Resin composition as well as preparation method and application thereof
By developing a resin composition for flexible circuit boards, the problem of poor adhesion between elastic lines and substrates is solved, and high adhesion and low resistance of conductive lines are achieved, and suitable for a variety of substrates.
Patent Information
- Application Number
- CN202411369520.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-01-07
AI Technical Summary
When printing flexible circuit boards, the adhesion between the elastic circuit and the substrate is poor, resulting in tensile cracking problems. Moreover, due to the poor flatness of the substrate surface, the elastic circuit cannot be printed directly, resulting in a large resistance.
Develop a resin composition, including components A, B, and C, which is prepared by specific mixing and stirring steps, and after forming a coating, it forms a conductive line on its surface, thereby improving the adhesion and flatness of the conductive line to the substrate, and reducing resistance.
It effectively improves the adhesion and flatness between the conductive lines and the substrate, reduces the product's resistance, and is suitable for a variety of substrates, including silicone, rubber and TPU.
Smart Images
Figure BDA0005067193340000131 
Figure BDA0005067193340000141
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of new materials, and in particular to a resin composition and a preparation method and application thereof. Background Art
[0002] Flexible printed circuit (FPC), also known as "soft board", is a printed circuit made of flexible materials (such as cloth, rubber, silicone, etc.) as the base material. In order to ensure that the flexible circuit board can be bent or extended within a certain range, its circuit pattern is mostly elastic.
[0003] However, when printing flexible circuit boards, due to the particularity of the flexible substrate, the adhesion between the elastic circuit and the substrate is poor, and in severe cases, problems such as stretching cracks are prone to occur. In addition, substrates such as elastic fabrics cannot be used to directly print elastic circuits due to their poor surface flatness.
[0004] In view of this, the present invention is proposed. Summary of the invention
[0005] The purpose of the present invention is to provide a resin composition for elastic circuits. The difficulty of its research and development lies mainly in that after forming a coating on the surface of a substrate, a conductive circuit is formed on the surface of the coating using a conductive paste. On the one hand, the adhesion between the conductive circuit and the substrate is still not ideal. On the other hand, compared with directly forming a conductive circuit on the surface of the substrate, the resistance of the product obtained in this way is very large. After exploring and optimizing the key factors affecting the above effects, the present invention provides a resin composition and a preparation method and application thereof.
[0006] Specifically, the present invention first provides a resin composition, comprising: component A, component B and component C;
[0007] By mass ratio, component A: component B: component C = (9-14): (4-8): (1-3).
[0008] Furthermore, the component A is prepared by a method comprising the following steps:
[0009] Step (1), mixing the first resin and the first solvent, and stirring at 80-120° C. and 200±50 rpm for 48-72 hours;
[0010] Step (2), mixing the mixture obtained in step (1) with the first auxiliary agent, stirring at a rotation speed of more than 500 rpm for 2-5 hours, and then stirring at 60-80° C. and 100-200 rpm for 2-4 hours.
[0011] Furthermore, the first resin is selected from one or more of TPU or SEBS with a molecular weight greater than 50,000.
[0012] Furthermore, the first solvent is selected from one or more of ketones, ethers, lipids and alcohols having a boiling point higher than 150°C.
[0013] Furthermore, the first auxiliary agent is selected from one or more of liquid styrene-butadiene rubber, liquid nitrile rubber, and liquid silicone rubber.
[0014] Furthermore, in terms of mass ratio, the first resin: the first solvent: the first auxiliary agent = (8-17.5): (24-55): (1.2-3.6).
[0015] Furthermore, the component B is prepared by a method comprising the following steps:
[0016] Step (1), mixing the second resin and the second solvent, and stirring at 80-120° C. and 200±50 rpm for 24-36 hours;
[0017] Step (2), cooling the mixture obtained in step (1) to 60-80° C., mixing with a modifier, and stirring at a speed of 500±50 rpm for 4-6 hours;
[0018] Step (3), cooling the mixture obtained in step (2) to room temperature (25° C.), mixing it with a curing accelerator, and stirring it at a speed of 500±50 rpm for 0.2-1 h.
