High-impact-resistance data acquisition device and manufacturing method

Abstract

The invention provides a high-impact-resistance data acquisition device and a manufacturing method, and relates to the technical field of data acquisition devices and manufacturing methods, and the high-impact-resistance data acquisition device comprises a housing; the circuit board is arranged in the shell, and the circuit board and the inner wall of the shell are arranged at an interval; and the data acquisition and processing module is arranged on the circuit board, the data acquisition and processing module and the inner wall of the shell are arranged at an interval, and the interval between the circuit board and the inner wall of the shell and the interval between the data acquisition and processing module and the inner wall of the shell are filled with buffer rubber. As the buffer rubber is filled in the gap between the circuit board and the inner wall of the shell as well as between the data acquisition and processing module and the inner wall of the shell, relatively large relative displacement among the components can be prevented, and meanwhile, as the buffer rubber can absorb vibration and impact from all directions, the impact resistance of the data acquisition device is greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of data acquisition devices and manufacturing methods, and in particular to a high-impact-resistant data acquisition device and a manufacturing method. Background Art

[0002] The primary function of a data acquisition device is to convert analog signals into digital signals, facilitating back-end data analysis and processing. These devices are widely used in industries such as defense, aerospace, the Industrial Internet of Things, and scientific research and education. In airborne and missile-borne applications, these platforms face harsh operating environments, such as high shock and overload conditions. Unprotected data acquisition devices are susceptible to stress damage to circuits, loss of solder joints on circuit boards, and disconnection of cables, potentially damaging the entire device or causing it to malfunction.

[0003] In order to solve the above technical problems, the related technology adopts a shock-absorbing structure to perform impact resistance treatment on the data collector. For example, the utility model patent with publication number CN220773585U discloses a shock-absorbing and waterproof handheld data collector, which includes a crash shell and a data collector body. The inner wall of the crash shell is fixedly connected with a plurality of first spring pieces, one end of the crash shell is fixedly connected with a telescopic cylinder, the middle part of the telescopic cylinder is fixedly connected with a second spring piece, a hole opened on one side of the crash shell is adapted to the scanning end at one end of the data collector body, and the telescopic cylinder is adapted to the scanning end of the data collector body and the hole of the crash shell. The plurality of first spring pieces are fixedly connected to the inner wall of the crash shell, so that when the outer wall of the crash shell is impacted, the first spring pieces will reduce the impact force transmitted by the crash shell to the data collector body, thereby reducing the possibility of damage to the data collector body.

[0004] However, the data collector uses the first spring plate as a buffering and shock-absorbing component. Because the first spring plate's buffering and shock-absorbing effects vary significantly when subjected to forces in different directions, for example, it provides a good buffering and shock-absorbing effect when the force is applied along the thickness of the first spring plate, but a poor buffering and shock-absorbing effect when the force is applied along the length of the first spring plate. In actual use, the data collector experiences very complex impact forces, making it difficult for the first spring plate to provide a good buffering and shock-absorbing effect for all impacts. Summary of the Invention

[0005] The purpose of this application is to provide a highly impact-resistant data acquisition device and a manufacturing method, which is used to solve the problem that in the actual use of data acquisition devices in related technologies, the use of springs is difficult to achieve a good buffering and shock-absorbing effect against impacts in various situations.

[0006] In the first aspect, the present application provides a high-impact data acquisition device that adopts the following technical solutions:

[0007] A high-impact data acquisition device, comprising:

[0008] case;

[0009] a circuit board, the circuit board being disposed in the housing and spaced apart from an inner wall of the housing;

[0010] A data acquisition and processing module is provided on the circuit board. The data acquisition and processing module is spaced apart from the inner wall of the shell. The space between the circuit board and the data acquisition and processing module and the inner wall of the shell is filled with buffer glue.

[0011] Optionally, the data acquisition and processing module includes a signal conditioning circuit unit, an amplifying circuit unit, a data acquisition unit and an FPGA signal processing unit, which are arranged on the circuit board and connected in sequence.

