Packaging structure and corresponding preparation method

Abstract

The invention provides a packaging structure and a corresponding preparation method. The packaging structure comprises an annular circuit board; the first adapter plate is positioned at one end of the annular circuit board and is used for electrically connecting the annular circuit board with an external structure; wherein the annular circuit board comprises an annular dielectric layer, a first chip located on the surface of the annular dielectric layer, a first pin located in the annular dielectric layer and a first metal circuit, the first metal circuit is connected with the first chip and the corresponding first pin, and the first pin is exposed on the first end face of the annular dielectric layer; one side, facing the annular circuit board, of the first adapter plate is provided with a first bonding pad corresponding to the first pin, and the first bonding pad is connected with the corresponding first pin, so that the first adapter plate is electrically connected with the annular circuit board. By fully utilizing the wiring space, the wiring can be carried out on the XY plane, and the annular circuit board can be formed by utilizing the space in the Z direction, so that the wiring density is greatly increased, and a single packaging body can integrate more chips.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, in particular to a packaging structure and a corresponding preparation method. Background Art

[0002] As semiconductor products develop towards high density, high integration and small size, more and more people are focusing on the development of advanced packaging technology. 3D packaging can certainly improve IO density and electrical performance, but it is also necessary to further improve the utilization of surface area and space to achieve more IO integration. Summary of the invention

[0003] The purpose of the present invention is to solve the problem of how to achieve more IO integration, and to provide a packaging structure and a corresponding preparation method. In order to achieve the above object, the present invention provides a packaging structure, comprising: Ring circuit board; A first adapter plate located at one end of the annular circuit board, the first adapter plate being used to electrically connect the annular circuit board to an external structure; Among them, the annular circuit board includes an annular dielectric layer, a first chip located on the surface of the annular dielectric layer, a first pin located in the annular dielectric layer, and a first metal circuit, the first metal circuit connects the first chip and the corresponding first pin, one end of the annular dielectric layer has a first end face, the first pin is exposed to the first end face, and the first adapter board has a first solder pad corresponding to the first pin on the side surface facing the annular circuit board, the first solder pad is connected to the corresponding first pin, so as to realize the electrical connection between the first adapter board and the annular circuit board.

[0004] As an implementable embodiment, there is at least one annular circuit board. When there are at least two annular circuit boards, at least two annular circuit boards are arranged in a nesting doll style, and there is a gap between the at least two annular circuit boards.

[0005] As an implementable embodiment, it also includes: A second adapter board located at the other end of the annular circuit board, wherein the surface of the second adapter board has a second chip and / or a patch antenna; The annular circuit board also includes a second pin and a second metal circuit, the second pin and the second metal circuit are located in the annular dielectric layer, the second metal circuit connects the first chip and the corresponding second pin, the other end of the annular dielectric layer has a second end face, the second pin is exposed to the second end face, and the second adapter board has a second solder pad corresponding to the second pin on one side surface facing the annular circuit board, the second solder pad is connected to the corresponding second pin, so that the second chip and / or the patch antenna are electrically connected to the annular circuit board.

[0006] As an implementable embodiment, dielectric material is filled between the first adapter plate and the second adapter plate inside the annular circuit board.

[0007] As an implementation method, the second adapter board has at least one second redistribution layer, and the second adapter board surface is a side surface of the second adapter board away from the annular circuit board and / or a side surface of the second adapter board facing the annular circuit board.

[0008] As an implementable embodiment, a third chip is further provided on a surface of one side of the first adapter board facing the annular circuit board, and the third chip is located inside the annular circuit board.

[0009] As an implementable embodiment, the circuit board further includes a fourth metal circuit, and the fourth metal circuit connects a portion of the first pin and a portion of the second pin.

[0010] As an implementable embodiment, it also includes: A metal shielding cover is located on the surface of the first adapter plate, and is used to cover the outer side of the annular circuit board to achieve electromagnetic shielding.

[0011] As an implementation method, the first adapter plate has at least one first redistribution layer, and a surface of one side of the first adapter plate away from the annular circuit board is used for arranging solder balls.

[0012] As an implementation method, a solder ball is provided on a surface of the second adapter plate away from the annular circuit board, and the solder ball is electrically connected to a surface of the second adapter plate facing the annular circuit board through a second redistribution layer.

[0013] As an implementation method, there is at least one first chip, the surface of the annular dielectric layer includes the inner side surface of the annular dielectric layer and the outer side surface of the annular dielectric layer, and at least one first chip is located on the inner side surface of the annular dielectric layer and / or the outer side surface of the annular dielectric layer.

[0014] As a possible implementation method, the annular dielectric layers are connected via metal layers to form an annular circuit board.

[0015] As an implementable embodiment, the annular circuit board is a square annular circuit board, and the side edges of the square annular circuit board are arc-shaped.

