Automatic film coating and packaging equipment for chip processing and packaging method

Abstract

The invention discloses an automatic laminating and packaging device for chip processing and a packaging method, and relates to the technical field of chip processing.The automatic laminating and packaging device comprises a device body, conveying rollers are arranged on the two sides of the device body, the conveying rollers on the two sides are connected through a conveying belt, an objective table is arranged on the conveying belt, and laminating rollers are symmetrically arranged in the middle of the device body; a fixing vertical plate is arranged in the middle of the equipment body, the output end of the driving motor is perpendicular to the surface of the fixing vertical plate, the output end of the driving motor is connected with a transmission mechanism, a fixing rod is connected to the lower portion of the transmission mechanism, the transmission rod is fixedly connected with the transmission mechanism, and a limiting disc is coaxially arranged in the middle of the fixing rod; according to the equipment, the problems that during chip processing and film covering, bubbles exist between a protective film and a chip, the adhesive force of the protective film is affected, and the durability and the protection effect of the protective film are reduced are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and more specifically to a chip processing automatic film coating packaging device and a packaging method. Background Art

[0002] Chip lamination packaging is one of the technologies used to protect and package chips in semiconductor manufacturing. Its purpose is to improve the reliability and performance of chips, prevent environmental factors (such as moisture, oxygen, temperature changes, etc.) from damaging chips, and improve the mechanical strength of chips. Chip processing automatic lamination packaging equipment is mainly used to protect, package and enhance chips, ensure the stability and reliability of chip performance during use, and avoid chips from being affected by the external environment.

[0003] In the prior art, in order to process the chip during chip processing, the wafer needs to be cut, and before cutting, one side of the wafer circuit needs to be coated and packaged for protection. During use, the existing wafer coating equipment first needs to cover the surface of the wafer with a protective film, then press the protective film on the protective film, and then cut the protective film between the wafer surfaces through a cutting device. After the cutting is completed, the waste film on the edge can be removed. However, when the protective film is pressed on the wafer, bubbles will be generated between the protective film and the wafer due to incorrect film pasting methods during the film pasting process, thereby affecting the adhesion of the protective film, thereby weakening the protective effect of the protective film on the chip. In particular, in the subsequent processing process, the bubble area is easily peeled off or falls off, reducing the durability and protective effect of the protective film. For this reason, the prior art adopts vacuum bonding technology, and uses a vacuum environment to extract bubbles from between the protective film and the chip, so that the protective film is tightly attached to the surface of the chip. This can indeed completely remove bubbles and ensure the uniformity of the protective film, but the operation is more cumbersome and the equipment cost is higher, resulting in reduced chip processing production efficiency and increased chip production costs.

[0004] In view of the above situation, the present invention designs a chip processing automatic film laminating packaging equipment and packaging method to solve the above technical problems. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a chip processing automatic laminating packaging equipment and packaging method, which solves the problem that bubbles exist between the protective film and the chip during chip processing and laminating, which affects the adhesion of the protective film and reduces the durability and protective effect of the protective film.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic film coating and packaging device for chip processing, used for coating a protective film on the surface of a chip, comprising a device body, conveying rollers are arranged on both sides of the device body, and the conveying rollers are rotatably arranged on both sides of the device body, the conveying rollers on both sides are connected by a conveyor belt, and two groups of loading tables for placing chips are arranged on the conveyor belt, coating rollers are symmetrically arranged in the middle of the device body, a protective film is connected in the middle of the coating rollers, and the protective film is located above the loading table, a fixed vertical plate is arranged in the middle of the device body, and the fixed vertical plate is an L-shaped structure, a driving motor is arranged on the fixed vertical plate, and the driving motor passes through the fixed vertical plate The output end of the driving motor is arranged vertically on the surface of the fixed vertical plate, the output end of the driving motor is connected to a transmission mechanism, a fixed rod is connected below the transmission mechanism, a transmission rod is arranged on one side of the fixed rod, and the transmission rod is fixedly connected to the transmission mechanism, a limiting disk is coaxially arranged in the middle of the fixed rod, a telescopic part is arranged at one end of the transmission rod away from the transmission mechanism, a coating rod is connected to one end of the telescopic part away from the transmission rod, and a coating head is connected to one end of the coating rod, the driving motor drives the transmission rod to rotate periodically around the fixed rod through the transmission mechanism, and the fixed rod drives the coating rod to move in a circle within the limiting disk through the telescopic part, so that the coating rod tightly fits the protective film to the chip surface.