[0012] Optionally, a cooling module is also included, which includes a heat exchange chamber, a fan, a heat dissipation chamber and a circulation pump. The heat exchange chamber is arranged in the shell and contacts the circuit board. The heat dissipation chamber is connected to the heat exchange chamber. The heat exchange chamber and the heat dissipation chamber are filled with coolant. The fan is used to dissipate heat from the heat dissipation chamber. The circulation pump is connected to the heat exchange chamber and the heat dissipation chamber.

[0013] Optionally, the cooling module also includes two groups of first joints and two groups of second joints, the two groups of first joints are connected to the heat exchange chamber, and the first joints are provided with a first valve, the two groups of second joints are connected to the heat dissipation chamber, and the second joints are provided with a second valve, and the first joints and the second joints are detachably connected.

[0014] Optionally, the first valve includes a first valve core, which is arranged in the first joint; the second valve includes a second valve core, which is arranged in the second joint; when the first joint is connected to the second joint, the first valve core and the second valve core can be opened; when the first valve core and the second valve core are closed, the first joint can be separated from the second joint.

[0015] Optionally, a locking mechanism is further included, and the cooling module also includes a shell, the second joint, the fan, the heat dissipation chamber and the circulation pump are arranged on the shell, the shell is detachably connected to the shell, and the locking mechanism is used to limit the separation of the shell and the shell.

[0016] Optionally, it also includes an elastic member, the second joint is slidably provided on the outer shell, the elastic member is provided on the outer shell and acts on the second joint, the outer shell is provided with a first driving part and a second driving part, when the shell moves relative to the outer shell, the first joint can overcome the elastic force of the elastic member to push the second joint to slide, and the first driving part and the second driving part can respectively drive the first valve core and the second valve core to open and close.

[0017] Optionally, a locking mechanism is further included, which is arranged on the second connector. When the first connector is connected to the second connector, the second driving part can act on the locking mechanism to drive the locking mechanism to connect to the first connector. When the second driving part acts on the locking mechanism, the first driving part and the second driving part can respectively drive the first valve core and the second valve core to open.

[0018] Optionally, a blocking mechanism is further included, which is provided on the second connector, and the locking mechanism is connected to the blocking mechanism. When the locking mechanism is separated from the first connector, the blocking mechanism can limit the second driving part from driving the second valve core to open.

[0019] In a second aspect, the present application provides a method for manufacturing a high-impact data acquisition device using the following technical solutions:

[0020] A method for manufacturing a high-impact data acquisition device comprises the following steps:

[0021] Step S01. Solder and install the data acquisition and processing module on the circuit board;

[0022] Step S02. Apply conformal coating evenly on the circuit board and dry it.

[0023] Step S03. Evenly apply thermally conductive silicone on the circuit board and dry it;

[0024] Step S04: Install the circuit board and the data acquisition and processing module in the housing, pour glue into the housing, and encapsulate the circuit board, the data acquisition and processing module and the housing into a whole.

[0025] To sum up, the present application includes at least one of the following beneficial technical effects: since the buffer glue is filled in the gap between the circuit board and the data acquisition and processing module and the inner wall of the shell, the shell, circuit board and data acquisition and processing module of the high-impact resistant data acquisition device of the present application are integrated into a whole through the potting glue, which can prevent large relative displacement between the components. At the same time, since the buffer glue can absorb vibrations and impacts from all directions, the impact resistance of the data acquisition device is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a structural block diagram of the data acquisition and processing module in the embodiment of the present application;

[0027] Figure 2 A cross-sectional view of a high-impact data acquisition device from a first perspective in an embodiment of the present application;

[0028] Figure 3 This is a flow chart of a method for manufacturing a high-shock-resistant data acquisition device in an embodiment of the present application;

[0029] Figure 4 This is a cross-sectional view of the high-impact data acquisition device from a second perspective in an embodiment of the present application;

[0030] Figure 5 for Figure 4 A partial enlarged schematic diagram of part B1;

