Hidden pattern processing method and hidden pattern product

Abstract

The invention discloses a hidden pattern processing method and a hidden pattern product, and belongs to the technical field of vacuum coating. Comprising the following steps: drawing a pattern digital image; outputting the pattern digital image to a film; manufacturing a screen printing plate through the manufactured film; printing pattern ink on the surface of the sheet on the screen printing plate to form a hidden pattern layer; the sheet with the hidden pattern layer formed on the surface is baked; plating a metal film on the surfaces of the dried sheet and the pattern printing ink; laying a protective film on the sheet, and stripping the metal film and the pattern ink on the sheet; printing ground color ink on the surface, deviating from the metal film and the pattern ink, of the protective film, and forming an external pattern layer on the protective film through the ground color ink; performing double-sided film mounting on the protective film on which the externally-displayed pattern layer is formed; according to the hidden pattern processing method and the hidden pattern product, the problems that in the prior art, hidden pattern coating technology equipment is high in cost, the early-stage preparation time is long, and pollution exists are solved.

Description

Technical Field

[0001] The invention belongs to the technical field of vacuum coating, and in particular relates to a hidden pattern processing method and a hidden pattern product. Background Art

[0002] The traditional vacuum coating process evaporates or sputters metals, alloys or compounds in a vacuum, causing them to solidify and deposit on the material to be coated (called a substrate, substrate or matrix), forming a thin film on the surface of the material, thereby giving the material many new and good physical and chemical properties, and also making the material's appearance richer, but with this, the requirements for processing equipment are also getting higher and higher.

[0003] The hidden pattern coating process in the prior art usually uses photolithography equipment to process the nanoimprint master mold. The equipment cost is high, the mold opening and proofing time is long, and it has certain harm to the environment. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a hidden pattern processing method and a hidden pattern product, which solves the problems of high cost, long preparation time and pollution of hidden pattern coating process equipment in the prior art.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is: In a first aspect, a hidden pattern processing method is provided, comprising the following steps: Draw digital images of patterns; Outputting the digital pattern image onto a film; Making a screen printing plate by using the prepared film sheet; Printing pattern ink on the surface of the sheet material by the screen printing plate, and forming a hidden pattern layer on the surface of the sheet material by the pattern ink; Baking the sheet material with the hidden pattern layer formed on the surface to dry the pattern ink; Evenly coating the surface of the dried sheet and the pattern ink with a metal film; Laying a protective film on the sheet material that can adhere to the surface of the metal film, and peeling off the metal film and the pattern ink on the sheet material through the protective film; Printing a base color ink on a side of the protective film that is away from the metal film and the pattern ink, so as to form an external pattern layer on the protective film through the base color ink; The protective film forming the external pattern layer is double-sided laminated, and the double-sided laminated protective film is cut by a molding device to obtain a finished product.

[0006] Optionally, the OD value of the film is ≥3.5.

[0007] Optionally, the sheet material with the hidden pattern layer formed on the surface is baked at a temperature of 75° C. to 85° C. and a baking time of 27 minutes to 35 minutes.

[0008] Optionally, the adhesive force of the protective film is ≥600gf / 25mm.

[0009] Optionally, the pattern ink is a peelable ink.

[0010] Optionally, the sheet material is any one or more of PC material, PET material, aluminum plate, and acrylic.

[0011] Optionally, the light transmittance of the metal film is 40% to 70%.

[0012] In a second aspect, a hidden pattern product is provided, which is produced by the hidden pattern processing method described in the first aspect, and the hidden pattern product includes a hidden pattern layer and an external pattern layer, a protective film is arranged between the hidden pattern layer and the external pattern layer, and a metal film is arranged between the hidden pattern layer and the protective film.

[0013] Optionally, a laminating protective layer is provided on the side of the hidden pattern layer and the visible pattern layer facing away from the protective film.

[0014] Compared with the prior art, the present invention has the following beneficial effects: (1) Compared with other hidden texture processing technologies, the hidden pattern processing method in this technical solution does not need to use high-priced photolithography equipment to process the nanoimprint master mold. The hidden pattern effect can be achieved through a variety of traditional and mature printing technologies, which can effectively reduce the production cost and time cost of mold opening and proofing. In terms of environmental impact, it does not have high pollution such as etching, stripping, and chemical film stripping; (2) By utilizing the light transmittance of the metal film, the hidden pattern layer can be displayed at different viewing angles under different lighting conditions, and the hidden pattern layer can have a certain metallic texture, making the hidden pattern products made of this material more prominent in terms of hiding and display effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 It is a schematic flow chart of a hidden pattern processing method in a preferred embodiment of the present invention; Figure 2 It is a structural schematic diagram of a hidden pattern product in a preferred embodiment of the present invention; Among them, 1. Hidden pattern layer; 2. Visible pattern layer; 3. Protective film; 4. Metal film; 5. Mounting glue protective layer. DETAILED DESCRIPTION