[0016] Accordingly, the present invention also provides a method for preparing a packaging structure, comprising: A circuit board is provided, the circuit board comprising a dielectric layer, a first chip located on a surface of the dielectric layer, a first pin located in the dielectric layer, and a first metal line, the first metal line connecting the first chip and the corresponding first pin, one end of the dielectric layer having a first end surface, the first pin being exposed at the first end surface; Bending the dielectric layer to form an annular dielectric layer to obtain an annular circuit board; A first adapter plate is provided, and the first adapter plate is arranged at one end of the annular circuit board for electrically connecting the annular circuit board and an external structure; wherein, a surface of the first adapter plate facing the annular circuit board has a first soldering pad corresponding to the first pin, and the first soldering pad is connected to the corresponding first pin to realize electrical connection between the first adapter plate and the annular circuit board.

[0017] As an implementable method, in the process of forming the annular circuit board, at least one annular circuit board is formed, wherein when there are at least two annular circuit boards, after the step of obtaining at least two annular circuit boards, the step further includes: At least two annular circuit boards are arranged in a nesting doll style on the surface of the first adapter board, and a gap is provided between the at least two annular circuit boards.

[0018] As an implementation method, the circuit board further includes a second pin and a second metal line, the second pin and the second metal line are located in the dielectric layer, the second metal line connects the first chip and the corresponding second pin, the other end of the dielectric layer has a second end surface, and the second pin is exposed at the second end surface; After the step of arranging the first adapter plate at one end of the annular circuit board, the step further includes: A second adapter board is provided, wherein the surface of the second adapter board has a second chip and / or a patch antenna, and the second adapter board is arranged at the other end of the annular circuit board so that the second chip and / or the patch antenna is electrically connected to the annular circuit board; wherein the surface of the second adapter board facing the annular circuit board has a second soldering pad corresponding to the second pin, and the second soldering pad is connected to the corresponding second pin, thereby realizing electrical connection between the second adapter board and the annular circuit board.

[0019] As an implementable method, after the step of arranging the second adapter plate at the other end of the annular circuit board, the method further includes: A metal shielding cover is formed on the surface of the first adapter plate, and the metal shielding cover is used to cover the outer side of the annular circuit board to achieve electromagnetic shielding.

[0020] As an implementation method, the second adapter board has at least one second redistribution layer, and the second adapter board surface is a side surface of the second adapter board away from the annular circuit board and / or a side surface of the second adapter board facing the annular circuit board.

[0021] As an implementable embodiment, after the step of arranging the first adapter plate at one end of the annular circuit board, the method further includes: The dielectric material is filled on the surface of the first adapter plate inside the annular circuit board.

[0022] As an implementable method, after the step of arranging the second adapter plate at the other end of the annular circuit board, the method further includes: Solder balls are formed on a surface of the first adapter plate at one side away from the annular circuit board.

[0023] As an implementable embodiment, a third chip is further provided on a surface of one side of the first adapter board facing the annular circuit board, and the third chip is located inside the annular circuit board.

[0024] As an implementable method, the steps of surrounding the dielectric layer to form an annular dielectric layer to obtain an annular circuit board include: forming metal layers on both sides of the dielectric layer; The dielectric layer is bent to obtain an annular dielectric layer, and the annular dielectric layer is connected through a metal layer to form an annular circuit board.

[0025] As an implementation method, the first adapter board has at least one first redistribution layer.

[0026] As an implementation method, there is at least one first chip, the surface of the annular dielectric layer includes the inner side surface of the annular dielectric layer and the outer side surface of the annular dielectric layer, and at least one first chip is located on the inner side surface of the annular dielectric layer and / or the outer side surface of the annular dielectric layer.

[0027] As an implementable embodiment, the annular circuit board is a square annular circuit board, and the side edges of the square annular circuit board are arc-shaped.

[0028] Beneficial effects of the present invention: The present invention provides a packaging structure and a corresponding preparation method, by providing an annular circuit board; arranging a first adapter board at one end of the annular circuit board, and electrically connecting the annular circuit board and an external structure through the first adapter board; the annular circuit board includes an annular dielectric layer, a first chip located on the surface of the annular dielectric layer, and a first pin and a first metal line located in the annular dielectric layer, wherein the first metal line connects the first chip and the corresponding first pin, one end of the annular dielectric layer has a first end face, the first pin is exposed to the first end face, and the first adapter board has a first pad corresponding to the first pin on the side facing the annular circuit board, and the first pad is connected to the corresponding first pin, so as to realize the electrical connection between the first adapter board and the annular circuit board. The present invention makes full use of the wiring space, so that the wiring can not only be carried out on the XY plane, but also the space in the Z direction can be used to form an annular circuit board, which greatly increases the wiring density, so that a single package can integrate more chips.

