A high-precision patch device for smart meter production

Abstract

The present invention discloses a high-precision patch device for smart meter production, which relates to the technical field of meter production, and includes a device body and a mounting component, wherein the mounting component is used to mount electronic components on a circuit board brushed with solder paste. The present invention connects the electric push rods on both sides of the storage box with the middle lower pressure plate, and drives the support rod to rise and fall during the lifting and lowering process of the electric push rod, thereby causing the No. 1 piston plate to move inside the storage box, and the staff can put the solder paste into the storage box at one time. At this time, under the action of the No. 1 piston plate, the solder paste at the bottom of the storage box is squeezed downward, reducing the contact between the solder paste and the air, ensuring the quality of the solder paste, cooperating with the transport component to make a gap between the bottom of the storage box and the top of the transport component, avoiding the phenomenon of solder paste overflowing during the soldering process, reducing the time and labor cost of solder paste printing, and at the same time reducing the amount of solder paste remaining at the bottom of the solder paste printing component, and improving the quality of solder paste printing.

Description

Technical Field

[0001] The present invention relates to the technical field of electric meter production, and in particular to a high-precision patch device for producing smart electric meters. Background Art

[0002] Modern solder paste printers are generally composed of mechanisms such as plate loading, solder paste adding, stamping, and circuit board feeding. Its working principle is to first fix the circuit board to be printed on the printing positioning table, and then the left and right scrapers of the printer will print the solder paste or red glue through the steel mesh on the corresponding pads. The PCB with uniform printing is input to the placement machine through the transmission table for automatic placement. The automatic placement machine is used to accurately place electronic components on the specified position on the PCB. The placement machine ensures that each component is placed in the correct position by identifying the marks on the PCB and the coding of the components.

[0003] The current circuit board solder paste printer's stencil position cannot be adjusted, and cannot adapt to stencils of various specifications, and therefore cannot adapt to circuit boards of various specifications.

[0004] Chinese patent document CN211942519U discloses a semi-automatic solder paste printer with adjustable steel mesh position, including a frame, a workbench and a solder paste printing part, wherein the solder paste printing part is driven by a printing lifting mechanism to lift the entire solder paste printing part, and the solder paste printing part also includes a cutter head, a cutter head driving mechanism, a steel mesh and a steel mesh fixing device, wherein the steel mesh fixing device includes a steel mesh fixing part and a steel mesh cantilever, steel mesh fixing parts are provided on opposite sides of the steel mesh, and the steel mesh fixing parts are locked and fixed to the steel mesh cantilever by a locking part, and the steel mesh cantilever is movably connected to the solder paste printing part, and the steel mesh cantilever is locked to the solder paste printing part by a fixing part; however, the following defects still exist in the implementation process:

[0005] Although the device in the above-mentioned document can lock the steel mesh fixing part to the steel mesh cantilever through a locking part, the steel mesh cantilever is movably connected to the solder paste printing part, and the steel mesh cantilever is locked to the solder paste printing part through a fixing part, the position between the steel mesh fixing part and the steel mesh cantilever can be adjusted, so that the position and angle of the steel mesh can be adjusted to improve the quality of solder paste printing. Since the position of the steel mesh fixing part and the steel mesh cantilever can be adjusted, the steel mesh fixing device in this scheme can be used for steel meshes of different specifications. However, the device in the above-mentioned document solders the circuit board by pouring solder paste on the top of the steel mesh. However, in this way, the solder paste is exposed to the air, causing the internal metal components to react with the oxygen in the air to oxidize, and the internal solvent will evaporate in the air, causing the solder paste to dry out and affect fluidity and printing performance. At the same time, the bottom of the steel mesh is in contact with the circuit board. During the application of the solder paste, a small part of the solder paste will overflow from the position where it is in contact with the circuit board. After the steel mesh is lifted, there will be residues on the contact surface with the circuit board. The residues will cause the surface of the circuit board to be stained with excess solder paste when the solder paste is subsequently applied, affecting the accuracy of the subsequent patch and reducing the efficiency of the meter production patch. Summary of the invention

[0006] The purpose of the present invention is to provide a high-precision patch device for the production of smart meters to solve the problems raised in the above background technology that the quality of solder paste is damaged when exposed to the air and the residue at the bottom of the steel mesh affects the patch accuracy.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0008] A high-precision patch device for smart meter production comprises a device body and a mounting component, wherein the mounting component is used to mount electronic components on a circuit board brushed with solder paste and dry the components, and the rear end of the device body is fixedly connected to a frame; further comprising: a solder paste printing assembly, which is arranged at the front end of the frame, and the solder paste printing assembly is used to extrude solder paste onto the surface of the circuit board, and the solder paste printing assembly comprises a storage box arranged at the front end of the frame, and electric push rods are symmetrically fixedly installed on both sides of the storage box, and the tops of the two electric push rods are fixedly connected to the same lower pressure plate, and a support rod is fixedly connected to the middle position of the bottom of the lower pressure plate, and a No. 1 piston plate is fixedly connected to the bottom of the support rod, and the No. 1 piston plate is slidably connected to the storage box, and the shape and contour of the No. 1 piston plate and the storage box are adapted, and the bottom of the inner wall of the storage box is connected to a printing plate by screws, and a plurality of printing holes are provided on the printing plate, and a sealing strip that is extruded and matched with the printing plate is provided on the bottom of the inner wall of the storage box; a transport assembly is used to transport the circuit board to the bottom of the solder paste printing assembly, and the transport assembly is connected to the device body.

[0009] The above-mentioned technical solution is adopted, in which the electric push rods on both sides of the storage box are connected to the lower pressure plate in the middle. During the lifting process of the electric push rods, the support rods are driven to rise and fall, thereby causing the No. 1 piston plate to move inside the storage box. The staff can place the solder paste into the storage box at one time. At this time, under the action of the No. 1 piston plate, the solder paste at the bottom of the storage box is squeezed downward, reducing the contact between the solder paste and the air, thereby ensuring the quality of the solder paste.

[0010] A further improvement of the technical solution of the present invention is that the opening diameter of the bottom of the printing hole is smaller than the opening diameter of the top, and the inner wall of the printing hole is arranged as an arc structure.

[0011] The above-mentioned technical scheme is adopted, in which the printing plate is fixed to the inner side of the bottom of the storage box by bolts. At this time, the above-mentioned solder paste enters the storage box through the feed port and accumulates on the surface of the printed plate. When the No. 1 piston plate moves downward to extrude the solder paste, the solder paste contacts the circuit board through the printing hole. It should be noted that the printing hole is at the same position as the position of the circuit board where the solder paste needs to be printed. The inner wall of the printing hole is bent inward and has a smooth rounded corner. The bottom is close to the middle position, so that the interior of the printing hole is set in an inverted cone shape. The opening at the bottom is smaller than the opening at the top. In the process of squeezing the solder paste, the solder paste can more easily enter the bottom of the printing hole along the arc contour of the printing hole. After the No. 1 piston plate moves down a small part, the solder paste and the top of the circuit board fit together. In this process, the diameter of the part where the solder paste is connected to the printing plate gradually becomes smaller, which makes it easier for the extruded solder paste to separate from the printing plate.