[0031] Figure 6 for Figure 4 A partial enlarged schematic diagram of part B2;

[0032] Figure 7 This is a cross-sectional view of the high-impact data acquisition device from a third perspective in an embodiment of the present application;

[0033] Figure 8 for Figure 7 A partial enlarged schematic diagram of part A;

[0034] Figure 9 for Figure 5 A partial enlarged schematic diagram of part B11;

[0035] Figure 10 This is a cross-sectional view of the high-impact data acquisition device from a fourth perspective in an embodiment of the present application;

[0036] Figure 11 for Figure 10 A partial enlarged schematic diagram of part C in the middle.

[0037] Description of reference numerals:

[0038] 10. Housing; 11. Accommodating cavity; 12. Elastic column; 13. Locking groove;

[0039] 20. Heat exchange chamber; 30. Heat dissipation chamber; 31. Heat dissipation pipe; 32. Guide shell;

[0040] 40. First joint; 41. Pin; 411. Lock hole; 42. First bracket; 43. First interface; 44. First hose;

[0041] 50. Second joint; 51. Connecting seat; 511. Groove; 512. Through hole; 52. Support; 53. Second bracket; 54. Second interface; 55. Tube; 551. Baffle; 56. Second hose; 57. Guide sleeve;

[0042] 60. Locking mechanism; 61. Wedge block; 611. Locking rod; 612. End; 62. Locking spring;

[0043] 70. Locking mechanism; 71. Third rotating shaft; 711. Third gear; 712. First bevel gear; 72. Fourth rotating shaft; 721. Fourth gear; 722. Second bevel gear; 73. Locking rack;

[0044] 80. Blocking mechanism; 81. Slider; 811. Screw hole; 82. Screw; 821. Fifth gear; 83. Sliding column; 831. Flange; 832. Transmission rack; 84. Third spring;

[0045] 90. First rotating shaft; 91. First driven gear; 92. First driving gear;

[0046] 100. Second rotating shaft; 101. Second driven gear; 102. Second driving gear;

[0047] 110. Circuit board; 120. Data acquisition and processing module;

[0048] 130, first valve core; 131, first valve stem; 132, first spring; 133, first driven rack;

[0049] 140, second valve core; 141, second valve stem; 142, second spring; 143, second driven rack;

[0050] 150. Housing; 151. Slide groove; 152. Guide hole; 153. First active rack; 154. Second active rack; 160. Compression spring; 170. Fan; 180. Circulation pump. DETAILED DESCRIPTION

[0051] The following is combined with Figure 1 -Attached Figure 11 , further details of this application are given.

[0052] Example 1

[0053] The embodiment of the present application discloses a highly shock-resistant data acquisition device.

[0054] Reference Figure 1 and Figure 2A high-impact data acquisition device includes a housing 10, a circuit board 110, and a data acquisition and processing module 120. The housing 10 defines a receiving chamber 11. The circuit board 110 is disposed within the receiving chamber 11 of the housing 10 and is spaced apart from the inner wall of the housing 10. The data acquisition and processing module 120 is disposed on the circuit board 110 and includes a signal conditioning circuit unit, an amplification circuit unit, a data acquisition unit, and an FPGA signal processing unit, which are disposed on the circuit board 110 and are sequentially connected.

[0055] The signal conditioning circuit unit is used to amplify and filter the analog signals input from various sensors to adapt them to the input range of the data acquisition unit. The amplification circuit unit has different amplification factors and amplifies the conditioned analog signals at different rates. The data acquisition unit includes multiple ADC chips and is controlled by a synchronous sampling clock generated by the FPGA signal processing unit. The ADC chips hold, quantize, and encode the sampled analog signals, converting them into digital signals before transmitting them to the FPGA signal processing unit via the serial data interface within the ADC chip. The FPGA signal processing unit generates the ADC sampling synchronization clock and simultaneously performs real-time data processing on the digital signals output by multiple ADC chips to obtain the final digital signal.

