Semiconductor transceiving integrated packaging device and manufacturing method thereof

Abstract

The invention belongs to the field of optical packaging, and relates to a semiconductor transceiving integrated packaging device and a manufacturing method thereof. The device comprises a tube socket, and a connecting pin is arranged on the tube socket. The tube cap is arranged on the tube seat, the tube cap and the tube seat are matched to form a closed space, and a collimating lens and window glass are arranged on the tube cap; the semiconductor chip is arranged in the closed space, and the semiconductor chip at least comprises a light emitting device and a light receiving device; wherein the tube socket and the tube cap are sealed and fixed through electric resistance welding, and the light emitting device and the light receiving device are respectively connected with the connecting pins through gold wire bonding; the device provided by the invention is high in manufacturability, can accommodate receiving and transmitting chips at the same time, and realizes receiving and transmitting integrated packaging; the device is compact in structure, small in packaging size, high in integration, low in cost and easy to maintain.

Description

Technical Field

[0001] The present invention relates to a semiconductor transceiver integrated packaging device and a manufacturing method thereof, belonging to the field of optical packaging, and is used for packaging optoelectronic devices, integrating a transmitting end and a receiving end into one, providing an optoelectronic channel and a thermal channel therefor, and protecting the chip. Background Art

[0002] In the past, the transistor outline (TO) socket used in semiconductor packaging could only accommodate receiving or transmitting chips alone due to structural and material limitations, and could not accommodate both receiving and transmitting chips at the same time, that is, the laser and the detector were designed separately, such as the transmitting TO-56 and the receiving TO-46; even in the optical transceiver device, although the transmitting TO and the receiving TO are integrated, the optical transceiver device still has problems such as large packaging size, heavy weight, difficult installation and maintenance, and difficulty in applying high-density integration. Summary of the invention

[0003] Based on the problems existing in the prior art, the size and manufacturing process of the optical device are taken into consideration, the internal space of the device is fully utilized, and the tube seat and tube cap packaging structure and manufacturing scheme are designed. The present invention proposes a semiconductor transceiver integrated packaging device and a manufacturing method thereof. The device and method of the present invention can realize the integration of transceiver and transceiver and high integration.

[0004] In a first aspect of the present invention, the present invention provides a semiconductor transceiver integrated packaging device, comprising:

[0005] A tube socket, on which a plurality of connecting pins are arranged;

[0006] A tube cap, the tube cap is arranged on the tube base and cooperates with the tube base to form a closed space, and a collimating lens and a flat window glass are arranged on the tube cap;

[0007] A semiconductor chip is disposed in the enclosed space, wherein the semiconductor chip comprises at least a light emitting device and a light receiving device;

[0008] The tube seat and the tube cap are fixed by resistance welding, and the light emitting device and the light receiving device are connected to the connecting pins by gold wire bonding respectively.

[0009] Furthermore, the tube holder includes a metal base and four connecting pins passing through the metal base, and the four connecting pins respectively form a dense pin pair and a sparse pin pair; a boss is provided on the metal base, and the boss deviates from the center of the metal base, and a light emitting device is placed on the side of the boss close to the dense pin pair; a light receiving device is placed on the surface of the metal base close to the sparse pin pair.

[0010] Furthermore, the light emitting device is connected to the dense pin pair through a welding wire; and the light receiving device is connected to the sparse pin pair through a welding wire.

[0011] Furthermore, the semiconductor chip also includes a heat dissipation device.

[0012] Furthermore, the tube holder also includes a ground pin, and the ground pin is located at the center of the multiple connecting pins.

[0013] Furthermore, the tube cap comprises a metal cap, on which a blocking structure is arranged to form two isolated through-portions; a collimating lens is arranged on the first through-portion, and a flat window glass is arranged on the second through-portion.

[0014] Furthermore, the offset distance of the boss from the center of the metal base is greater than half the thickness of the blocking structure; the height of the collimating lens is greater than the height of the boss; and the offset distance of the light receiving device from the center of the metal base is greater than half the thickness of the blocking structure.

