Heat dissipation device and return difference control method thereof

Abstract

The invention discloses a heat dissipation device and a return difference control method thereof. The return difference control method comprises the steps that the equipment temperature is obtained, and the equipment temperature is the temperature of equipment to be cooled at the current moment; on-off of a first switch is controlled based on comparison between the equipment temperature and a first temperature, and on-off of a second switch is controlled based on comparison between the equipment temperature and a second temperature; when the first switch and the second switch are switched on, the heat dissipation device starts to work so as to reduce the temperature of the equipment; when the equipment temperature is reduced to be between the first temperature and the second temperature, the heat dissipation device continues to work; and when the equipment temperature is lower than the first temperature and the second temperature at the same time, the heat dissipation device stops working. By means of the mode, starting and stopping of the heat dissipation device are controlled by setting the two different temperature threshold values of the first temperature and the second temperature, the problem of frequent starting and stopping caused by temperature fluctuation near a critical point is solved, the stability of a system is improved, and the service life of the system is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment heat dissipation, and in particular to a heat dissipation device and a hysteresis control method thereof. Background Art

[0002] With the development of electronic equipment, the problem of heating has become increasingly prominent. Traditional heat dissipation control methods often use a single temperature threshold control, which easily causes the cooling fan to start and stop frequently, which not only increases energy consumption but also reduces the life of the cooling fan.

[0003] Therefore, a more intelligent and stable heat dissipation control solution is needed. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a hysteresis control method for a heat dissipation device, the method comprising:

[0005] Obtaining device temperature, where the device temperature is the current temperature of the device to be cooled;

[0006] Controlling the on-off of the first switch based on a comparison between the device temperature and the first temperature, and controlling the on-off of the second switch based on a comparison between the device temperature and the second temperature;

[0007] The first switch and the second switch are turned on, and the heat dissipation device starts to work to reduce the temperature of the device; when the temperature of the device drops to between the first temperature and the second temperature, the heat dissipation device continues to work; when the temperature of the device is lower than the first temperature and the second temperature at the same time, the heat dissipation device stops working.

[0008] In one embodiment, the first temperature is greater than the second temperature, and the hysteresis value is the difference between the first temperature and the second temperature.

[0009] The present invention also provides a heat dissipation device using any of the above hysteresis control methods, the device comprising:

[0010] A cooling fan, wherein the cooling fan is used to dissipate heat for the device to be cooled;

[0011] A temperature acquisition module, the temperature acquisition module is used to collect temperature data of the device to be cooled;

[0012] A control module, wherein the input end of the control module is connected to the output end of the temperature acquisition module, and the control end of the control module is connected to the controlled end of the cooling fan.

[0013] In one embodiment, the device further comprises a power supply module, and the power supply module is respectively connected to a power supply end of the cooling fan, a power supply end of the temperature acquisition module and a power supply end of the control module.

[0014] In one embodiment, it is characterized in that the power supply module also includes a power conversion circuit, and the power input to the cooling fan, the temperature acquisition module and the control module is adjusted based on the power conversion circuit.

[0015] In one embodiment, it is characterized in that the control module includes:

[0016] Data acquisition module, used to obtain device temperature;

[0017] A hysteresis control circuit controls whether a power supply module supplies power to a cooling fan based on the device temperature.

[0018] In one embodiment, the hysteresis control circuit includes a first switch and a second switch; the first switch is connected in series with the second switch; the first switch is turned on when the device temperature is higher than a first temperature, and the second switch is turned on when the device temperature is higher than a second temperature.

[0019] In one embodiment, the hysteresis control circuit also includes a switch tube, which is connected to the cooling fan, and the working state of the cooling fan is controlled based on the switch tube; the switch tube includes a coil, a third switch and a fourth switch; when the coil is energized, the third switch and the fourth switch are turned on; one end of the third switch is connected to a side of the first switch away from the second switch, and the other end of the third switch is connected to a side of the first switch close to the second switch; the fourth switch is installed between the cooling fan and the power supply, and whether the cooling fan is powered on is controlled based on the on and off of the fourth switch.

[0020] The present invention further provides an electronic device, comprising: a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the steps of any of the above methods.

[0021] The present invention also provides a computer-readable storage medium, wherein the computer-readable storage medium stores program data, and the program data can be executed by a processor to implement the steps of any of the above methods.