[0056] The data acquisition and processing module 120 is spaced apart from the inner wall of the housing cavity 11 of the housing 10. The space between the circuit board 110, the data acquisition and processing module 120, and the inner wall of the housing cavity 11 of the housing 10 is filled with a buffering adhesive, which can be epoxy resin. Because the space between the circuit board 110, the data acquisition and processing module 120, and the inner wall of the housing cavity 11 of the housing 10 is filled with the buffering adhesive, the housing 10, the circuit board 110, and the data acquisition and processing module 120 of the high-impact data acquisition device of the present application are integrated into a single unit through the potting adhesive, thereby preventing large relative displacement between the various components. Furthermore, because the buffering adhesive can absorb vibration and impact from all directions, the impact resistance of the data acquisition device is greatly improved.

[0057] Reference Figure 3 , the embodiment of the present application also discloses a method for manufacturing a high-impact resistant data acquisition device.

[0058] A method for manufacturing a high-impact data acquisition device comprises the following steps:

[0059] Step S01. Solder and install the data acquisition and processing module 120 on the circuit board 110;

[0060] Step S02. Evenly apply conformal coating on the circuit board 110 and dry it;

[0061] Step S03. Evenly coating thermally conductive silicone on the circuit board 110 and drying it;

[0062] Step S04: Install the circuit board 110 and the data acquisition and processing module 120 in the housing 10, and use epoxy resin to fill the accommodating cavity 11 of the housing 10 to encapsulate the circuit board 110 and the data acquisition and processing module 120 with the housing 10 as a whole.

[0063] Example 2

[0064] The embodiment of the present application discloses a highly shock-resistant data acquisition device.

[0065] Reference Figures 4 to 6 The difference between the high-impact resistant data acquisition device of this embodiment and the high-impact resistant data acquisition device of Example 1 is that it also includes a cooling module, which includes a heat exchange chamber 20, a fan 170, a heat dissipation chamber 30, a circulation pump 180, two groups of first joints 40, two groups of second joints 50, a locking mechanism 60, and an outer shell 150. The heat exchange chamber 20 is in the shape of a plate shell and is arranged in the shell 10 and contacts the circuit board 110. An elastic column 12 is fixed on the inner wall of the shell 10, the heat exchange chamber 20 is fixed on the elastic column 12, the circuit board 110 is fixed on the heat exchange chamber 20, the heat dissipation chamber 30 is connected to the heat exchange chamber 20, and the heat exchange chamber 20 and the heat dissipation chamber 30 are filled with coolant. The fan 170 is used to dissipate heat from the heat dissipation chamber 30, and the circulation pump 180 is connected to the heat exchange chamber 20 and the heat dissipation chamber 30.

[0066] Because the space between the circuit board 110, the data acquisition and processing module 120, and the inner wall of the housing 10 cavity 11 is filled with a buffering rubber, the buffering rubber will affect the heat dissipation and cooling of the circuit board 110. Therefore, the high-impact data acquisition device of this embodiment can cool the circuit board 110 through the cooling module. Its working principle is as follows: the circulating pump 180 drives the coolant to circulate between the heat exchange chamber 20 and the heat dissipation chamber 30. When the coolant flows through the heat exchange chamber 20, it exchanges heat with the circuit board 110, cooling the circuit board 110. The coolant then enters the heat dissipation chamber 30, where it is dissipated by the fan 170, reducing the temperature of the coolant. The cooled coolant then enters the heat exchange chamber 20 to cool the circuit board 110, and this cycle repeats.

[0067] Reference Figures 4 to 6 The housing 10 is detachably connected to the outer shell 150. The second connector 50, fan 170, heat dissipation chamber 30, and circulation pump 180 are disposed on the outer shell 150. Two sets of first connectors 40 are connected to the heat exchange chamber 20, each of which is provided with a first valve. Two sets of second connectors 50 are connected to the heat dissipation chamber 30, each of which is provided with a second valve. The first connectors 40 and the second connectors 50 are detachably connected.

