Polybutadiene acrylate photosensitive resin composition with self-healing property and application thereof in 405nm photocuring 3D printing

Abstract

The invention discloses a polybutadiene acrylate photosensitive resin composition with a self-healing property and an application of the polybutadiene acrylate photosensitive resin composition in 405nm photocuring 3D printing. The composition is prepared from the following raw materials in parts by mass: 1-60 parts of self-healing polybutadiene acrylate, 1-40 parts of a reactive diluent and 1-5 parts of a photoinitiator. The prepared photosensitive resin composition can be applied to 405nm photocuring 3D printing, has the capacity of printing a complex structure, is simple and convenient in preparation method, good in mechanical property and simple in self-repairing and recycling method, can keep good mechanical property after being repaired, and has important significance on 3D printing in some application fields with high requirements.

Description

Technical Field

[0001] The present invention relates to the preparation and application fields of photosensitive resins, and in particular to a self-healing polybutadiene acrylate photosensitive resin composition and application thereof in 405nm light-curing 3D printing. Background Art

[0002] When discussing the core raw material of light-curing 3D printing technology, photosensitive resin, we must first realize that the selection of this material, its inherent structural characteristics and the performance it exhibits are all directly related to the overall quality of the final 3D printed product. The reason why photosensitive resin is favored in many fields is that it has a series of significant advantages, such as rapid curing speed, high degree of curing, excellent light sensitivity, and unparalleled environmental protection characteristics. With the help of advanced 3D printing technology, we can use photosensitive resin to significantly improve the dimensional accuracy, surface quality, reliability and stability of products.

[0003] However, although photosensitive resins are popular in many fields such as manufacturing and chemical industries due to their rapid curing and molding characteristics, with the rapid development of science and technology, various industries have increasingly higher requirements for the accuracy, toughness, strength and weather resistance of printed parts. At present, the application types of photosensitive resins are relatively limited, which to a certain extent restricts the further development and breakthrough of light-curing 3D printing technology and becomes a bottleneck for technological progress in this field.

[0004] In order to break this bottleneck and promote the continuous development of 3D printing technology, we must be committed to the research and development of photosensitive resin composite / modified materials. Through innovative research, we can develop more types of photosensitive resin composite / modified materials and continuously optimize their performance, so as to ensure that 3D printing technology can be widely used in more fields and achieve continuous technological breakthroughs. Self-healing materials, as a new type of intelligent materials, have unique functions, that is, they can sense changes in the external environment and integrate driving mechanisms and information processing capabilities. This type of material simulates the mechanism of natural damage repair in organisms and demonstrates the ability to automatically repair and heal when suffering internal or external damage. The core lies in the energy and material replenishment mechanism, which imitates the natural principle of damage healing in organisms and gives the material the ability to repair damage autonomously. Summary of the invention

[0005] In view of the situation and shortcomings of the prior art, the purpose of the present invention is to provide a self-healing polybutadiene acrylate photosensitive resin composition with good mechanical properties and high self-healing efficiency and its application in 405nm photocuring 3D printing. By introducing disulfide bonds into the main chain of the molecule, the self-healing function of the photocurable resin is realized, and the structure and properties of the self-healing resin are studied. The prepared self-healing photocurable resin broadens the application of polybutadiene, and a 3D printing material with good molding properties, excellent mechanical properties and reusability can be obtained.

[0006] In order to achieve the above technical objectives, the technical solution adopted by the present invention is:

[0007] A self-healing polybutadiene acrylate photosensitive resin composition is prepared from the following raw materials in parts by weight:

[0008] 1-60 parts of self-healing polybutadiene acrylate

[0009] Active diluent 1-40 parts

[0010] Photoinitiator 1-5 parts

[0011] The molecular formula of the self-healing polybutadiene acrylate is shown in formula (1):

[0012]

[0013] Wherein, m=1, 2 or 3; x=27-65, y=10-20, z=5-15, and the structural formula of R1, R2, and R3 is any of the following:

[0014]

[0015] Furthermore, the preparation method of the self-healing polybutadiene acrylate is as follows:

[0016] (1) Mixing 100 parts of hydroxy-terminated polybutadiene and 200 parts of diisocyanate by mole, then adding a solvent and 0.1 to 2 parts of a catalyst, and reacting at 60 to 100° C. for 1 to 3 hours under N2 protection to obtain a prepolymer A;

