Filling adhesive for chip packaging and chip packaging method

Abstract

The invention relates to the technical field of chip packaging, and particularly discloses filling glue for chip packaging and a chip packaging method. The filling adhesive for chip packaging comprises a component A and a component B, the component A is prepared from the following raw materials in parts by weight according to the total weight of the component A: 30 to 40 parts of epoxy resin, 5 to 10 parts of polydimethylsiloxane, 0.5 to 1 part of antioxidant, 20 to 30 parts of heat-conducting filler, 1 to 2 parts of thermal polymerization inhibitor and 0.5 to 1 part of defoaming agent; the component B comprises the following raw materials in parts by weight: a curing agent. The heat dissipation rate of the filling adhesive during curing can be effectively improved, the heat stability of the filling adhesive during curing can be improved, and the filling adhesive and the chip can be protected against heat damage during curing.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip packaging filling glue and a chip packaging method. Background Art

[0002] As the core component of electronic devices, the performance and stability of chips are crucial. Filling glue for chip packaging is one of the key materials to ensure the stable operation of chips. Filling glue not only provides mechanical support between the chip and the packaging substrate, but also plays a pivotal role in moisture-proof, dust-proof, and shock-proof. With the rapid development of electronic technology, the performance requirements for chip packaging filling glue are becoming increasingly stringent, prompting it to continue to develop in the direction of high performance, high reliability, environmental protection and sustainability.

[0003] In the related technology, a solid filling glue for filling the bottom of a large-size chip is disclosed, which includes, by mass: 15 to 50 parts of epoxy-modified polyurethane resin; 15 to 30 parts of polyether-modified epoxy resin; 1 to 6 parts of carbon black; 1 to 3 parts of magnetic material; 20 to 40 parts of filler; 1 to 6 parts of dispersant; and 1 to 6 parts of curing agent.

[0004] Due to the large area of ​​large-size chips, heat conduction and thermal uniformity become key issues. If the heat generated by the filler during curing cannot be dissipated quickly and evenly, it may cause thermal damage to the chip or performance degradation. Epoxy-modified polyurethane resin and polyether-modified epoxy resin may produce a higher exothermic peak during the curing process, resulting in excessively high local temperatures, which may affect the performance and stability of the chip. Summary of the invention

[0005] In order to improve the heat dissipation performance of the filling glue when curing, the present application provides a filling glue for chip packaging and a chip packaging method.

[0006] In a first aspect, the present application provides a chip packaging filler and a chip packaging method, which adopts the following technical solutions:

[0007] A filling glue for chip packaging comprises a component A and a component B. Based on the total weight of the component A, the component A comprises the following raw materials in parts by weight: 30-40 parts of epoxy resin, 5-10 parts of polydimethylsiloxane, 0.5-1 part of antioxidant, 20-30 parts of thermal conductive filler, 1-2 parts of thermal inhibitor and 0.5-1 part of defoaming agent; the component B comprises the following raw materials in parts by weight: a curing agent.

[0008] By adopting the above technical scheme, during the curing process, epoxy resin and polydimethylsiloxane react with a curing agent to form a cross-linked network to achieve the encapsulation between the chip and the packaging substrate. Since the polydimethylsiloxane molecular chain contains a high silicon component, after curing, the thermal conductivity and elasticity of the filler can be improved, which is not only conducive to providing mechanical support and shockproof effect between the chip and the packaging substrate, but also effectively improves the heat dissipation rate when the filler is cured. Moreover, the thermally conductive filler and the thermal inhibitor are dispersed in the filler, and the thermally conductive filler forms an efficient heat conduction network in the filler, which can quickly conduct the heat generated during the curing process to the outside of the packaging structure, thereby significantly reducing the local temperature rise. The thermal inhibitor can reduce the activation energy of the curing reaction, so that the reaction can be carried out at a lower temperature. It is helpful to reduce the heat release during the curing process, thereby improving the thermal stability of the filler when it is cured. Therefore, the present application improves the heat dissipation performance when the filler is cured, and helps to protect the filler and the chip from thermal damage during curing.

[0009] In a specific embodiment, the thermally conductive filler is boron nitride or silicon carbide.