[0068] The locking mechanism 60 is used to limit the separation of the shell 10 and the outer shell 150. More specifically, the locking mechanism 60 includes a wedge block 61 and a locking spring 62. A slide groove 151 is provided on the outer shell 150. The wedge block 61 is slidably arranged in the slide groove 151. A locking rod 611 is provided on the wedge block 61. The locking rod 611 slides through the outer shell 150. The locking rod 611 is provided with an end 612 for limiting the separation of the wedge block 61 from the slide groove 151. The shell 10 is provided with a locking groove 13 that can be engaged with the wedge block 61. The locking spring 62 is sleeved on the outside of the locking rod 611. The two ends of the locking spring 62 respectively abut against the inner walls of the wedge block 61 and the slide groove 151.

[0069] The housing 10 and outer shell 150 of the high-impact data acquisition device of this application are detachable. After data acquisition is complete, the housing 10 and outer shell 150 can be separated for easy portability. When the housing 10 and outer shell 150 are separated, the first connector 40 and the second connector 50 are separated. When the first connector 40 and the second connector 50 are separated, the first valve and the second valve can be used to control the sealing of the first connector 40 and the second connector 50, respectively, to prevent coolant leakage.

[0070] Reference Figure 4 and Figure 5 In an optional embodiment, the first valve and the second valve may adopt the following structure: the first valve includes a first valve core 130, which is arranged in the first joint 40. More specifically, the first joint 40 is fixed to the shell 10, and the first joint 40 is connected to the heat exchange chamber 20 through a first hose 44. A first bracket 42 is provided on the first joint 40, and a first valve stem 131 is provided on the first valve core 130. The first valve stem 131 is slidably passed through the first bracket 42, and a first spring 132 is sleeved on the outside of the first valve stem 131. The two ends of the first spring 132 are respectively in contact with the first valve core 130 and the first bracket 42. A first interface 43 is provided at the end of the first joint 40, and the first valve core 130 can be sealed at the first interface 43 under the elastic force of the first spring 132.

[0071] The second valve includes a second valve core 140, which is arranged in the second joint 50. More specifically, the second joint 50 is arranged on the outer shell 150, and the second joint 50 is connected to the heat dissipation compartment 30. A second bracket 53 is provided on the second joint 50, and a second valve stem 141 is provided on the second valve core 140. The second valve stem 141 is slidably passed through the second bracket 53, and a second spring 142 is sleeved on the outer side of the second valve stem 141. The two ends of the second spring 142 are respectively in contact with the second valve core 140 and the second bracket 53. A second interface 54 is provided at the end of the second joint 50, and the second valve core 140 can be sealed at the second interface 54 under the elastic force of the second spring 142.

[0072] Reference Figure 4 and Figure 5The housing 150 is provided with a guide hole 152, and the second joint 50 is provided with a tube body 55. The second joint 50 is slidably inserted into the guide hole 152 of the housing 150 through the tube body 55. The housing 150 is provided with an elastic member, which acts on the second joint 50. More specifically, the elastic member can be a compression spring 160, which is sleeved on the outside of the tube body 55. The two ends of the compression spring 160 are respectively in contact with the second joint 50 and the housing 150. The tube body 55 is provided with a baffle 551 for limiting the separation of the tube body 55 from the housing 150.

[0073] A first driving part and a second driving part are provided on the outer shell 150. When the shell 10 moves relative to the outer shell 150, the first connector 40 can overcome the elastic force of the elastic member to push the second connector 50 to slide, and the first driving part and the second driving part can respectively drive the first valve core 130 and the second valve core 140 to open and close.

[0074] More specifically, a first rotating shaft 90 is rotatably provided on the first joint 40, a first driven gear 91 and a first driving gear 92 are provided on the first rotating shaft 90, a first driven rack 133 engaged with the first driven gear 91 is provided on the first valve stem 131 of the first valve core 130, and the first driving part is a first driving rack 153 provided on the housing 150, and the first driving rack 153 can engage with the first driving gear 92.

