Chip bonding mechanism and bonding equipment

Abstract

The invention discloses a chip bonding mechanism and bonding equipment, and belongs to the technical field of semiconductors. The chip bonding mechanism is mounted on a space moving unit of the bonding equipment and comprises a mounting bracket, an adapter plate, a bonding head and a posture adjusting module. And the bonding suction nozzle of the bonding head adopts an arc-shaped design, so that the contact area is optimized, and air residue caused by the attachment of the whole plane is avoided. A posture adjusting module and a space XYZ moving unit of the bonding head are matched to adopt six-axis interpolation motion, and it is guaranteed that the posture and path of a bonding suction nozzle can be planned. According to the invention, by using the interpolation motion of the six-axis mechanism and cooperating with the small-area fitting contact of the arc-shaped suction nozzle, the bonding contact point can roll and move outwards along a vortex-shaped track from the center of the chip, and air is effectively extruded, so that a bonding cavity is eliminated. The method is suitable for advanced packaging, and especially suitable for the bonding requirement of mixed bonding and the hole inhibition requirement.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a chip bonding mechanism and bonding equipment. Background Art

[0002] During the chip bonding process (bonding between chip and substrate or bonding between chip and chip, hereinafter collectively referred to as bonding between chip and substrate), due to the unevenness of the bonding surface, or the unevenness of the chip adsorption fixture surface and the substrate adsorption fixture surface, air gaps may exist in local areas of the bonding area, resulting in poor bonding or failure. This phenomenon is called bonding voids.

[0003] The traditional method of preventing bonding voids is: first, controlling the machining flatness of each bonding surface; second, controlling the relative parallelism of the two bonding surfaces. However, due to the limitations of the machining accuracy of the bonding surfaces, it is difficult to achieve sub-micron flatness; at the same time, there are micron or sub-micron errors in the parallelism control of the bonding surfaces. For the current increasing number of high-density bonding applications, especially hybrid bonding applications, traditional methods have been difficult to effectively prevent bonding voids.

[0004] Therefore, there is an urgent need to provide a chip bonding mechanism and bonding equipment to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a chip bonding mechanism and bonding equipment, which can not only bond the chip to the substrate but also eliminate bonding voids.

[0006] In order to achieve the above objectives, the following technical solutions are provided:

[0007] Chip bonding mechanism, including:

[0008] The mounting bracket includes a first mounting plate;

[0009] An adapter plate, spaced apart from the first mounting plate, the adapter plate being provided with a first through hole;

[0010] A bonding head, which is inserted into the first through hole and fixedly connected to the adapter plate;

[0011] The posture adjustment module includes at least three height adjustment mechanisms, and the at least three height adjustment mechanisms are circumferentially arranged between the first mounting plate and the adapter plate with the axis of the bonding head as the center. At least three of the height adjustment mechanisms can adjust their own lengths so that the posture of the bonding nozzle of the bonding head can be adjusted.

[0012] As an optional solution for the chip bonding mechanism, the lower end surface of the bonding nozzle is a spherical structure.

[0013] As an optional solution of the chip bonding mechanism, a second through hole is provided on the first mounting plate, and the chip bonding mechanism further includes a floating module, and the floating module includes:

[0014] A first fastener having a limit head, wherein one end of the first fastener away from the limit head is inserted into the second through hole and fixedly connected to the adapter plate;

[0015] An elastic member is sleeved on the first fastener, one end of the elastic member abuts against the limit head, and the other end of the elastic member abuts against the first mounting plate.

[0016] As an optional solution of the chip bonding mechanism, the chip bonding mechanism includes at least three floating modules, and the at least three floating modules are arranged at intervals in the circumferential direction with the axis of the bonding head as the center.

[0017] As an optional solution of the chip bonding mechanism, the fixed end of the height adjustment mechanism is fixedly connected to the first mounting plate, and the telescopic end of the height adjustment mechanism can abut against the adapter plate.

[0018] As an optional solution of the chip bonding mechanism, the chip bonding mechanism further includes a mounting block having a V-shaped groove, the mounting block is arranged on the adapter plate, and the telescopic end of the height adjustment mechanism is pressed against the inner wall surface of the V-shaped groove.