[0010] By adopting the above technical solution, the thermal conductivity of boron nitride and silicon carbide is high, and an effective thermal conductive network can be formed in the filling glue, which can quickly conduct away the heat generated during the curing process, helping to reduce the risk of performance degradation or damage caused by heat accumulation during chip packaging. In addition, boron nitride and silicon carbide have high strength and hardness, which can improve the mechanical properties of the filling glue and help improve the reliability of chip packaging.

[0011] In a specific embodiment, the particle size of the thermally conductive filler is 12-28 microns.

[0012] By adopting the above technical solution, within this particle size range, the thermal conductivity of the filling glue is larger, the thermal resistance is smaller, and the bending strength is larger. This shows that the selection of thermally conductive fillers within the above particle size range can not only ensure that the filling glue has a higher thermal conductivity rate, but also improve the toughness of the filling glue.

[0013] In a specific embodiment, the thermal inhibitor is 2,5-di-tert-butylhydroquinone.

[0014] By adopting the above technical solution, 2,5-di-tert-butylhydroquinone has excellent thermal stability, can effectively prevent or slow down the curing reaction of the filling glue, and can slowly react with free radicals over a long period of time to eliminate the free radicals generated during the storage of component A, while improving the storage stability of component A while minimizing the effect on the gelation time, thereby ensuring that the colloid maintains stable performance during the curing process.

[0015] In a specific embodiment, the component A further comprises the following components in parts by weight: 3-6 parts of phenolic resin.

[0016] By adopting the above technical solution, the phenolic resin has excellent heat resistance and bonding properties, which helps to improve the adhesion between the filling glue and the chip and packaging materials, improve the reliability and durability of the packaging, and further enhance the thermal stability of the system.

[0017] In a specific embodiment, the curing agent is 2-methylimidazole or 2-ethyl-4-methylimidazole.

[0018] By adopting the above technical scheme, the active hydrogen atoms on the imidazole ring of 2-methylimidazole or 2-ethyl-4-methylimidazole can undergo a cross-linking reaction with the functional groups in the epoxy resin and the polydimethylsiloxane, thereby reducing the activation energy of the curing reaction, allowing the epoxy resin and the polydimethylsiloxane to be cured at a lower temperature and form a denser network structure.

[0019] In a specific embodiment, the B component further includes fluorocarbon-modified polyacrylate or perfluoroalkyl ethanol ammonium phosphate.

[0020] By adopting the above technical solution, when the curing agent is cured with the epoxy resin and polydimethylsiloxane, the fluorocarbon-modified polyacrylate or perfluoroalkyl ethanol ammonium phosphate can reduce the surface tension of the filling glue, improve its wettability and leveling properties, and help the filling glue to cover the chip surface more evenly, reduce the interface thermal resistance, and thus improve the overall heat dissipation effect.

[0021] In a second aspect, the present application provides a chip packaging method, which adopts the following technical solution:

[0022] A chip packaging method comprises the following steps:

[0023] According to the proportion, epoxy resin, polydimethylsiloxane, antioxidant, thermal conductive filler, thermal inhibitor and defoamer are mixed evenly to obtain component A; and curing agent is stirred evenly to obtain component B;

[0024] Through photolithography, continuous microstructures are formed on the substrate of the chip package;

[0025] Mix component A and component B in a weight ratio of 1:(0.2-0.4) to obtain a filling glue, inject the filling glue between the chip and the substrate, cure at 60-100°C, remove excess filling glue, conduct appearance inspection and performance test, and complete chip packaging.

[0026] By adopting the above technical solution, the continuous microstructure acts as a heat sink during the curing process of the filling glue, which can quickly conduct the heat generated during the curing process to the edge of the substrate, helping to further improve the heat dissipation rate during the curing of the filling glue.

[0027] In summary, this application has the following beneficial effects:

[0028] 1. The present application can effectively increase the heat dissipation rate during curing of the filling glue, improve the thermal stability during curing of the filling glue, and help protect the filling glue and the chip from thermal damage during curing.

[0029] 2. In the present application, it is preferred to use a thermally conductive filler with a particle size of 12-28 microns, which can not only ensure that the filling glue has a higher thermal conductivity rate, but also improve the toughness of the filling glue.