[0019] Furthermore, the second resin is selected from one or more of amino-modified epoxy resins and epoxy-modified acrylic resins.
[0020] Furthermore, the second solvent is selected from one or more of ketone solvents, ether solvents, and halogenated hydrocarbon solvents having a boiling point higher than 150°C.
[0021] Furthermore, the modifier is selected from one or more of polyols, glycidyl ethers, and styrene.
[0022] Furthermore, the curing accelerator is selected from one or more of blocked isocyanate and modified amine.
[0023] Furthermore, in terms of mass ratio, the second resin: the second solvent: the modifier: the curing accelerator = (5-10): (10-30): (2.5-5): (2.5-6).
[0024] Furthermore, the component C is prepared by a method comprising the following steps: adding the second auxiliary agent and the third auxiliary agent to the third solvent in sequence at 30-50°C and 100-200rpm, cooling to room temperature (25°C), and stirring at a speed of more than 500rpm for 4-6h.
[0025] Furthermore, the second auxiliary agent is selected from one or more of aminosilane coupling agent, mercaptosilane coupling agent, epoxysilane coupling agent, titanate coupling agent, nano-fumed silica, polyamide wax, polyethylene glycol, butanediol, and fatty acid ester.
[0026] Furthermore, the third auxiliary agent is selected from one or more of a leveling agent, a defoaming agent, and an antioxidant.
[0027] Furthermore, the third solvent is a mixture of a lipid solvent and a benzene solvent.
[0028] Furthermore, in terms of mass ratio, the second auxiliary agent: the third auxiliary agent: the third solvent = (2.5-7.5): (0.5-2.5): (1.25-9).
[0029] The present invention finds that a resin composition prepared by mixing component A, component B and component C respectively prepared in the above manner, after forming a coating on the surface of a substrate, and then forming a conductive circuit on the surface of the coating using a conductive paste, can not only effectively improve the bonding ability between the coating and the adhesive material in the conductive paste, but also reduce the bonding ability between the coating and the conductive particles in the conductive paste, thereby improving the dispersibility of the conductive particles, that is, improving the adhesion between the conductive circuit and the substrate, thereby improving the flatness of the conductive circuit, and reducing the product resistance.
[0030] The present invention also provides a method for preparing the above-mentioned resin composition, comprising: uniformly mixing component A, component B and component C, and then grinding and degassing.
[0031] In a specific embodiment, grinding is performed using a triple roll mill.
[0032] The present invention also provides application of the above resin composition in a circuit board, preferably in a flexible circuit board.
[0033] The present invention also provides an electronic device, comprising a laminated substrate, a coating and a conductive circuit, wherein the coating is formed by printing the above-mentioned resin composition and heating and curing it.
[0034] Furthermore, the printing method is screen printing, pad printing or roller printing.
[0035] Furthermore, the material of the substrate is elastic material.
[0036] Furthermore, the temperature of the heating and curing is 80-140°C.
[0037] In the present invention, the resin composition can be adapted to a variety of substrates (especially elastic material substrates), and the coating formed by the resin composition can improve the adhesion between the substrate and the conductive circuit, and can also be cured at low temperature.
[0038] Based on the above scheme, the beneficial effects of the present invention are as follows:
[0039] The coating formed by the resin composition provided by the present invention has a thickness between 0.5-5 μm, an elongation at break of >500%, and a peeling force of >7 N / cm, which can provide a dense and smooth surface for the substrate, greatly improve the adhesion between the conductive circuit and the substrate, and the coating is suitable for substrates of various materials (such as silicone, rubber, TPU, cloth, etc.), and at the same time, has good conductivity. DETAILED DESCRIPTION
[0040] The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.
[0041] If no specific techniques or conditions are specified in the examples, the techniques or conditions described in the literature in the field or the product instructions are used. If no manufacturer is specified for the reagents or instruments used, they are all conventional products that can be purchased through regular channels.