[0017] (2) adding 200 parts by mole of a hydroxyl-containing acrylic monomer to prepolymer A, reacting at 50 to 90° C. for 1 to 3 hours to obtain prepolymer B;

[0018] (3) Prepolymer B is mixed with a thiol compound containing -SH, with -NCO:-SH = (m-1):m by mole, where m is the number of -SH functional groups of the thiol compound, and the mixture is reacted at 30 to 70° C. for 1 to 3 hours. After the reaction is complete, the solvent is removed by a vacuum water pump to obtain a polybutadiene acrylate having self-healing properties.

[0019] Wherein, the polybutadiene is one or more of 1,2 addition polybutadiene, trans 1,4 addition polybutadiene, cis 1,4 addition polybutadiene. The diisocyanate is one or more of toluene diisocyanate, hexamethylene diisocyanate, 4,4′-diphenylmethane diisocyanate, polymethylene polyphenyl polyisocyanate, isophorone diisocyanate, triphenylmethane triisocyanate, xylene diisocyanate, 1,4-cyclohexylene diisocyanate, 1,4-tetrahydronaphthylene diisocyanate; the catalyst in step (1) is one or more of dibutyltin dilaurate, stannous isooctanoate, zinc isooctanoate, bismuth isooctanoate; the solvent is toluene, pentylene, isocyanate ... The hydroxyl-containing acrylic monomer in step (2) is one or more of hydroxyethyl methacrylate, hydroxypropyl methacrylate, and pentaerythritol triacrylate; the -SH-containing thiol compound in step (3) is one or more of 1,3-propanedithiol, 2,2'-(1,2-ethylenedioxy)bis(ethylenethiol), trimethylolpropane tris(3-mercaptopropionate), and pentaerythritol tetrakis-3-mercaptopropionate;

[0020] Preferably, the diluent is selected from at least one of styrene, acrylate diluents, hydroxyacrylate diluents, vinyl ether diluents, and cyclohexane diluents. The acrylate diluent is selected from at least one of methyl methacrylate, lauryl methacrylate, 1,6-hexanediol diacrylate, tetrahydrofuran acrylate, tripropylene glycol diacrylate, hexanediol diacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, pentaerythritol acrylate, isobornyl acrylate, and cyclotrimethylolpropane formal acrylate; the hydroxyacrylate diluent is selected from at least one of hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxyethyl acrylate, and acrylic acid; the vinyl ether diluent is selected from at least one of 4-hydroxybutyl vinyl ether and diethylene glycol divinyl ether; the cyclohexane diluent is selected from at least one of 4-vinyl epoxycyclohexane and 4-vinyl epoxycyclohexane.

[0021] Preferably, the photoinitiator is selected from at least one of acylphosphine oxide photoinitiators and aromatic ketone photoinitiators. The acylphosphine oxide photoinitiator is selected from at least one of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide and 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide; the aromatic ketone photoinitiator is selected from at least one of 1-hydroxy-cyclohexyl-acetophenone, α,α-dimethyl-α-hydroxyacetophenone, p-isopropylphenyl-2-hydroxydimethylacetone-1, benzophenone, chlorinated benzophenone, acrylated benzophenone, 4-phenylbenzophenone, 2-chlorinated thioxanthone, isopropyl thioxanthone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, dimethyl thioxanthone, diethyl thioxanthone, dichloro thioxanthone, 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinobenzylphenyl)butanone.

[0022] Preferably, the preparation method of the self-healing polybutadiene acrylate photosensitive resin composition is: mix an appropriate amount of self-healing polybutadiene acrylate and an active diluent, heat the mixture to 30-80°C, stir and mix evenly, then add a photoinitiator, stir until evenly mixed to obtain a transparent viscous liquid, and thus obtain the self-healing polybutadiene acrylate photosensitive resin composition.

[0023] The self-healing polybutadiene acrylate photosensitive resin composition can be applied to 405nm photocuring 3D printing: the self-healing polybutadiene acrylate photosensitive resin composition is poured into a photocuring 3D printer, and the single-layer printing layer thickness parameter is set to 5-200 μm through a 3D printing computer software program to print molded parts of any size.