[0022] Beneficial effects of the present invention: Different from the prior art, the present invention discloses a heat dissipation device and a hysteresis control method thereof; wherein the hysteresis control method comprises: obtaining the device temperature, the device temperature being the temperature of the device to be dissipated at the current moment; controlling the on-off of the first switch based on the comparison between the device temperature and the first temperature, and controlling the on-off of the second switch based on the comparison between the device temperature and the second temperature; the first switch and the second switch are turned on, the heat dissipation device starts to work and then reduces the device temperature; when the device temperature drops to between the first temperature and the second temperature, the heat dissipation device continues to work; when the device temperature is lower than the first temperature and the second temperature at the same time, the heat dissipation device stops working. In the above manner, the present invention controls the start and stop of the heat dissipation device by setting two different temperature thresholds of the first temperature and the second temperature, thereby avoiding the problem of frequent startup and shutdown caused by temperature fluctuations near the critical point, and improving the stability and service life of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a flow chart of an embodiment of a hysteresis control method provided by the present invention;

[0024] Figure 2 A schematic structural diagram of an embodiment of a heat dissipation device provided by the present invention;

[0025] Figure 3 for Figure 2 A schematic diagram of the structure of an embodiment of a control module in FIG.

[0026] Figure 4 for Figure 3 A structural diagram of an embodiment of a hysteresis control circuit in FIG.

[0027] Figure 5 A schematic diagram of the structure of an electronic device according to an embodiment of the present invention;

[0028] Figure 6 A schematic diagram of the structure of an embodiment of a computer-readable storage medium provided by the present invention. DETAILED DESCRIPTION

[0029] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0030] The existing heat dissipation device is controlled by a temperature threshold. When the device temperature is higher than the temperature threshold, the heat dissipation device starts to cool down. When the device temperature is lower than the temperature threshold, the heat dissipation device stops working. Controlling the start and stop of the heat dissipation device by only one temperature threshold can easily lead to frequent start and stop of the heat dissipation device, making the heat dissipation device easy to be damaged.

[0031] The present invention provides a hysteresis control method for a heat dissipation device, see Figure 1 As shown, Figure 1 The present invention provides a flow chart of a method for controlling hysteresis according to an embodiment of the present invention.

[0032] Step S11: Obtain the device temperature, which is the temperature of the device to be cooled at the current moment; the device temperature can be obtained by a built-in or external temperature sensor, which can be a thermistor, a thermocouple, an infrared temperature sensor or an integrated circuit temperature sensor, without any limitation; monitor the device temperature through the temperature sensor, and take measures to cool the device before the temperature is too high, so as to prevent the device from being degraded or even damaged due to overheating. In this embodiment, the power of the heat dissipation device is constant, for example, the heat dissipation device is a cooling fan, and the speed of the fan is constant when it is started; in other embodiments, the specific value of the operating device temperature can be used to adjust the working power of the heat dissipation device, so as to improve the heat dissipation efficiency when the temperature is too high; and reduce the heat dissipation power and energy consumption when the temperature is low.

[0033] Step S12: Controlling the on and off of the first switch based on the comparison between the device temperature and the first temperature, and controlling the on and off of the second switch based on the comparison between the device temperature and the second temperature; by setting the first temperature and the second temperature, a hysteresis region is formed, within which the heat dissipation device will not start and stop frequently, thereby reducing the wear of the heat dissipation device and prolonging its service life; in this embodiment, when the device temperature is greater than the first temperature, the first switch is turned on; when the device temperature is greater than the second temperature, the second switch is turned on.

[0034] Step S13: the first switch and the second switch are turned on, the heat sink starts to work and thus reduces the temperature of the device; the heat sink works, the temperature of the device gradually decreases, and when the temperature of the device drops to between the first temperature and the second temperature, the heat sink continues to work; when the temperature of the device is lower than the first temperature and the second temperature at the same time, the heat sink stops working; the hysteresis control can not only ensure that the device is cooled down in time at high temperature, but also can stop the operation of the heat sink in time when the temperature drops, thus avoiding unnecessary waste of resources; it can improve the heat dissipation efficiency while ensuring the safe operation of the device.

