Antenna cold plate structure with high heat conduction capability

By setting up a heat dissipation flow path in the antenna cold plate cavity and using a series and parallel flow channel structure, the problem of insufficient thermal conductivity of the existing cold plate is solved, and the effect of efficient heat dissipation and low flow resistance is achieved. It is suitable for machines with high heat flow density Radar antenna.

CN119253228APending Publication Date: 2025-01-03LEIHUA ELECTRONICS TECH RES INST AVIATION IND OF CHINA
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Patent Information

Application Number
CN202411370469.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-29
Publication Date
2025-01-03

AI Technical Summary

Technical Problem

The thermal conductivity of existing antenna cold plates is insufficient and cannot meet the new requirements of high-power airborne radar for the design of cooling cold plates. As the cold flow increases, the system flow resistance also increases, resulting in an increase in the demand for system pressure resources.

Method used

Design an antenna cold plate structure with high thermal conductivity. By setting a heat dissipation flow path in the cold plate cavity and filling it with coolant, combined with the series and parallel flow channel structure, the fin spacing and cold plate cavity thickness are optimized, and the flow resistance is reduced. Improve heat dissipation efficiency.

Benefits of technology

It significantly improves the heat dissipation capability, reduces the thickness and flow resistance of the cold plate, meets the heat dissipation needs of airborne radar antennas with high heat flow density, and ensures temperature uniformity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The antenna cold plate structure with the high heat conduction capacity is suitable for heat dissipation of a high-power active phased array radar antenna, the radar antenna comprises a TR assembly capable of generating heat and a heat dissipation cold plate of the TR assembly, the heat dissipation cold plate comprises a cold plate cavity, a first cold plate cover plate and a second cold plate cover plate, and the first cold plate cover plate and the second cold plate cover plate are installed on the two sides of the cold plate cavity. Heat dissipation flow paths are symmetrically arranged on the side faces parallel to the center line of the cold plate cavity, and cooling liquid is filled in the heat dissipation flow paths in a flowing mode so that continuous heat dissipation can be conducted on the T / R assembly installed on the first cold plate cover plate and the second cold plate cover plate, the heat dissipation requirement can be met, and the T / R assembly has the characteristic of low flow resistance.
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Description

Technical Field

[0001] The invention belongs to the technical field of heat dissipation structures, and in particular relates to an antenna cold plate structure with high thermal conductivity. Background Art

[0002] With the continuous development of electronic technology, the power of airborne radar is constantly increasing. In order to obtain the maximum power in a limited space, it is necessary to continuously increase the arrangement density of the radar antenna unit T / R components and the power of the T / R components. Based on these two requirements, it is necessary to improve the heat exchange capacity of the cold plate to meet the heat dissipation requirements of the high heat flux density T / R components, and reduce the flow resistance of the cold plate to reduce the pressure resource requirements of the system.

[0003] Generally speaking, the heat dissipation capacity of the cold plate increases with the increase of the cold mass flow rate, but as the flow rate increases, the flow resistance in the system will also increase, which requires the pump to provide more power to maintain the required flow rate. However, most of the commonly used antenna cold plate fins currently use heat conductive sheets to dissipate heat, which has poor thermal performance and cannot meet the new requirements for heat dissipation cold plate design brought about by the advancement of airborne radar technology. Summary of the invention

[0004] In view of this, the antenna cold plate structure with high thermal conductivity of the present invention meets the requirements of high-power heat dissipation of T / R components and has low flow resistance characteristics.

[0005] An antenna cold plate structure with high thermal conductivity is suitable for heat dissipation of a high-power active phased array radar antenna. The radar antenna includes a TR component capable of generating heat and a heat dissipation cold plate. The heat dissipation cold plate includes a cold plate cavity and a first cold plate cover plate and a second cold plate cover plate installed on both sides of the cold plate cavity.

[0006] A heat dissipation flow path is symmetrically arranged on the side parallel to the center line of the cold plate cavity, and the heat dissipation flow path is filled with coolant in a flowable manner to continuously dissipate heat for the T / R components installed on the first cold plate cover plate and the second cold plate cover plate.

[0007] Beneficial Effects

[0008] By combining series and parallel flow channels, the cold mass flow rate in the parallel heat dissipation area is increased, and the heat dissipation efficiency of the parallel area is improved; the fin spacing in the series area is balanced and designed, and the temperature uniformity and the flow resistance of the cold plate are comprehensively considered. The total thickness of the cold plate cavity is fully utilized, and the node with the largest local resistance loss of the cold plate is eliminated through the heat dissipation flow path. The kinetic energy of the coolant is fully utilized in the heat dissipation area of ​​the cold plate cavity, which greatly improves the overall heat dissipation capacity. It can be applied to airborne radar antenna cold plates with high heat flux density, especially products with high requirements for thickness and flow resistance. After adopting the structure of the present invention, the heat dissipation capacity can be improved while the thickness and flow resistance of the cold plate can be significantly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0010] Figure 1 It is a schematic diagram of the overall structure of the cold plate;