[0029] The present invention can realize double-sided mounting of the first chip on the annular circuit board through the annular circuit board, thereby improving the utilization rate of the surface area and space and realizing more chip integration.

[0030] The present invention further improves the utilization of surface area and space by arranging at least two annular circuit boards in a nesting doll style, thereby achieving more chip integration.

[0031] The present invention arranges the second adapter plate at the other end of the annular circuit board, thereby further improving the utilization rate of the surface area and space and realizing more chip integration.

[0032] The first adapter board and the second adapter board provided by the present invention not only serve as an intermediate layer, but can also be flexibly transformed into an active circuit board, and different pin modes can be designed according to external interfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 and Figure 2 A three-dimensional exploded schematic diagram of a packaging structure provided by some embodiments of the present invention; Figure 3 A three-dimensional exploded schematic diagram of a metal shielding cover provided on the surface of the first adapter plate provided in some embodiments of the present invention; Figure 4 A schematic diagram of a circuit board; Figure 5 A three-dimensional schematic diagram of forming metal layers on both sides of a circuit board; Figure 6 is a three-dimensional schematic diagram of a first adapter plate; Figure 7 is a three-dimensional schematic diagram of a second adapter plate; Figure 8Schematic diagram of the preparation process of the packaging structure provided by some embodiments of the present invention. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be understood that as used herein, terms such as "first", "second", and "third" describe various elements, components, regions, layers, and / or sections, which should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Terms such as "first", "second", and "third" do not imply a sequence or order when used herein unless the context clearly indicates.

[0036] In this application document, unless otherwise clearly specified and limited, the terms "connected", "connection", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] For ease of description, spatially relative terms such as "under", "below", "below", "above", "on", "upper", etc. may be used herein to describe the relationship of an element or feature to other elements or features as shown in the drawings. It should be understood that the spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation shown in the drawings. For example, if the device in the drawings is turned over, the elements described as being "under" or "beneath" other elements or features will be oriented "above" the other elements or features. Therefore, the term "under" can include both above and below orientations.

[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0039] See also Figure 1 and Figure 2 Some embodiments of the present invention provide a packaging structure, including: An annular circuit board 100; a first adapter board 200 located at one end of the annular circuit board 100, the first adapter board 200 being used to electrically connect the annular circuit board 100 to an external structure; wherein the annular circuit board 100 includes an annular dielectric layer 110, a first chip 131 located on the surface of the annular dielectric layer 110, a first pin 121 located in the annular dielectric layer 110, and a first metal circuit, the first metal circuit connecting the first chip 131 and the corresponding first pin 121, one end of the annular dielectric layer 110 having a first end face 104, the first pin 121 being exposed to the first end face 104, a side surface 201 of the first adapter board facing the annular circuit board having a first soldering pad 210 corresponding to the first pin 121, the first soldering pad 210 being connected to the corresponding first pin 121, thereby realizing electrical connection between the first adapter board 200 and the annular circuit board 100.

[0040] In some embodiments, see Figure 1 and Figure 2 , the annular circuit board 100 is a square annular circuit board, and the side edge 103 of the square annular circuit board is arc-shaped. In some embodiments, the annular circuit board 100 can also be a circular annular circuit board or an annular circuit board of other shapes. In some embodiments, the annular circuit board 100 is formed by Figure 5 The circuit board 1 shown is formed by bending. Figure 4The circuit board 1 includes a dielectric layer 10, a first chip 131 located on the surface of the dielectric layer 10, a first pin 121 located in the dielectric layer, and a first metal line 141, wherein the first metal line 141 connects the first chip 131 and the corresponding first pin 121, and one end of the dielectric layer 10 has a first end surface 104, and the first pin 121 is exposed to the first end surface 104. In some embodiments, see Figure 4 The circuit board 1 also includes a second pin 122 and a second metal line 142, the second pin 122 and the second metal line 142 are located in the dielectric layer 10, the second metal line 142 connects the first chip 131 and the corresponding second pin 122, and the other end of the dielectric layer 10 has a second end surface 105, and the second pin 122 is exposed to the second end surface 105.

[0041] It should be noted that if Figure 4 The first metal line 141 and the second metal line 142 shown are schematic position diagrams. The dielectric layer 10, the first pin 121, the first metal line 141, the second pin 122 and the second metal line 142 can be prepared and formed in the process of preparing the redistribution layer.