[0007] Preferably, the transmission mechanism includes an inner toothed disc, a driving gear, a driven gear and a moving part, the inner toothed disc is arranged below the fixed vertical plate, and the inner toothed disc is connected to the fixed vertical plate through the moving part, the moving part drives the inner toothed disc to reciprocate on the output shaft of the driving motor, a driving gear is arranged at the center position of the inner toothed disc, and the driving gear is fixedly connected to the output end of the driving motor, a driven gear is arranged on one side of the driving gear, and the driven gear is meshed with the driving gear, and the driving gear drives the driven gear to rotate in the inner toothed disc.

[0008] Preferably, a plurality of outer rectangular tubes are arranged in a circular array above the inner gear disk, the outer rectangular tubes are fixedly connected to the fixed vertical plate, the inner rectangular tubes are slidably connected to the inner rectangular tubes, the number of the inner rectangular tubes corresponds to the number of the outer rectangular tubes, and one end of the inner rectangular tube is connected to one side of the inner gear disk.

[0009] Preferably, the moving part includes an electromagnet and a return spring, and the electromagnet is arranged in two groups, one group of the electromagnets is arranged below the fixed vertical plate, and the other group of the electromagnets is arranged above the inner gear disk. The electromagnet is coaxially arranged with the output shaft of the driving motor, and the two groups of electromagnets have opposite magnetic properties. A return spring is arranged on the inner side of the electromagnet, one end of the return spring is connected to the fixed vertical plate, and the other end of the return spring is connected to the inner gear disk.

[0010] Preferably, a vortex limit groove is provided on the limit plate, and the diameter of the vortex limit groove is larger than the diameter of the chip. A plurality of rotating plates are rotatably arranged on the limit plate, and the rotating plates correspond to each other in pairs. A gap is provided between the rotating plates, and the gap is smaller than the diameter of the coating rod. The plurality of rotating plates are located in a straight line, and when the rotating plate swings, the coating rod can move from the end of the vortex limit groove to the starting section of the vortex limit groove.

[0011] Preferably, the telescopic part includes a rectangular tube, a movable groove and a control spring. The rectangular tube is fixedly arranged at one end of the transmission rod. A movable groove is opened inside the rectangular tube. A control spring is arranged in the movable groove. One end of the control spring is connected to the movable groove, and the other end of the control spring is connected to the coating rod.

[0012] Preferably, a laminating head is provided at one end of the laminating rod, a mounting groove is opened in the laminating head, a cutting blade is provided in the mounting groove, and a magnet is provided on one side of the cutting blade, the magnet is connected to the mounting groove through a compression spring, and the compression spring and the connecting end of the magnet are slidably connected.

[0013] Preferably, a placement groove is provided on the stage, and the diameter of the placement groove is consistent with the diameter of the chip, a V-shaped groove is provided on one side of the placement groove, and the V-shaped groove is coaxially arranged with the placement groove.

[0014] Preferably, the V-shaped groove is provided with the same magnet, and the magnet is arranged on one side of the V-shaped groove, the laminating rod drives the laminating head to perform periodic circular motion, and the cutting blade moves in accordance with the V-shaped groove.

[0015] Preferably, the packaging method comprises the following steps: S1: Select a suitable stage according to the size of the chip, and fix the stage on the conveyor belt. The conveyor belt is driven to move by the rotation of the conveyor roller, and the conveyor belt drives the stage to move under the laminating roller; S2: The coating roller rotates to cover the chip with the protective film, and the electromagnet is energized. The inner gear disc moves toward the chip based on the principle that like poles repel each other. S3: The fixed rod is attached to the chip surface, and the driven gear is driven to rotate periodically in the inner gear disk by the rotation of the driving gear, and the transmission rod performs periodic circular motion around the fixed rod; S4: The transmission rod rotates around the fixed rod, and the laminating rod moves in the vortex limiting groove by using the vortex limiting groove provided on the limiting plate; S5: The coating rod moves in the vortex limiting groove and pulls the compression spring. When the coating rod moves to the outermost side of the vortex limiting groove, the elastic potential energy of the compression spring is used to enable the coating rod to push the rotating plate to achieve reset.