[0019] As an optional solution of the chip bonding mechanism, a second through hole is provided on the first mounting plate, and the chip bonding mechanism includes a second fastener, and the second fastener passes through the second through hole and is connected to the fixed end of the height adjustment mechanism.

[0020] As an optional solution for the chip bonding mechanism, a avoidance hole is provided on the first mounting plate, the upper end shell of the bonding head is inserted into the avoidance hole, and the inner diameter of the avoidance hole is larger than the outer diameter of the upper end shell.

[0021] A bonding device comprises a carrier fixture, a space moving unit and a technical solution of a chip bonding mechanism as described in any one of the above items, wherein the chip bonding mechanism is arranged on the space moving unit.

[0022] As an optional solution for the chip bonding mechanism, the spatial movable unit includes a base, a first direction movable module, a second direction movable module and a third direction movable module, the first direction movable module and the carrier fixture are arranged on the base, the second direction movable module is arranged on the first direction movable module, the third direction movable module is arranged on the second direction movable module, and the mounting bracket of the chip bonding mechanism is connected to the third direction movable module.

[0023] As an optional solution for the chip bonding mechanism, the first direction moving module, the second direction moving module, the third direction moving module and the posture adjustment module can perform six-axis interpolation motion so that the contact point of the bonding nozzle on the chip can roll along a rolling trajectory.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The chip bonding mechanism and bonding equipment provided by the present invention install the bonding head on the adapter plate, and at least three height adjustment mechanisms are installed at circumferential intervals between the mounting bracket and the adapter plate. The at least three height adjustment mechanisms can adjust their own lengths so that the posture of the bonding nozzle of the bonding head can be adjusted. The bonding nozzle adopts a curved surface design to reduce the contact area with the chip. After the bonding nozzle is in adsorption contact with the chip, it can roll on the surface of the chip with a certain rolling trajectory, and gradually squeeze the air between the chip and the substrate during the rolling process to avoid bonding voids in local areas. This can avoid the cavitation problem caused by poor air exhaust during traditional planar contact. The chip bonding mechanism provided by the present invention can not only enable the chip to be bonded to the substrate, but also eliminate bonding voids. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0027] Figure 1 It is a schematic diagram of the assembly of the chip bonding mechanism in an embodiment of the present invention;

[0028] Figure 2 An exploded schematic diagram of a chip bonding mechanism in an embodiment of the present invention;

[0029] Figure 3 is a cross-sectional view of a chip bonding mechanism according to an embodiment of the present invention;

[0030] Figure 4 A schematic diagram of the structure of a bonding device in an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of a bonding nozzle before rolling in an embodiment of the present invention;

[0032] Figure 6 A schematic diagram of rolling a bonding nozzle in an embodiment of the present invention;

[0033] Figure 7Schematic diagram of the rolling trajectory of the bonding nozzle along the vortex line in an embodiment of the present invention.

[0034] Reference numerals:

[0035] 100, chip bonding mechanism; 200, stage fixture; 300, base; 400, first direction moving module; 500, second direction moving module; 600, third direction moving module; 700, chip; 800, substrate; 900, rolling track;

[0036] 1. Mounting bracket; 2. Adapter plate; 3. Bonding head; 4. Posture adjustment module; 5. Floating module; 6. Mounting block; 61. V-shaped groove;

[0037] 11. first mounting plate; 111. second through hole; 112. third through hole; 113. avoidance hole; 12. second mounting plate; 121. fourth through hole;

[0038] 21. a first through hole;

[0039] 31. Bonding nozzle; 32. Upper housing;

[0040] 41. Height adjustment mechanism;

[0041] 51. First fastener; 511. Limiting head; 52. Elastic member. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0043] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or are the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0044] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0046] In order to bond the chip to the substrate and eliminate the bonding voids between the two, this embodiment provides a chip bonding mechanism and bonding equipment suitable for high-density bonding applications such as hybrid bonding, which can effectively prevent and eliminate bonding voids. Figures 1 to 7 The specific contents of this embodiment are described in detail. It should be noted that the first direction mentioned in this embodiment is Figure 4 The X direction in this embodiment is Figure 4 The third direction mentioned in this embodiment is Figure 4 The Z direction in .