[0030] 3. The method of the present application can quickly conduct the heat generated during the curing process to the edge of the substrate, which helps to further improve the heat dissipation rate during the curing of the filling glue. DETAILED DESCRIPTION

[0031] Unless otherwise specified, the raw materials used in the examples and comparative examples of the present application are commercially available. The epoxy resin is LX-01 from Japan Daisou, the polydimethylsiloxane is purchased from Aladdin, CAS No. 9016-00-6, the antioxidant is 1076, the defoamer is XS601, the tetramethylpiperidinium nitroxide free radical phosphite triester is the inhibitor 705, the phenolic resin is BY06 from Yoshida Chemical, the fluorocarbon modified polyacrylate is EFKA FL 3772 from BASF, and the perfluoroalkyl ethanol ammonium phosphate is Ruikaibang F-8901.

[0032] The present application is further described in detail below with reference to examples and comparative examples.

[0033] Example

[0034] Example 1

[0035] This embodiment provides a filling glue for chip packaging, including component A and component B.

[0036] Component A uses the following raw materials: 35 g of epoxy resin, 7 g of polydimethylsiloxane, 0.7 g of antioxidant, 25 g of boron nitride with a particle size of 12-20 microns, 1.5 g of 2,5-di-tert-butylhydroquinone and 0.7 g of defoaming agent.

[0037] Component B is 2-methylimidazole.

[0038] This embodiment also provides a chip packaging method, which comprises the following steps:

[0039] According to the proportion, epoxy resin, polydimethylsiloxane, antioxidant, boron nitride, 2,5-di-tert-butylhydroquinone and defoamer are mixed and stirred evenly to obtain component A; 2-methylimidazole is stirred evenly to obtain component B.

[0040] Mix component A and component B in a weight ratio of 1:0.3 and stir evenly to obtain a filling glue. Inject the filling glue between the chip and the substrate, cure at 80°C, remove excess filling glue, perform appearance inspection and performance test, and complete chip packaging.

[0041] Example 2

[0042] The only difference between this embodiment and embodiment 1 is that component A uses the following raw materials: 30 g of epoxy resin, 5 g of polydimethylsiloxane, 0.5 g of antioxidant, 30 g of boron nitride with a particle size of 12-20 μm, 1 g of 2,5-di-tert-butylhydroquinone and 0.5 g of defoaming agent.

[0043] Example 3

[0044] The only difference between this embodiment and embodiment 1 is that component A uses the following raw materials: 40 g of epoxy resin, 10 g of polydimethylsiloxane, 1 g of antioxidant, 20 g of boron nitride with a particle size of 12-20 microns, 2 g of 2,5-di-tert-butylhydroquinone and 1 g of defoaming agent.

[0045] Example 4

[0046] The only difference between this embodiment and embodiment 1 is that the boron nitride is replaced by an equal amount of silicon carbide having a particle size of 12-20 microns.

[0047] Example 5

[0048] The only difference between this embodiment and embodiment 1 is that the particle size of the boron nitride is 4-12 microns.

[0049] Example 6

[0050] The only difference between this embodiment and embodiment 1 is that the particle size of the boron nitride is 20-28 microns.

[0051] Example 7

[0052] The only difference between this embodiment and embodiment 1 is that the particle size of the boron nitride is 28-36 microns.

[0053] Example 8

[0054] The only difference between this embodiment and embodiment 1 is that an equal amount of tetramethylpiperidinium nitroxide phosphite triester is used to replace 2,5-di-tert-butylhydroquinone.

[0055] Example 9

[0056] The only difference between this embodiment and embodiment 1 is that 2-methylimidazole is replaced by an equal amount of 2-ethyl-4-methylimidazole.

[0057] Example 10

[0058] The difference between this embodiment and embodiment 1 is that component A uses the following raw materials: 35g of epoxy resin, 7g of polydimethylsiloxane, 0.7g of antioxidant, 35g of boron nitride with a particle size of 12-20 microns, 1.5g of 2,5-di-tert-butylhydroquinone, 0.7g of defoamer, and 3g of phenolic resin. In the chip packaging method, epoxy resin, polydimethylsiloxane, antioxidant, boron nitride, 2,5-di-tert-butylhydroquinone, defoamer and phenolic resin are mixed and stirred evenly to obtain component A.