[0075] A second rotating shaft 100 is rotatably provided on the second joint 50, and a second driven gear 101 and a second driving gear 102 are provided on the second rotating shaft 100. A second driven rack 143 meshing with the second driven gear 101 is provided on the second valve stem 141 of the second valve core 140. The second driving part is a second driving rack 154 provided on the housing 150, and the second driving rack 154 can mesh with the second driving gear 102.

[0076] The heat dissipation chamber 30 includes a heat dissipation pipe 31 and a guide shell 32 connected to both ends of the heat dissipation pipe 31. The circulation pump 180 is connected to one of the guide shells 32. The circulation pump 180 and the other guide shell 32 are respectively connected to the pipe body 55 through the second hose 56. The fan 170 is opposite to the heat dissipation pipe 31.

[0077] During the connection process of the housing 10 and the outer shell 150 of the high-shock-resistant data acquisition device of the present application, the first valve core 130 and the second valve core 140 can be opened only after the first connector 40 and the second connector 50 are connected, thereby preventing the first valve core 130 and the second valve core 140 from opening and causing coolant leakage before the first connector 40 and the second connector 50 are connected. During the separation process of the housing 10 and the outer shell 150, the first connector 40 can be separated from the second connector 50 only after the first valve core 130 and the second valve core 140 are closed, thereby preventing the first connector 40 from separating from the second connector 50 and causing coolant leakage before the first valve core 130 and the second valve core 140 are closed.

[0078] Reference Figures 7 to 11 In an optional embodiment, during the connection or disconnection process between the first connector 40 and the second connector 50, the locking mechanism 70 can be used to control the opening and closing of the first valve core 130 and the second valve core 140. More specifically, the locking mechanism 70 is provided on the second connector 50. When the first connector 40 and the second connector 50 are connected, the second driving unit can act on the locking mechanism 70 to drive the locking mechanism 70 to connect with the first connector 40. Only after the second driving unit acts on the locking mechanism 70 can the first driving unit and the second driving unit respectively drive the first valve core 130 and the second valve core 140 to open.

[0079] Furthermore, the locking mechanism 70 includes a third rotating shaft 71, a fourth rotating shaft 72 and a locking rack 73. The third rotating shaft 71 and the fourth rotating shaft 72 are rotatably arranged on the second joint 50. The third rotating shaft 71 is provided with a third gear 711 and a first bevel gear 712. The second active rack 154 can mesh with the third gear 711. The fourth rotating shaft 72 is provided with a fourth gear 721 and a second bevel gear 722. The second bevel gear 722 meshes with the first bevel gear 712. The second joint 50 is provided with a connecting seat 51, and the connecting seat 51 is provided with a groove 511. The first joint 40 is provided with a pin 41 that can be plugged into the groove 511. The pin 41 is provided with a lock hole 411. The locking rack 73 is slidably provided on the connecting seat 51 and meshes with the fourth gear 721. The locking rack 73 can be plugged into the lock hole 411.

[0080] Reference Figure 8 、 Figure 9 and Figure 11 A blocking mechanism 80 is provided on the second connector 50, and the locking mechanism 70 is connected to the blocking mechanism 80. When the locking mechanism 70 is separated from the first connector 40, the blocking mechanism 80 can limit the second driving part from driving the second valve core 140 to open, thereby preventing the second valve core 140 from being accidentally opened and causing coolant leakage after the first connector 40 is separated from the second connector 50.

[0081] More specifically, the blocking mechanism 80 includes a slider 81, a screw 82, a slide post 83 and a third spring 84. A guide sleeve 57 is provided on the second joint 50. The slider 81 is slidably arranged in the guide sleeve 57. The slider 81 can prevent the second active rack 154 from engaging with the second active gear 102. A screw hole 811 is provided on the slider 81. The screw 82 is rotatably provided on the second joint 50 and is screwed to the slider 81 through the screw hole 811. A fifth gear 821 is provided on the screw rod 82, a through hole 512 penetrating the groove 511 is provided on the connecting seat 51, a support 52 is provided on the second joint 50, the slide post 83 is slidably provided on the support 52 and inserted into the through hole 512, the pin 41 can abut against the slide post 83, a flange 831 is provided on the slide post 83, a third spring 84 is sleeved on the outside of the slide post 83, and the two ends of the third spring 84 abut against the flange 831 and the support 52 respectively, and a transmission rack 832 engaged with the fifth gear 821 is provided on the slide post 83.