[0035] In summary, the present invention discloses a hysteresis control method including: obtaining the device temperature, the device temperature being the temperature of the device to be cooled at the current moment; controlling the on-off of the first switch based on the comparison between the device temperature and the first temperature, and controlling the on-off of the second switch based on the comparison between the device temperature and the second temperature; the first switch and the second switch are turned on, and the heat dissipation device starts to work and thus reduces the device temperature; when the device temperature drops to between the first temperature and the second temperature, the heat dissipation device continues to work; when the device temperature is lower than the first temperature and the second temperature at the same time, the heat dissipation device stops working. In the above manner, the present invention controls the start and stop of the heat dissipation device by setting two different temperature thresholds of the first temperature and the second temperature, thereby avoiding the problem of frequent startup and shutdown caused by temperature fluctuations near the critical point, and improving the stability and service life of the system.

[0036] In one embodiment, the first temperature is greater than the second temperature, that is, the device temperature first rises to the second temperature, the second switch is turned on, and the heat sink does not work at this time; when the device temperature rises to the first temperature, the first switch is turned on, and the heat sink gradually cools down; when the device temperature drops below the first temperature but higher than the second temperature, the heat sink continues to operate; when the device temperature drops below the second temperature, the heat sink stops working. In this embodiment, the first temperature is greater than the second temperature, and in other embodiments, the second temperature is greater than the first temperature, and no limitation is made here; the hysteresis value is the difference between the first temperature and the second temperature, that is, the hysteresis value is the value of the first temperature minus the second temperature. By setting the preset values ​​of the first temperature and the second temperature, the size of the hysteresis value can be adjusted to adjust the operating conditions of the heat sink, thereby improving the applicability of the hysteresis control method.

[0037] The present invention also provides a heat dissipation device that can use the above-mentioned hysteresis control method, such as Figure 2 As shown, Figure 2 The schematic diagram of the structure of an embodiment of the heat dissipation device provided by the present invention is as follows. The heat dissipation device comprises a temperature acquisition module 11 , a control module 12 and a heat dissipation fan 13 .

[0038] The temperature acquisition module 11 is used to collect temperature data of the device to be cooled; the temperature acquisition module 11 is connected to the control module 12, and the temperature data of the device to be cooled is sent to the control module 12; the temperature acquisition module 11 monitors the temperature of the device to be cooled in real time, and feeds the data back to the control module 12, so as to realize precise control of the operation of the cooling fan 13. This means that the cooling intensity can be adjusted according to actual needs, instead of simply running at full speed or stopping completely;

[0039] The input end of the control module 12 is connected to the output end of the temperature acquisition module 11, and the control end of the control module 12 is connected to the controlled end of the cooling fan 13; the control module 12 receives the temperature data of the device to be cooled sent by the temperature acquisition module 11, and controls the cooling fan 13 to operate for cooling based on the temperature data; accurate control of the operation of the cooling fan 13 can reduce the number of unnecessary starts, thereby reducing mechanical wear and extending the service life of the cooling fan;

[0040] The cooling fan 13 is used to dissipate heat for the device to be cooled. The cooling fan 13 generates airflow by rotating to help remove the heat generated by the device. In other embodiments, the cooling fan can be replaced by a cooling element such as a liquid cooling system, which is not limited here. The cooling fan 13 is only started when necessary, which not only improves the cooling efficiency but also reduces unnecessary energy consumption. Especially under low load conditions, it can avoid energy waste caused by excessive cooling.

[0041] In one embodiment, the heat dissipation device further includes a power supply module (not shown), which is respectively connected to the power supply end of the heat dissipation fan 13, the power supply end of the temperature acquisition module 11, and the power supply end of the control module 12; the power supply module serves as the power supply center of the entire heat dissipation device, and it can centrally manage the power distribution of all components to ensure that each part can obtain appropriate voltage and current supply. The power supply module has multiple power supply ports, each of which is responsible for providing power to different components such as the heat dissipation fan 13, the temperature acquisition module 11, and the control module 12. This design allows each component to have an independent power supply path, thereby avoiding power interference.

[0042] By centrally managing the power supply, the power supply module can ensure that all components can obtain stable power support under any circumstances. Even if a component has a problem, it will not affect the normal operation of other parts; the power supply module can adjust the output power according to the actual needs of each component to avoid unnecessary power waste. For example, when the temperature acquisition module 11 does not need to work frequently, its power supply can be appropriately reduced to reduce losses.