[0016] Beneficial effects of the present invention: 1. The present invention provides an automatic film laminating and packaging device and packaging method for chip processing. The device drives a conveyor belt to reciprocate through a conveyor roller, and a loading platform is provided on the conveyor belt. The chip is placed on the loading platform. When the loading platform reciprocates on the conveyor belt, it can be achieved through two groups of loading platforms. When one group of loading platforms is performing chip laminating operation, the other group of loading platforms can pre-install chips. When one group of loading platforms completes the chip laminating operation, the other group of loading platforms can perform chip laminating operation. At the same time, the chip can be pre-installed on the loading platform that has completed the chip laminating operation, thereby avoiding the need for only one group of loading platforms to repeat the installation and disassembly actions, saving operation time, and thus improving the production efficiency of the overall equipment.

[0017] 2. The present invention provides an automatic film coating and packaging device and method for chip processing. The device cooperates with a limit plate and a coating rod through a transmission mechanism, and a driving motor drives the transmission mechanism to move. Since the limit plate is fixedly arranged on a fixed rod below the transmission mechanism, the transmission mechanism drives the transmission rod to rotate periodically around the fixed rod, and the transmission rod drives the coating rod to move in a vortex limit groove provided on the limit plate. At this time, the coating head rotates in a circle toward the outside around the fixed rod. When the coating rod drives the coating head to move, bubbles can be avoided between the protective film and the chip, and the bubbles that have been generated between the protective film and the chip can be removed. The coating head rotates in a circle in accordance with the surface of the chip, so that the protective film is closely fitted to the surface of the chip, thereby avoiding that the adhesion of the protective film is affected, thereby improving the durability and protective effect of the protective film.

[0018] 3. The present invention provides an automatic film coating and packaging device for chip processing and a packaging method. The device cooperates with the film coating rod through a telescopic part. When the transmission rod drives the film coating rod to move in the vortex limit groove, the film coating rod pulls the telescopic spring. When the film coating rod moves toward the outside of the vortex limit groove, the elastic potential energy of the control spring becomes larger and larger. When the film coating rod moves to the outermost side of the vortex limit groove, the elastic potential energy of the control spring is the largest, and the control spring pulls the film coating rod to push the rotating plate to move, so that the film coating rod moves to the initial end of the vortex limit groove, thereby realizing the resetting of the film coating rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a cross-sectional view of the overall structure of the present invention; Figure 3 It is a cross-sectional view of the overall structure of the transmission mechanism of the present invention in conjunction with the limiting plate; Figure 4 It is a partial cross-sectional view of the overall structure of the transmission mechanism of the present invention in conjunction with the limiting plate; Figure 5 For the present invention Figure 4 A partial enlarged view of the middle A; Figure 6 For the present invention Figure 4 A partial enlarged view of point B in the middle; Figure 7 It is a schematic diagram of the overall structure of the transmission mechanism of the present invention; Figure 8 It is a schematic diagram of the overall structure of the limiting plate of the present invention.

[0020] Reference numerals: 1. Equipment body; 11. Conveyor roller; 12. Conveyor belt; 13. Loading platform; 131. Storage slot; 132. V-shaped slot; 14. Laminating roller; 15. Fixed vertical plate; 2. Driving motor; 3. Transmission mechanism; 31. Internal gear plate; 311. Internal rectangular tube; 312. External rectangular tube; 32. Driving gear; 33. Driven gear; 34. Moving part; 341. Electromagnet; 342. Return spring; 35. Fixed rod; 36. Transmission rod; 4. Limiting plate; 41. Vortex limiting slot; 42. Rotating plate; 5. Telescopic part; 51. Rectangular tube; 52. Moving slot; 53. Control spring; 6. Laminating rod; 61. Laminating head; 611. Mounting slot; 612. Compression spring; 613. Magnet; 614. Cutting blade; DETAILED DESCRIPTION In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0021] refer to Figure 1 , Figure 2 , Figure 3To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic film coating and packaging device for chip processing, used for coating a protective film on the surface of a chip, comprising a device body 1, conveying rollers 11 are arranged on both sides of the device body 1, and the conveying rollers 11 are rotatably arranged on both sides of the device body 1, the conveying rollers 11 on both sides are connected by a conveyor belt 12, and two groups of loading tables 13 for placing chips are arranged on the conveyor belt 12, a coating roller 14 is symmetrically arranged in the middle of the device body 1, a protective film is connected in the middle of the coating roller 14, and the protective film is located above the loading table 13, a fixed vertical plate 15 is arranged in the middle of the device body 1, and the fixed vertical plate 15 is an L-shaped structure, a driving motor 2 is arranged on the fixed vertical plate 15, and the driving motor 2 is arranged through the fixed vertical plate 15, The output end of the driving motor 2 is arranged vertically on the surface of the fixed vertical plate 15, and the output end of the driving motor 2 is connected to a transmission mechanism 3, and a fixed rod 35 is connected below the transmission mechanism 3. A transmission rod 36 is arranged on one side of the fixed rod 35, and the transmission rod 36 is fixedly connected to the transmission mechanism 3, and a limiting disk 4 is coaxially arranged in the middle of the fixed rod 35, and a telescopic part 5 is arranged at one end of the transmission rod 36 away from the transmission mechanism 3, and a coating rod 6 is connected to the end of the telescopic part 5 away from the transmission rod 36, and a coating head 61 is connected to one end of the coating rod 6, and the driving motor 2 drives the transmission rod 36 to rotate periodically around the fixed rod 35 through the transmission mechanism 3, and the fixed rod 35 drives the coating rod 6 to move in a circle in the limiting disk 4 through the telescopic part 5, so that the coating rod 6 can closely fit the protective film to the chip surface.

