Semiconductor resin vibration arrangement mechanism

Abstract

The invention relates to the field of semiconductor chip manufacturing, in particular to a semiconductor resin vibration arrangement mechanism which comprises complete machine equipment, a vibration mechanism is fixedly installed at the top of the complete machine equipment, a discharging mechanism is installed above the vibration mechanism, and a feeding mechanism is installed at the feeding end of the vibration mechanism. The material detecting mechanism is installed at the tail end of the feeding mechanism, the material discharging mechanism is installed on the rear portion of the material detecting mechanism, the resin arranging unit is installed at the rear end of the material detecting mechanism, and the resin arranging unit is located above the material discharging mechanism. And incomplete and unqualified resin materials can be separated and discharged, so that the resin arrangement and transportation space is reduced, the quality of plastic package products is ensured, and the production efficiency of plastic package equipment is improved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor chip manufacturing, in particular to a semiconductor resin vibration arrangement mechanism. Background Art

[0002] At present, in the equipment for semiconductor plastic encapsulation products, the resin arrangement method is mostly to arrange the resin directly in a straight line or arrange it horizontally and then vertically before transporting it to a mechanism for grabbing the resin. The disadvantages are: the resin arrangement speed is slow, the position and specifications of the resin cannot be detected, and it cannot be ensured whether the transported resin is qualified, which in turn affects the quality of the overall plastic encapsulation product. At the same time, the resin arrangement and transportation take up a large space, which makes the entire equipment bloated and not minimalist and refined enough. If different specifications of resins need to be arranged, different resin arrangement units need to be replaced, and the equipment needs to be disassembled and assembled again, which wastes a lot of manpower and time and also affects the production efficiency of the equipment. Summary of the invention

[0003] In order to improve the production efficiency of the equipment, reduce the equipment operation rhythm, and reduce the space occupied by the resin vibration part of the entire equipment, the present invention provides a semiconductor resin vibration arrangement mechanism.

[0004] The technical solution adopted by the present invention is to provide a semiconductor resin vibration arrangement mechanism, including a complete machine, wherein a vibration mechanism, a discharge mechanism, a feeding mechanism, a material inspection mechanism, a discharge mechanism and a resin arrangement unit are fixedly installed on the top of the complete machine, wherein the discharge mechanism is installed above the vibration mechanism, the feeding mechanism is installed at the feeding end of the vibration mechanism, the material inspection mechanism is installed at the end of the feeding mechanism, the discharge mechanism is installed at the rear of the material inspection mechanism, and the resin arrangement unit is installed at the rear end of the material inspection mechanism, and the resin arrangement unit is located above the discharge mechanism;

[0005] The discharging mechanism is composed of a mechanical slide rail, a material box, a resin baffle plate 1, a material bin 1, a sensor 1, a sensor 2, and a discharging guide plate. The two mechanical slide rails are slidably installed on both sides of the material box, the resin baffle plate 1 is movably installed at the bottom of the material box, the material bin 1 is installed at the bottom of the resin baffle plate 1, the sensor 1 and the sensor 2 are installed on both sides outside the material box, the discharging guide plate is installed at the discharging position of the discharging mechanism, the material bin vibration motor is installed below the material bin 1, and the circular vibration motor is installed above the bottom plate 1.

[0006] Furthermore, the vibration mechanism consists of a base plate 1, a silo vibration motor and a circular vibration motor. The base plate 1 is installed on the equipment body, the silo vibration motor is installed below the silo, and the circular vibration motor is installed above the base plate 1.

[0007] Furthermore, the feeding mechanism is composed of a discharging guide slider, a linear vibration motor, a counterweight, a sensor mounting plate, and a resin height limit plate. The discharging guide slider is installed at the end of the circular vibrator, the linear vibration motor is installed at the bottom of the discharging guide slider, the counterweight is installed on the right side of the linear vibration motor, the resin height limit plate is installed above the discharging guide slider, and the sensor mounting plate is installed obliquely above the resin height limit plate.