[0082] The implementation principle of the high impact resistant data acquisition device and manufacturing method of this embodiment is as follows: Figure 4 and Figure 5 When the shell 10 is connected to the outer shell 150 and the first connector 40 is connected to the second connector 50, the first valve core 130 and the second valve core 140 are both in the open state. At this time, the coolant can circulate between the heat exchange chamber 20 and the heat dissipation chamber 30 through the first connector 40 and the second connector 50 to cool the circuit board 110.

[0083] When the housing 10 needs to be separated from the outer shell 150, the locking rod 611 is pulled to withdraw the wedge block 61 from the locking groove 13, and then the housing 10 is separated from the outer shell 150. During the separation process, the second connector 50 is pushed to slide axially upward under the elastic force of the compression spring 160. During the sliding process of the second connector 50, the first active rack 153 and the second active rack 154 are first separated from the first active gear 92 and the second active gear 102, so that the first valve core 130 and the second valve core 140 respectively block the first connector 40 and the second connector 50 under the elastic force of the first spring 132 and the second spring 142, thereby preventing coolant leakage. Then the second active rack 154 is separated from the third gear 711, and during the separation process, the third rotating shaft 71 is driven to rotate, and then the fourth rotating shaft 72 is driven to rotate through the first bevel gear 712 and the second bevel gear 722, and then the locking rack 73 is driven to slide through the fourth gear 721, so that the locking rack 73 is withdrawn from the lock hole 411 to achieve unlocking, and then the first joint 40 can be separated from the second joint 50.

[0084] When the second connector 50 slides upward in the axial direction, the first active rack 153 and the second active rack 154 first separate from the first active gear 92 and the second active gear 102 before the second active rack 154 separates from the third gear 711. Therefore, the first connector 40 can only separate from the second connector 50 after the first valve core 130 and the second valve core 140 are closed. Conversely, when the housing 10 is connected to the outer shell 150, the second active rack 154 first engages with the third gear 711 before the first active rack 153 and the second active rack 154 engage with the first active gear 92 and the second active gear 102. Consequently, only after the locking rack 73 is plugged into the locking hole 411, i.e., after the first connector 40 and the second connector 50 are locked and connected, can the first active rack 153 and the second active rack 154 drive the first valve core 130 and the second valve core 140 to open, thereby enabling the first valve core 130 and the second valve core 140 to open after the first connector 40 and the second connector 50 are connected.

[0085] When the pin 41 exits the groove 511 , the third spring 84 pushes the slide 83 to slide, and then drives the screw 82 to rotate through the transmission rack 832 and the fifth gear 821 . The screw 82 then drives the slider 81 to move above the second driving gear 102 , thereby preventing the second connector 50 from being pressed downward, thereby preventing the second valve core 140 from being accidentally opened and causing coolant leakage.

[0086] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. A high impact resistant data acquisition device, characterized in that: include: Housing (10); A circuit board (110), the circuit board (110) being arranged in the housing (10), the circuit board (110) being spaced apart from an inner wall of the housing (10); A data acquisition and processing module (120), wherein the data acquisition and processing module (120) is arranged on the circuit board (110), the data acquisition and processing module (120) is spaced apart from the inner wall of the shell (10), and the space between the circuit board (110) and the data acquisition and processing module (120) and the inner wall of the shell (10) is filled with buffer glue.

2. A high impact resistant data acquisition device according to claim 1, characterized in that: The data acquisition processing module (120) comprises a signal conditioning circuit unit, an amplifying circuit unit, a data acquisition unit and an FPGA signal processing unit which are arranged on the circuit board (110) and connected in sequence.