[0047] The chip bonding mechanism 100 in this embodiment includes a mounting bracket 1, an adapter plate 2, a bonding head 3 and a posture adjustment module 4. Among them, the mounting bracket 1 includes a first mounting plate 11. The adapter plate 2 is spaced apart from the first mounting plate 11, and the adapter plate 2 is provided with a first through hole 21. The bonding head 3 is inserted into the first through hole 21 and is fixedly connected to the adapter plate 2. The posture adjustment module 4 includes at least three height adjustment mechanisms 41, and at least three height adjustment mechanisms 41 are circumferentially spaced apart between the first mounting plate 11 and the adapter plate 2 with the axis of the bonding head 3 as the center, and at least three height adjustment mechanisms 41 can adjust their own lengths to allow the bonding nozzle 31 of the bonding head 3 to perform posture adjustment.

[0048] Furthermore, if Figure 3 Combination Figure 5 , Figure 6 and Figure 7As shown, the lower end surface of the bonding nozzle 31 in this embodiment is a spherical structure. The bonding nozzle 31 is in point contact or small area contact with the chip 700, which increases the tolerance for local warping of the substrate 800 and the carrier fixture 200 during the bonding process and simplifies processing. The chip bonding mechanism 100 can cooperate with the XYZ motion mechanism to perform six-axis interpolation movement of the arc surface of the bonding nozzle 31 to ensure that the posture and path of the bonding nozzle 31 can be planned. The bonding nozzle 31 introduces the concept and design of the nozzle with an arc contact surface. Under the premise of not affecting the vacuum adsorption of the chip, the surface of the nozzle is a small-sized arc. The arc surface can reduce the pressing area during the chip bonding process and prevent the problem of voids caused by the conventional plane pressing. The present invention also introduces the moving path planning and optimization of the bonding point. By using the interpolation movement of the above-mentioned six-axis mechanism, the bonding contact point can be rolled outward along a spiral trajectory starting from the center of the chip, thereby effectively squeezing out the air.

[0049] Furthermore, if Figures 1 to 3 As shown, the first mounting plate 11 is provided with a second through hole 111, and the chip bonding mechanism 100 further includes a floating module 5, the floating module 5 includes a first fastener 51 with a limit head 511 and an elastic member 52, and one end of the first fastener 51 away from the limit head 511 is inserted into the second through hole 111 and fixedly connected to the adapter plate 2. The elastic member 52 is sleeved on the first fastener 51, one end of the elastic member 52 abuts against the limit head 511, and the other end of the elastic member 52 abuts against the first mounting plate 11. Among them, the inner diameter of the second through hole 111 is greater than the outer diameter of the first fastener 51. The elastic member 52 can be a laminated spring or a coil spring. During use, the elastic member 52 is always in a compressed state, and under the action of the elastic member 52, the first fastener 51 can pull the adapter plate 2 upward, so that the upper end of the adapter plate 2 is always abutted against the lower end of the height adjustment mechanism 41.

[0050] Optionally, the chip bonding mechanism 100 includes at least three floating modules 5, which are arranged circumferentially with the axis of the bonding head 3 as the center. When at least three height adjustment mechanisms 41 are working, at least three floating modules 5 are added accordingly to help balance the force on the adapter plate 2.

[0051] Furthermore, the fixed end of the height adjustment mechanism 41 is fixedly connected to the first mounting plate 11, and the telescopic end of the height adjustment mechanism 41 can abut against the adapter plate 2. When the telescopic end of the height adjustment mechanism 41 is extended, the height of the corresponding position of the adapter plate 2 can be lowered, and the adapter plate 2 can drive the bonding head 3 to adjust the posture by controlling the extension and retraction of multiple height adjustment mechanisms 41. Exemplarily, the height adjustment mechanism 41 can adjust the stroke and accuracy according to the posture, and the height adjustment mechanism 41 can select different mechanisms, such as but not limited to servo motor drive mechanism, telescopic cylinder, electric push rod or piezoelectric ceramic nano actuator and other mechanisms.