[0059] Embodiment 11

[0060] The difference between this embodiment and embodiment 1 is that component A uses the following raw materials: 35g of epoxy resin, 7g of polydimethylsiloxane, 0.7g of antioxidant, 35g of boron nitride with a particle size of 12-20 microns, 1.5g of 2,5-di-tert-butylhydroquinone, 0.7g of defoamer, and 4.5g of phenolic resin. In the chip packaging method, epoxy resin, polydimethylsiloxane, antioxidant, boron nitride, 2,5-di-tert-butylhydroquinone, defoamer and phenolic resin are mixed and stirred evenly to obtain component A.

[0061] Example 12

[0062] The difference between this embodiment and embodiment 1 is that component A uses the following raw materials: 35g of epoxy resin, 7g of polydimethylsiloxane, 0.7g of antioxidant, 35g of boron nitride with a particle size of 12-20 microns, 1.5g of 2,5-di-tert-butylhydroquinone, 0.7g of defoamer, and 6g of phenolic resin. In the chip packaging method, epoxy resin, polydimethylsiloxane, antioxidant, boron nitride, 2,5-di-tert-butylhydroquinone, defoamer and phenolic resin are mixed and stirred evenly to obtain component A.

[0063] Example 13

[0064] The difference between this embodiment and embodiment 1 is that the B component uses the following raw materials: 22 g of 2-methylimidazole and 2 g of fluorocarbon modified polyacrylate. In the chip packaging method, 2-methylimidazole and fluorocarbon modified polyacrylate are mixed evenly to obtain the B component.

[0065] Embodiment 14

[0066] The only difference between this embodiment and embodiment 1 is that the B component uses the following raw materials: 22 g of 2-methylimidazole and 2 g of perfluoroalkylethanol ammonium phosphate. In the chip packaging method, 2-methylimidazole and perfluoroalkylethanol ammonium phosphate are mixed uniformly to obtain the B component.

[0067] Embodiment 15

[0068] The difference between this embodiment and embodiment 1 is that component A uses the following raw materials: 35g of epoxy resin, 7g of polydimethylsiloxane, 0.7g of antioxidant, 35g of boron nitride with a particle size of 12-20 microns, 1.5g of 2,5-di-tert-butylhydroquinone, 0.7g of defoamer, and 4.5g of phenolic resin. Component B uses the following raw materials: 22g of 2-methylimidazole and 2g of perfluoroalkyl ethanol ammonium phosphate. In the chip packaging method, epoxy resin, polydimethylsiloxane, antioxidant, boron nitride, 2,5-di-tert-butylhydroquinone, defoamer and phenolic resin are mixed and stirred to obtain component A. 2-Methylimidazole and perfluoroalkyl ethanol ammonium phosphate are mixed to obtain component B.

[0069] Example 16

[0070] The only difference between this embodiment and Embodiment 1 is that, in the chip packaging method, component A and component B are mixed in a weight ratio of 1:0.2 and stirred evenly to obtain a filling glue.

[0071] Embodiment 17

[0072] The only difference between this embodiment and Embodiment 1 is that, in the chip packaging method, component A and component B are mixed in a weight ratio of 1:0.4 and stirred evenly to obtain a filling glue.

[0073] Embodiment 18

[0074] The only difference between this embodiment and embodiment 1 is that, in the chip packaging method, a filling glue is injected between the chip and the substrate, cured at 60° C., excess filling glue is removed, and appearance inspection and performance testing are performed to complete the chip packaging.

[0075] Embodiment 19

[0076] The only difference between this embodiment and embodiment 1 is that, in the chip packaging method, a filling glue is injected between the chip and the substrate, cured at 100° C., excess filling glue is removed, and appearance inspection and performance testing are performed to complete the chip packaging.

[0077] Embodiment 20

[0078] The difference between this embodiment and embodiment 1 is that the chip packaging method adopts the following steps:

[0079] According to the proportion, epoxy resin, polydimethylsiloxane, antioxidant, boron nitride, 2,5-di-tert-butylhydroquinone and defoamer are mixed and stirred evenly to obtain component A; 2-methylimidazole is stirred evenly to obtain component B.

[0080] By photolithography, a continuous regular hexagonal microstructure is formed on the substrate of the chip package;

[0081] Mix component A and component B in a weight ratio of 1:0.3 and stir evenly to obtain a filling glue. Inject the filling glue between the chip and the substrate, cure at 80°C, remove excess filling glue, perform appearance inspection and performance test, and complete chip packaging.