[0022] During the working process, the operator first fixes one end of the protective film to the coating roller 14 on one side of the equipment body 1, and the other end of the protective film is coaxially arranged with the coating roller 14 on the other side of the equipment body 1, so that the coating roller 14 can be driven to rotate by controlling the motor (not shown in the figure), so that the protective film is spread flat on the stage 13, and then the operator places the chip on the stage 13. The stage 13 is provided with two groups. In the initial state, the operator installs chips on both groups of stages 13, and drives the conveyor belt 12 to rotate by rotating the conveyor roller 11. Since the stage 13 is arranged on the conveyor belt 12, when the stage 13 moves to the bottom of the protective film for coating operation, another group of idle stages 13 can be used for pre-installation of chips, thereby saving the time of chip coating operation. When the chip is coated, the drive motor 2 is started, and the moving key drives the transmission mechanism 3 to move downward. At this time The fixing rod 35 arranged under the transmission mechanism 3 pushes the protective film to adhere to the chip surface, so that the protective film is fixed by the fixing rod 35, and the driving motor 2 rotates to drive the transmission mechanism 3 to move, and the movement of the transmission mechanism 3 drives the transmission rod 36 to move in a circle around the fixing rod 35. Since the coating rod 6 is connected to the transmission rod 36, the coating rod 6 moves in a circle around the fixing rod 35 at this time. Through the limit plate 4 arranged in the middle of the fixing rod 35, when the transmission rod 36 drives the coating rod 6 to rotate, the limiting plate 4 can make the coating rod 6 move in a circle around the fixing rod 35 according to the specified route, so that the coating head 61 arranged at one end of the coating rod 6 can remove the bubbles between the protective film and the chip, and at the same time, it can avoid the generation of bubbles when the protective film and the chip are attached. When the coating rod 6 moves in a circle, the telescopic part 5 can be used to avoid the coating rod 6 from getting stuck during the periodic circular motion, thereby improving the stability of the overall equipment operation.

[0023] refer to Figure 4 , Figure 5 , Figure 6 As shown, the transmission mechanism 3 includes an inner toothed disc 31, a driving gear 32, a driven gear 33 and a moving member 34. The inner toothed disc 31 is arranged below the fixed vertical plate 15, and the inner toothed disc 31 is connected to the fixed vertical plate 15 through the moving member 34. The moving member 34 drives the inner toothed disc 31 to reciprocate on the output shaft of the driving motor 2. A driving gear 32 is arranged at the center position of the inner toothed disc 31, and the driving gear 32 is fixedly connected to the output end of the driving motor 2. A driven gear 33 is arranged on one side of the driving gear 32, and the driven gear 33 is meshed with the driving gear 32. The driving gear 32 drives the driven gear 33 to rotate in the inner toothed disc 31.

[0024] During operation, since the output end of the driving motor 2 is connected to the driving gear 32, the driving motor 2 can drive the driving gear 32 to move coaxially when it rotates. The driving gear 32 rotates to drive the driven gear 33 meshing with it to rotate. Since one end of the inner toothed disc 31 is fixedly connected to the moving member 34, and one end of the moving member 34 is fixedly connected to the fixed vertical plate 15, the driving gear 32 drives the driven gear 33 to perform periodic circular motion around the inner toothed disc 31.