[0012] A further improvement of the technical solution of the present invention is that a plurality of raised blocks matching the shape and contour of the printing holes are fixedly connected to the bottom of the No. 1 piston plate, and a feed port is provided on the No. 1 piston plate.

[0013] The above-mentioned technical solution is adopted, in which a protruding block is arranged at the bottom of the printing plate, and the No. 1 piston plate is fitted with the surface of the printing plate. At this time, the residual solder paste in the printing plate is squeezed out by the action of the protruding block, thereby reducing the residual amount of solder paste in the printing plate and blocking the printing hole at the same time, thereby avoiding the phenomenon that the No. 1 piston plate cannot extrude the solder paste due to the inability to maintain a vacuum state inside the storage box.

[0014] A further improvement of the technical solution of the present invention is that: a slide rail is symmetrically fixedly installed on one side of the storage box close to the frame, and a limit block is slidably connected to the inner wall of the slide rail, the limit block and the storage box are fixedly connected, a fixed plate is fixedly connected to one side of the storage box close to the limit block, and a No. 1 rack is fixedly connected to one side of the fixed plate close to the slide rail, a motor is fixedly installed inside the frame, the output end of the motor extends to the outside of the frame and is fixedly connected to a gear, a fixed base is provided at the bottom of the storage box, a No. 2 rack is fixedly connected to one side of the fixed base close to the frame, the No. 2 rack and the No. 1 rack are both meshed with the gear, and the fixed base is connected to the transport assembly.

[0015] The above-mentioned technical scheme is adopted, in which rack No. 1 is connected to the storage box, and rack No. 2 is connected to the fixed base. When the motor drive gear inside the frame rotates, rack No. 1 and gear move in opposite directions, and drive the storage box and the fixed base to move in opposite directions, thereby creating a gap between the printed board and the circuit board, further preventing the solder paste on the bottom of the printed board during the solder paste extrusion process from affecting the subsequent connection between the circuit board and the solder paste.

[0016] A further improvement of the technical solution of the present invention is that: a support seat is detachably connected to one side of the storage box, a spring is fixedly connected to the middle position of the bottom of the support seat, one end of the spring is fixedly connected to a slitting plate, an adjusting bevel is fixedly connected to the side of the slitting plate away from the spring, the side of the adjusting bevel close to the slitting plate is arranged in an inclined surface, the side of the adjusting bevel close to the slitting plate is slidably connected to a fixed bevel, the rear end of the fixed bevel is fixedly connected to a limit plate, the limit plate and the frame are fixedly connected, the top of the slitting plate fits with the bottom of the printing plate, a cross limit bar is fixedly connected to the top of the support seat, and the cross limit bar and the printing plate are slidably connected.

[0017] The above-mentioned technical scheme is adopted, in which the inclined surface of the adjusting inclined block on the side of the cutting plate conflicts with the fixed inclined block. Since the fixed inclined block is fixed to the surface of the frame by a limiting plate, when the adjusting inclined block conflicts with the fixed inclined block, the adjusting inclined block slides sideways under the action of the upward force and the inclined surface of the fixed inclined block. At this time, the holes and printed holes on the surface of the cutting plate are staggered, which further improves the effect of solder paste breaking and makes the solder paste more uniform on the surface of the circuit board.

[0018] A further improvement of the technical solution of the present invention is that: a sliding plate is detachably connected to the top of the printing plate, a circular clamping block is fixedly connected to the side of the printing plate close to the sliding plate, a clamping column is inserted into the inner wall of the circular clamping block, the clamping column and the sliding plate are fixedly connected, the side of the sliding plate away from the clamping column is arranged in an inclined surface, and the clamping column is arranged in a conical shape.

[0019] The above technical solution is adopted, in which the sliding plate is connected to the printed board through a clamping column, an arc-shaped groove is provided at the middle position of the clamping column, the top of the clamping column is rounded, and the circular clamping block inside the printed board is conical, and the opening diameter of the top is smaller than the opening diameter of the bottom. When fixing the sliding plate, the clamping column is inserted into the circular clamping block, and the top of the circular clamping block is fitted with the middle position of the circular clamping block to fix the sliding plate.

[0020] A further improvement of the technical solution of the present invention is that the transport component includes a limiting inclined plate symmetrically fixedly connected to the inner side wall of the fixed base, a plurality of connecting columns distributed in a linear array are fixedly connected to the side of the limiting inclined plate close to the fixed base, the connecting columns and the fixed base are slidably connected, a plurality of No. 1 suction cups distributed in a linear array are fixedly connected to the top of the limiting inclined plate, an infrared sensor is fixedly connected to the top of the inner side wall of the fixed base, and the No. 1 suction cup is connected to the external air pump through a pipeline.

[0021] The above-mentioned technical scheme is adopted, in which the limiting inclined plate on the inner side of the fixed base can adjust its own position under the action of the connecting column, and the infrared sensor on the inner side can sense the position of the circuit board in real time. When the circuit board is transported to the surface of the limiting inclined plate under the action of the first conveyor rack, the No. 1 suction cup can fix the circuit board on the surface of the limiting inclined plate under the action of the air pump, thereby increasing the stability of the circuit board during the process of applying solder paste.

[0022] A further improvement of the technical solution of the present invention is that: the transport component also includes a first conveying rack fixedly connected to the top of the device body, a second conveying rack is fixedly connected to the top of the device body near the mounting component, a first bracket is arranged at the middle position of the top of the device body, a second motor is fixedly connected to the outer wall of the first bracket, a conveyor belt is fixedly connected to the inner wall of the first bracket, a limit frame is fixedly connected to one side of the bottom of the first bracket, a magnet is fixedly connected to the inner wall of the limit frame, a push block is detachably connected to the side of the magnet away from the limit frame, a piston rod is fixedly connected to the side of the push block away from the magnet, one end of the piston rod is fixedly connected to the second piston plate, both sides of the second piston plate are fixedly connected to a buffer pad, a piston cylinder is arranged on the outer wall of the piston rod, the piston cylinder and the second piston plate are slidably connected, the outer wall of the piston cylinder is fixedly connected to the air intake pipe, the end of the piston cylinder away from the piston rod is fixedly connected to the hose, the push block is slidably connected to the first bracket, the top of the push block is arranged in an inclined surface, the shape and contour of the push block and the bottom of the first bracket are matched, and the inner wall of the piston cylinder is fixedly connected to a limit column for limiting the stroke of the second piston plate.