[0024] The self-repair method of light-curing 3D printed parts is to bond the broken printed sample sections together and bond and repair them under a certain temperature and pressure, so that the parts can restore their structure and performance. The temperature is 20-200°C, the pressure is 0.5-3.5MPa, and the bonding and repair time is 1min-4h.

[0025] By adopting the above-mentioned technical scheme, the present invention has the following beneficial effects compared with the prior art: the present invention introduces sulfur-containing dynamic cross-linking bonds into polybutadiene acrylate, and the prepared polybutadiene acrylate has repairable properties, high transparency, flexibility and other characteristics, and the contained polythiourea dynamic bonds can be continuously disconnected and combined during the curing process, playing a role in repairing cracks. The self-healing polybutadiene acrylate is further prepared into a photosensitive resin composition with an active diluent and a photoinitiator, which retains the high elasticity and stretchable properties of polybutadiene. The printed products not only have good mechanical properties but also can be self-repaired, and the self-repairing method is simple, and good mechanical properties can be maintained after repair. At the same time, the self-healing polybutadiene acrylate photosensitive resin composition for 3D printing provided by the present invention has good printability, the ability to print complex structures, and low preparation cost, which can effectively reduce the price of 405nm 3D printing resin, and lay the foundation for the large-scale application of 405nm 3D printing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The invention discloses a synthetic route for the self-healing polybutadiene acrylate.

[0027] Figure 2 The FI-RT, 1 H-NMR.

[0028] Figure 3 It is the stress-strain curve of the printed sample of the polybutadiene acrylate photosensitive resin composition with self-healing property prepared in Examples 1-5 of the present invention.

[0029] Figure 4 This is a stress-strain curve of a 3D printed sample of a self-healing polybutadiene acrylate photosensitive resin composition prepared in Example 5 of the present invention after self-healing after being cut.

[0030] Figure 5 This is a microscopic image of the fracture scar of a 3D printed sample of a self-healing polybutadiene acrylate photosensitive resin composition prepared in Example 5 after being cut and self-healed. DETAILED DESCRIPTION

[0031] The scheme of the present invention is further described below in conjunction with specific implementation modes.

[0032] The raw materials involved in the following examples are as follows:

[0033] The self-healing polybutadiene acrylates are abbreviated as A-1, A-2 and A-3, and the preparation methods are as follows:

[0034] Self-healing polybutadiene acrylate A-1

[0035] (1) In a round-bottom flask containing 120 g of hydroxy-terminated polybutadiene (hydroxyl value: 0.7 mmol / g), 14.64 g of toluene diisocyanate and 100 g of ethyl acetate were added, N2 was introduced for protection, 0.2 g of dibutyltin dilaurate as a catalyst was added, and the mixture was reacted at 85° C. for 2 hours to obtain prepolymer A;

[0036] (2) reacting prepolymer A with 5.48 g of hydroxyethyl methacrylate at 75° C. for 1.5 hours to obtain prepolymer B;

[0037] (3) Weigh 7.68 g of 2,2'-(1,2-ethylenedioxy)bis(ethyl mercaptan) and dissolve it in 20 g of ethyl acetate. Use a constant pressure dropping funnel to slowly drop it into prepolymer B at a rate of 2 drops / second. React at 70° C. for 1.5 hours. After the reaction is complete, remove the ethyl acetate with a vacuum water pump to obtain a self-healing polyurethane acrylate A-1, which has the structural formula:

[0038]

[0039] R1: R2: R3: Self-healing polyurethane acrylate A-2

[0040] (1) In a round-bottom flask containing 120 g of hydroxy-terminated polybutadiene (hydroxyl value: 0.7 mmol / g), 14.64 g of toluene diisocyanate and 100 g of ethyl acetate were added, N2 was introduced for protection, 0.2 g of dibutyltin dilaurate as a catalyst was added, and the mixture was reacted at 85° C. for 2 hours to obtain prepolymer A;

[0041] (2) reacting prepolymer A with 5.48 g of hydroxyethyl methacrylate at 75° C. for 1.5 hours to obtain prepolymer B;