[0042] In some embodiments, the dielectric layer 10 can be bent to form an annular dielectric layer 110, and then the annular dielectric layer 110 is connected through the metal layer 150 to form an annular circuit board 100. In some embodiments, the flexible circuit board can be bent and connected into an annular circuit board by cold welding or laser welding without damaging the circuit. In some embodiments, the side edges 303 of the second adapter plate 300 are rounded and bent to form an arc shape. In some embodiments, the annular dielectric layer 110 has an inner side surface 102 and an outer side surface 101, and one side surface 12 of the dielectric layer corresponds to the inner side surface 102 of the annular dielectric layer 110, and the other side surface 11 of the dielectric layer corresponds to the outer side surface 101 of the annular dielectric layer 110. In some embodiments, the first pin 121 and the second pin 122 are also exposed to the outer side surface 101 of the annular circuit board. In some embodiments, there is at least one first chip 131, the surface of the annular dielectric layer 110 includes the inner side surface 102 of the annular dielectric layer 110 and the outer side surface 101 of the annular dielectric layer 110, and at least one first chip 131 is located on the inner side surface 102 of the annular dielectric layer 110 and / or the outer side surface 101 of the annular dielectric layer 110. In some embodiments, when some first chips 131 are located on the inner side surface 102 of the annular dielectric layer 110 or the outer side surface 101 of the annular dielectric layer 110 at the same time, adjacent first chips 131 may be connected through a third metal line.

[0043] In some embodiments, the circuit board 1 further includes a fourth metal circuit, and the fourth metal circuit connects a portion of the first pin 121 and a portion of the second pin 122 .

[0044] In some embodiments, there is at least one annular circuit board 100. When there are at least two annular circuit boards 100, at least two annular circuit boards 100 are arranged in a nesting doll style, and there is a gap between at least two annular circuit boards 100. Figure 2 The two annular circuit boards 100 are arranged in a nesting doll style, and there is a gap between the two annular circuit boards 100 .

[0045] In some embodiments, see Figure 6 is a three-dimensional diagram of the first adapter plate 200, such as Figure 6 (a) is a three-dimensional schematic diagram of a side surface 201 of the first adapter plate facing the annular circuit board facing upward, and the side surface 201 of the first adapter plate facing the annular circuit board has a plurality of first solder pads 210 distributed in an annular array, such as Figure 6 (b) is a three-dimensional schematic diagram of the first adapter board with one side surface 202 facing upward away from the annular circuit board. In some embodiments, the side surface 201 of the first adapter board facing the annular circuit board also has a third chip, and the third chip is located in the internal space surrounded by the annular circuit board 100. In some embodiments, the first adapter board 200 has at least one first redistribution layer. In some embodiments, the side surface 202 of the first adapter board away from the annular circuit board is used to set solder balls. In some embodiments, the side edge 203 of the first adapter board 200 is arc-shaped. In some embodiments, the outer side surface 101 of the annular dielectric layer 110 and the side surface 204 of the first adapter board corresponding to it are located in the same plane. In some embodiments, the annular array distribution of the first solder pad 210 is consistent with the mapping of the first pin 121, and the inner layer of the first adapter board 200 leads the signal to the side surface 202 of the first adapter board away from the annular circuit board through the redistribution layer. In some embodiments, the IO interface of the side surface 202 of the first adapter board away from the annular circuit board can be designed to meet the specifications of the external device or circuit board, such as solder ball array / pad / pin, etc.

[0046] In some embodiments, see Figure 1 , Figure 2 and Figure 4The annular circuit board 100 further includes a second pin 122 and a second metal line 142, the second pin 122 and the second metal line 142 are located in the annular dielectric layer 110, the second metal line 142 connects the first chip 131 and the corresponding second pin 122, the other end of the annular dielectric layer 110 has a second end surface 105, and the second pin 122 is exposed to the second end surface 105. Figure 1 and Figure 2 , the packaging structure provided by some embodiments of the present invention further includes: a second adapter board 300 located at the other end of the annular circuit board 100, and the second adapter board 300 has a second chip 132 and / or a patch antenna. In some embodiments, see also Figure 7 , Figure 7 This is a three-dimensional diagram of the second adapter board 300, and a side surface 302 of the second adapter board facing the annular circuit board has a second solder pad 310 corresponding to the second pin 122, and the second solder pad 310 is connected to the corresponding second pin 122 to achieve electrical connection of the second chip 131 and / or the patch antenna to the annular circuit board 100.