[0023] The above-mentioned technical solution is adopted, in which the hose at the tail of the piston cylinder is connected to the above-mentioned air pump. When the conveyor belt conveys the circuit board to the right place, the air pump draws out the air in the piston cylinder, causing the No. 2 piston plate to move on the inner wall of the piston cylinder, thereby extracting the push block from the bottom of the first bracket. At this time, the second motor connected to the conveyor belt descends, thereby separating the conveyor belt and the circuit board. When the air pump stops working, the push block slides on the bottom of the first bracket under the action of the magnet. At this time, the first bracket rises under the action of the push block, allowing the conveyor belt to continue to convey the circuit board. The push block and the first bracket are compatible in shape and contour, and the push block is made of metal.

[0024] A further improvement of the technical solution of the present invention is that a second bracket is fixedly connected to the middle position of the top of the device body, a fixed plate is fixedly connected to the inner side wall of the second bracket, a first motor is arranged at the middle position of the bottom of the second bracket, a supporting diagonal rod is fixedly connected to the top of the first motor, a second suction cup is fixedly connected to the top of the supporting diagonal rod, the side of the fixed plate away from the second bracket is spherically arranged, a fixed block is rotatably connected to the side of the fixed plate away from the second bracket, and connecting tubes are fixedly connected to both sides of the fixed block.

[0025] The above technical solution is adopted. In this solution, when the circuit board is stained with solder paste and descends with the fixed base, the bottom and the No. 2 suction cup are fitted together. At this time, the first motor starts to work, and the supporting inclined rod on its top has a slight slope. During the rotation of the first motor, the No. 2 suction cup rotates accordingly. It should be noted that a fixed plate, a connecting tube and a fixed block are provided at the bottom of the No. 2 suction cup, and the fixed plate is fixed on the inner side of the second bracket. During the rotation, the sphere at the front end of the fixed plate rotates in the fixed block. The No. 2 suction cup can achieve multi-angle rotation under the action of the connecting tube and the fixed block, thereby making the solder paste on the surface of the circuit board more uniform.

[0026] Due to the adoption of the above technical solution, the present invention has the following technical advances compared with the prior art:

[0027] 1. The present invention provides a high-precision patch device for the production of smart electric meters, which is connected to the lower pressure plate in the middle through electric push rods on both sides of the storage box. During the lifting process of the electric push rods, the support rods are driven to lift and lower, thereby causing the No. 1 piston plate to move inside the storage box. The staff can put the solder paste into the storage box at one time. At this time, the solder paste at the bottom of the storage box is squeezed downward under the action of the No. 1 piston plate, thereby reducing the contact between the solder paste and the air and ensuring the quality of the solder paste. At the same time, the transport component is cooperated to make a gap between the bottom of the storage box and the top of the transport component, thereby avoiding the phenomenon of solder paste overflowing due to the fit of the steel mesh and the circuit board during the soldering process. With the cooperation of the solder paste printing component and the transport component, the quality of the solder paste is guaranteed, the time and labor cost of solder paste printing are reduced, and at the same time, the amount of solder paste remaining at the bottom of the solder paste printing component is reduced, thereby improving the efficiency of solder paste printing.

[0028] 2. The present invention provides a high-precision patch device for the production of smart meters, which is connected to an air pump through a hose at the rear of a piston cylinder. When the conveyor belt delivers the circuit board to the right place, the air pump extracts the air in the piston cylinder, causing the second piston plate to move on the inner wall of the piston cylinder, thereby drawing the push block out from the bottom of the first bracket. At this time, the second motor connected to the conveyor belt descends, thereby separating the conveyor belt and the circuit board. When the air pump stops working, the push block slides on the bottom of the first bracket under the action of a magnet. At this time, the first bracket rises under the action of the push block, allowing the conveyor belt to continue to transport the circuit board, thereby ensuring the normal transportation of the circuit board without damaging the circuit board.

[0029] 3. The present invention provides a high-precision patch device for the production of smart meters. The slitting plate is arranged to fit the bottom of the printed board, and the holes on its surface are in the same position as the printed holes. When the solder paste contacts the circuit board, the storage box and the fixed base move in opposite directions. At this time, the printed board moves upward with the storage box. The slitting plate is attached to the bottom of the printed board through a cross limit bar and moves upward with the printed board. It should be noted that at this time, the inclined surface of the side adjustment bevel of the slitting plate conflicts with the fixed bevel. Since the fixed bevel is fixed to the surface of the frame through the limit plate, when the adjustment bevel When it conflicts with the fixed bevel block, the adjusting bevel block slides sideways under the action of the rising force and the inclined surface of the fixed bevel block. At this time, the holes on the surface of the slitting plate and the printed holes are staggered, which further improves the effect of solder paste breaking and makes the solder paste more uniform on the surface of the circuit board. It should be noted that the connection position between the adjusting bevel block and the slitting plate is L-shaped. During the rising process, the L-shaped base of the adjusting bevel block will not block the fixed bevel block, which increases the stability of the structure. When the printed board is reset with the storage box, the slitting plate is reset under the action of the spring, which further improves the accuracy of solder paste extrusion.

[0030] 4. The present invention provides a high-precision patch device for the production of smart meters. After the fixed base is lowered, the bottom of the circuit board and the No. 2 suction cup are fitted together. At this time, the first motor starts to work, and the supporting inclined rod on the top has a slight slope. During the rotation of the first motor, the No. 2 suction cup rotates accordingly. It should be noted that a fixed plate, a connecting tube and a fixed block are provided at the bottom of the No. 2 suction cup, and the fixed plate is fixed on the inner side of the second bracket. During the rotation, the sphere at the front end of the fixed plate rotates in the fixed block. The No. 2 suction cup can achieve multi-angle rotation under the action of the connecting tube and the fixed block, thereby making the solder paste on the surface of the circuit board more uniform and improving the quality of subsequent patching.

[0031] 5. The present invention provides a high-precision patch device for the production of smart meters. By setting up a solder paste printing component and a transportation component, the two form a complete set of patches for meter production. The overall structure is simple and efficient. While ensuring the effect of solder paste use, it can also prevent the solder paste overflowing from the bottom of the printed board from contaminating the subsequent circuit board surface, thereby improving the effect of the patch. At the same time, the automatic transportation of the circuit board is realized under the action of the transportation component, thereby improving the efficiency of the patch. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present invention will be further described below in conjunction with the accompanying drawings.