[0042] (3) Weigh 9.84 g of trimethylolpropane tris(3-thiopropionate) and dissolve it in 20 g of ethyl acetate. Use a constant pressure dropping funnel to slowly drop it into the prepolymer B at a rate of 2 drops / second. React at 70° C. for 1.5 hours. After the reaction is complete, remove the ethyl acetate with a vacuum water pump to obtain a self-healing polybutadiene acrylate A-2, whose structural formula is:

[0043] R1: R2: R3: Self-healing polyurethane acrylate A-3

[0044] (1) In a round-bottom flask containing 120 g of hydroxy-terminated polybutadiene (hydroxyl value: 0.7 mmol / g), 14.64 g of toluene diisocyanate and 100 g of acetone were added, N2 protection was introduced, 0.2 g of dibutyltin dilaurate as a catalyst was used, and the mixture was reacted at 85°C for 2 hours to obtain prepolymer A.

[0045] (2) Prepolymer A was reacted with 5.48 g of hydroxyethyl methacrylate at 75° C. for 1.5 hours to obtain prepolymer B.

[0046] (3) Weigh 7.68 g of 2,2'-(1,2-ethylenedioxy)bis(ethanethiol) and dissolve it in 20 g of acetone. Use a constant pressure dropping funnel to slowly drop it into the prepolymer B at a rate of 1 drop / second and react at 70° C. for 1.5 hours. After the reaction is complete, remove the acetone with a vacuum water pump to obtain a self-healing polybutadiene acrylate A-3, whose structural formula is:

[0047]

[0048] R1: R2: R3:

[0049] Thinner:

[0050] Acrylic acid morpholine: purchased from Shanghai Youming Chemical Co., Ltd., abbreviated as B-1;

[0051] Lauryl methacrylate: purchased from Guangdong Lihou Trading Co., Ltd., abbreviated as B-2;

[0052] Photoinitiator:

[0053] 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide, purchased from Aladdin Reagent (Shanghai) Co., Ltd., product number photoinitiator TPO, abbreviated as C-1;

[0054] 1-Hydroxy-cyclohexyl-acetophenone: purchased from Aladdin Reagent (Shanghai) Co., Ltd., product number photoinitiator 184, abbreviated as C-2;

[0055] Examples 1-6

[0056] The polybutadiene acrylate photosensitive resin composition with self-healing properties has a specific formula as shown in Table 1, and correspondingly obtains 1# to 6# resin compositions:

[0057] Table 1 Example 1-6 formulation

[0058]

[0059] The preparation steps are as follows: mix the self-healing polybutadiene acrylate and diluent and heat them to 30-80°C, add the photoinitiator after stirring and mixing evenly, stir until evenly to obtain a transparent viscous liquid, and obtain the self-healing polybutadiene acrylate photosensitive resin composition samples (1#~6#).

[0060] The prepared photosensitive resin composition is poured into a 3D printer produced by Shenzhen YIDIMU Intelligent Technology Co., Ltd. and formed through computer modeling, composition and printing.

[0061] For the product prepared in the above embodiment, the mechanical properties of the self-healing polybutadiene acrylate photosensitive resin composition before and after self-healing were observed and evaluated:

[0062] Self-repair method for photocurable 3D printed parts: Laminating the broken printed sample sections, laminating and repairing them under a certain temperature and pressure, and the parts can restore their structure and performance. The temperature range is 20-200°C, the pressure is 0.5-3.5MPa, and the laminating and repairing time is 1min-4h.