[0008] Furthermore, the material checking mechanism is composed of sensor three, sensor four, a height limit plate fixing block, a pressing cylinder, sensor five, sensor mounting plate two, sensor mounting plate three, sensor fixing block, a resin baffle mounting block, resin baffle two, connecting rod one, and base plate two. The sensor three and sensor four are installed on the outside of the sensor mounting plate one, the height limit plate fixing block is installed on the front end notch of the resin height limit plate, the pressing cylinder is vertically installed in the U-shaped groove of the height limit plate fixing block, sensor five is installed in front of the pressing cylinder, sensor five is installed on the outside of the sensor fixing block through sensor mounting plate two and sensor mounting plate three, a grease baffle mounting block is installed under the sensor fixing block, the grease baffle mounting block is connected to the resin baffle two, the sensor fixing block and the resin baffle mounting block are installed on the outside of the base plate two through connecting rod one, and the base plate two is installed above the base plate one.

[0009] Furthermore, the discharging mechanism is composed of a slide, a base plate, a connecting rod 2, a movable base plate, a waste guide plate, a waste collection box, a sensor detection plate, a sensor 9, a sensor 10, a cylinder connecting block, a cylinder 1, a linear guide 1, a linear guide 2, a limit block 1, a limit block 2, a limit nail 1, and a limit nail 2. The slide is fixed on the outside of the base plate, and the base plate is installed above the movable base plate through four connecting rods 2. The waste guide plate is installed on the side of the slide, and the waste collection box is installed below the waste guide plate. The sensor detection plate is installed on the outside of the movable base plate, the sensor 9 and the sensor 10 are installed on the outside of the base plate 2, the cylinder connecting block is installed on the outside of the movable base plate, the cylinder 1 is installed on the outside of the cylinder connecting block, the linear guide 1 and the linear guide 2 are installed below the movable base plate, and the linear guide 1 and the linear guide 2 have limit blocks 1 and the outside of limit blocks 2 installed on the base plate 2 on both sides respectively, and the limit nails 1 and 2 are installed on the heads of the limit blocks 1 and the limit blocks 2 respectively.

[0010] Furthermore, the resin arrangement unit is composed of a claw 1, a claw mounting block, a linear module, a sensor 6, a sensor 7, and a sensor 8. The claw is installed above the claw mounting block, the claw mounting block is installed above the linear module, the sensor 6, the sensor 7, and the sensor 8 are installed on the side of the linear module, and the linear module is installed on the outside of the substrate.

[0011] The beneficial effects of the present invention are as follows:

[0012] The semiconductor resin vibration arrangement mechanism described in the present invention can ensure the speed of resin arrangement and transportation, as well as the detection of resin specifications and positions, and can separate and discharge incomplete and unqualified resin materials, thereby reducing the space for resin arrangement and transportation, ensuring the quality of plastic-sealed products, and improving the production efficiency of plastic-sealed equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a front view of a semiconductor resin vibration arrangement mechanism;

[0014] Figure 2 It is a rear view of a semiconductor resin vibration arrangement mechanism;

[0015] Figure 3 It is an axonometric view of a semiconductor resin vibration arrangement mechanism;

[0016] Figure 4 yes Figure 3 Partial view of middle III;

[0017] Figure 5 yes Figure 3 Partial view of middle IV;

[0018] Figure 6 It is a schematic diagram of the connection of a material box of a semiconductor resin vibration arrangement mechanism;

[0019] Figure 7 It is a schematic diagram of the connection of a moving base plate of a semiconductor resin vibration arrangement mechanism;

[0020] Figure 8 yes Figure 7 Partial view of II in the middle.