[0033] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0034] Figure 2 For the present invention Figure 1 Enlarged view of point A in the middle;

[0035] Figure 3 This is a schematic diagram of the three-dimensional structure of the storage box and the fixed base in the present invention;

[0036] Figure 4 It is a schematic diagram of the overall structure of the No. 1 piston plate in the present invention;

[0037] Figure 5 It is a schematic diagram of the three-dimensional structure of the printing plate and the slitting plate in the present invention;

[0038] Figure 6 It is a schematic diagram of the overall structure of the printed board in the present invention;

[0039] Figure 7 For the present invention Figure 6 Enlarged view of point B in the middle;

[0040] Figure 8 It is a schematic diagram of the three-dimensional structure of the printing plate and the sliding plate in the present invention;

[0041] Fig. 9 For the present invention Figure 8 Enlarged view of point C in the middle;

[0042] Fig.10 It is a schematic diagram of the overall structure of the split plate in the present invention;

[0043] Fig.11 For the present invention Fig.10 Enlarged view of point D in the middle;

[0044] Fig.12 It is a schematic diagram of the three-dimensional structure of the fixed inclined block and the adjustable inclined block in the present invention;

[0045] Fig.13 It is a schematic diagram of the overall structure of the fixed base in the present invention;

[0046] Fig.14 It is a schematic diagram of the coordinated three-dimensional structure of the infrared sensor and the fixed base of the present invention;

[0047] Fig.15 It is a schematic diagram of the three-dimensional structure of the second bracket and the second suction cup in the present invention;

[0048] Fig.16 It is a schematic diagram of the coordinated three-dimensional structure of the fixed plate and the fixed block in the present invention;

[0049] Fig.17 It is a schematic diagram of the overall structure of the conveyor belt in the present invention;

[0050] Fig.18 This is a schematic diagram of the three-dimensional structure of the magnet and the push block in the present invention;

[0051] Fig.19 It is a schematic diagram of the cross-sectional structure of the printing plate and the printing hole in the present invention.

[0052] In the figure: 1, device body; 2, frame; 3, first conveyor rack; 4, second conveyor rack; 5, mounting components; 6, first bracket; 7, second bracket; 8, storage box; 9, lower pressure plate; 10, support rod; 11, No. 1 piston plate; 12, electric push rod; 13, limit plate; 14, fixed oblique block; 15, slide rail; 16, limit block; 17, No. 1 rack; 18, gear; 19, No. 2 rack; 20, fixed plate; 21, cutting plate; 22, adjusting oblique block; 23, fixed base; 24, feed port; 25, raised block; 26, printing plate; 27, printing hole; 29 , support seat; 30, spring; 31, sliding plate; 32, circular clamping block; 33, clamping column; 34, cross limit strip; 35, limit inclined plate; 36, connecting column; 37, No. 1 suction cup; 38, infrared sensor; 39, No. 2 suction cup; 40, first motor; 41, support inclined rod; 42, fixed plate; 43, connecting pipe; 44, fixed block; 45, conveyor belt; 46, second motor; 47, limit frame; 48, magnet; 49, piston cylinder; 50, hose; 51, intake pipe; 52, push block; 53, piston rod; 54, No. 2 piston plate; 55, buffer pad. DETAILED DESCRIPTION

[0053] The present invention is further described in detail below in conjunction with embodiments:

[0054] Example 1

[0055] like Figure 1 , Figure 2 and Figure 3 As shown, the present invention provides a high-precision patch device for the production of smart meters, including a device body 1 and a mounting component 5, the mounting component 5 is used to mount electronic components on a circuit board brushed with solder paste and dry it, the rear end of the device body 1 is fixedly connected to a frame 2; it also includes: a solder paste printing component, a solder paste printing component arranged at the front end of the frame 2, the solder paste printing component is used to extrude solder paste onto the surface of the circuit board, the solder paste printing component includes a storage box 8 arranged at the front end of the frame 2, electric push rods 12 are symmetrically fixedly installed on both sides of the storage box 8, the tops of the two electric push rods 12 are fixedly connected to the same lower pressure plate 9, a support rod 10 is fixedly connected to the middle position of the bottom of the lower pressure plate 9, the bottom of the support rod 10 is fixedly connected to a No. 1 piston plate 11, the No. 1 piston plate 11 is slidably connected to the storage box 8, and the shape and contour of the No. 1 piston plate 11 and the storage box 8 are adapted, as shown in FIG. Figure 3 and Figure 5As shown, the bottom of the inner wall of the storage box 8 is connected to a printed board 26 by screws, a plurality of printing holes 27 are provided on the printed board 26, and a sealing strip which is squeezed and matched with the printed board 26 is provided at the bottom of the inner wall of the storage box 8; a transport component is used to transport the circuit board to the bottom of the solder paste printing component, and the transport component is connected to the device body 1.

[0056] In the process of electric meter production, solder paste needs to be poured on the surface of the steel mesh and printed on the surface of the circuit board through a scraper. Since the solder paste cannot be in contact with the air for a long time, adding too much solder paste at one time will affect the quality of the remaining solder paste. Adding it in multiple times will consume more time and manpower. Printing the solder paste through a scraper will cause residues to appear on the bottom of the steel mesh, affecting the progress and effect of subsequent patch processing.

[0057] In this embodiment, the electric push rods 12 on both sides of the storage box 8 are connected to the lower pressure plate 9 in the middle. During the lifting and lowering process of the electric push rods 12, the support rods 10 are driven to lift and lower, thereby causing the No. 1 piston plate 11 to move inside the storage box 8. The staff can place the solder paste into the storage box 8 at one time. At this time, the solder paste at the bottom of the storage box 8 is squeezed downward under the action of the No. 1 piston plate 11, reducing the contact between the solder paste and the air and ensuring the quality of the solder paste. At the same time, the transportation component is cooperated to make a gap between the bottom of the storage box 8 and the top of the transportation component to avoid the phenomenon of solder paste overflow due to the fit between the steel mesh and the circuit board during the soldering process. With the cooperation of the solder paste printing component and the transportation component, the quality of the solder paste is guaranteed, the time and labor cost of solder paste printing are reduced, and at the same time, the amount of solder paste remaining at the bottom of the solder paste printing component is reduced, thereby improving the efficiency of solder paste printing.

[0058] Example 2

[0059] like Figure 6 , Figure 7 and Fig.19 As shown, preferably, based on Example 1, the present invention provides a technical solution: preferably, the opening diameter at the bottom of the printing hole 27 is smaller than the opening diameter at the top, and the inner wall of the printing hole 27 is set to an arc structure.

[0060] Since the solder paste is extruded through the No. 1 piston plate 11 to realize the solder paste printing of the circuit board, the shape of the solder paste is the same as the shape of the printing hole 27 on the surface of the printing plate 26 during the extrusion process, resulting in uncontrollable solder paste breakage position, affecting the adhesion amount of the solder paste.

[0061] In this embodiment, the printing plate 26 is fixed to the inner side of the bottom of the storage box 8 by bolts. At this time, the above-mentioned solder paste enters the storage box 8 through the feed port 24 and accumulates on the surface of the printing plate 26. When the No. 1 piston plate 11 moves downward to extrude the solder paste, the solder paste contacts the circuit board through the printing hole 27. It should be noted that the printing hole 27 is at the same position as the position where the solder paste needs to be printed on the circuit board. The inner wall of the printing hole 27 is bent inward and has a smooth rounded corner. The bottom is close to the middle position, so that the interior of the printing hole 27 is set in an inverted cone shape, and the opening at the bottom is smaller than the opening at the top. In the process of squeezing the solder paste, the solder paste can more easily enter the bottom of the printing hole 27 along the arc contour of the printing hole 27. After the No. 1 piston plate 11 moves down a small part, the solder paste and the top of the circuit board fit together. In this process, the diameter of the part where the solder paste is connected to the printing plate 26 gradually becomes smaller, which makes it easier for the extruded solder paste to separate from the printing plate 26.