[0017] The present invention will now be further described in detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0018] It should be noted that if there are directional indications (such as up, down, bottom, top, etc.) involved in this embodiment, the directional indication is only used to explain the relative position relationship, movement, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly. The terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. Unless otherwise clearly specified and defined, the terms "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Embodiment 1

[0019] like Figure 1 As shown, a hidden pattern processing method comprises the following steps: Draw digital images of patterns; Outputting the digital pattern image onto a film; Making a screen printing plate by using the prepared film sheet; Printing pattern ink on the surface of the sheet material by the screen printing plate, and forming a hidden pattern layer 1 on the surface of the sheet material by the pattern ink; Baking the sheet with the hidden pattern layer 1 formed on the surface to dry the pattern ink; A metal film 4 is evenly plated on the surface of the dried sheet and the pattern ink; Laying a protective film 3 on the sheet material, which can adhere to the surface of the metal film 4, and peeling off the metal film 4 and the pattern ink on the sheet material through the protective film 3; Printing a base color ink on a side of the protective film 3 that is away from the metal film 4 and the pattern ink, so as to form an external pattern layer 2 on the protective film 3 by the base color ink; The protective film 3 forming the external pattern layer 2 is double-sided laminated, and the double-sided laminated protective film 3 is cut by a molding device to obtain a finished product.

[0020] Specifically, the time for pattern digital image is short, and there is no need to open molds for proofing. Moreover, the pattern digital image can be drawn into different styles according to needs. The pattern digital image can be output to the film through the film output machine in the prior art, and screen printing plates with different mesh counts can be made according to the exposure of the film to achieve patterns of different fineness. Then, the pattern ink is printed on the sheet by the semi-automatic screen printing machine in the prior art using the above-mentioned screen printing plate. After the pattern ink dries, a hidden pattern will be formed on the sheet. Then, a vacuum coating machine in the prior art is used to coat one or more layers of metal film on the sheet and the pattern ink. 4. Then, the surface of the sheet is surfaced using a laminating machine in the prior art so that the protective film 3 can adhere to the metal film 4 and / or the dry pattern ink. Then, after the laminating machine is completed, the protective film 3 can be torn off from the sheet at the discharge port and rolled up. Since the adhesion strength between the metal film 4 and the pattern ink, and the adhesion strength between the protective film 3 and the metal film 4 and the pattern ink are much greater than the adhesion strength between the pattern ink and the sheet, when the protective film 3 is torn off, the metal film 4 and the pattern ink will be completely peeled off from the surface of the sheet, ensuring that all the pattern ink within the range is torn off without residue. Then, a semi-automatic screen printer is used to print the base color ink on the surface of the protective film 3 torn off from the sheet, and then a gluing machine is used to perform double-sided lamination on the protective film 3 that has been printed with the base color ink, so as to protect the formed hidden pattern layer 1 and the visible pattern layer 2, and then the protective film 3 that has completed the double-sided lamination operation is cut by a molding device in the prior art to meet the use requirements. Since the metal film 4 has a certain light transmittance, the hidden pattern layer 1 formed by the graphic ink can be observed through the metal film 4 at different viewing angles, and the hidden graphic part can also have a clear metallic texture, and the effect is obvious.

[0021] At the same time, compared with other hidden texture processing technologies in the industry, it does not require the use of high-priced lithography equipment to process nanoimprint master molds, which can effectively reduce the production cost and time cost of mold opening and proofing. From the perspective of environmental impact, semi-automatic screen printing machines, film output machines, laminating machines and molding equipment are all relatively mature printing equipment in the existing technology, and there is no high pollution such as etching, stripping, and chemical film stripping.

[0022] As mentioned above, the transmittance can be adjusted according to the required hiding effect. The coating target material used by the vacuum coating machine is mainly composed of titanium powder, silicon powder, and titanium powder, which can effectively improve the uniformity of the metal film 4. At the same time, the number of layers, order, and thickness of the metal film 4 should be adjusted according to the transmittance requirements. The lower the transmittance, the stronger the hiding effect, and vice versa. In this technical solution, preferably, the transmittance of the metal film 4 is 40% to 70%.

[0023] Furthermore, the OD value of the film in the pattern digital image input is ≥3.5, and there are no scratches or folds on the film surface. A higher OD value means that the film has a stronger blocking effect on light, which can ensure that only light in a specific area is transmitted, achieving precise exposure control. At the same time, a higher OD value can also effectively reduce the impact of stray light on exposure, making the image clearer and the product quality better.