[0082] Embodiment 21

[0083] The difference between this embodiment and embodiment 1 is that component A uses the following raw materials: 35g epoxy resin, 7g polydimethylsiloxane, 0.7g antioxidant, 35g boron nitride with a particle size of 12-20 microns, 1.5g 2,5-di-tert-butylhydroquinone, 0.7g defoamer, and 4.5g phenolic resin. Component B uses the following raw materials: 22g 2-methylimidazole and 2g perfluoroalkylethanol ammonium phosphate. In the chip packaging method,

[0084] According to the proportion, epoxy resin, polydimethylsiloxane, antioxidant, boron nitride, 2,5-di-tert-butylhydroquinone, defoamer and phenolic resin are mixed and stirred evenly to obtain component A; 2-methylimidazole and perfluoroalkyl ethanol ammonium phosphate are mixed evenly to obtain component B.

[0085] By photolithography, a continuous regular hexagonal microstructure is formed on the substrate of the chip package;

[0086] Mix component A and component B in a weight ratio of 1:0.3 and stir evenly to obtain a filling glue. Inject the filling glue between the chip and the substrate, cure at 80°C, remove excess filling glue, perform appearance inspection and performance test, and complete chip packaging.

[0087] Comparative Example

[0088] Comparative Example 1

[0089] The only difference between this comparative example and Example 1 is that component A uses the following raw materials: 42 g of epoxy resin, 0.7 g of antioxidant, 35 g of boron nitride with a particle size of 12-20 μm, 1.5 g of 2,5-di-tert-butylhydroquinone and 0.7 g of defoaming agent.

[0090] Comparative Example 2

[0091] The only difference between this comparative example and Example 1 is that component A uses the following raw materials: 36.5 g of epoxy resin, 7 g of polydimethylsiloxane, 0.7 g of antioxidant, 35 g of boron nitride with a particle size of 12-20 μm, and 0.7 g of defoaming agent.

[0092] Comparative Example 3

[0093] The difference between this comparative example and Example 1 is that in the chip packaging method: Component A and Component B are mixed in a weight ratio of 1:0.1 and stirred evenly to obtain a filling glue. The filling glue is injected between the chip and the substrate, cured at 80° C., excess filling glue is removed, and appearance inspection and performance test are performed to complete chip packaging.

[0094] Comparative Example 4

[0095] The difference between this comparative example and Example 1 is that in the chip packaging method: Component A and Component B are mixed in a weight ratio of 1:0.5 and stirred evenly to obtain a filling glue. The filling glue is injected between the chip and the substrate, cured at 80° C., excess filling glue is removed, and appearance inspection and performance test are performed to complete chip packaging.

[0096] Comparative Example 5

[0097] The difference between this comparative example and Example 1 is that in the chip packaging method: Component A and Component B are mixed in a weight ratio of 1:0.3 and stirred evenly to obtain a filling glue. The filling glue is injected between the chip and the substrate, cured at 50° C., excess filling glue is removed, and appearance inspection and performance test are performed to complete chip packaging.

[0098] Comparative Example 6

[0099] The difference between this comparative example and Example 1 is that in the chip packaging method: Component A and Component B are mixed in a weight ratio of 1:0.3 and stirred evenly to obtain a filling glue. The filling glue is injected between the chip and the substrate, cured at 110° C., excess filling glue is removed, and appearance inspection and performance test are performed to complete chip packaging.

[0100] Performance testing

[0101] The following performance tests were performed on the filling glues prepared in Examples 1-21 and Comparative Examples 1-6:

[0102] According to the ASTM5470 test standard, the thermal conductivity of the filling glue is tested, and according to the GB / T2570-1995 test standard, the bending strength of the filling glue is tested. The test results are shown in Table 1.

[0103] Table 1

[0104]

[0105]

[0106] Combining Examples 1-3 and Comparative Examples 1-2 and Table 1, it can be seen that compared with Example 1, the thermal conductivity and bending strength of Comparative Examples 1 and 2 are significantly reduced, and the thermal conductivity and bending strength of Examples 2-3 change slightly, and are both greater than Comparative Examples 1 and 2. This shows that the thermal conductivity rate and toughness of Examples 1-3 are better, and also shows that the use of the raw material ratio of Examples 1-3 is helpful to improve the thermal conductivity and mechanical properties of the filling glue.