[0062] like Figure 4 As shown, preferably, a plurality of raised blocks 25 matching the shape and contour of the printed holes 27 are fixedly connected to the bottom of the No. 1 piston plate 11 , and a feed port 24 is provided on the No. 1 piston plate 11 .

[0063] When the amount of remaining solder paste is small, the amount of solder paste in some printing holes 27 is insufficient, resulting in the No. 1 piston plate 11 being unable to normally extrude the solder paste, and the remaining solder paste in the printing hole 27 being unable to be discharged.

[0064] By setting a protruding block 25 at the bottom of the printing plate 26, the No. 1 piston plate 11 fits against the surface of the printing plate 26. At this time, the residual solder paste in the printing plate 26 is squeezed out by the action of the protruding block 25, thereby reducing the residual amount of solder paste in the printing plate 26 and blocking the printing hole 27 at the same time, thereby avoiding the phenomenon that the No. 1 piston plate 11 cannot extrude the solder paste due to the inability to maintain a vacuum state inside the storage box 8.

[0065] Example 3

[0066] like Figure 3 As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, a slide rail 15 is symmetrically fixedly installed on one side of the storage box 8 close to the frame 2, and a limit block 16 is slidably connected to the inner wall of the slide rail 15, the limit block 16 and the storage box 8 are fixedly connected, and a fixed plate 20 is fixedly connected to one side of the storage box 8 close to the limit block 16, and a No. 1 rack 17 is fixedly connected to the side of the fixed plate 20 close to the slide rail 15, a motor is fixedly installed inside the frame 2, and the output end of the motor extends to the outside of the frame 2 and is fixedly connected to a gear 18, a fixed base 23 is provided at the bottom of the storage box 8, and a No. 2 rack 19 is fixedly connected to the side of the fixed base 23 close to the frame 2, the No. 2 rack 19 and the No. 1 rack 17 are both meshed with the gear 18, and the fixed base 23 is connected to the transport component.

[0067] Since the bottom of the traditional printed board 26 fits the surface of the circuit board, some solder paste will overflow from the gap between the two, causing the bottom of the printed board 26 to be contaminated with solder paste. During the subsequent printing process of the circuit board, the solder paste on the bottom of the printed board 26 will contaminate the surface of the circuit board, thereby affecting the quality of the circuit board.

[0068] In this embodiment, the No. 1 rack 17 and the No. 2 rack 19 are connected to the storage box 8 and the fixed base 23 through the fixed plate 20. The driving gear 18 drives the No. 2 rack 19 and the No. 1 rack 17 to move under the action of the motor, thereby causing the storage box 8 and the fixed base 23 to move in the opposite direction. It should be noted that a circuit board is fixed inside the fixed base 23. During use, the fixed base 23 transports the circuit board to the bottom of the printed board 26. The solder paste is discharged from the printing hole 27 to the surface of the circuit board under the extrusion force of the No. 1 piston plate 11. At this time With the cooperation of rack No. 1 17, gear 18 and rack No. 2 19, the storage box 8 is ordered to move upward and the fixed base 23 is ordered to move downward. Since the above-mentioned printing hole 27 makes the diameter of the connection between the solder paste and the printed board 26 smaller, when the storage box 8 and the fixed base 23 move in opposite directions at the same time, the solder paste is more likely to break at the connection position with the printed board 26, thereby realizing the connection between the solder paste and the circuit board, further reducing the possibility of residual solder paste at the bottom of the printed board 26, and further avoiding the situation where the residual solder paste at the bottom of the printed board 26 affects the subsequent circuit board patch.

[0069] like Figure 5 , Fig.10 , Fig.11 and Fig.12 As shown, preferably, one side of the storage box 8 is detachably connected to a support seat 29, a spring 30 is fixedly connected to the middle position of the bottom of the support seat 29, one end of the spring 30 is fixedly connected to the slitting plate 21, the side of the slitting plate 21 away from the spring 30 is fixedly connected to an adjusting bevel 22, the side of the adjusting bevel 22 close to the slitting plate 21 is arranged in an inclined surface, the side of the adjusting bevel 22 close to the slitting plate 21 is slidably connected to a fixed bevel 14, the rear end of the fixed bevel 14 is fixedly connected to a limiting plate 13, the limiting plate 13 and the frame 2 are fixedly connected, the top of the slitting plate 21 fits with the bottom of the printing plate 26, the top of the support seat 29 is fixedly connected to a cross limit bar 34, and the cross limit bar 34 and the printing plate 26 are slidably connected.

[0070] Since the solder paste is connected to the circuit board by moving the storage box 8 and the fixed base 23 in opposite directions at the same time, this method may cause inconsistent positions of solder paste breakage, resulting in uneven amount of solder paste adhered to the circuit board, affecting the quality of subsequent patching.

[0071] In order to ensure the uniformity of solder paste printing, the slitting plate 21 is arranged to fit with the bottom of the printing plate 26, and the position of the holes opened on its surface is the same as that of the printing holes 27. When the solder paste contacts the circuit board, the storage box 8 and the fixed base 23 move in the opposite direction. At this time, the printing plate 26 moves upward with the storage box 8. The slitting plate 21 is fitted to the bottom of the printing plate 26 through the cross limit bar 34 and moves upward with the printing plate 26. It should be noted that at this time, the inclined surface of the side adjustment bevel block 22 of the slitting plate 21 conflicts with the fixed bevel block 14. Since the fixed bevel block 14 is fixed to the surface of the frame 2 through the limit plate 13, when the adjustment bevel block 22 and the fixed bevel block 14 are When the inclined blocks 14 collide with each other, the adjusting inclined block 22 slides sideways under the action of the upward force and the inclined surface of the fixed inclined block 14. At this time, the holes on the surface of the slitting plate 21 and the printing holes 27 are staggered, which further improves the effect of solder paste breaking and makes the solder paste more uniform on the surface of the circuit board. It should be noted that the connection position between the adjusting inclined block 22 and the slitting plate 21 is L-shaped. During the rising process, the L-shaped base of the adjusting inclined block 22 will not block the fixed inclined block 14, which increases the stability of the structure. When the printed board 26 is reset with the storage box 8, the slitting plate 21 is reset under the action of the spring 30, which further improves the accuracy of solder paste extrusion.