[0042] Example 1
[0043] This embodiment provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 9:8:3; wherein,
[0044] The preparation method of the component A is as follows:
[0045] Step (1), 8.0 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 35.8 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 80° C. and 200 rpm for 72 hours;
[0046] Step (2), mixing the mixture obtained in step (1) with 1.2 parts of the first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 hours, and then stirring at 80° C. and 200 rpm for 4 hours.
[0047] The preparation method of the second component is as follows:
[0048] Step (1), 10 parts of the second resin (amino-modified epoxy resin) and 20 parts of the second solvent (DEAC) were mixed and stirred at 120° C. and 200 rpm for 36 hours;
[0049] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 5.0 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0050] Step (3), cooling the mixture obtained in step (2) to room temperature, mixing it with 5.0 parts of a curing accelerator (blocked isocyanate), and stirring at 500 rpm for 1 hour.
[0051] The preparation method of the third component is as follows:
[0052] At 50°C and 200rpm, 7.5 parts of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 1.3 parts of the third auxiliary agent were added to 6.3 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 700rpm for 6h.
[0053] Example 2
[0054] This embodiment provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 14:4:2; wherein,
[0055] The preparation method of the component A is as follows:
[0056] Step (1), 17.5 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 4:1) and 50.8 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 80° C. and 230 rpm for 60 h;
[0057] Step (2), mixing the mixture obtained in step (1) with 1.8 parts of a first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0058] The preparation method of the second component is as follows:
[0059] Step (1), 5.0 parts of the second resin (amino-modified epoxy resin) and 10 parts of the second solvent (DEAC) were mixed and stirred at 100° C. and 200 rpm for 30 h;
[0060] Step (2), cooling the mixture obtained in step (1) to 60° C., mixing with 2.5 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 550 rpm for 5 hours;
[0061] Step (3), cooling the mixture obtained in step (2) to room temperature, mixing it with 2.5 parts of a curing accelerator (blocked isocyanate), and stirring at 480 rpm for 0.5 h.
[0062] The preparation method of the third component is as follows:
[0063] At 40°C and 200rpm, 4.0 parts of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 2.0 parts of the third auxiliary agent were added to 4.0 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 600rpm for 6h.
[0064] Example 3
[0065] This embodiment provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 11:8:1; wherein,
[0066] The preparation method of the component A is as follows:
[0067] Step (1), 10 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 43 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 80° C. and 200 rpm for 72 hours;
[0068] Step (2), mixing the mixture obtained in step (1) with 2.0 parts of a first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0069] The preparation method of the second component is as follows:
[0070] Step (1), 10 parts of the second resin (epoxy-modified acrylic resin) and 20 parts of the second solvent (DEAC) were mixed, and stirred at 110° C. and 200 rpm for 30 h;
[0071] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 5.0 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0072] Step (3), cooling the mixture obtained in step (2) to room temperature, mixing it with 5.0 parts of a curing accelerator (modified amine), and stirring at 500 rpm for 0.8 h.
[0073] The preparation method of the third component is as follows:
[0074] At 40°C and 150rpm, 2.5 parts of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 1.3 parts of the third auxiliary agent were added to 1.3 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 800rpm for 4h.
[0075] Example 4
[0076] This embodiment provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 14:5:1; wherein,
[0077] The preparation method of the component A is as follows:
[0078] Step (1), 17.5 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 50.8 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 100° C. and 200 rpm for 70 hours;
[0079] Step (2), mixing the mixture obtained in step (1) with 1.8 parts of a first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0080] The preparation method of the second component is as follows:
[0081] Step (1), 6.0 parts of the second resin (amino-modified epoxy resin) and 13 parts of the second solvent (DEAC) were mixed and stirred at 120° C. and 200 rpm for 36 hours;
[0082] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 3.0 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0083] Step (3), cooling the mixture obtained in step (2) to room temperature, mixing it with 3.0 parts of a curing accelerator (blocked isocyanate), and stirring at 500 rpm for 1 hour.
[0084] The preparation method of the third component is as follows:
[0085] At 40°C and 180rpm, 2.5 parts of the second auxiliary agent (a mixture of equal proportions of aminosilane coupling agent, mercaptosilane coupling agent, epoxysilane coupling agent, polyamide wax and polyethylene glycol) and 1.3 parts of the third auxiliary agent were added to 1.3 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 700rpm for 6h.
