 5-3 is well fitted, heat the heat soldering block 5-3 to melt the tin block 3-3 in the packaging hole 3-2 through heat transfer.

[0044] S7: The hot solder block 5-3 is moved back and forth in the telescopic frame 5-5, and the hot solder block 5-3 is continuously heated, so that the tin blocks 3-3 in the several packaging holes 3-2 are heated and melted; the reciprocating hot solder block 5-3 can evenly transfer the heat to the tin block 3-3 in each packaging hole 3-2 through the heat conduction groove 3-1, so that the several tin blocks 3-3 are melted to perform soldering connection on the pin 4-1 and the pad 2.

[0045] S8: After the chip 4 is packaged, the hot solder block 5-3 is withdrawn and waits for cooling to prevent the solder block 3-3 from not being cooled and fixed, which may cause an unstable connection between the pin 4-1 and the pad 2, and finally the collection process is performed.

Claims

1. A double-sided chip packaging structure, comprising a substrate, characterized in that: The substrate (1) is provided with solder pads (2) at the upper and lower ends respectively, a packaging board (3) is provided on the outside of the solder pad (2), a chip (4) is provided on the outside of the packaging board (3), a heat welding mechanism (5) is provided on the outside of the chip (4), a heat conduction groove (3-1) matched with the heat welding mechanism (5) is provided on the side of the packaging board (3), a plurality of packaging holes (3-2) are provided on the packaging board (3), a tin block (3-3) is provided in the packaging hole (3-2), a plurality of snap-fit ​​grooves (3-4) are provided on the side of the packaging board (3) close to the solder pad (2), and the pins (4-1) of the chip (4) are connected to the solder pad (2) through the snap-fit ​​grooves (3-4), the pins (4-1) of the chip (4) pass through the packaging holes (3-2) and the snap-fit ​​grooves (3-4) and then abut against the solder pad (2), the heat welding mechanism (5) heats the heat conduction groove (3-1) to melt the tin block (3-3), and the cooled tin block (3-3) fixes and connects the solder pad (2) and the pins (4-1).

2. The double-sided chip packaging structure according to claim 1, characterized in that: The hot welding mechanism (5) comprises a receiving frame (5-1), a taking frame (5-2), and a hot welding block (5-3); one end of the receiving frame (5-1) is connected to a mechanical arm (5-4); the inner side wall of the receiving frame (5-1) is slidably connected to a plurality of telescopic frames (5-5); each telescopic frame (5-5) is slidably connected to a connecting frame (5-6); the inner side of one end of the connecting frame (5-6) close to the base plate (1) is connected to the hot welding block (5-3); and the middle part of one end of the receiving frame (5-1) close to the base plate (1) is connected to the taking frame (5-2).

3. The double-sided chip packaging structure according to claim 2, characterized in that: The structure of the receiving frame (5-1) is a rectangular frame structure, and the structure of the connecting frame (5-6) is an L-shaped structure.

4. The double-sided chip packaging structure according to claim 1, characterized in that: A plurality of limiting guide bars (3-5) are evenly arranged in the packaging hole (3-2).

5. The double-sided chip packaging structure according to claim 1, characterized in that: The engaging groove (3-4) is located at the bottom of the packaging hole (3-2) and is connected to the packaging hole (3-2).

6. The double-sided chip packaging structure according to claim 1, characterized in that: The side of the packaging plate (3) close to the pad (2) is connected to a limiting convex plate (3-6), and the surface of the base plate (1) close to the pad (2) is provided with a limiting groove (2-1) matching the limiting convex plate (3-6).

7. The double-sided chip packaging structure according to claim 1, characterized in that: A sealing groove (3-7) is formed between the central cavity of the limiting convex plate (3-6), the outer edge of the limiting convex plate (3-6) and the inner wall of the packaging plate (3).

8. A double-sided chip packaging structure according to claim 1 or 7, characterized in that: A sealing groove (3-7) is provided on one side of the packaging plate (3) close to the pad (2), and a sealing strip (2-2) matching the sealing groove (3-7) is provided on the surface of the substrate (1) close to the pad (2).

9. A double-sided chip packaging method, characterized in that: The steps include: S1: cleaning the substrate (1), the chip (4) and the packaging plate (3), and fixing the packaging plate (3) on both sides of the outer wall of the substrate (1); S2: clamping the substrate (1) by means of a clamping fixture to keep the substrate (1) in a horizontal state; S3: placing the horizontally clamped substrate (1) between two robotic arms (5-4) for stable placement; S4: using the pick-up racks (5-2) on both sides of the substrate (1), respectively adsorbing and picking up the chip (4) and the packaging plate (3); S5: by moving and adjusting the mechanical arm (1), the chip (4) adsorbed and picked up by the picking rack (5-2) is respectively clamped on the packaging plates (3) on both sides of the substrate (1); S6: moving and adjusting the telescopic frame (5-5) to fit the heat soldering block (5-3) into the heat conduction groove (3-1) on the side wall of the packaging plate (3); after the heat soldering block (5-3) is fitted, heating the heat soldering block (5-3) to melt the tin block (3-3) in the packaging hole (3-2) through heat transfer; S7: causing the hot solder block (5-3) to reciprocate in the telescopic frame (5-5), and the hot solder block (5-3) to continuously generate heat, so that the tin blocks (3-3) in the plurality of packaging holes (3-2) are heated and melted; S8: After the chip (4) is packaged, the hot solder block (5-3) is withdrawn, waits for cooling, and is finally collected and processed.

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