[0021] In the figure: 0, bottom plate 1; 1, mechanical slide rail; 2, material box; 3, resin baffle 1; 4, silo 1; 5, sensor 1; 6, sensor 2; 7, discharge guide plate; 8, silo vibration motor; 9, circular vibration motor; 10, discharge guide slider; 11, linear vibration motor; 12, counterweight; 13, sensor 3; 14, sensor 4; 15, sensor mounting plate 1; 16, resin height limit plate; 17, height limit plate fixing block; 18, pressing cylinder; 19, sensor 5; 20, sensor mounting plate 2; 21, sensor mounting plate 3; 22, sensor fixing block; 23, resin baffle mounting block; 24, resin baffle 2; 25, connecting rod 1; 26, bottom plate 2; 27, slide ; 28. Base plate; 29. ​​Connecting rod 2; 30. Moving bottom plate; 31. Waste guide plate; 32. Waste collection box; 33. Pusher claw 1; 34. Pusher claw mounting block; 35. Linear module; 36. Sensor 6; 37. Sensor 7; 38. Sensor 8; 39. Sensor detection board; 40. Sensor 9; 41. Sensor 10; 42. Cylinder connecting block; 43. Cylinder 1; 44. Linear guide 1; 45. Linear guide 2; 46. Limit block 1; 47. Limit block 2; 48. Limit pin 1; 49. Limit pin 2; 100. Discharge mechanism; 101. Vibration mechanism; 102. Feeding mechanism; 103. Material inspection mechanism; 104. Discharge mechanism; 105. Resin arrangement unit. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0023] like Figure 1-Figure 8 As shown, the present invention provides a semiconductor resin vibration arrangement mechanism, including a complete machine, wherein a vibration mechanism 101 is fixedly installed on the top of the complete machine, the discharge mechanism 100 is installed above the vibration mechanism 101, the feeding mechanism 102 is installed at the feeding end of the vibration mechanism 101, the material inspection mechanism 103 is installed at the end of the feeding mechanism 102, the discharge mechanism 104 is installed at the rear of the material inspection mechanism 103, and the resin arrangement unit 105 is installed at the rear end of the material inspection mechanism 103, and the resin arrangement unit 105 is located above the discharge mechanism 104;

[0024] The discharge mechanism 100 is composed of a mechanical slide rail 1, a material box 2, a resin baffle plate 3, a silo 4, a sensor 1 5, a sensor 2 6, and a discharge guide piece 7. The two mechanical slide rails 1 are slidably installed on both sides of the material box 2, the resin baffle plate 3 is movably installed at the bottom of the material box 2, the silo 4 is installed at the bottom of the resin baffle plate 3, the sensor 1 5 and the sensor 2 6 are installed on both sides outside the material box 2, the discharge guide piece 7 is installed at the discharge position of the discharge mechanism 100, the silo vibration motor 8 is installed below the silo 4, and the circular vibration motor 9 is installed above the bottom plate 0.

[0025] Specifically, the vibration mechanism 101 is composed of a base plate 0, a silo vibration motor 8, and a circular vibration motor 9. The base plate 0 is installed on the equipment body, the silo vibration motor 8 is installed below the silo 4, and the circular vibration motor 9 is installed above the base plate 0.

[0026] Specifically, the feeding mechanism 102 is composed of a discharge guide slider 10, a linear vibration motor 11, a counterweight 12, a sensor mounting plate 15, and a resin height limiting plate 16. The discharge guide slider 10 is installed at the end of the circular vibrator, the linear vibration motor 11 is installed at the bottom of the discharge guide slider 10, the counterweight 12 is installed on the right side of the linear vibration motor 11, the resin height limiting plate 16 is installed above the discharge guide slider 10, and the sensor mounting plate 15 is installed obliquely above the resin height limiting plate 16.

[0027] Specifically, the material inspection mechanism 103 is composed of a sensor three 13, a sensor four 14, a height limit plate fixing block 17, a pressing cylinder 18, a sensor five 19, a sensor mounting plate two 20, a sensor mounting plate three 21, a sensor fixing block 22, a resin baffle mounting block 23, a resin baffle two 24, a connecting rod one 25, and a bottom plate two 26. The sensor three 13 and the sensor four 14 are installed on the outside of the sensor mounting plate one 15, the height limit plate fixing block 17 is installed at the front end notch position of the resin height limit plate 16, and the pressing cylinder 18 is vertically installed in the U-shaped groove of the height limit plate fixing block 17, and a sensor five 19 is installed in front of the pressing cylinder 18. The sensor five 19 is installed on the outside of the sensor fixing block 22 through the sensor mounting plate two 20 and the sensor mounting plate three 21. A grease baffle mounting block 23 is installed under the sensor fixing block 22. The grease baffle mounting block 23 is connected to the resin baffle two 24. The sensor fixing block 22 and the resin baffle mounting block 23 are installed on the outside of the bottom plate two 26 through the connecting rod one 25, and the bottom plate two 26 is installed above the bottom plate one 0.