[0052] Furthermore, the chip bonding mechanism 100 further includes a mounting block 6 having a V-shaped groove 61, the mounting block 6 is arranged on the adapter plate 2, and the telescopic end of the height adjustment mechanism 41 presses against the inner wall surface of the V-shaped groove 61. When the telescopic end of the height adjustment mechanism 41 extends downward, it bears the pressure through the V-shaped groove 61 of the mounting block 6, avoiding over-positioning and improving the repeatability accuracy of posture adjustment.

[0053] Further, the first mounting plate 11 is provided with a second through hole 111, and the chip bonding mechanism 100 includes a second fastener (not shown in the figure), and the second fastener passes through the second through hole 111 and is connected to the fixed end of the height adjustment mechanism 41. The second fastener may be, but is not limited to, a bolt or a screw, etc. The upper end of the height adjustment mechanism 41 may be fixed to the first mounting plate 11 by screwing the second fastener.

[0054] Furthermore, the first mounting plate 11 is provided with an avoidance hole 113, and the upper end shell 32 of the bonding head 3 is penetrated in the avoidance hole 113, and the inner diameter of the avoidance hole 113 is larger than the outer diameter of the upper end shell 32. Since the bonding nozzle 31 on the bonding head 3 performs vortex rolling along the rolling track 900, the avoidance hole 113 is added to avoid structural interference between the upper end shell 32 of the bonding head 3 and the first mounting plate 11.

[0055] like Figure 4 As shown, this embodiment also provides a bonding device, which includes a stage fixture 200, a space moving unit and the chip bonding mechanism 100 mentioned above, and the chip bonding mechanism 100 is arranged on the space moving unit. The chip bonding mechanism 100 can be moved to the top of the stage fixture 200 by the space moving unit for bonding the chip 700 and the substrate 800.

[0056] Furthermore, if Figure 2 Combination Figure 4As shown, the space moving unit includes a base 300, a first direction moving module 400, a second direction moving module 500 and a third direction moving module 600, the first direction moving module 400 and the stage fixture 200 are arranged on the base 300, the second direction moving module 500 is arranged on the first direction moving module 400, the third direction moving module 600 is arranged on the second direction moving module 500, and the mounting bracket 1 of the chip bonding mechanism 100 is connected to the third direction moving module 600. The mounting bracket 1 also includes a second mounting plate 12, and the first mounting plate 11 is connected to the second mounting plate 12 in a T-shaped structure. A fourth through hole 121 is provided on the second mounting plate 12, and a bolt can pass through the fourth through hole 121 to connect with the third direction moving module 600, so as to install the chip bonding mechanism 100 on the space moving unit. The posture adjustment module 4 can cooperate with the space moving unit to perform six-axis movement of the arc surface of the bonding nozzle 31 to ensure real-time controllability and path planning of the bonding area. The contact surface between the bonding nozzle 31 and the chip 700 starts from the center of the chip 700 and moves outward along the spiral rolling trajectory 900, thereby effectively squeezing out the air.

[0057] The working principle of the bonding device in this embodiment is as follows: at the initial contact, the posture of the bonding nozzle 31 remains relatively parallel to the substrate 800, the third-direction moving module 600 descends, and the lowest point of the arc surface of the bonding nozzle 31 will first contact the central area of ​​the chip 700, thereby squeezing out the air in the central area and ensuring the fit of the central area. Afterwards, the six-axis interpolation motion, that is, the posture adjustment module 4, is used to adjust the posture of the nozzle fitting surface, and at the same time, the movement of the space moving unit is coordinated to compensate for the offset of the nozzle arc surface center (i.e., the center of the sphere) during the posture adjustment process, so that the arc surface of the bonding nozzle 31 can be relatively rolled against the surface of the chip 700; at the same time, the point contact of the nozzle arc surface spreads from the center of the chip 700 to the periphery of the chip 700 in the form of a vortex line, so that the air can be further squeezed out. At the same time, due to the existence of the rolling effect, the friction force on the chip 700 in the horizontal direction is very small, and the horizontal displacement of the chip 700 is avoided as much as possible. During the process, it is also necessary to monitor and adjust the pressure in real time, or use a floating constant force output mechanism to simplify force control.