[0047] In some embodiments, Figure 7 (b) is a three-dimensional schematic diagram of a side surface 302 of the second adapter plate facing the annular circuit board, and the side surface 302 of the second adapter plate facing the annular circuit board has a plurality of second pads 310 distributed in an annular array. In some embodiments, the annular array distribution of the second pads 310 is consistent with the mapping of the second pin 122. In some embodiments, the second adapter plate surface is a side surface 301 of the second adapter plate away from the annular circuit board and / or a side surface 302 of the second adapter plate facing the annular circuit board, for example Figure 7 (a) is a three-dimensional schematic diagram of the side surface 301 of the first adapter board away from the annular circuit board facing upward, and the second chip 132 and / or the patch antenna are located on the side surface 301 of the second adapter board away from the annular circuit board. However, in other embodiments, the second chip 132 and / or the patch antenna can also be located on the side surface 302 of the second adapter board facing the annular circuit board. In some embodiments, the second adapter board 300 has at least one second redistribution layer. In some embodiments, solder balls are provided on the side surface 301 of the second adapter board away from the annular circuit board, and the solder balls are electrically connected to the side surface 302 of the second adapter board facing the annular circuit board through the second redistribution layer. The solder balls can further realize the electrical connection between the second adapter board and another external device or circuit board. In some embodiments, the outer side surface 101 of the annular dielectric layer 110 and the side surface 304 of the second adapter board corresponding to it are located in the same plane.

[0048] In some embodiments, dielectric material is filled between the first adapter plate 200 and the second adapter plate 300 inside the annular circuit board 100. In some embodiments of the present invention, multiple annular circuit boards of different sizes are assembled in a ring shape, and dielectric material can be filled between the annular circuit boards to prevent short circuits and strengthen the package.

[0049] In some embodiments, Figure 3 In (a), after forming the first adapter plate 200 and the second adapter plate 300 at both ends of the annular circuit board 100, the metal shielding cover 400 can also be set on the outer side of the annular circuit board 100 on the surface of the first adapter plate 200, and play the role of metal shielding and protection. However, in other embodiments, a plastic sealing layer covering the annular circuit board 100 can also be formed on the surface of the first adapter plate 200.

[0050] Accordingly, some embodiments of the present invention disclose a method for preparing a packaging structure, comprising: Provide as Figure 4 The circuit board 1 shown in the figure comprises a dielectric layer 10, a first chip 131 located on the surface of the dielectric layer 10, a first pin 121 located in the dielectric layer, and a first metal line 141, wherein the first metal line 141 connects the first chip 131 and the corresponding first pin 121, and one end of the dielectric layer 10 has a first end surface 104, and the first pin 121 is exposed to the first end surface 104.

[0051] In some embodiments, see Figure 4 The circuit board 1 also includes a second pin 122 and a second metal line 142, the second pin 122 and the second metal line 142 are located in the dielectric layer 10, the second metal line 142 connects the first chip 131 and the corresponding second pin 122, and the other end of the dielectric layer 10 has a second end surface 105, and the second pin 122 is exposed to the second end surface 105.

[0052] It should be noted that if Figure 4 The first metal line 141 and the second metal line 142 shown are schematic position diagrams. The dielectric layer 10, the first pin 121, the first metal line 141, the second pin 122 and the second metal line 142 can be prepared and formed in the process of preparing the redistribution layer.

[0053] like Figure 8As shown in (a), the dielectric layer 10 is bent to form an annular dielectric layer 110 to obtain an annular circuit board 100. In some embodiments, the dielectric layer 10 is surrounded to form an annular dielectric layer 110, and the step of obtaining the annular circuit board 100 includes: bending the dielectric layer 10 to obtain an annular dielectric layer 110, and connecting the annular dielectric layer 110 through a metal layer 150 to form an annular circuit board 100. In some embodiments, see Figure 5 , a metal layer 150 is formed on both sides of the dielectric layer 10, which can be formed by electroplating to facilitate subsequent welding and assembly. In some embodiments, the flexible circuit board can be bent and joined into an annular circuit board by cold welding or laser welding without damaging the circuit. In some embodiments, the side edges 203 of the first adapter plate 200 are rounded and bent to form an arc shape. In some embodiments, the outer side surface 101 of the annular dielectric layer 110 and the side surface 204 of the first adapter plate corresponding to it are located in the same plane. In some embodiments, the circuit board 1 is a bendable flexible circuit board.

[0054] In some embodiments, see Figure 8 In (a), the annular circuit board 100 is a square annular circuit board, and the side edge 103 of the square annular circuit board is arc-shaped. In some embodiments, the annular circuit board 100 can also be a circular annular circuit board or an annular circuit board of other shapes. In some embodiments, the annular dielectric layer 110 has an inner side 102 and an outer side 101, and see Figure 4 , one side surface 12 of the dielectric layer corresponds to the inner side surface 102 of the annular dielectric layer 110, and the other side surface 11 of the dielectric layer corresponds to the outer side surface 101 of the annular dielectric layer 110; and the annular dielectric layer 110 is connected through the metal layer 150 to form an annular circuit board 100. In some embodiments, the first pin 121 and the second pin 122 are also exposed to the outer side surface 101 of the annular circuit board. In some embodiments, there is at least one first chip 131, and the surface of the annular dielectric layer 110 includes the inner side surface 102 of the annular dielectric layer 110 and the outer side surface 101 of the annular dielectric layer 110, and at least one first chip 131 is located on the inner side surface 102 of the annular dielectric layer 110 or / and the outer side surface 101 of the annular dielectric layer 110. In some embodiments, when some first chips 131 are simultaneously located on the inner side surface 102 of the annular dielectric layer 110 or the outer side surface 101 of the annular dielectric layer 110, adjacent first chips 131 can be connected through a third metal line.