[0043] In one embodiment, the power supply module further includes a power conversion circuit, and the power input to the cooling fan 13, the temperature acquisition module 11, and the control module 12 is adjusted based on the power conversion circuit; the power conversion circuit in the power supply module can convert the input power into a voltage level suitable for each component according to the requirements of different components. For example, the cooling fan 13 may require a higher voltage to ensure sufficient wind force, while the temperature acquisition module 11 and the control module 12 may require a lower stable voltage; the power conversion circuit includes an AC / DC conversion circuit and / or a step-down circuit.

[0044] Through the power conversion circuit, it can be ensured that each component operates at the most suitable voltage, avoiding energy loss caused by voltage mismatch, thereby improving the energy efficiency of the entire system; each component can obtain a stable power supply, reducing the risk of unstable performance or failure due to voltage fluctuations.

[0045] In one embodiment, the control module 12 includes a data acquisition module 121 and a hysteresis control circuit 122; Figure 3 As shown, Figure 3 for Figure 2 A schematic diagram of the structure of an embodiment of a control module in FIG.

[0046] The data acquisition module 121 is connected to the temperature acquisition module 11, and the data acquisition module 121 acquires the device temperature by receiving the temperature data sent by the temperature acquisition module 11; in one embodiment, the data acquisition module 121 also includes a screening module, which determines whether the temperature data sent by the temperature acquisition module 11 is normal through the screening module. If it is abnormal, the hysteresis control circuit 122 is not controlled to work, thereby improving the accuracy of data transmission.

[0047] The hysteresis control circuit 122 is connected to the cooling fan 13. The hysteresis control circuit 122 controls whether the power supply module supplies power to the cooling fan 13 based on the device temperature. The hysteresis control circuit 122 compares the device temperature with the preset first temperature and second temperature. When the device temperature exceeds the first temperature, the hysteresis control circuit 122 starts the cooling fan 13; when the temperature drops below the second temperature, the cooling fan 13 stops working.

[0048] like Figure 4 As shown, Figure 4 for Figure 3 A structural diagram of an embodiment of a hysteresis control circuit in FIG.

[0049] The hysteresis control circuit 122 includes a first switch K1 and a second switch K2. The first switch K1 is connected in series with the second switch K2. The first switch K1 is turned on when the device temperature is higher than a first temperature, and the second switch K2 is turned on when the device temperature is higher than a second temperature.

[0050] The hysteresis control circuit 122 also includes a switch tube 1221, which is connected to the cooling fan 13, and the working state of the cooling fan 13 is controlled based on the switch tube 1221; in the present embodiment, the switch tube 1221 is a relay; the relay may be an electromagnetic relay, when the coil is energized, an electromagnetic effect is generated, and the normally closed contact is switched to the normally open contact, after the relay is powered off, the electromagnetic effect disappears, and the relay is reset by a spring, switching from the normally open contact to the normally closed contact; after the relay is powered on, the minimum current required to switch from the normally closed contact to the normally open contact is the pull-in current, and the current provided by the power supply to the electromagnetic relay should be greater than the pull-in current.

[0051] The switch tube 1221 includes a coil Q1, a third switch K3 and a fourth switch K4; the coil Q1 relay is turned on by the third switch K3 and the fourth switch K4; one end of the third switch K3 is connected to a side of the first switch K1 away from the second switch K2, and the other end of the third switch K3 is connected to a side of the first switch K1 close to the second switch K2; the fourth switch K4 is installed between the cooling fan 13 and the power supply, and controls whether the cooling fan 13 is powered on based on the on-off of the fourth switch K4.

[0052] The following describes in detail the working process of the hysteresis control circuit provided in this embodiment:

[0053] When the device temperature rises to the second temperature, the second switch K2 is closed, but at this time the first switch K1 is not closed, the coil Q1 is not energized, the fourth switch K4 is not closed, and the cooling fan 13 does not work;

[0054] When the temperature rises to the first temperature, the first switch K1 and the second switch K2 are both closed, the coil Q1 is energized, the third switch K3 and the fourth switch K4 are closed, and the heat dissipation fan 13 works to cool down the device to be cooled;

[0055] When the temperature drops below the first temperature but higher than the second temperature, the second switch K2 is closed, the first switch K1 is disconnected, the power supply powers the coil Q1 through the third switch K3 and the second switch K2, the fourth switch K4 is closed, and the cooling fan 13 works to cool the device to be cooled;

[0056] When the temperature drops below the second temperature, the second switch K2 is disconnected, the coil Q1 is not energized, the fourth switch K4 is disconnected, and the cooling fan 13 stops working.