[0025] A plurality of outer rectangular tubes 312 are arranged in a circular array above the inner gear disk 31, and the outer rectangular tubes 312 are fixedly connected to the fixed vertical plate 15, and the inner rectangular tubes 311 are slidably connected inside the outer rectangular tubes 312, and the number of the inner rectangular tubes 311 corresponds to the number of the outer rectangular tubes 312, and one end of the inner rectangular tube 311 is connected to one side of the inner gear disk 31. Through such an arrangement, when the inner gear disk 31 is displaced toward the chip surface through the moving part 34, the inner gear disk 31 drives the inner rectangular tube 311 to move toward the chip surface, so that the inner gear disk 31 can be fixed. The manner in which multiple groups of inner rectangular tubes 311 are connected to the outer rectangular tubes 312 can avoid the deviation of the inner gear disk 31 during the movement, and at the same time can improve the stability of the movement of the inner gear disk 31.

[0026] The moving member 34 includes an electromagnet 341 and a return spring 342. The electromagnet 341 is provided in two groups, one of which is provided below the fixed vertical plate 15, and the other is provided above the inner gear plate 31. The electromagnet 341 is provided coaxially with the output shaft of the driving motor 2, and the two groups of electromagnets 341 have opposite magnetic properties. A return spring 342 is provided inside the electromagnet 341, one end of the return spring 342 is connected to the fixed vertical plate 15, and the other end of the return spring 342 is connected to the inner gear plate 31. By such a setting When the inner toothed disk 31 needs to move toward the chip, it is only necessary to energize the electromagnet 341 under the fixed vertical plate 15. By utilizing the principle that like poles of the electromagnet 341 repel each other, the electromagnet 341 under the fixed vertical plate 15 moves the electromagnet 341 above the inner toothed disk 31. At this time, the inner toothed disk 31 moves downward, ending the chip laminating operation. At this time, the electromagnet 341 under the fixed vertical plate 15 is de-energized, and the elastic potential energy of the reset spring 342 is utilized to drive the inner toothed disk 31 to move toward the fixed vertical plate 15, thereby completing the reset of the inner toothed disk 31.

[0027] refer to Figure 7 , Figure 8As shown, the limit plate 4 is provided with a vortex limit groove 41, the diameter of the vortex limit groove 41 is larger than the chip diameter, the limit plate 4 is rotatably provided with a plurality of rotating plates 42, and the rotating plates 42 correspond to each other, and gaps are provided between the rotating plates 42, and the gaps are smaller than the diameter of the coating rod 6, and the plurality of rotating plates 42 are located in a straight line, and when the rotating plates 42 swing, the coating rod 6 can move from the end of the vortex limit groove 41 to the starting section of the vortex limit groove 41, and the telescopic member 5 includes a rectangular tube 51, a moving groove 52 and a control spring 53, the rectangular tube 51 is fixedly provided at one end of the transmission rod 36, a moving groove 52 is provided inside the rectangular tube 51, a control spring 53 is provided in the moving groove 52, and one end of the control spring 53 is connected to the moving groove 52, and the control The other end of the spring 53 is connected to the coating rod 6. Through such an arrangement, when the coating rod 6 moves in the vortex limit groove 41, the coating rod 6 will pull the control spring 53 to move in the moving groove 52. During the displacement of the coating rod 6 from the starting section to the end of the vortex limit groove 41, the elastic potential energy of the control spring 53 becomes larger and larger. When the coating rod 6 moves to the end of the vortex limit groove 41, the elastic potential energy of the control spring 53 reaches a maximum value. When the control spring 53 moves to the place where the rotating plate 42 is opened, the control spring 53 drives the coating rod 6 to push the rotating plate 42 open, so that the coating rod 6 moves from the end of the vortex limit groove 41 to the initial end, thereby realizing the resetting of the coating rod 6. There is no need for the operator to manually reset the coating rod 6, which saves operation time and improves the coating efficiency of the overall device.