[0086] Example 5
[0087] This embodiment provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 13:4:3; wherein,
[0088] The preparation method of the component A is as follows:
[0089] Step (1), 13.5 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 50 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 80° C. and 200 rpm for 72 hours;
[0090] Step (2), mixing the mixture obtained in step (1) with 1.5 parts of a first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0091] The preparation method of the second component is as follows:
[0092] Step (1), 5.0 parts of the second resin (amino-modified epoxy resin) and 10 parts of the second solvent (DEAC) were mixed and stirred at 120° C. and 200 rpm for 36 hours;
[0093] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 2.5 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0094] Step (3), after cooling the mixture obtained in step (2) to room temperature, mix it with 2.5 parts of curing accelerator (blocked isocyanate), and stir it at 500 rpm for 1 hour.
[0095] The preparation method of the third component is as follows:
[0096] At 50°C and 200rpm, 7.5 parts of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 1.3 parts of the third auxiliary agent were added to 6.3 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 700rpm for 6h.
[0097] Example 6
[0098] This embodiment provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 11:6:3; wherein,
[0099] The preparation method of the component A is as follows:
[0100] Step (1), 10 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 43 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 80° C. and 200 rpm for 72 hours;
[0101] Step (2), mixing the mixture obtained in step (1) with 2.0 parts of a first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0102] The preparation method of the second component is as follows:
[0103] Step (1), 7.0 parts of the second resin (amino-modified epoxy resin) and 16 parts of the second solvent (DEAC) were mixed and stirred at 120° C. and 200 rpm for 36 hours;
[0104] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 3.5 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0105] Step (3), after cooling the mixture obtained in step (2) to room temperature, mix it with 3.5 parts of curing accelerator (blocked isocyanate), and stir it at 500 rpm for 1 hour.
[0106] The preparation method of the third component is as follows:
[0107] At 50°C and 200rpm, 7.5 parts of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 1.3 parts of the third auxiliary agent were added to 6.3 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 700rpm for 6h.
[0108] Example 7
[0109] This embodiment provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 11.7:6:2.3; wherein,
[0110] The preparation method of the component A is as follows:
[0111] Step (1), mixing 12 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 45 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1), and stirring at 80° C. and 200 rpm for 72 hours;
[0112] Step (2), mixing the mixture obtained in step (1) with 1.5 parts of a first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0113] The preparation method of the second component is as follows:
[0114] Step (1), 6.0 parts of the second resin (amino-modified epoxy resin) and 18 parts of the second solvent (DEAC) were mixed and stirred at 120° C. and 200 rpm for 36 hours;
[0115] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 3.0 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0116] Step (3), cooling the mixture obtained in step (2) to room temperature, mixing it with 3.0 parts of a curing accelerator (blocked isocyanate), and stirring at 500 rpm for 1 hour.
[0117] The preparation method of the third component is as follows:
[0118] At 50°C and 200rpm, 5.0 parts of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 2.5 parts of the third auxiliary agent were added to 4.0 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 700rpm for 6h.
[0119] Comparative Example 1
[0120] This comparative example provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 3.3:15.3:1; wherein,
[0121] The preparation method of the component A is as follows:
[0122] Step (1), 4.0 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 12 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 80° C. and 200 rpm for 72 hours;
[0123] Step (2), mixing the mixture obtained in step (1) with 1.0 part of the first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0124] The preparation method of the second component is as follows:
[0125] Step (1), 14 parts of the second resin (amino-modified epoxy resin) and 44 parts of the second solvent (DEAC) were mixed and stirred at 120° C. and 200 rpm for 36 hours;
[0126] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 10 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0127] Step (3), cooling the mixture obtained in step (2) to room temperature, mixing it with 10 parts of a curing accelerator (blocked isocyanate), and stirring at 500 rpm for 1 hour.
[0128] The preparation method of the third component is as follows:
[0129] At 50°C and 200rpm, 2.5 parts of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 1.3 parts of the third auxiliary agent were added to 1.3 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 700rpm for 6h.