[0011] Figure 2 This is the front view of the cold plate cavity;

[0012] Figure 3 for Figure 2 AA section view in;

[0013] Figure 4 for Figure 2 BB section view in;

[0014] Figure 5 The front view of the first heat dissipation fin and the second heat dissipation fin is provided, wherein:

[0015] 1. First cold plate cover; 2. Cold plate cavity; 3. Second cold plate cover; 4. Liquid inlet hole; 5. First rectangular flow channel; 6. Liquid supply path; 7. First flow limiting hole; 8. Second flow limiting hole; 9. Groove; 10. First heat dissipating fin; 11. Liquid return path; 12. Series fluid cavity; 13. Second heat dissipating fin; 14. Second rectangular flow channel; 15. Liquid outlet hole. DETAILED DESCRIPTION

[0016] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0017] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0018] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0019] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present disclosure, and only show the components related to the present disclosure rather than being drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout type may also be more complicated.

[0020] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, one skilled in the art will appreciate that aspects may be practiced without these specific details.

[0021] like Figures 1 to 5 The antenna cold plate structure with high thermal conductivity shown in the figure is suitable for heat dissipation of high-power active phased array radar antenna. The radar antenna includes TR components that can generate heat and Figure 1 The heat sink shown in the figure is the main heat generating component of the radar antenna. Figure 1 , which includes a cold plate cavity 2 and a first cold plate cover plate 1 and a second cold plate cover plate 3 installed on both sides of the cold plate cavity 2. The first cold plate cover plate 1 and the second cold plate cover plate 3 are symmetrically arranged in structure, and the first cold plate cover plate 1 and the second cold plate cover plate 3 are respectively in contact with the T / R component on one side facing away from the other, and the opposite sides are installed on the cold plate cavity 2. Preferably, they are installed in a sealed manner to avoid leakage of coolant, wherein heat dissipation flow paths are symmetrically arranged on the side surfaces parallel to the center line of the cold plate cavity 2, and the heat dissipation flow paths are filled with coolant in a flowable manner to continuously dissipate heat for the T / R components installed on the first cold plate cover plate 1 and the second cold plate cover plate 3.

[0022] As a specific implementation method provided in this case, see Figure 3 , Figure 4A liquid inlet hole 4 is provided at a preset position on one side of the bottom surface of the cold plate cavity 2 (e.g., the bottom surface adjacent to one side of the cold plate cavity 2), and an external device transports coolant to the heat dissipation flow path through the liquid inlet hole 4. A liquid outlet hole 15 is provided at a preset position on the other side (the bottom surface adjacent to the other side of the cold plate cavity 2), and the external device recovers the coolant through the liquid outlet hole 15, thereby realizing that the coolant flows in the heat dissipation flow path in a circulating manner through the liquid inlet hole 4 and the liquid outlet hole 15.

[0023] As a specific implementation method provided in this case, Figure 2 As shown, the heat dissipation flow path includes a plurality of grooves 9 (e.g., the grooves 9 are arranged in an interval manner) arranged in the center line direction of the cold plate cavity 2, a liquid supply path 6 and a liquid return path 11, a step structure (the step structure includes a plurality of steps arranged continuously) and a series fluid cavity 12, wherein,

[0024] A series fluid chamber 12 is provided on the cold plate cavity 2 between the liquid outlet hole 15 and the groove 9 adjacent to the liquid outlet hole 15, the liquid supply path 6 is connected with the liquid inlet hole 4, and the liquid outlet hole 15 is connected with the liquid return path 11;

[0025] The step structure is arranged on the liquid supply path 6, and gradually narrows the flow path of the coolant along the conveying direction of the coolant, thereby adjusting the flow rate and pressure of the coolant;

[0026] Each groove 9 is connected to the liquid supply path 6 by opening a first flow limiting hole 7 at one end. The size of the first flow limiting hole 7 increases successively from the initial position, i.e., the groove 9 adjacent to the liquid inlet hole 4, to the preset position along the delivery direction of the coolant, and the size of the first flow limiting hole 7 decreases successively from the preset position to the direction of the groove 9 adjacent to the series fluid cavity 12. Preferably, the preset position is the center position of the liquid supply path 6, and can also be adjusted according to the results of the simulated flow rate, so as to achieve the consistency of the inflow and outflow of the coolant in each groove 9, thereby achieving the characteristic of high temperature uniformity.