[0063] See attached Figure 2 , which are FI-RT, 1 H-NMR, A-1 and A-2 have similar structures. The only difference is the different number of -SH in the cross-linking monomer containing thiol groups, which leads to different number of photosensitive groups in the final product. Therefore, their FI-RT, 1 There is no significant difference in H-NMR. From FI-RT, we can see that A-1 and A-2 have the same wavelength at 2250-2200 cm -1 The characteristic absorption peak of the NCO group at 1722 cm-1 disappeared, indicating that the -NCO in TDI had completely reacted with the -OH in HTPB and the -OH in HTPB. -1 、1673cm -1 and 1223cm -1 The vibration absorption peaks of -NHCOO-, -C=C-, and -CN- can also show the reaction of -NCO and -OH, and the successful integration of the acrylic acid double bond into the product. In addition, the peak at 1230 cm -1 The -SC- bonds at the ends of the sulfhydryl groups can be used to prove that the crosslinking monomers containing thiol groups are successfully incorporated into A-1 and A-2. 1HNMR analysis showed that the peak at 5.4 ppm (11, 20) was attributed to the protons on -CH=CH- in the 1,4 structural unit of the polybutadiene main chain, the peaks at 4.80 and 5.69 ppm (16, 17) were attributed to the protons on -CH=CH2- in the 1,2 structural unit of the main chain, the peaks at 1.10-2.15 ppm (13, 14, 15, 18) corresponded to the protons on -CH- in the 1,2 structural unit of the main chain and the protons on -CH2- in the 1,2 structural unit and the 1,4 structural unit, respectively, the peaks at 7-7.5 ppm and 2.5 ppm corresponded to the protons on the benzene ring of TDI (7, 8, 9) and the methyl group (6) on the benzene ring, and most importantly, the peaks at 7.6 ppm and 2 ppm were attributed to the protons on -NH- in the carbamate formed by the reaction of -NCO in TDI and -OH in HTPB and the protons on the double bond in acrylate, respectively. Analysis showed that the product synthesis was consistent with expectations.

[0064] See attached Figure 3 , which are the stress-strain curves of the printed samples of the self-healing polybutadiene acrylate photosensitive resin composition prepared in Examples 1-5 of the present invention. It can be seen that the tensile strength and elongation at break of the products of each example are both above 7MPa and 200%, showing good mechanical properties, and the mechanical properties of Example 5 are more outstanding, with the tensile strength and elongation at break reaching 9.8MPa and 383% respectively, so it is used to explore the self-healing properties of the material.

[0065] See attached Figure 4 , which are the tensile curves of the self-healing polybutadiene acrylate photosensitive resin composition printed samples prepared in Example 5 of the present invention. The results show that after 0.5h-4h hot press repair, the tensile strength and elongation at break of the repaired material increased from 2.50MPa and 34.47% to 7.63MPa and 237.05% respectively. The tensile strength and elongation at break repair efficiency can reach up to 77.9% and 62.0%.

[0066] See attached Figure 5 The results show that the magnified image of the cut part with a metallographic microscope shows that all the cut strips are restored and connected together. As the self-healing time increases, the fracture marks become less and less obvious, indicating that the material has good self-healing properties.

[0067] The above are only a few embodiments of the present application and do not constitute any form of limitation to the present application. Although the present application is disclosed as above with preferred embodiments, it is not intended to limit the present application. Any technician familiar with the profession, without departing from the scope of the technical solution of the present application, using the above disclosed technical content to make slight changes or modifications are equivalent to equivalent implementation cases and fall within the scope of the technical solution.

Claims

1. A self-healing polybutadiene acrylate photosensitive resin composition, characterized in that: It is prepared from the following raw materials in parts by weight: 1-60 parts of self-healing polybutadiene acrylate Active diluent 1~40 parts Photoinitiator 1-5 parts The molecular formula of the self-healing polybutadiene acrylate is shown in formula (1): Wherein, m=1, 2 or 3; x=27-65, y=10-20, z=5-15, and the structural formula of R1, R2, and R3 is any of the following:

2. The self-healing polybutadiene acrylate photosensitive resin composition according to claim 1, characterized in that: The preparation method of the self-healing polybutadiene acrylate is as follows: (1) mixing terminal hydroxyl polybutadiene and diisocyanate, then adding solvent and catalyst, reacting at 60-100° C. for 1-3 hours under N2 protection to obtain prepolymer A; (2) adding a hydroxyl-containing acrylic acid monomer to prepolymer A, reacting at 50-90° C. for 1-3 hours to obtain prepolymer B; (3) Prepolymer B is mixed with a thiol compound containing -SH, with -NCO:-SH = (m-1):m by mole, where m is the number of -SH functional groups of the thiol compound, and the mixture is reacted at 30 to 70° C. for 1 to 3 hours. After the reaction is complete, the solvent is removed by a vacuum water pump to obtain a polybutadiene acrylate having self-healing properties.