[0055] like Figure 8As shown in (b), a first adapter plate 200 is provided, and the first adapter plate 200 is arranged at one end of the annular circuit board 100, for electrically connecting the annular circuit board 100 to an external structure, wherein a side surface 201 of the first adapter plate facing the annular circuit board has a first solder pad 210 corresponding to the first pin 121, and the first solder pad 210 is connected to the corresponding first pin 121, so as to realize the electrical connection between the first adapter plate 200 and the annular circuit board 100. In some embodiments, in the process of forming the annular circuit board 100, at least one annular circuit board 100 is formed.

[0056] In some embodiments, see Figure 6 is a three-dimensional diagram of the first adapter plate 200, such as Figure 6 (a) is a three-dimensional schematic diagram of a side surface 201 of the first adapter plate facing the annular circuit board facing upward, and the side surface 201 of the first adapter plate facing the annular circuit board has a plurality of first pads 210 arranged in a circular array, such as Figure 6 (b) is a three-dimensional schematic diagram of the first adapter board with one side surface 202 facing upward away from the annular circuit board. In some embodiments, the side surface 201 of the first adapter board facing the annular circuit board also has a third chip, and the third chip is located in the internal space surrounded by the annular circuit board 100. In some embodiments, the first adapter board 200 has at least one first redistribution layer. In some embodiments, the side surface 202 of the first adapter board away from the annular circuit board is used to set solder balls. In some embodiments, the annular array distribution of the first solder pad 210 is consistent with the mapping of the first pin 121, and the inner layer of the first adapter board 200 leads the signal to the side surface 202 of the first adapter board away from the annular circuit board through the redistribution layer. In some embodiments, the IO interface of the side surface 202 of the first adapter board away from the annular circuit board can be designed to meet the specifications of external devices or circuit boards, such as solder ball arrays / pads / pins, etc.

[0057] In some embodiments, when there are at least two annular circuit boards 100, after obtaining at least two annular circuit boards 100, refer to Figure 8 (c) in the method further includes: arranging at least two annular circuit boards 100 in a nesting doll-like manner on the surface of the first adapter plate 200, and at least two annular circuit boards 100 are spaced apart. In some embodiments, after the step of arranging the first adapter plate 200 on one end of the annular circuit board 100, see Figure 8 (c) in the method further includes: filling a dielectric material on a surface of the first adapter plate 200 inside the annular circuit board 100 .

[0058] See also Figure 8 (d) in the method, after the step of arranging the first adapter board 200 at one end of the annular circuit board 100, further includes: providing a second adapter board 300, wherein the surface of the second adapter board 300 has a second chip 132 and / or a patch antenna, and in some embodiments, a side surface 302 of the second adapter board facing the annular circuit board has a second solder pad 310 corresponding to the second pin 122, and the second solder pad 310 is connected to the corresponding second pin 122, so that the second adapter board 300 is electrically connected to the annular circuit board 100, thereby arranging the second adapter board 300 at the other end of the annular circuit board 100, so that the second chip 132 and / or the patch antenna is electrically connected to the annular circuit board 100; wherein the side surface 302 of the second adapter board facing the annular circuit board has a second solder pad 310 corresponding to the second pin 122, and the second solder pad 310 is connected to the corresponding second pin 122, thereby realizing the electrical connection between the second adapter board 300 and the annular circuit board 100.

[0059] In some embodiments, Figure 7 (b) is a three-dimensional schematic diagram of a side surface 302 of the second adapter plate facing the annular circuit board, and the side surface 302 of the second adapter plate facing the annular circuit board has a plurality of second pads 310 distributed in an annular array, and the annular array distribution of the second pads 310 is consistent with the mapping of the second pin 122. In some embodiments, the second adapter plate surface is a side surface 301 of the second adapter plate away from the annular circuit board and / or a side surface 302 of the second adapter plate facing the annular circuit board, for example Figure 7 (a) is a three-dimensional schematic diagram of the first adapter plate with one side surface 301 facing upward away from the annular circuit board, and the second chip 132 and / or the patch antenna are located on one side surface 301 of the second adapter plate away from the annular circuit board. However, in other embodiments, the second chip 132 and / or the patch antenna may also be located on one side surface 302 of the second adapter plate facing the annular circuit board.