[0057] For the above embodiment, the present invention provides a computer device, see Figure 5 , Figure 5 The computer device of the present invention comprises a memory and a processor, wherein the memory and the processor are coupled to each other, the memory stores program data, and the processor is used to execute the program data to implement the steps of any embodiment of the above-mentioned hysteresis control method.

[0058] In this embodiment, the processor may also be referred to as a CPU (Central Processing Unit). The processor may be an integrated circuit chip having signal processing capabilities. The processor may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0059] The method of the above embodiment can be implemented in the form of a computer program, so the present invention provides a computer readable storage medium, see Figure 6 , Figure 6 The computer-readable storage medium of the present invention is a schematic diagram of a structure of an embodiment of the computer-readable storage medium. The computer-readable storage medium stores program data that can be run by a processor, and the program data can be executed by the processor to implement the steps of any embodiment of the above-mentioned hysteresis control method.

[0060] The computer-readable storage medium in this embodiment may be a medium that can store program data, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, or may be a server that stores the program data. The server may send the stored program data to other devices for execution, or may execute the stored program data by itself.

[0061] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A hysteresis control method for a heat dissipation device, characterized in that: The method comprises: Obtaining device temperature, where the device temperature is the current temperature of the device to be cooled; Controlling the on-off of the first switch based on a comparison between the device temperature and the first temperature, and controlling the on-off of the second switch based on a comparison between the device temperature and the second temperature; The first switch and the second switch are turned on, and the heat dissipation device starts to work to reduce the temperature of the device; when the temperature of the device drops to between the first temperature and the second temperature, the heat dissipation device continues to work; when the temperature of the device is lower than the first temperature and the second temperature at the same time, the heat dissipation device stops working.

2. The method according to claim 1, characterized in that The first temperature is greater than the second temperature, and the hysteresis value is the difference between the first temperature and the second temperature.

3. A heat dissipation device using the hysteresis control method according to claim 1-2, characterized in that: The device comprises: A cooling fan, wherein the cooling fan is used to dissipate heat for the device to be cooled; A temperature acquisition module, the temperature acquisition module is used to collect temperature data of the device to be cooled; A control module, wherein the input end of the control module is connected to the output end of the temperature acquisition module, and the control end of the control module is connected to the controlled end of the cooling fan.

4. The device according to claim 3, characterized in that The device also includes a power supply module, which is respectively connected to a power supply end of the cooling fan, a power supply end of the temperature acquisition module, and a power supply end of the control module.

5. The device according to claim 4, characterized in that The power supply module further includes a power conversion circuit, and the power input to the cooling fan, the temperature acquisition module and the control module is adjusted based on the power conversion circuit.

6. The device according to claim 4, characterized in that The control module comprises: Data acquisition module, used to obtain device temperature; A hysteresis control circuit controls whether a power supply module supplies power to a cooling fan based on the device temperature.

7. The device according to claim 6, characterized in that The hysteresis control circuit includes a first switch and a second switch; the first switch is connected in series with the second switch; the first switch is turned on when the temperature of the device is higher than a first temperature, and the second switch is turned on when the temperature of the device is higher than a second temperature.

8. The device according to claim 7, characterized in that The hysteresis control circuit also includes a switch tube, which is connected to the cooling fan, and the working state of the cooling fan is controlled based on the switch tube; the switch tube includes a coil, a third switch and a fourth switch; when the coil is energized, the third switch and the fourth switch are turned on; one end of the third switch is connected to a side of the first switch away from the second switch, and the other end of the third switch is connected to a side of the first switch close to the second switch; the fourth switch is installed between the cooling fan and the power supply, and whether the cooling fan is powered on is controlled based on the on and off of the fourth switch.

9. An electronic device, characterized in that: The electronic device comprises: a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the steps of the method according to any one of claims 1 to 2.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores program data, and the program data can be executed by a processor to implement the steps of the method according to any one of claims 1 to 2.

Images