[0107] It can be seen from Example 1, Examples 4-7 and Table 1 that as the particle size of boron nitride gradually increases, the thermal conductivity of the filling glue gradually increases, but the bending strength gradually decreases. Within the particle size range of 12-28 microns, and using silicon carbide or boron nitride, a filling glue with both a large thermal conductivity and a large bending strength can be obtained.

[0108] Combining Example 1, Examples 8-9 and Table 1, it can be seen that the thermal conductivity and bending strength of Example 1 are greater than those of Example 8, and the thermal conductivity of Example 1 is greater than that of Example 9, but the bending strength is less than that of the examples. This shows that the use of 2,5-di-tert-butylhydroquinone helps to further improve the thermal conductivity and mechanical properties of the filling glue, and the use of 2-ethyl-4-methylimidazole helps to improve the mechanical properties of the filling glue. Thermal conductivity of the filling glue using 2-methylimidazole.

[0109] Combining Example 1, Examples 10-15 and Table 1, it can be seen that compared with the examples, the thermal conductivity and bending strength of Examples 10-15 are significantly increased, and the increase in Example 15 is the largest. This shows that adding phenolic resin to component A and adding leveling agent to component B are both helpful to further improve the thermal conductivity and mechanical properties of the filler, and adding phenolic resin and leveling agent at the same time has a better effect.

[0110] Combining Example 1, Examples 16-19 and Comparative Examples 3-6 and Table 1, it can be seen that the thermal conductivity and bending strength of Comparative Examples 3-6 are poor, which shows that when the weight ratio of component A to component B is 1:(0.2-0.4) and 60-100°C, it helps to improve the thermal conductivity and mechanical properties of the filling glue.

[0111] It can be seen from Example 1, Examples 20-21 and Table 1 that the thermal conductivity of the filling glue is Example 1 < Example 20 < Example 21, and the bending strength of the filling glue is Example 1 < Example 20 < Example 21, which shows that in the packaging method, pre-arranging a continuous microstructure on the substrate helps to improve the thermal conductivity and mechanical properties of the filling glue.

[0112] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A chip encapsulation filling glue, characterized in that: It comprises component A and component B; based on the total weight of component A, component A comprises the following raw materials in parts by weight: 30-40 parts of epoxy resin, 5-10 parts of polydimethylsiloxane, 0.5-1 part of antioxidant, 20-30 parts of thermal conductive filler, 1-2 parts of thermal inhibitor and 0.5-1 part of defoaming agent; component B comprises the following raw materials in parts by weight: curing agent.

2. A chip encapsulation filling glue according to claim 1, characterized in that: The thermal conductive filler is boron nitride or silicon carbide.

3. A chip encapsulation filling glue according to claim 2, characterized in that: The particle size of the thermal conductive filler is 12-28 microns.

4. The chip encapsulation filling glue according to claim 1, characterized in that: The thermal polymerization inhibitor is 2,5-di-tert-butylhydroquinone.

5. The chip encapsulation filling glue according to claim 4, characterized in that: The component A also includes the following components in parts by weight: 3-6 parts of phenolic resin.

6. The chip encapsulation filling glue according to claim 1, characterized in that: The curing agent is 2-methylimidazole or 2-ethyl-4-methylimidazole.

7. The chip encapsulation filling glue according to claim 1, characterized in that: The B component also includes fluorocarbon modified polyacrylate or perfluoroalkyl ethanol ammonium phosphate.

8. A packaging method using the chip packaging filler according to any one of claims 1 to 7, characterized in that: The steps include: According to the proportion, epoxy resin, polydimethylsiloxane, antioxidant, thermal conductive filler, thermal inhibitor and defoamer are mixed evenly to obtain component A; and curing agent is stirred evenly to obtain component B; Through photolithography, continuous microstructures are formed on the substrate of the chip package; Mix component A and component B in a weight ratio of 1:(0.2-0.4) to obtain a filling glue, inject the filling glue between the chip and the substrate, cure at 60-100°C, remove excess filling glue, conduct appearance inspection and performance test, and complete chip packaging.

Images