[0072] Example 4

[0073] like Figure 8 and Fig. 9 As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the top of the printing plate 26 is detachably connected to the sliding plate 31, and the side of the printing plate 26 close to the sliding plate 31 is fixedly connected to a circular clamping block 32, and the inner wall of the circular clamping block 32 is inserted with a clamping column 33, the clamping column 33 and the sliding plate 31 are fixedly connected, and the side of the sliding plate 31 away from the clamping column 33 is arranged in an inclined surface, and the clamping column 33 is arranged in a conical shape.

[0074] Due to the poor fluidity of solder paste, when it is first placed in the storage box 8, a few printed holes 27 at the edge may not be injected with solder paste, resulting in the printed holes 27 not being blocked by solder paste when the solder paste is first extruded. In the process of squeezing the No. 1 piston plate 11, the extrusion length of the solder paste is uneven (no solder paste is squeezed out of some printed holes 27 that are not filled with solder paste), resulting in poor quality of subsequent patch.

[0075] In this embodiment, sliding plates 31 are provided on both sides of the top of the printing plate 26. One side of the sliding plate 31 is inclined. The sliding plate 31 can be used to apply solder paste on the surface of the printing plate 26 to ensure that there is solder paste in each printing hole 27, so that the solder paste extrusion effect is better.

[0076] Specifically, the sliding plate 31 is connected to the printed board 26 through a clamping column 33. An arc-shaped groove is provided at the middle position of the clamping column 33. The top of the clamping column 33 is rounded. The circular clamping block 32 inside the printed board 26 is conical. The opening diameter of the top is smaller than the opening diameter of the bottom. When fixing the sliding plate 31, the clamping column 33 is inserted into the circular clamping block 32, and the top of the circular clamping block 32 is fitted with the middle position of the circular clamping block 32 to fix the sliding plate 31.

[0077] Example 5

[0078] like Fig.13 and Fig.14 As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the transport component includes a limiting inclined plate 35 symmetrically fixedly connected to the inner wall of the fixed base 23, and a plurality of connecting columns 36 distributed in a linear array are fixedly connected to the side of the limiting inclined plate 35 close to the fixed base 23, and the connecting columns 36 and the fixed base 23 are slidably connected, and a plurality of No. 1 suction cups 37 distributed in a linear array are fixedly connected to the top of the limiting inclined plate 35, and an infrared sensor 38 is fixedly connected to the top of the inner wall of the fixed base 23, and the No. 1 suction cup 37 is connected to an external air pump through a pipeline, and the transport component also includes a first conveying rack 3 fixedly connected to the top of the device body 1, and a second conveying rack 4 is fixedly connected to the top of the device body 1 close to the mounting component 5.

[0079] Since the circuit board needs to be transported to the bottom of the printed board 26 before the solder paste can be extruded, and the circuit boards of different batches are of different sizes, the circuit boards cannot be fixed.

[0080] In this embodiment, by setting up a fixed base 23, the inner limiting inclined plate 35 can adjust its own position under the action of the connecting column 36, and the inner infrared sensor 38 can sense the position of the circuit board in real time. When the circuit board is transported to the surface of the limiting inclined plate 35 under the action of the first conveying rack 3, the No. 1 suction cup 37 can fix the circuit board on the surface of the limiting inclined plate 35 under the action of the air pump, thereby increasing the stability of the circuit board during the process of applying solder paste, and the circuit board is sent to the mounting component 5 for soldering treatment under the action of the second conveying rack 4.

[0081] like Figure 1 , Fig.17 and Fig.18As shown, preferably, a first bracket 6 is provided at the middle position of the top of the device body 1, a second motor 46 is fixedly connected to the outer wall of the first bracket 6, a conveyor belt 45 is fixedly connected to the inner wall of the first bracket 6, a limit frame 47 is fixedly connected to one side of the bottom of the first bracket 6, a magnet 48 is fixedly connected to the inner wall of the limit frame 47, a push block 52 is detachably connected to the side of the magnet 48 away from the limit frame 47, a piston rod 53 is fixedly connected to the side of the push block 52 away from the magnet 48, and one end of the piston rod 53 is fixedly connected to the second piston plate 54, Buffer pads 55 are fixedly connected to both sides of the No. 2 piston plate 54, and a piston cylinder 49 is provided on the outer wall of the piston rod 53. The piston cylinder 49 and the No. 2 piston plate 54 are slidably connected, and an intake pipe 51 is fixedly connected to the outer wall of the piston cylinder 49. A hose 50 is fixedly connected to the end of the piston cylinder 49 away from the piston rod 53. The push block 52 is slidably connected to the first bracket 6, and the top of the push block 52 is arranged in an inclined surface. The shape contours of the push block 52 and the bottom of the first bracket 6 are adapted, and a limit column for limiting the stroke of the No. 2 piston plate 54 is fixedly connected to the inner wall of the piston cylinder 49.

[0082] Since the first conveyor rack 3 cannot completely deliver the circuit board to the position, the solder paste cannot be properly squeezed onto the surface of the circuit board. Therefore, a conveyor belt 45 is added to deliver the circuit board to the specified position. However, in this way, after the circuit board is in place, the conveyor belt 45 is still working, causing the bottom of the circuit board to be sucked by the No. 1 suction cup 37 and rubbed by the conveyor belt 45, causing damage to the circuit board.

[0083] In this embodiment, the hose 50 at the tail end of the piston cylinder 49 is connected to the above-mentioned air pump. After the conveyor belt 45 conveys the circuit board to the right place, the air pump draws out the air in the piston cylinder 49, causing the No. 2 piston plate 54 to move on the inner wall of the piston cylinder 49, thereby extracting the push block 52 from the bottom of the first bracket 6. At this time, the second motor 46 connected to the conveyor belt 45 descends, thereby separating the conveyor belt 45 and the circuit board. When the air pump stops working, the push block 52 slides on the bottom of the first bracket 6 under the action of the magnet 48. At this time, the first bracket 6 rises under the action of the push block 52, allowing the conveyor belt 45 to continue to convey the circuit board, wherein the buffer pad 55 can absorb part of the impact generated during the movement of the No. 2 piston plate 54.

[0084] Example 6

[0085] like Fig.15 and Fig.16As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, a second bracket 7 is fixedly connected to the middle position of the top of the device body 1, a fixed plate 42 is fixedly connected to the inner wall of the second bracket 7, a first motor 40 is arranged at the middle position of the bottom of the second bracket 7, a supporting diagonal rod 41 is fixedly connected to the top of the first motor 40, a second suction cup 39 is fixedly connected to the top of the supporting diagonal rod 41, the fixed plate 42 is spherically arranged on the side away from the second bracket 7, a fixed block 44 is rotatably connected to the side of the fixed plate 42 away from the second bracket 7, and connecting tubes 43 are fixedly connected to both sides of the fixed block 44.

[0086] After the solder paste is stained on the circuit board, part of the solder paste will be unevenly stained, which will affect the effect of subsequent patch.