[0015] In a second aspect of the present invention, the present invention further provides a method for preparing a semiconductor transceiver integrated packaging device, the method comprising:

[0016] Providing a tube holder, on which a plurality of connecting pins are arranged;

[0017] Providing a semiconductor chip, the semiconductor chip at least comprising a light emitting device and a light receiving device; the light emitting device and the light receiving device are respectively connected to the connecting pins by gold wire bonding;

[0018] Mounting the semiconductor chip on the stem;

[0019] A tube cap is provided, which is arranged on the tube base and cooperates with the tube base to form a closed space so that the semiconductor chip is located in the closed space; a collimating lens and a flat window glass are arranged on the tube cap.

[0020] Furthermore, the manufacturing method of the tube seat includes:

[0021] Providing a metal base;

[0022] A boss and four through-holes are formed on the metal base by mechanical processing; the four through-holes respectively form a dense through-hole pair and a sparse through-hole pair;

[0023] Passing a plurality of connecting pins through corresponding through-portions via fillers to form dense pin pairs and sparse pin pairs;

[0024] A light emitting device is placed on the side of the boss near the dense pin pair; and a light receiving device is placed on the surface of the metal base near the sparse pin pair.

[0025] Furthermore, the manufacturing method of the tube cap includes:

[0026] Providing a metal cap;

[0027] Forming a blocking structure and two through-holes on the metal cap by mechanical processing;

[0028] Sintering a collimating lens at low temperature on the first through portion;

[0029] The flat window pane is sintered at low temperature on the second aperture.

[0030] Beneficial effects of the present invention:

[0031] The present invention proposes a transceiver integrated, highly integrated packaging device and a preparation method thereof. The tube seat has strong manufacturability and can accommodate receiving and transmitting chips at the same time, realizing transceiver integrated packaging; the device has a compact structure, a small packaging size, high integration, low cost and easy maintenance. The embodiment of the present invention adopts a full metal sealing design, reasonably designs the device packaging structure, has strong anti-interference ability and high reliability, contains two parts, the transmitting and receiving parts, has a compact structure and a small size, and at the same time ensures the heat dissipation performance and safety performance of the product, and can also achieve the effect of transceiver integration and different transmission rates. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a three-dimensional schematic diagram of the structure of a semiconductor transceiver integrated packaging device provided in an embodiment of the present application;

[0033] Figure 2 is a three-dimensional schematic diagram of a tube base structure provided in an embodiment of the present application;

[0034] Figure 3 is a three-dimensional schematic diagram of a pipe cap structure provided in an embodiment of the present application;

[0035] Figure 4 is a cross-sectional schematic diagram of a tube base structure provided in an embodiment of the present application;

[0036] Figure 5 is a longitudinal section schematic diagram of a tube base structure provided in an embodiment of the present application;

[0037] Figure 6 is a schematic cross-sectional view of a pipe cap structure provided in an embodiment of the present application;

[0038] Figure 7 It is a three-dimensional schematic diagram of the structure of a semiconductor transceiver integrated packaging device provided in an embodiment of the present application;

[0039] Figure 8 is a flow chart of a method for manufacturing a semiconductor transceiver integrated packaging device provided in an embodiment of the present application;

[0040] Fig. 9 It is a schematic diagram of the tube socket manufacturing process provided in the embodiment of the present application;

[0041] Fig.10 It is a schematic diagram of the pipe cap production process provided in the embodiment of the present application. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] The "and / or" in this article is only a description of the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In the description of this application, the words "first", "second", etc. are only used to distinguish different objects, and do not limit the quantity and execution order, and the words "first", "second", etc. do not necessarily mean that they are different. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions.