[0130] Comparative Example 2
[0131] This comparative example provides a resin composition, comprising: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 17: 1.6: 1; wherein,
[0132] The preparation method of the component A is as follows:
[0133] Step (1), 20 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 64 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 80° C. and 200 rpm for 72 hours;
[0134] Step (2), mixing the mixture obtained in step (1) with 3.0 parts of the first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0135] The preparation method of the second component is as follows:
[0136] Step (1), 2.0 parts of the second resin (amino-modified epoxy resin) and 4.0 parts of the second solvent (DEAC) were mixed and stirred at 120° C. and 200 rpm for 36 hours;
[0137] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 1.0 part of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0138] Step (3), after cooling the mixture obtained in step (2) to room temperature, mix it with 1.0 part of curing accelerator (blocked isocyanate), and stir it at 500 rpm for 1 hour.
[0139] The preparation method of the third component is as follows:
[0140] At 50°C and 200rpm, 2.5 parts of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 1.3 parts of the third auxiliary agent were added to 1.3 parts of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 700rpm for 6h.
[0141] Comparative Example 3
[0142] This comparative example provides a resin composition, including: component A, component B and component C; in terms of mass ratio, component A: component B: component C = 43.1: 14.7: 1; wherein,
[0143] The preparation method of the component A is as follows:
[0144] Step (1), 15 parts of a first resin (a mixture of TPU and SEBS in a weight ratio of 9:1) and 56.8 parts of a first solvent (a mixture of DEAC and isophorone in a weight ratio of 1:1) were mixed, and stirred at 80° C. and 200 rpm for 72 hours;
[0145] Step (2), mixing the mixture obtained in step (1) with 1.5 parts of a first auxiliary agent (a mixture of liquid styrene-butadiene rubber and liquid silicone rubber in a weight ratio of 1:1), stirring at 600 rpm for 5 h, and then stirring at 80° C. and 200 rpm for 4 h.
[0146] The preparation method of the second component is as follows:
[0147] Step (1), 4.0 parts of the second resin (amino-modified epoxy resin) and 18 parts of the second solvent (DEAC) were mixed and stirred at 120° C. and 200 rpm for 36 hours;
[0148] Step (2), cooling the mixture obtained in step (1) to 80° C., mixing with 2.0 parts of a modifier (a mixture of polyol and styrene in a weight ratio of 1:1), and stirring at 500 rpm for 5 hours;
[0149] Step (3), after cooling the mixture obtained in step (2) to room temperature, mix it with 1.0 part of curing accelerator (blocked isocyanate), and stir it at 500 rpm for 1 hour.
[0150] The preparation method of the third component is as follows:
[0151] At 50°C and 200rpm, 1.0 part of the second auxiliary agent (a mixture of aminosilane coupling agent, mercaptosilane coupling agent and epoxysilane coupling agent in a weight ratio of 1:1:1) and 0.2 part of the third auxiliary agent were added to 0.5 part of the third solvent (a mixture of DBE and xylene in a weight ratio of 4:1) in sequence, cooled to room temperature, and stirred at 700rpm for 6h.
[0152] Test example
[0153] In this test example, the resin compositions of the embodiment and the comparative example were respectively used to form a coating on the surface of an elastic substrate (specifically a rubber substrate), and then a conductive paste was used to form a conductive circuit on the surface of the coating, and several electronic devices were obtained after post-treatment; for comparison, this test example also used the same conductive paste to form a conductive circuit on the surface of the same elastic substrate, and obtained a comparative electronic device after the same post-treatment; and then the performance of each electronic device was tested, as follows:
[0154] 1. After stretching each electronic device until it breaks, calculate the elongation at break;
[0155] 2. Peel off the coating on each electronic device from the elastic substrate and test the peel strength;
[0156] 3. Use a resistance meter to test the resistance of each electronic device, and then calculate the square resistance;
[0157] 4. Stretch each electronic device by 20% and then restore it, repeat 10 times, and then use a resistance meter to test the resistance of each electronic device, and then calculate the square resistance;
[0158] 5. The test results are shown in Table 1;
[0159] Table 1
[0160]
[0161]
[0162] Although the present invention has been described in detail above with general descriptions and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements may be made thereto based on the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection claimed by the present invention.