[0027] Further, such as Figure 5 As shown, the first cooling plate cover plate 1 is provided with a first heat dissipation fin 10 and a second heat dissipation fin 13 on the side facing the corresponding groove 9, wherein the second heat dissipation fin 13 is provided on the side of the first cooling plate cover plate 1 at a position corresponding to the series fluid cavity 12 and the first heat dissipation fins 10 are arranged at intervals in the center line direction, and each first heat dissipation fin 10 corresponds to a groove 9;

[0028] The size of the second heat dissipation fin 13 is larger than that of the first heat dissipation fin 10. The external parts in contact with the first cold plate cover 1 can be cooled by the second heat dissipation fin 13 and the series fluid cavity 12. Preferably, the groove 9 is connected to the return liquid path 11 by opening a second flow limiting hole 8 at the other end, and the second flow limiting hole 8 is gradually enlarged along the flow direction of the return liquid path 11. The purpose is to cooperate with the first flow limiting hole 7 and the step structure to keep the flow in all grooves 9 consistent, thereby ensuring the consistency of the temperature of the heat dissipation component and the requirement of high heat dissipation.

[0029] In some or all of the above technical solutions, the first cold plate cover plate 1 and the second cold plate cover plate 3 are arranged in a mirror-image manner.

[0030] The coolant flows in from the liquid inlet hole 4, and the first rectangular flow channel 5 is processed in the cold plate cavity 2 by the electric spark process. The first rectangular flow channel 5 is connected with the liquid inlet hole 4. The coolant flows through the liquid inlet hole 4 and flows into the heat dissipation flow paths set on both sides of the cold plate cavity 2 through the first rectangular flow channel 5, and the coolant is evenly distributed to the liquid supply path 6 on the left and right sides. The flow rate is adjusted by the step structure in the liquid supply path 6 and the first flow limiting hole 7 and the second flow limiting hole 8 to ensure that the coolant flow rate is basically consistent, thereby controlling the uniformity of the coolant temperature in each groove 9. The coolant is collected through the return liquid path 11 and enters the series fluid cavity 12. The series fluid cavity 12 and the second heat dissipation fin 13 exchange heat again. After the heat exchange, the coolant on both sides is discharged through the liquid outlet hole 15 through the second rectangular flow channel 14 set on the cold plate cavity 2 for recycling.

[0031] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An antenna cold plate structure with high thermal conductivity, suitable for heat dissipation of a high-power active phased array radar antenna, wherein the radar antenna includes a TR component capable of generating heat or generating heat, characterized in that: It includes a cold plate cavity and a first cold plate cover plate and a second cold plate cover plate respectively installed on both sides of the cold plate cavity, wherein: A heat dissipation flow path is symmetrically arranged on the side parallel to the center line of the cold plate cavity, and the heat dissipation flow path is filled with coolant in a flowable manner to continuously dissipate heat for the T / R components installed on the first cold plate cover plate and the second cold plate cover plate.

2. The antenna cold plate structure according to claim 1, characterized in that: A liquid inlet hole is provided at a preset position on one side of the bottom surface of the cold plate cavity, and an external device transports coolant to the heat dissipation flow path through the liquid inlet hole. A liquid outlet hole is provided at a preset position on the other side, and the coolant flows in the heat dissipation flow path in a circulating manner through the liquid inlet hole and the liquid outlet hole.

3. The antenna cold plate structure according to claim 2, characterized in that: The heat dissipation flow path includes a plurality of grooves, a liquid supply path and a liquid return path, a step structure and a series fluid cavity arranged in the center line direction of the cold plate cavity, wherein: The series fluid cavity is arranged between the liquid outlet hole and the groove adjacent to the liquid outlet hole on the cold plate cavity, the liquid supply path is connected with the liquid inlet hole, and the liquid return path is connected with the liquid outlet hole; The step structure is arranged on the liquid supply path, and gradually narrows the flow path of the coolant along the conveying direction of the coolant, thereby adjusting the flow rate and pressure of the coolant; Each of the grooves is connected to the liquid supply path by opening a first flow limiting hole at one end, and the size of the first flow limiting hole increases successively along the delivery direction of the coolant to a preset position, and the size of the first flow limiting hole decreases successively from the preset position to the direction of the groove adjacent to the series fluid cavity.

4. The antenna cold plate structure according to claim 3, characterized in that: The preset position is the center position of the liquid supply path.

5. The antenna cold plate structure according to claim 4, characterized in that: The first cold plate cover is provided with a first heat dissipation fin and a second heat dissipation fin on the side facing the corresponding groove, wherein: A second heat dissipation fin is arranged on the side of the first cold plate cover at a position corresponding to the series fluid cavity, and first heat dissipation fins are arranged at intervals in the center line direction, and each of the first heat dissipation fins corresponds to one of the grooves, and the external parts in contact with the first cold plate cover can be cooled through the first heat dissipation fins and the grooves; The size of the second heat dissipation fin is greater than that of the first heat dissipation fin, and the external parts in contact with the first cold plate cover can be cooled through the second heat dissipation fin and the series fluid cavity.

6. The antenna cold plate structure according to claim 5, characterized in that: The groove is connected to the liquid return path in a manner of opening a second flow limiting hole at the other end, and the aperture of the second flow limiting hole increases successively along the flow direction of the coolant in the liquid return path.

7. The antenna cold plate structure according to claim 1, characterized in that: The first cold plate cover plate and the second cold plate cover plate are arranged in a mirror-image manner.