[0060] In some embodiments, the second adapter plate 300 has at least one second redistribution layer. In some embodiments, the side edge 303 of the second adapter plate 300 is arc-shaped. In some embodiments, the outer side surface 101 of the annular dielectric layer 110 and the corresponding side surface 304 of the second adapter plate are located in the same plane.

[0061] In some embodiments, after the step of placing the second adapter board 300 at the other end of the annular circuit board 100, the step further includes: forming solder balls on a side surface 202 of the first adapter board away from the annular circuit board. In some embodiments, the IO interface of the side surface 202 of the first adapter board away from the annular circuit board can be designed to meet the specifications of an external device or circuit board, for example, a solder ball array / pad / pin, etc.

[0062] In some embodiments, after the step of placing the second adapter plate 300 at the other end of the annular circuit board 100, the step further includes: forming solder balls on a side surface 301 of the second adapter plate 300 away from the annular circuit board. The solder balls can further realize electrical connection between the second adapter plate and another external device or circuit board.

[0063] In some embodiments, after the step of arranging the second adapter plate 300 at the other end of the annular circuit board 100, the step further includes: forming a metal shielding cover 400 on the surface of the first adapter plate 200, wherein the metal shielding cover 400 is used to cover the outside of the annular circuit board 100 to achieve electromagnetic shielding. Figure 3 In (a), after forming the first adapter plate 200 and the second adapter plate 300 at both ends of the annular circuit board 100, the metal shielding cover 400 can also be set on the outer side of the annular circuit board 100 on the surface of the first adapter plate 200, and play the role of metal shielding and protection. However, in other embodiments, a plastic sealing layer covering the annular circuit board 100 can also be formed on the surface of the first adapter plate 200.

[0064] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A packaging structure, characterized in that: include: Ring circuit board; A first adapter plate located at one end of the annular circuit board, the first adapter plate being used to electrically connect the annular circuit board to an external structure; Among them, the annular circuit board includes an annular dielectric layer, a first chip located on the surface of the annular dielectric layer, a first pin located in the annular dielectric layer, and a first metal circuit, the first metal circuit connects the first chip and the corresponding first pin, one end of the annular dielectric layer has a first end face, the first pin is exposed to the first end face, and the first adapter board has a first solder pad corresponding to the first pin on the side surface facing the annular circuit board, the first solder pad is connected to the corresponding first pin, so as to realize the electrical connection between the first adapter board and the annular circuit board.

2. The packaging structure according to claim 1, characterized in that: There is at least one annular circuit board. When there are at least two annular circuit boards, at least two annular circuit boards are arranged in a nesting doll style, and there is a gap between the at least two annular circuit boards.

3. The packaging structure according to claim 1, characterized in that: Also includes: A second adapter board located at the other end of the annular circuit board, wherein the surface of the second adapter board has a second chip and / or a patch antenna; The annular circuit board also includes a second pin and a second metal circuit, the second pin and the second metal circuit are located in the annular dielectric layer, the second metal circuit connects the first chip and the corresponding second pin, the other end of the annular dielectric layer has a second end face, the second pin is exposed to the second end face, and the second adapter board has a second solder pad corresponding to the second pin on one side surface facing the annular circuit board, the second solder pad is connected to the corresponding second pin, so that the second chip and / or the patch antenna are electrically connected to the annular circuit board.

4. The packaging structure according to claim 3, characterized in that: A dielectric material is filled between the first adapter plate and the second adapter plate inside the annular circuit board.

5. The packaging structure according to claim 3, characterized in that: The second adapter board has at least one second redistribution layer, and the second adapter board surface is a side surface of the second adapter board away from the annular circuit board and / or a side surface of the second adapter board facing the annular circuit board.

6. The packaging structure according to claim 5, characterized in that: A solder ball is provided on a surface of the second adapter plate on one side away from the annular circuit board, and the solder ball is electrically connected to a surface of the second adapter plate on one side facing the annular circuit board through a second redistribution layer.

7. The packaging structure according to claim 3, characterized in that: A third chip is also provided on a surface of the first adapter board facing the annular circuit board, and the third chip is located inside the annular circuit board.

8. The packaging structure according to claim 3, characterized in that: The circuit board further includes a fourth metal circuit, and the fourth metal circuit connects a portion of the first pin and a portion of the second pin.

9. The packaging structure according to claim 1, characterized in that: Also includes: A metal shielding cover is disposed on the surface of the first adapter plate, and is used to cover the outer side of the annular circuit board to achieve electromagnetic shielding.

10. The packaging structure according to claim 1, characterized in that: The first adapter board has at least one first redistribution layer, and a surface of one side of the first adapter board away from the annular circuit board is used for arranging solder balls.