[0058] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A chip bonding mechanism, characterized in that: include: A mounting bracket (1) comprising a first mounting plate (11); An adapter plate (2) is arranged at a distance from the first mounting plate (11), and the adapter plate (2) is provided with a first through hole (21); A bonding head (3) is inserted into the first through hole (21) and is fixedly connected to the adapter plate (2); The posture adjustment module (4) comprises at least three height adjustment mechanisms (41), wherein the at least three height adjustment mechanisms (41) are arranged between the first mounting plate (11) and the adapter plate (2) at circumferential intervals with the axis of the bonding head (3) as the center, and the at least three height adjustment mechanisms (41) are capable of adjusting their own lengths so that the bonding nozzle (31) of the bonding head (3) can be posture adjusted.

2. The chip bonding mechanism according to claim 1, characterized in that: The lower end surface of the bonding suction nozzle (31) is in a spherical structure.

3. The chip bonding mechanism according to claim 1, characterized in that: The first mounting plate (11) is provided with a second through hole (111), and the chip bonding mechanism further comprises a floating module (5), and the floating module (5) comprises: a first fastener (51) having a limiting head (511), wherein one end of the first fastener (51) away from the limiting head (511) is inserted into the second through hole (111) and is fixedly connected to the adapter plate (2); An elastic member (52) is sleeved on the first fastener (51), one end of the elastic member (52) abuts against the limit head (511), and the other end of the elastic member (52) abuts against the first mounting plate (11).

4. The chip bonding mechanism according to claim 3, characterized in that: The chip bonding mechanism comprises at least three floating modules (5), and the at least three floating modules (5) are arranged at intervals in the circumferential direction with the axis of the bonding head (3) as the center.

5. The chip bonding mechanism according to claim 3, characterized in that: The fixed end of the height adjustment mechanism (41) is fixedly connected to the first mounting plate (11), and the telescopic end of the height adjustment mechanism (41) can abut against the adapter plate (2).

6. The chip bonding mechanism according to claim 5, characterized in that: The chip bonding mechanism also includes a mounting block (6) having a V-shaped groove (61), wherein the mounting block (6) is arranged on the adapter plate (2), and the telescopic end of the height adjustment mechanism (41) is pressed against the inner wall surface of the V-shaped groove (61).

7. The chip bonding mechanism according to claim 5, characterized in that: The first mounting plate (11) is provided with a third through hole (112), and the chip bonding mechanism comprises a second fastener, which passes through the third through hole (112) and is connected to a fixed end of the height adjustment mechanism (41).

8. The chip bonding mechanism according to any one of claims 1 to 7, characterized in that: The first mounting plate (11) is provided with an avoidance hole (113), the upper end shell (32) of the bonding head (3) is inserted into the avoidance hole (113), and the inner diameter of the avoidance hole (113) is greater than the outer diameter of the upper end shell (32).

9. A bonding device, characterized in that It comprises a carrier fixture (200), a space moving unit and a chip bonding mechanism as claimed in any one of claims 1 to 8, wherein the chip bonding mechanism is arranged on the space moving unit.

10. The bonding device according to claim 9, characterized in that The spatial moving unit comprises a base (300), a first direction moving module (400), a second direction moving module (500) and a third direction moving module (600); the first direction moving module (400) and the carrier fixture (200) are arranged on the base (300); the second direction moving module (500) is arranged on the first direction moving module (400); the third direction moving module (600) is arranged on the second direction moving module (500); and the mounting bracket (1) of the chip bonding mechanism is connected to the third direction moving module (600).

11. The bonding device according to claim 10, characterized in that The first direction moving module (400), the second direction moving module (500), the third direction moving module (600) and the posture adjustment module (4) are capable of performing six-axis interpolation movement, so that the contact point of the bonding nozzle (31) on the chip (31) performs rolling movement along a rolling track (900).

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