[0044] See also Figure 1 ,like Figure 1 As shown, Figure 1 : This is a schematic diagram of the structure of a semiconductor transceiver integrated packaging device provided in an embodiment of the present application, wherein the semiconductor transceiver integrated packaging device comprises a tube seat 10, on which a connecting pin 11 is provided; a tube cap 20, wherein the tube cap 20 is provided on the tube seat 10 and cooperates with the tube seat 10 to form a closed space, wherein a collimating lens 22 and a flat window glass 23 are provided on the tube cap 20; a semiconductor chip is provided in the closed space, wherein the semiconductor chip comprises at least a light emitting device and a light receiving device; wherein the tube seat 10 and the tube cap 20 are fixed by resistance welding, and the light emitting device and the light receiving device are respectively connected to the connecting pin by gold wire bonding.

[0045] In some embodiments, the connecting pins 11 may be wrapped by an insulator to achieve insulation between the connecting pins 11 and the tube base 10 and the tube cap 11. The number of connecting pins 11 may be increased on the tube base 10 according to actual usage. The semiconductor chip sealed in the closed space establishes electrical connection with the outside through the pins 11 passing through the tube base 10.

[0046] See also Figure 2 ,like Figure 2 As shown, Figure 2 It is a three-dimensional schematic diagram of the tube socket structure provided in an embodiment of the present application; the tube socket 10 includes a metal base 12 and four connecting pins 11 passing through the metal base 12, and the four connecting pins 11 respectively form a dense pin pair 111 and a sparse pin pair 112; a boss 13 is provided on the metal base 12, and the boss 13 deviates from the center of the metal base 12, and a light emitting device 122 is placed on the side of the boss close to the dense pin pair 111; a light receiving device 121 is placed on the surface of the metal base 12 close to the sparse pin pair 112.

[0047] Among them, the embodiment of the present application also provides a ground pin 113, and all semiconductor chips share the ground pin 113, which reduces the number of ground pins while ensuring product safety performance.

[0048] It should be noted that the position and spacing of the sparse pin pairs not only ensure the manufacturability of the metal base, but also ensure that the cap and the base will not interfere with the pin pairs when they are enclosed in a closed space, and also ensure the effectiveness of the bonding process; the same is true for the position and spacing of the dense pin pairs. The size of the spacing can ensure that it is sufficient to accommodate heat dissipation devices, etc., and will not interfere with the filler, and the heat dissipation devices will not interfere with the cap. This setting method not only realizes the integrated packaging of the optical emitting device and the optical receiving device, but also effectively reduces the packaging volume, and at the same time solves the mutual interference problem between the two.

[0049] See also Figure 3 ,like Figure 3 As shown, Figure 3 It is a three-dimensional schematic diagram of the tube cap structure provided in an embodiment of the present application; the tube cap 20 includes a metal cap 21, and a blocking structure 24 is arranged on the metal cap 21 to form two isolated through-portions; a collimating lens 22 is arranged on the first through-portion 25, and a flat window glass 23 is arranged on the second through-portion 26.

[0050] See also Figure 4 and Figure 5 ,like Figure 4 and Figure 5 As shown, Figure 4 and Figure 5Schematic diagram of cross section and longitudinal section of the tube base structure provided in the embodiment of the present application; the size of the four through-portions is φB, and the four through-portions form dense through-portions pairs and sparse through-portions pairs respectively; the dense through-portions spacing is L1, and the sparse through-portions spacing is L2; ​​the shadowed portion on the surface of the metal tube base 12 is the placement position of the light emitting device 121, wherein the light emitting device includes TEC / ceramic heat sink / chip, etc., and the placement position of the light emitting device here is deviated from the center of the metal base 12, and the size of the light emitting device deviating from the center of the metal base 12 is K2; The length K1 of the light emitting device 121 is less than L1, which can prevent the light emitting device 121 from contacting the filler and causing the light emitting device 121 to fail during use; a boss 13 is provided on the metal base 12, and the boss 13 is far away from the center of the metal base. The dimension of the boss 13 deviating from the center of the metal base is D, and the length, width and height of the boss are W1, W2 and W3 respectively. The light receiving device 122 can be placed on the side of the boss 13, that is, the shaded part of the side of the boss. The light emitting device 121 and the light receiving device 122 are connected to the connecting pin 11 through welding wires.