[0028] Specifically, the discharging mechanism 104 is composed of a slide 27, a base plate 28, a connecting rod 29, a movable base plate 30, a waste guide plate 31, a waste collection box 32, a sensor detection plate 39, a sensor 9 40, a sensor 10 41, a cylinder connection block 42, a cylinder 1 43, a linear guide 1 44, a linear guide 2 45, a limit block 1 46, a limit block 2 47, a limit pin 1 48 and a limit pin 2 49. The slide 27 is fixed to the outside of the base plate 28, the base plate 28 is installed above the movable base plate 30 through four connecting rods 29, the waste guide plate 31 is installed on the side of the slide 27, and the waste collection box 3 2 is installed below the waste guide plate 31, the sensor detection plate 39 is installed on the outside of the moving base plate 30, the sensor nine 40 and the sensor ten 41 are installed on the outside of the base plate two 26, the cylinder connecting block 42 is installed on the outside of the moving base plate 30, the cylinder one 43 is installed on the outside of the cylinder connecting block 42, the linear guide one 44 and the linear guide two 45 are installed below the moving base plate 30, and the linear guide one 44 and the linear guide two 45 have limit blocks one 46 and limit blocks two 47 installed on the outside of the base plate two 26 on both sides, and the heads of the limit blocks one 46 and the limit blocks two 47 are respectively installed with limit pins one 48 and limit pins two 49.

[0029] Specifically, the resin arrangement unit 105 is composed of a pusher claw 1 33, a pusher claw mounting block 34, a linear module 35, a sensor 6 36, a sensor 7 37 and a sensor 8 38, the pusher claw is mounted above the pusher claw mounting block 34, the pusher claw mounting block 34 is mounted above the linear module 35, the sensor 6 36, the sensor 7 37, the sensor 8 38 are mounted on the side of the linear module 35, and the linear module 35 is mounted on the outside of the substrate 28.

[0030] Specifically, the silo vibration motor 8 is installed under the silo 1 4 to drive the resin material in the silo to vibrate into the disc track. Sensor 1 5 and sensor 2 6 are installed on both sides outside the material box 2 to detect whether there is resin material in the silo through cross-shooting and send a signal to the equipment. The circular vibration motor 9 allows the resin entering the disc track to be arranged neatly along the disc track. The function of the discharge guide piece 7 allows the resin to enter the vibration mechanism 101 from the discharge mechanism 100.

[0031] Specifically, the height of the resin height limiting plate 16 of the feeding mechanism 102 can be adjusted according to the waist-shaped hole on the discharge guide slider 10, and can be adapted to resin materials of various specifications.

[0032] Specifically, the material inspection mechanism 103 is equipped with sensor three 13 and sensor four 14 above the feeding mechanism 102. Sensor three 13 and sensor four 14 are used to detect whether there is resin material coming out from the discharge guide slider 10. The pressing cylinder 18 moves downward to suppress the resin material driven by the linear vibration motor 11, and sensor five 19 moves downward to detect the height of the resin and whether it is damaged.

[0033] Specifically, when the sensor five 19 detects defective waste, the discharge mechanism 104 will receive a signal, the cylinder one 43 will drive the linear guide one 44, the linear guide two 45 will move to the rear side, the pressing cylinder 18 will open, and the waste will move along the waste guide plate 31 into the waste collection box 32.

[0034] Specifically, the resin moves along the discharge guide slider 10 into the groove of the claw 1 33, and the linear module 35 drives the claw 1 33 above the claw mounting block 34 to move linearly. Sensor six 36, sensor seven 37, and sensor eight 38 are the positive and negative limits and origin position sensors of the linear module 35.

[0035] Specifically, the hole position on the resin height limiting plate 16 is a waist hole, which can be adjusted according to the resin height. A pressing cylinder 18 is installed on the height limiting plate fixing block 17. The pressing cylinder 18 moves up and down to press a resin material moving in the discharge guide slider 10.

[0036] Specifically, the sensor mounting plate 20 and the sensor mounting plate 3 21 have waist holes, and the sensor 5 19 mounted thereon can be adjusted up, down, left, and right.

[0037] Specifically, the movable base plate 30 can move linearly on the plane of the linear guide rail 1 44 and the linear guide rail 2 45, and the movement stroke is determined by the stroke of the cylinder 1 43. The linear guide rail 1 44 and the linear guide rail 2 45 are respectively provided with a limit block 1 46 and a limit block 2 47 installed on the base plate 26 on both sides, and the heads of the limit blocks are respectively provided with a limit pin 1 48 and a limit pin 2 49, which limit the position of the movable base plate 30.