[0087] In this embodiment, when the circuit board is stained with solder paste and descends with the fixed base 23, the bottom and the No. 2 suction cup 39 are in contact with each other, and the first motor 40 starts to work at this time. The supporting inclined rod 41 on its top has a slight slope. During the rotation of the first motor 40, the No. 2 suction cup 39 rotates accordingly. It should be noted that a fixed plate 42, a connecting tube 43 and a fixed block 44 are provided at the bottom of the No. 2 suction cup 39, and the fixed plate 42 is fixed on the inner side of the second bracket 7. During the rotation, the ball at the front end of the fixed plate 42 rotates in the fixed block 44, and the No. 2 suction cup 39 can realize multi-angle rotation under the action of the connecting tube 43 and the fixed block 44, thereby making the solder paste on the surface of the circuit board more uniform and improving the quality of subsequent patch.

[0088] The working principle of the high-precision patch device used in the production of smart meters is explained in detail below.

[0089] like Figure 1-Figure 19As shown, during the production process, the circuit board is first transported by the first conveyor rack 3 to the surface of the limiting inclined plate 35. The surface of the limiting inclined plate 35 is arranged in an inclined plane, so that the circuit board can be moved above the first suction cup 37. The limiting inclined plate 35 can adjust its own position under the action of the connecting column 36, and the infrared sensor 38 inside it can sense the position of the circuit board in real time. When the circuit board is transported to the surface of the limiting inclined plate 35 under the action of the first conveyor rack 3, the hose 50 at the tail of the piston cylinder 49 is connected to the air pump. When the conveyor belt 45 transports the circuit board to the position, the air pump extracts the air in the piston cylinder 49. , so that the second piston plate 54 moves on the inner wall of the piston cylinder 49, so that the push block 52 is pulled out from the bottom of the first bracket 6. At this time, the second motor 46 connected to the conveyor belt 45 descends, thereby separating the conveyor belt 45 and the circuit board. When the air pump stops working, the push block 52 slides on the bottom of the first bracket 6 under the action of the magnet 48. At this time, the first bracket 6 rises under the action of the push block 52, so that the conveyor belt 45 can continue to transport the circuit board. After the conveyor belt 45 transports the circuit board to the right place, the first suction cup 37 can fix the circuit board on the surface of the limit inclined plate 35 under the action of the air pump;

[0090] The electric push rods 12 on both sides of the storage box 8 are connected to the lower pressure plate 9 in the middle. During the lifting process of the electric push rods 12, the support rods 10 are driven to lift and lower, thereby moving the No. 1 piston plate 11 inside the storage box 8. The staff can put the solder paste into the storage box 8 at one time. At this time, the solder paste at the bottom of the storage box 8 is squeezed downward under the action of the No. 1 piston plate 11, reducing the contact between the solder paste and the air and ensuring the quality of the solder paste. The printing plate 26 is fixed to the inner side of the bottom of the storage box 8 by bolts. At this time, the solder paste enters the storage box 8 through the feed port 24 and accumulates on the surface of the printing plate 26. When the No. 1 piston plate 11 moves downward to squeeze the solder paste, the solder paste The solder paste contacts the circuit board through the printing hole 27. The printing hole 27 is at the same position as the position where the solder paste needs to be printed on the circuit board. The inner wall of the printing hole 27 is bent inward and is set in a smooth rounded corner. The bottom is close to the middle position, so that the inside of the printing hole 27 is set in an inverted cone shape. The opening at the bottom is smaller than the opening at the top. In the process of squeezing the solder paste, the solder paste is more easily squeezed to the bottom of the printing hole 27 along the arc contour of the inner wall of the printing hole 27. After the No. 1 piston plate 11 moves down a small part, the solder paste fits the top of the circuit board. In this process, the diameter of the part where the solder paste is connected to the printing plate 26 gradually becomes smaller, which makes it easier for the extruded solder paste to separate from the printing plate 26.

[0091] When the amount of remaining solder paste is small, the first piston plate 11 is in contact with the surface of the printing plate 26, and the residual solder paste in the printing plate 26 is squeezed out by the protruding block 25, thereby reducing the residual amount of solder paste in the printing plate 26;

[0092] When solder paste is first added to the storage box 8, sliding plates 31 are provided on both sides of the top of the printing plate 26. One side of the sliding plate 31 is inclined. The sliding plate 31 can be used to apply solder paste on the surface of the printing plate 26 to ensure that each printing hole 27 has solder paste, so that the solder paste extrusion effect is better.

[0093] The slitting plate 21 fits with the bottom of the printed board 26, and the holes on its surface are in the same position as the printing holes 27. When the solder paste contacts the circuit board, the storage box 8 and the fixed base 23 move in the opposite direction. At this time, the printed board 26 moves upward with the storage box 8. The slitting plate 21 fits with the bottom of the printed board 26 through the cross limit bar 34 and moves upward with the printed board 26. At this time, the inclined surface of the side adjustment bevel block 22 of the slitting plate 21 conflicts with the fixed bevel block 14. Since the fixed bevel block 14 is fixed to the surface of the frame 2 through the limit plate 13, when the adjustment bevel block 22 and the fixed bevel block 14, the adjusting bevel block 22 slides to the side under the action of the rising force and the inclined surface of the fixed bevel block 14. At this time, the holes on the surface of the slitting plate 21 and the printing holes 27 are staggered, which further improves the effect of solder paste breaking and makes the solder paste more uniform on the surface of the circuit board. The connection position between the adjusting bevel block 22 and the slitting plate 21 is L-shaped. During the rising process, the L-shaped base of the adjusting bevel block 22 will not block the fixed bevel block 14, which increases the stability of the structure. When the printed board 26 is reset with the storage box 8, the slitting plate 21 is reset under the action of the spring 30;

[0094] When the circuit board is stained with solder paste and descends with the fixed base 23, the bottom and the No. 2 suction cup 39 fit together, and the first motor 40 starts to work at this time. The supporting inclined rod 41 on its top has a slight slope. During the rotation of the first motor 40, the No. 2 suction cup 39 rotates accordingly. It should be noted that a fixed plate 42, a connecting tube 43 and a fixed block 44 are provided at the bottom of the No. 2 suction cup 39, and the fixed plate 42 is fixed on the inner side of the second bracket 7. During the rotation, the ball at the front end of the fixed plate 42 rotates in the fixed block 44, and the No. 2 suction cup 39 can realize multi-angle rotation under the action of the connecting tube 43 and the fixed block 44. Finally, the circuit board stained with solder paste is sent to the mounting component 5 for welding through the second conveying rack 4.