[0051] See also Figure 6 ,like Figure 6 As shown, Figure 6 It is a schematic cross-sectional view of the tube cap structure provided in an embodiment of the present application; the metal cap 21 is provided with a blocking structure 24, and the thickness of the blocking structure 24 is F; after sintering into a tube cap, the height of the collimating lens 22 is E; it should be noted that φA is the maximum installation position (the metal base φA is consistent with the metal cap φA), and all devices / components / structures cannot exceed this position, including the bosses, pins, and mounting devices on the metal base, and D>F / 2, E>W3, K2>F / 2. This size design method can avoid interference, which causes the tube base and the tube cap to fail to enclose an airtight space.

[0052] See also Figure 7 ,like Figure 7 As shown, Figure 7It is a three-dimensional schematic diagram of the structure of a semiconductor transceiver integrated packaging device provided in an embodiment of the present application; the semiconductor transceiver integrated packaging device includes a tube seat 10, on which a plurality of connecting pins 11 are arranged; a tube cap 20, the tube cap 20 is arranged on the tube seat 10, and cooperates with the tube seat 10 to form a closed space, and a collimating lens 22 and a flat window glass 23 are arranged on the tube cap 20; a semiconductor chip is arranged in the closed space, and the semiconductor chip includes at least a light emitting device and a light receiving device; wherein the tube seat 10 and the tube cap 20 are fixed by resistance welding, and the light emitting device and the light receiving device are respectively connected to the connecting pins by gold wire bonding. The tube base 10 includes a metal base 12 and four connecting pins 11 penetrating the metal base 12, wherein the four connecting pins 11 respectively form a dense pin pair 111 and a sparse pin pair 112; a boss 13 is provided on the metal base 12, and the boss 13 deviates from the center of the metal base 12, and a light emitting device 122 is placed on the side of the boss close to the dense pin pair 111; a light receiving device 121 is placed on the surface of the metal base 12 close to the sparse pin pair 112. The tube cap 20 includes a metal cap 21, and a blocking structure 24 is provided on the metal cap 21 to form two isolated through-portions; a collimating lens 22 is provided on the first through-portion 25, and a flat window glass 23 is provided on the second through-portion 26.

[0053] In the embodiment of the present application, since the light emitting device 122 is installed on the side of the boss 13, a collimating lens 22 is arranged on the first through-hole portion 25 to convert the divergent light into parallel light, ensuring that the light remains parallel during the transmission process, thereby improving the performance and stability of the optical system; and the light receiving device 121 is located on the surface of the metal base 12, so a flat window glass 23 can be directly arranged above the light receiving device 121. The flat window glass usually has high light transmittance, which can ensure that the light passes smoothly and will not have a negative impact on the performance of the optical system.

[0054] The semiconductor transceiver integrated packaging device provided in the embodiment of the present application is integrally coupled with a collimating lens 22 and a flat window glass 23. A blocking structure 24 is provided between the two, so that they do not interfere with each other and form a transceiver channel; the transceiver channels are isolated and independent from each other, thus avoiding crosstalk between the transceiver channels and improving product performance.

[0055] See also Figure 8 ,like Figure 8 As shown, Figure 8 : is a flow chart of a method for manufacturing a semiconductor transceiver integrated packaging device provided in an embodiment of the present application; the method comprises:

[0056] S101, providing a tube holder, wherein the tube holder is provided with a plurality of connecting pins;

[0057] In the embodiment of the present application, the tube socket is a metal tube socket, and connecting pins are provided on the tube socket. The connecting pins can be used for the photoelectric transmitter and the photoelectric receiver. The transmitting end and the receiving end are respectively bonded to two electrical pins, and they do not interfere with each other electrically; this not only reduces the number of grounding pins, but also ensures the safety performance of the product.