[0038] Specifically, the slide 27 is fixed on the base plate 28 and installed on the linear guide rail to move along with the linear guide rail. The center of the notch at the front end of the slide 27 is consistent with the center of the end of the discharge guide slider 10.

[0039] Specifically, the claw 1 33 and the claw mounting block 34 are installed on the linear module 35 and move linearly along the linear module 35. There are several grooves for collecting resin on the claw 1 33. During the movement, the center of the groove of the claw 1 33 coincides with the center of the notch at the front end of the slide 27.

[0040] The working principle of the present invention is as follows:

[0041] When loading resin material, pull out the material box 2, pour the resin into the material box 2, pull out the resin baffle 3, and the resin falls into the material bin 4. Sensors 1 5 and 2 6 are installed on both sides of the material bin 4 to detect whether there is resin in the material bin 4. The material bin vibration motor 8 drives the resin in the material bin 4 to vibrate, accelerates the movement of the resin, and the resin then falls into the circular vibrating feeder through the discharge guide sheet 7. The circular vibration motor 9 drives the resin in the circular vibrating feeder to vibrate and arrange it in a regular horizontal direction through vibration. There is a step near the discharge port of the circular vibrating feeder. When the resin falls on the step, it changes from horizontal arrangement to vertical arrangement, and then moves to the discharge guide slider 10. The front end of the discharge guide slider 10 is equipped with a counter-shooting Sensor three 13 and sensor four 14 are used to detect whether there is resin on the discharge guide slider 10. The resin height limit plate 16 can be adjusted up and down according to the height of the resin to meet the needs of different types of resin passing through. A pressing cylinder 18 is installed on the resin height limit plate 16 to detect the height of the resin. The sensor five 19 in front of the pressing cylinder 18 can detect the specific specifications of the resin material. When sensor five 19 detects unqualified resin material, linear guide one 44 and linear guide two 45 drive the slide 27 to move, and the unqualified resin material will fall into the waste collection box 32 through the waste guide plate 31. There is a resin baffle two 24 in front of the sensor five 19, which can effectively prevent multiple resins from being transported to the slot position for storing a single resin material on the claw one 33 at the same time.

[0042] The qualified resin material is moved to the slide 27 through the discharge guide slider 10, and the claw 1 33 is fixed on the linear module 35 and performs linear motion. There are multiple grooves for placing the resin material on the claw 1 33. During the movement, the center of the groove for placing the resin material on the claw 1 33 coincides with the center of the notch for discharging the material at the front end of the slide 27, and the resin material vibrates into the groove.

[0043] The present invention can ensure the speed of resin arrangement and transportation, detect the resin specification and position, and can separate and discharge incomplete and unqualified resin materials, thereby reducing the space for resin arrangement and transportation, ensuring the quality of plastic-sealed products and improving the production efficiency of plastic-sealed equipment.

[0044] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention and the drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor resin vibration arrangement mechanism, comprising a complete device, wherein a vibration mechanism (101), a material discharge mechanism (100), a material feeding mechanism (102), a material inspection mechanism (103), a material discharge mechanism (104) and a resin arrangement unit (105) are fixedly installed on the top of the complete device, characterized in that: The material discharge mechanism (100) is installed above the vibration mechanism (101), the material feeding mechanism (102) is installed at the material feeding end of the vibration mechanism (101), and the material inspection mechanism (103) is installed at the end of the material feeding mechanism (102); The material discharging mechanism (104) is installed at the rear of the material checking mechanism (103), the resin arranging unit (105) is installed at the rear end of the material checking mechanism (103), and the resin arranging unit (105) is located above the material discharging mechanism (104).

2. A semiconductor resin vibration arrangement mechanism according to claim 1, characterized in that: The material discharge mechanism (100) is composed of a mechanical slide rail (1), a material box (2), a resin baffle plate 1 (3), a material bin 1 (4), a sensor 1 (5), a sensor 2 (6) and a material discharge guide plate (7); The two mechanical slide rails (1) are slidably mounted on both sides of the material box (2), the resin baffle plate 1 (3) is movably mounted on the bottom of the material box (2), the material bin 1 (4) is mounted on the bottom of the resin baffle plate 1 (3), the sensor 1 (5) and the sensor 2 (6) are mounted on both sides outside the material box (2), the material discharge guide plate (7) is mounted at the discharge position of the material discharge mechanism (100), the material bin vibration motor (8) is mounted below the material bin 1 (4), and the circular vibration motor (9) is mounted above the bottom plate 1 (0).