11. The packaging structure according to claim 1, characterized in that: There is at least one first chip, the surface of the annular dielectric layer includes an inner side surface of the annular dielectric layer and an outer side surface of the annular dielectric layer, and at least one first chip is located on the inner side surface of the annular dielectric layer and / or the outer side surface of the annular dielectric layer.

12. The packaging structure according to claim 1, characterized in that: The annular dielectric layers are connected via metal layers to form an annular circuit board.

13. The packaging structure according to claim 1, characterized in that: The annular circuit board is a square annular circuit board, and the side edges of the square annular circuit board are arc-shaped.

14. A method for preparing a packaging structure, characterized in that: include: A circuit board is provided, the circuit board comprising a dielectric layer, a first chip located on a surface of the dielectric layer, a first pin located in the dielectric layer, and a first metal line, the first metal line connecting the first chip and the corresponding first pin, one end of the dielectric layer having a first end surface, the first pin being exposed at the first end surface; Bending the dielectric layer to form an annular dielectric layer to obtain an annular circuit board; A first adapter plate is provided, and the first adapter plate is arranged at one end of the annular circuit board for electrically connecting the annular circuit board and an external structure; wherein, a surface of the first adapter plate facing the annular circuit board has a first soldering pad corresponding to the first pin, and the first soldering pad is connected to the corresponding first pin to realize electrical connection between the first adapter plate and the annular circuit board.

15. The method for preparing a packaging structure according to claim 14, characterized in that: In the process of forming the annular circuit board, at least one annular circuit board is formed, wherein when there are at least two annular circuit boards, after the step of obtaining at least two annular circuit boards, the process further includes: At least two annular circuit boards are arranged in a nesting doll style on the surface of the first adapter board, and a gap is provided between the at least two annular circuit boards.

16. The method for preparing a packaging structure according to claim 14, characterized in that: The circuit board further includes a second pin and a second metal line, the second pin and the second metal line are located in the dielectric layer, the second metal line connects the first chip and the corresponding second pin, the other end of the dielectric layer has a second end surface, and the second pin is exposed at the second end surface; After the step of arranging the first adapter plate at one end of the annular circuit board, the step further includes: A second adapter board is provided, wherein the surface of the second adapter board has a second chip and / or a patch antenna, and the second adapter board is arranged at the other end of the annular circuit board so that the second chip and / or the patch antenna is electrically connected to the annular circuit board; wherein the surface of the second adapter board facing the annular circuit board has a second soldering pad corresponding to the second pin, and the second soldering pad is connected to the corresponding second pin, thereby realizing electrical connection between the second adapter board and the annular circuit board.

17. The method for preparing a packaging structure according to claim 16, characterized in that: After the step of arranging the second adapter plate at the other end of the annular circuit board, the method further includes: A metal shielding cover is formed on the surface of the first adapter plate, and the metal shielding cover is used to cover the outer side of the annular circuit board to achieve electromagnetic shielding.

18. The method for preparing a packaging structure according to claim 16, characterized in that: The second adapter board has at least one second redistribution layer, and the second adapter board surface is a side surface of the second adapter board away from the annular circuit board and / or a side surface of the second adapter board facing the annular circuit board.

19. The method for preparing a packaging structure according to claim 14, characterized in that: After the step of arranging the first adapter plate at one end of the annular circuit board, the method further includes: The dielectric material is filled on the surface of the first adapter plate inside the annular circuit board.

20. The method for preparing a packaging structure according to claim 14, characterized in that: After the step of arranging the second adapter plate at the other end of the annular circuit board, the method further includes: Solder balls are formed on a surface of the first adapter plate at one side away from the annular circuit board.

21. The method for preparing a packaging structure according to claim 14, characterized in that: A third chip is also provided on a surface of the first adapter board facing the annular circuit board, and the third chip is located inside the annular circuit board.

22. The method for preparing a packaging structure according to claim 14, characterized in that: The steps of surrounding the dielectric layer to form an annular dielectric layer to obtain an annular circuit board include: forming metal layers on both sides of the dielectric layer; The dielectric layer is bent to obtain an annular dielectric layer, and the annular dielectric layer is connected through a metal layer to form an annular circuit board.

23. The method for preparing a packaging structure according to claim 14, characterized in that: The first transfer board has at least one first redistribution layer.

24. The method for preparing a packaging structure according to claim 14, characterized in that: There is at least one first chip, the surface of the annular dielectric layer includes an inner side surface of the annular dielectric layer and an outer side surface of the annular dielectric layer, and at least one first chip is located on the inner side surface of the annular dielectric layer and / or the outer side surface of the annular dielectric layer.

25. The method for preparing a packaging structure according to claim 14, characterized in that: The annular circuit board is a square annular circuit board, and the side edges of the square annular circuit board are arc-shaped.

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