3. The self-healing polybutadiene acrylate photosensitive resin composition according to claim 2, characterized in that: The polybutadiene described in step (1) is one or more of 1,2 addition polybutadiene, trans-1,4 addition polybutadiene, and cis-1,4 addition polybutadiene; the diisocyanate is one or more of toluene diisocyanate, hexamethylene diisocyanate, 4,4′-diphenylmethane diisocyanate, polymethylene polyphenyl polyisocyanate, isophorone diisocyanate, triphenylmethane triisocyanate, xylene diisocyanate, 1,4-cyclohexylene diisocyanate, and 1,4-tetrahydronaphthylene diisocyanate; the catalyst is one or more of dibutyltin dilaurate, stannous isooctanoate, zinc isooctanoate, and bismuth isooctanoate; the solvent is one or more of toluene, pentane, hexane, ether, ethyl acetate, ethyl acetate, and acetone.

4. The self-healing polybutadiene acrylate photosensitive resin composition according to claim 2, characterized in that: The hydroxyl-containing acrylic monomer in step (2) is one or a combination of hydroxyethyl methacrylate, hydroxypropyl methacrylate, and pentaerythritol triacrylate; the -SH-containing thiol compound in step (3) is one or a combination of 1,3-propanedithiol, 2,2'-(1,2-ethylenedioxy)diethylthiol, trimethylolpropane tris(3-mercaptopropionate), and pentaerythritol tetrakis-3-mercaptopropionate.

5. The self-healing polybutadiene acrylate photosensitive resin composition according to claim 1, characterized in that: The diluent is selected from at least one of styrene, acrylate diluents, hydroxyacrylate diluents, vinyl ether diluents, and cyclohexane diluents. The acrylate diluent is selected from at least one of methyl methacrylate, lauryl methacrylate, 1,6-hexanediol diacrylate, tetrahydrofuran acrylate, tripropylene glycol diacrylate, hexanediol diacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, pentaerythritol acrylate, isobornyl acrylate, and cyclotrimethylolpropane formal acrylate; the hydroxyacrylate diluent is selected from at least one of hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxyethyl acrylate, and acrylic acid; the vinyl ether diluent is selected from at least one of 4-hydroxybutyl vinyl ether and diethylene glycol divinyl ether; the cyclohexane diluent is selected from at least one of 4-vinyl epoxycyclohexane and 4-vinyl epoxycyclohexane.

6. The self-healing polybutadiene acrylate photosensitive resin composition according to claim 1, characterized in that: The photoinitiator is selected from at least one of acylphosphine oxide photoinitiators and aromatic ketone photoinitiators; the acylphosphine oxide photoinitiator is selected from at least one of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide and 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide; the aromatic ketone photoinitiator is selected from at least one of 1-hydroxy-cyclohexyl-acetophenone, α,α-dimethyl-α-hydroxyacetophenone, p-isopropylphenyl-2-hydroxydimethylacetone-1, benzophenone, chlorinated benzophenone, acrylated benzophenone, 4-phenylbenzophenone, 2-chlorinated thioxanthone, isopropyl thioxanthone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, dimethyl thioxanthone, diethyl thioxanthone, dichloro thioxanthone, and 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinobenzylphenyl)butanone.

7. A method for preparing the self-healing polybutadiene acrylate photosensitive resin composition according to any one of claims 1 to 6, characterized in that: The self-healing polybutadiene acrylate and active diluent are mixed and heated to 30-80° C., and after being stirred and mixed evenly, a photoinitiator is added, and after being stirred until evenly mixed, a self-healing polybutadiene acrylate photosensitive resin composition is obtained.

8. Use of the self-healing polybutadiene acrylate photosensitive resin composition according to any one of claims 1 to 6 in 405nm photocuring 3D printing.

9. The use according to claim 8, characterized in that: The self-healing polybutadiene acrylate photosensitive resin composition is poured into a light-curing 3D printer, and a single-layer printing layer thickness parameter is set to 5 to 200 μm through a 3D printing computer software program to print a light-curing 3D printed part.

10. The self-repairing method of a light-cured 3D printed part obtained by application according to claim 9, characterized in that: The damaged printed sample sections are bonded together and repaired at a temperature of 20-200°C and a pressure of 0.5-3.5Mpa, and the structure and performance of the product can be restored.

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