Claims
1. A resin composition, characterized in that Including: component A, component B and component C; By mass ratio, component A: component B: component C = (9-14): (4-8): (1-3).
2. The resin composition according to claim 1, characterized in that The component A is prepared by a method comprising the following steps: Step (1), mixing the first resin and the first solvent, and stirring at 80-120° C. and 200±50 rpm for 48-72 hours; Step (2), mixing the mixture obtained in step (1) with the first auxiliary agent, stirring at a rotation speed of more than 500 rpm for 2-5 hours, and then stirring at 60-80° C. and 100-200 rpm for 2-4 hours.
3. The resin composition according to claim 2, characterized in that The first resin is selected from one or more of TPU or SEBS with a molecular weight greater than 50,000; and / or, The first solvent is selected from one or more of ketones, ethers, lipids and alcohols having a boiling point higher than 150° C.; and / or, The first auxiliary agent is selected from one or more of liquid styrene-butadiene rubber, liquid nitrile rubber, and liquid silicone rubber; and / or, By mass ratio, the first resin: the first solvent: the first auxiliary agent = (8-17.5): (24-55): (1.2-3.6).
4. The resin composition according to claim 1, characterized in that The component B is prepared by a method comprising the steps of: Step (1), mixing the second resin and the second solvent, and stirring at 80-120° C. and 200±50 rpm for 24-36 hours; Step (2), cooling the mixture obtained in step (1) to 60-80° C., mixing with a modifier, and stirring at a speed of 500±50 rpm for 4-6 hours; Step (3), cooling the mixture obtained in step (2) to room temperature, mixing with a curing accelerator, and stirring at a speed of 500±50 rpm for 0.2-1 h.
5. The resin composition according to claim 4, characterized in that The second resin is selected from one or more of amino-modified epoxy resin and epoxy-modified acrylic resin; and / or, The second solvent is selected from one or more of ketone solvents, ether solvents, and halogenated hydrocarbon solvents having a boiling point higher than 150° C.; and / or, The modifier is selected from one or more of polyols, glycidyl ethers, and styrene; and / or, The curing accelerator is selected from one or more of blocked isocyanates and modified amines; and / or, By mass ratio, the second resin: the second solvent: the modifier: the curing accelerator = (5-10): (10-30): (2.5-5): (2.5-6).
6. The resin composition according to claim 1, characterized in that The component C is prepared by a method comprising the following steps: adding the second auxiliary agent and the third auxiliary agent to the third solvent in sequence at 30-50° C. and 100-200 rpm, cooling to room temperature, and stirring at a speed of more than 500 rpm for 4-6 hours.
7. The resin composition according to claim 6, characterized in that The second auxiliary agent is selected from one or more of aminosilane coupling agent, mercaptosilane coupling agent, epoxysilane coupling agent, titanate coupling agent, nano-fumed silica, polyamide wax, polyethylene glycol, butanediol, and fatty acid ester; and / or, The third auxiliary agent is selected from one or more of a leveling agent, a defoaming agent, and an antioxidant; and / or, The third solvent is a mixture of a lipid solvent and a benzene solvent; and / or, By mass ratio, the second auxiliary agent: the third auxiliary agent: the third solvent = (2.5-7.5): (0.5-2.5): (1.25-9).
8. The method for preparing the resin composition according to any one of claims 1 to 7, characterized in that: include: Component A, component B and component C are mixed evenly, and then ground and degassed.
9. Use of the resin composition according to any one of claims 1 to 7 in a circuit board, preferably in a flexible circuit board.
10. An electronic device comprising a stacked substrate, a coating and a conductive circuit, characterized in that: The coating is formed by printing the resin composition according to any one of claims 1 to 7 and heating and curing; Preferably, the printing method is screen printing, pad printing or roller printing; More preferably, the material of the substrate is an elastic material; Most preferably, the temperature of the heating and curing is 80-140°C.