[0058] S102, providing a semiconductor chip, wherein the semiconductor chip at least includes a light emitting device and a light receiving device; the light emitting device and the light receiving device are respectively connected to the connecting pins through gold wire bonding;

[0059] In the embodiment of the present application, the optical emitting device is a key component in the optical fiber communication system, and its main function is to convert electrical signals into optical signals for transmission in optical fibers. Common optical emitting devices include lasers (such as DFB lasers, YAG lasers, etc.) and light emitting diodes (LEDs). The optical receiving device is another important component in the optical fiber communication system, and its main function is to convert the transmitted optical signal into an electrical signal for subsequent processing. Common optical receiving devices include photodiodes (PIN tubes), avalanche photodiodes (APDs), etc. In addition, the semiconductor chip of the present application may also include other optical devices, such as heat dissipation devices such as TEC / ceramic heat sinks.

[0060] In the embodiment of the present application, the electrodes of the light emitting device and the electrodes of the light receiving device are respectively connected to the connecting pins by gold wire bonding, which has the characteristics of high precision and high reliability and is suitable for electronic components with tiny packages and high-density layouts. Gold wire bonding not only ensures the stability of the circuit, but also can withstand the influence of certain factors such as temperature and vibration, thereby improving the reliability and service life of the light receiving device and the light receiving device.

[0061] S103, mounting the semiconductor chip on the tube holder;

[0062] In the embodiment of the present application, in order to ensure the airtightness requirement of the packaged device, the present application installs the semiconductor chip in a tube seat, and then covers the semiconductor chip with a tube cap.

[0063] S104, providing a tube cap, wherein the tube cap is arranged on the tube base and cooperates with the tube base to form a closed space so that the semiconductor chip is located in the closed space; a collimating lens and a flat window glass are arranged on the tube cap.

[0064] In the embodiment of the present application, the tube cap is a metal tube cap, which adopts a full metal sealing design to ensure product safety performance.

[0065] In some embodiments of the present application, since both the tube seat and the tube cap are made of metal materials, the tube seat and the tube cap are fixed by resistance welding in this embodiment to ensure that the shell is airtight and leak-proof, and effectively protect the internal components; resistance welding is a process of using the resistance heat energy generated by the current passing through the contact surface and adjacent areas of the weld joint to heat the welded metal to a local melt or a high plastic state, and then form a fixed welded joint under a certain pressure. This welding method does not require filler materials and usually does not require gas protection, and has the advantages of high welding productivity, low cost, and uniform chemical composition of the weld metal.

[0066] See also Fig. 9 ,like Fig. 9 As shown, Fig. 9 : is a schematic diagram of the tube socket manufacturing process provided in an embodiment of the present application; the manufacturing method of the tube socket includes:

[0067] S201, providing a metal base;

[0068] S202, forming a boss and four through-holes on the metal base by mechanical processing; the four through-holes respectively form dense through-hole pairs and sparse through-hole pairs;

[0069] S203, passing the connecting pins through the corresponding through-portions via fillers to form dense pin pairs and sparse pin pairs;

[0070] S204, placing a light emitting device on the side of the boss near the dense pin pair; placing a light receiving device on the surface of the metal base near the sparse pin pair.

[0071] See also Fig.10 ,like Fig.10 As shown, Fig.10 : is a schematic diagram of the pipe cap manufacturing process provided in the embodiment of the present application. The manufacturing method of the pipe cap includes:

[0072] S301, providing a metal cap;

[0073] S302, forming a blocking structure and two through-holes on the metal cap by mechanical processing;

[0074] S303, sintering a collimating lens on the first through portion at low temperature;

[0075] S304, sintering the flat window glass on the second penetration portion at low temperature.

[0076] It should be noted that in the embodiments of the present application, the above dimensions are related dimensions, and the device can be manufactured according to the above related dimensions, and other dimensions can be designed as required; the sizes of the four through-holes (dimension φB) on the metal base are not required to be consistent, and the filler materials are not required to be consistent, so that the transmitting end and the receiving end can have different transmission rates; the device is only an example, and the layout positions of the transmitting end and the receiving end can be set as required; the tube cap has no strict requirements on the collimating lens and the flat window glass, and the collimating lens or the flat window glass can be used as required; the device is not limited to TO packaging, and other packaging forms are also acceptable.