3. A semiconductor resin vibration arrangement mechanism according to claim 2, characterized in that: The vibration mechanism (101) is composed of a base plate (0), a silo vibration motor (8), and a circular vibration motor (9); the base plate (0) is mounted on the equipment body, the silo vibration motor (8) is mounted below the silo (4), and the circular vibration motor (9) is mounted above the base plate (0).

4. A semiconductor resin vibration arrangement mechanism according to claim 3, characterized in that: The feeding mechanism (102) is composed of a discharge guide slider (10), a linear vibration motor (11), a counterweight (12), a sensor mounting plate (15), and a resin height limiting plate (16); the discharge guide slider (10) is mounted at the end of the circular vibrator, the linear vibration motor (11) is mounted at the bottom of the discharge guide slider (10), the counterweight (12) is mounted on the right side of the linear vibration motor (11), the resin height limiting plate (16) is mounted above the discharge guide slider (10), and the sensor mounting plate (15) is installed obliquely above the resin height limiting plate (16).

5. A semiconductor resin vibration arrangement mechanism according to claim 4, characterized in that: The material inspection mechanism (103) is composed of sensor three (13), sensor four (14), a height limit plate fixing block (17), a pressing cylinder (18), sensor five (19), sensor mounting plate two (20), sensor mounting plate three (21), sensor fixing block (22), resin baffle mounting block (23), resin baffle two (24), connecting rod one (25) and bottom plate two (26). The sensor three (13) and sensor four (14) are mounted on the outside of the sensor mounting plate one (15), the height limit plate fixing block (17) is mounted on the front end notch position of the resin height limit plate (16), and the pressing cylinder (19) is mounted on the outside of the sensor mounting plate one (15). 8) is vertically mounted in the U-shaped groove of the height limit plate fixing block (17), a sensor five (19) is mounted in front of the pressing cylinder (18), the sensor five (19) is mounted on the outside of the sensor fixing block (22) through the sensor mounting plate two (20) and the sensor mounting plate three (21), a grease baffle mounting block (23) is mounted below the sensor fixing block (22), the grease baffle mounting block (23) is connected to the resin baffle two (24), the sensor fixing block (22) and the resin baffle mounting block (23) are mounted on the outside of the bottom plate two (26) through the connecting rod one (25), and the bottom plate two (26) is mounted above the bottom plate one (0).

6. A semiconductor resin vibration arrangement mechanism according to claim 5, characterized in that: The discharging mechanism (104) is composed of a slide (27), a base plate (28), a second connecting rod (29), a movable base plate (30), a waste guide plate (31), a waste collection box (32), a sensor detection plate (39), a sensor nine (40), a sensor ten (41), a cylinder connection block (42), a cylinder one (43), a linear guide rail one (44), a linear guide rail two (45), a limit block one (46), a limit block two (47), a limit pin one (48) and a limit pin two (49). The slide (27) is fixed on the outside of the base plate (28), the base plate (28) is mounted above the movable base plate (30) through four second connecting rods (29), the waste guide plate (31) is mounted on the side of the slide (27), and the waste collection box ( The movable bottom plate (31) is provided with a plurality of movable bottom plates (32), a plurality of movable bottom plates (31) and a plurality of movable bottom plates (32) being provided with a plurality of movable bottom plates (31 ...2) being provided with a plurality of movable bottom plates (31), a plurality of movable bottom plates (31) and a plurality of movable bottom plates (32) being provided with a plurality of movable bottom plates (32) being 7. A semiconductor resin vibration arrangement mechanism according to claim 6, characterized in that: The resin arrangement unit (105) is composed of a first pusher claw (33), a pusher claw mounting block (34), a linear module (35), a sixth sensor (36), a seventh sensor (37), and an eighth sensor (38); the pusher claw is mounted above the pusher claw mounting block (34); the pusher claw mounting block (34) is mounted above the linear module (35); the sixth sensor (36), the seventh sensor (37), and the eighth sensor (38) are mounted on the side of the linear module (35); and the linear module (35) is mounted on the outside of the base plate (28).

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