3. A high impact resistant data acquisition device according to claim 1, characterized in that: The invention also comprises a cooling module, wherein the cooling module comprises a heat exchange chamber (20), a fan (170), a heat dissipation chamber (30) and a circulation pump (180); the heat exchange chamber (20) is arranged in the housing (10) and is in contact with the circuit board (110); the heat dissipation chamber (30) is communicated with the heat exchange chamber (20); the heat exchange chamber (20) and the heat dissipation chamber (30) are filled with coolant; the fan (170) is used to dissipate heat from the heat dissipation chamber (30); and the circulation pump (180) is communicated with the heat exchange chamber (20) and the heat dissipation chamber (30).

4. A high impact resistant data acquisition device according to claim 3, characterized in that: The cooling module further comprises two groups of first joints (40) and two groups of second joints (50); the two groups of the first joints (40) are connected to the heat exchange chamber (20); the first joints (40) are provided with a first valve; the two groups of the second joints (50) are connected to the heat dissipation chamber (30); the second joints (50) are provided with a second valve; the first joints (40) and the second joints (50) are detachably connected.

5. A high impact resistant data acquisition device according to claim 4, characterized in that: The first valve comprises a first valve core (130), and the first valve core (130) is arranged in the first joint (40). The second valve comprises a second valve core (140), and the second valve core (140) is arranged in the second joint (50). When the first joint (40) is connected to the second joint (50), the first valve core (130) and the second valve core (140) can be opened. When the first valve core (130) and the second valve core (140) are closed, the first joint (40) can be separated from the second joint (50).

6. A high impact resistant data acquisition device according to claim 5, characterized in that: The cooling module further comprises a locking mechanism (60), the cooling module further comprises a housing (150), the second joint (50), the fan (170), the heat dissipation chamber (30) and the circulation pump (180) are arranged on the housing (150), the housing (10) and the housing (150) are detachably connected, and the locking mechanism (60) is used to limit the separation of the housing (10) and the housing (150).

7. A high impact resistant data acquisition device according to claim 6, characterized in that: It also includes an elastic member, the second joint (50) is slidably arranged on the shell (150), the elastic member is arranged on the shell (150) and acts on the second joint (50), the shell (150) is provided with a first driving part and a second driving part, when the shell (10) moves relative to the shell (150), the first joint (40) can overcome the elastic force of the elastic member to push the second joint (50) to slide, and the first driving part and the second driving part can respectively drive the first valve core (130) and the second valve core (140) to open and close.

8. A high impact resistant data acquisition device according to claim 7, characterized in that: The invention also includes a locking mechanism (70), wherein the locking mechanism (70) is arranged on the second joint (50); when the first joint (40) is connected to the second joint (50), the second driving unit can act on the locking mechanism (70) to drive the locking mechanism (70) to connect to the first joint (40); when the second driving unit acts on the locking mechanism (70), the first driving unit and the second driving unit can respectively drive the first valve core (130) and the second valve core (140) to open.

9. A high impact resistant data acquisition device according to claim 8, characterized in that: The invention also includes a blocking mechanism (80), wherein the blocking mechanism (80) is arranged on the second connector (50), and the locking mechanism (70) is connected to the blocking mechanism (80). When the locking mechanism (70) is separated from the first connector (40), the blocking mechanism (80) can limit the second driving unit from driving the second valve core (140) to open.

10. A method for manufacturing a high impact resistant data acquisition device, characterized in that: The following steps are involved: Step S01. Soldering and installing a data acquisition and processing module (120) on a circuit board (110); Step S02. Evenly apply conformal coating on the circuit board (110) and dry it; Step S03. Evenly coating the circuit board (110) with thermally conductive silica gel and drying it; Step S04: Install the circuit board (110) and the data acquisition processing module (120) in the housing (10), inject glue into the housing (10), and seal the circuit board (110) and the data acquisition processing module (120) with the housing (10) as a whole.

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