[0077] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "side", "inside", "outside", "center", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0078] In the present invention, unless otherwise clearly stipulated and limited, the terms "installation", "setting", "connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0079] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor transceiver integrated packaging device, characterized in that: include: A tube socket, on which a plurality of connecting pins are arranged; A tube cap, the tube cap is arranged on the tube base and cooperates with the tube base to form a closed space, and a collimating lens and a flat window glass are arranged on the tube cap; A semiconductor chip is disposed in the enclosed space, wherein the semiconductor chip comprises at least a light emitting device and a light receiving device; The tube seat and the tube cap are fixed by resistance welding, and the light emitting device and the light receiving device are connected to the connecting pins by gold wire bonding respectively.

2. The semiconductor transceiver integrated packaging device according to claim 1, characterized in that: The tube holder includes a metal base and four connecting pins passing through the metal base, wherein the four connecting pins respectively form a dense pin pair and a sparse pin pair; a boss is provided on the metal base, wherein the boss deviates from the center of the metal base, and a light emitting device is placed on the side of the boss close to the dense pin pair; and a light receiving device is placed on the surface of the metal base close to the sparse pin pair.

3. The semiconductor transceiver integrated packaging device according to claim 2, characterized in that: The light emitting device is connected to the dense pin pair through a welding wire; the light receiving device is connected to the sparse pin pair through a welding wire.

4. The semiconductor transceiver integrated packaging device according to claim 1 or 2, characterized in that: The semiconductor chip also includes a heat dissipation device.

5. The semiconductor transceiver integrated packaging device according to claim 1 or 2, characterized in that: It also includes a ground pin, which is arranged on the tube seat and is located at the center of the multiple connecting pins.

6. The semiconductor transceiver integrated packaging device according to claim 2, characterized in that: The tube cap comprises a metal cap, on which a blocking structure is arranged to form two isolated through-portions; a collimating lens is arranged on the first through-portion, and a flat window glass is arranged on the second through-portion.

7. The semiconductor transceiver integrated packaging device according to claim 2, characterized in that: The offset distance of the boss from the center of the metal base is greater than half the thickness of the blocking structure; the height of the collimating lens is greater than the height of the boss; the offset distance of the light receiving device from the center of the metal base is greater than half the thickness of the blocking structure.

8. A method for manufacturing a semiconductor transceiver integrated packaging device, which is used to realize the semiconductor transceiver integrated packaging device as claimed in any one of claims 1 to 7, characterized in that: The method comprises: Providing a tube holder, on which a plurality of connecting pins are arranged; Providing a semiconductor chip, the semiconductor chip at least comprising a light emitting device and a light receiving device; the light emitting device and the light receiving device are respectively connected to the connecting pins by gold wire bonding; Mounting the semiconductor chip on the stem; A tube cap is provided, which is arranged on the tube base and cooperates with the tube base to form a closed space so that the semiconductor chip is located in the closed space; a collimating lens and a flat window glass are arranged on the tube cap.

9. The method for manufacturing a semiconductor transceiver integrated package device according to claim 8, characterized in that: The manufacturing method of the tube seat includes: Providing a metal base; A boss and four through-holes are formed on the metal base by mechanical processing; the four through-holes respectively form a dense through-hole pair and a sparse through-hole pair; Passing a plurality of connecting pins through corresponding through-portions via fillers to form dense pin pairs and sparse pin pairs; A light emitting device is placed on the side of the boss near the dense pin pair; and a light receiving device is placed on the surface of the metal base near the sparse pin pair.

10. The method for manufacturing a semiconductor transceiver integrated package device according to claim 8, wherein: The manufacturing method of the pipe cap comprises: Providing a metal cap; Forming a blocking structure and two through-holes on the metal cap by mechanical processing; Sintering a collimating lens at low temperature on the first through portion; The flat window pane is sintered at low temperature on the second aperture.

Images