[0095] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A high-precision chip mounting device for smart meter production, comprising a device body (1) and a mounting component (5), wherein the mounting component (5) is used to mount electronic components on a circuit board brushed with solder paste and dry the circuit board, and the rear end of the device body (1) is fixedly connected to a frame (2); characterized in that: Also includes: A solder paste printing assembly is arranged at the front end of the frame (2), and the solder paste printing assembly is used to extrude solder paste onto the surface of the circuit board; the solder paste printing assembly includes a storage box (8) arranged at the front end of the frame (2), electric push rods (12) are symmetrically fixedly installed on both sides of the storage box (8), the tops of the two electric push rods (12) are fixedly connected to the same lower pressure plate (9), a support rod (10) is fixedly connected at the middle position of the bottom of the lower pressure plate (9), the bottom of the support rod (10) is fixedly connected to a No. 1 piston plate (11), the No. 1 piston plate (11) and the storage box (8) are slidably connected, the No. 1 piston plate (11) and the storage box (8) are matched in shape and contour, the bottom of the inner wall of the storage box (8) is connected to a printing plate (26) by screws, a plurality of printing holes (27) are opened on the printing plate (26), and the bottom of the inner wall of the storage box (8) is provided with a sealing strip that is squeezed and matched with the printing plate (26); A transport component, used for transporting the circuit board to the bottom of the solder paste printing component, the transport component being connected to the device body (1); The storage box (8) is symmetrically fixedly installed with a slide rail (15) on one side close to the rack (2), and a limit block (16) is slidably connected to the inner side wall of the slide rail (15). The limit block (16) and the storage box (8) are fixedly connected. A fixed plate (20) is fixedly connected to one side of the storage box (8) close to the limit block (16), and a first rack (17) is fixedly connected to one side of the fixed plate (20) close to the slide rail (15). The rack ( 2) is fixedly installed inside, the output end of the motor extends to the outside of the frame (2) and is fixedly connected to a gear (18), a fixed base (23) is provided at the bottom of the storage box (8), a second rack (19) is fixedly connected to the side of the fixed base (23) close to the frame (2), the second rack (19) and the first rack (17) are both meshed and connected to the gear (18), and the fixed base (23) is connected to the transport component; A support seat (29) is detachably connected to one side of the storage box (8); a spring (30) is fixedly connected to the middle position of the bottom of the support seat (29); one end of the spring (30) is fixedly connected to a slitting plate (21); a side of the slitting plate (21) away from the spring (30) is fixedly connected to an adjusting bevel (22); a side of the adjusting bevel (22) close to the slitting plate (21) is arranged in an inclined surface; a side of the adjusting bevel (22) close to the slitting plate (21) is slidably connected to a fixed bevel (14); a rear end of the fixed bevel (14) is fixedly connected to a limiting plate (13); the limiting plate (13) is fixedly connected to the frame (2); the top of the slitting plate (21) is fitted with the bottom of the printing plate (26); a cross limiting strip (34) is fixedly connected to the top of the support seat (29); and the cross limiting strip (34) is slidably connected to the printing plate (26).

2. A high-precision patch device for smart meter production according to claim 1, characterized in that: The transport component comprises a limiting inclined plate (35) symmetrically fixedly connected to the inner side wall of the fixed base (23); a plurality of connecting columns (36) distributed in a linear array are fixedly connected to the side of the limiting inclined plate (35) close to the fixed base (23); the connecting columns (36) and the fixed base (23) are slidably connected; a plurality of No. 1 suction cups (37) distributed in a linear array are fixedly connected to the top of the limiting inclined plate (35); an infrared sensor (38) is fixedly connected to the top of the inner side wall of the fixed base (23); and the No. 1 suction cup (37) is connected to an external air pump through a pipeline.

3. A high-precision patch device for smart meter production according to claim 2, characterized in that: The transport assembly also includes a first conveying frame (3) fixedly connected to the top of the device body (1); a second conveying frame (4) is fixedly connected to the top of the device body (1) near the mounting component (5); a first bracket (6) is arranged at the middle position of the top of the device body (1); a second motor (46) is fixedly connected to the outer wall of the first bracket (6); a conveyor belt (45) is fixedly connected to the inner wall of the first bracket (6); a limit frame (47) is fixedly connected to one side of the bottom of the first bracket (6); a magnet (48) is fixedly connected to the inner wall of the limit frame (47); a push block (52) is detachably connected to the side of the magnet (48) away from the limit frame (47); a piston rod (53) is fixedly connected to the side of the push block (52) away from the magnet (48). ), one end of the piston rod (53) is fixedly connected to a No. 2 piston plate (54), both sides of the No. 2 piston plate (54) are fixedly connected to buffer pads (55), the outer wall of the piston rod (53) is provided with a piston cylinder (49), the piston cylinder (49) and the No. 2 piston plate (54) are slidably connected, the outer wall of the piston cylinder (49) is fixedly connected to an intake pipe (51), one end of the piston cylinder (49) away from the piston rod (53) is fixedly connected to a hose (50), the push block (52) and the first bracket (6) are slidably connected, the top of the push block (52) is arranged in an inclined surface, the shape contours of the push block (52) and the bottom of the first bracket (6) are adapted, and the inner wall of the piston cylinder (49) is fixedly connected to a limit column for limiting the stroke of the No. 2 piston plate (54).

4. The high-precision patch device for smart meter production according to claim 1, characterized in that: The opening diameter of the bottom of the printing hole (27) is smaller than the opening diameter of the top, and the inner wall of the printing hole (27) is arranged to be an arc-shaped structure.

5. The high-precision patch device for smart meter production according to claim 1, characterized in that: A plurality of raised blocks (25) matching the shape and contour of the printing hole (27) are fixedly connected to the bottom of the No. 1 piston plate (11), and a feed port (24) is provided on the No. 1 piston plate (11), and a sealing cover for sealing the feed port (24) is detachably connected to the top of the feed port (24).

6. The high-precision patch device for smart meter production according to claim 1, characterized in that: A second bracket (7) is fixedly connected at the middle position of the top of the device body (1), a fixing plate (42) is fixedly connected on the inner side wall of the second bracket (7), a first motor (40) is arranged at the middle position of the bottom of the second bracket (7), a supporting inclined rod (41) is fixedly connected at the top of the first motor (40), a second suction cup (39) is fixedly connected at the top of the supporting inclined rod (41), a side of the fixing plate (42) away from the second bracket (7) is spherically arranged, a side of the fixing plate (42) away from the second bracket (7) is rotatably connected to a fixing block (44), and connecting pipes (43) are fixedly connected to both sides of the fixing block (44).

7. The high-precision patch device for smart meter production according to claim 1, characterized in that: The top of the printing plate (26) is detachably connected to a sliding plate (31); a circular clamping block (32) is fixedly connected to a side of the printing plate (26) close to the sliding plate (31); a clamping column (33) is inserted into the inner wall of the circular clamping block (32); the clamping column (33) and the sliding plate (31) are fixedly connected; a side of the sliding plate (31) away from the clamping column (33) is arranged in an inclined surface; and the clamping column (33) is arranged in a conical shape.

Images