[0024] In the above, the sheet material after the hidden pattern layer 1 is formed on the surface is baked, and the baking temperature is 75°C to 85°C, and the baking time is 27 minutes to 35 minutes. Within this range, the drying process of the pattern ink can be effectively accelerated. Compared with lower or higher baking temperatures and longer or shorter baking times, within this range, the production cycle can be greatly shortened and the printing production efficiency can be improved while ensuring the drying quality of the pattern ink. Preferably, the baking temperature of the sheet material in this technical solution is 80°C and the baking time is 30 minutes.

[0025] As mentioned above, preferably, the adhesion of the protective film 3 is ≥ 600gf / 25mm, so that the protective film 3 can be firmly attached to the surface of the metal film 4, ensuring that when the protective film 3 is torn off, all the pattern ink within the range will be completely torn off by the protective film 3 without any residue. At the same time, the protective film 3 with high adhesion can remain stable in a normal production environment, ensuring that the protective film 3 can continue to play a role stably throughout the production process.

[0026] In this embodiment, the pattern ink is a peelable ink, and the sheet material is any one or more of PC material, PET material, aluminum plate, and acrylic. Embodiment 2

[0027] like Figure 2 As shown, on the basis of Example 1, a hidden pattern product is realized by the aforementioned hidden pattern processing method, including a hidden pattern layer 1 and an external pattern layer 2, a protective film 3 is arranged between the hidden pattern layer 1 and the external pattern layer 2, a metal film 4 is arranged between the hidden pattern layer 1 and the protective film 3, and a laminating protective layer 5 is arranged on the side of the hidden pattern layer 1 and the external pattern layer 2 facing away from the protective film 3.

[0028] Specifically, the metal film 4 is a single layer or multiple layers, and the laminating protective layer 5 is the product of a laminating machine performing double-sided lamination on the protective film 3 printed with base color ink, which can protect the hidden pattern layer 1 and the visible pattern layer 2.

[0029] The above is based on the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the content in the specification, and the technical scope must be determined according to the scope of the claims.

Claims

1. A hidden pattern processing method, characterized in that: The following steps are involved: Draw digital images of patterns; Outputting the digital pattern image onto a film; Making a screen printing plate by using the prepared film sheet; Printing pattern ink on the surface of the sheet material using the screen printing plate, and forming a hidden pattern layer (1) on the surface of the sheet material by using the pattern ink; Baking the sheet material with the hidden pattern layer (1) formed on the surface to dry the pattern ink; Evenly coating the surface of the dried sheet and the pattern ink with a metal film (4); Laying a protective film (3) on the sheet material, which is capable of adhering to the surface of the metal film (4), and peeling off the metal film (4) and the pattern ink on the sheet material through the protective film (3); Printing a base color ink on a side of the protective film (3) that is away from the metal film (4) and the pattern ink, so as to form an external pattern layer (2) on the protective film (3) through the base color ink; The protective film (3) forming the external pattern layer (2) is double-sided laminated, and the double-sided laminated protective film (3) is cut by a molding device to obtain a finished product.

2. The hidden pattern processing method according to claim 1, characterized in that: The OD value of the film is ≥3.

5.

3. The hidden pattern processing method according to claim 1, characterized in that: The sheet material with the hidden pattern layer (1) formed on the surface is baked at a temperature of 75° C. to 85° C. and a baking time of 27 minutes to 35 minutes.

4. The hidden pattern processing method according to claim 1, characterized in that: The adhesive force of the protective film (3) is ≥ 600 gf / 25 mm.

5. The hidden pattern processing method according to claim 1, characterized in that: The pattern ink is a peelable ink.

6. The hidden pattern processing method according to claim 1, characterized in that: The sheet material is any one or more of PC material, PET material, aluminum plate, and acrylic.

7. The hidden pattern processing method according to claim 1, characterized in that: The light transmittance of the metal film (4) is 40% to 70%.

8. A hidden pattern product, characterized in that: The hidden pattern product is manufactured by the hidden pattern processing method according to any one of claims 1 to 7, wherein the hidden pattern product comprises a hidden pattern layer (1) and an external pattern layer (2), a protective film (3) is arranged between the hidden pattern layer (1) and the external pattern layer (2), and a metal film (4) is arranged between the hidden pattern layer (1) and the protective film (3).

9. The hidden pattern product according to claim 8, characterized in that: A laminating protective layer (5) is provided on the side of the hidden pattern layer (1) and the visible pattern layer (2) facing away from the protective film (3).

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