[0028] A laminating head 61 is provided at one end of the laminating rod 6, a mounting groove 611 is provided in the laminating head 61, a cutting blade 614 is provided in the mounting groove 611, and a magnet 613 is provided on one side of the cutting blade 614, the magnet 613 is connected to the mounting groove 611 through a compression spring 612, and the connection end of the compression spring 612 and the magnet 613 is slidably connected, a storage groove 131 is provided on the stage 13, and the diameter of the storage groove 131 is consistent with the diameter of the chip, a V-shaped groove 132 is provided on one side of the storage groove 131, and the V-shaped groove 132 is coaxially arranged with the storage groove 131, the same magnet 613 is provided in the V-shaped groove 132, and the magnet 613 is arranged on one side of the V-shaped groove 132, the laminating rod 6 drives the laminating head 61 to perform periodic circular motion, and the cutting blade 614 moves in accordance with the V-shaped groove 132. During the working process, when the laminating rod 6 moves to When the chip is outside, the magnet 613 in the V-groove 132 will attract the cutting blade 614 to move downward. Since the coating rod 6 moves in the spiral limit groove 41, and the coating rod 6 does not move in a complete circle, the magnet 613 on the V-shaped side can attract the cutting blade 614 to move in line with the V-groove 132, thereby completing the cutting of the protective film. When the cutting blade 614 moves, the magnet 613 squeezes the compression spring 612 to move in line with the circumferential surface of the chip. When the coating rod 6 moves to the end of the spiral limit groove 41, the coating rod 6 moves toward the initial end of the spiral limit. At this time, the cutting blade 614 is blocked by the V-groove 132, and the cutting blade 614 moves upward. The magnet 613 above the cutting blade 614 is attracted to the mounting groove 611, thereby fixing the cutting blade 614 and preventing the cutting blade 614 from affecting the protective film that has just been cut.

[0029] The packaging method comprises the following steps: S1: Select a suitable stage 13 according to the size of the chip, and fix the stage 13 on the conveyor belt 12. The conveyor belt 12 is driven to move by the rotation of the conveyor roller 11, and the conveyor belt 12 drives the stage 13 to move under the coating roller 14; S2: The coating roller 14 rotates so that the protective film covers the chip, and the electromagnet 341 is energized. The inner gear disc 31 moves toward the chip based on the principle that like poles repel each other, thereby realizing the reciprocating motion of the inner gear disc 31; S3: The fixed rod 35 is attached to the chip surface, and the driving gear 32 is rotated to drive the driven gear 33 to rotate periodically in the inner gear plate 31, and the transmission rod 36 performs periodic circular motion around the fixed rod 35; S4: The transmission rod 36 rotates around the fixed rod 35, and the film-coating rod 6 moves in the vortex-shaped limiting groove 41 by using the vortex-shaped limiting groove 41 provided on the limiting plate 4, and the vortex-shaped limiting groove 41 can guide the film-coating rod 6; S5: The coating rod 6 moves in the spiral limiting groove 41 and pulls the compression spring 612. When the coating rod 6 moves to the outermost side of the spiral limiting groove 41, the elastic potential energy of the compression spring 612 is used to enable the coating rod 6 to push the rotating plate 42 to reset.

[0030] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.

Claims

1. A chip processing automatic film coating packaging equipment, used to coat a protective film on the surface of a chip, characterized in that: The device comprises a device body (1), wherein conveying rollers (11) are arranged on both sides of the device body (1), and the conveying rollers (11) are rotatably arranged on both sides of the device body (1), the conveying rollers (11) on both sides are connected by a conveying belt (12), and two groups of loading tables (13) for placing chips are arranged on the conveying belt (12), a coating roller (14) is symmetrically arranged in the middle of the device body (1), a protective film is connected in the middle of the coating roller (14), and the protective film is located above the loading table (13), and a fixed vertical plate (15) is arranged in the middle of the device body (1), and the fixed vertical plate (15) is an L-shaped structure; A drive motor (2) is arranged on the fixed vertical plate (15), and the drive motor (2) is arranged through the fixed vertical plate (15); an output end of the drive motor (2) is arranged perpendicular to the surface of the fixed vertical plate (15); the output end of the drive motor (2) is connected to a transmission mechanism (3); a fixed rod (35) is connected below the transmission mechanism (3); a transmission rod (36) is arranged on one side of the fixed rod (35), and the transmission rod (36) is fixedly connected to the transmission mechanism (3); a limit plate (4) is coaxially arranged in the middle of the fixed rod (35); A telescopic member (5) is provided at one end of the transmission rod (36) away from the transmission mechanism (3); the end of the telescopic member (5) away from the transmission rod (36) is connected to a coating rod (6); and one end of the coating rod (6) is connected to a coating head (61); the driving motor (2) drives the transmission rod (36) to rotate periodically around the fixed rod (35) through the transmission mechanism (3); the fixed rod (35) drives the coating rod (6) to move in a circular motion within the limiting disk (4) through the telescopic member (5), so that the coating rod (6) closely fits the protective film to the surface of the chip.

2. The chip processing automatic film laminating packaging equipment according to claim 1, characterized in that: The transmission mechanism (3) comprises an inner toothed disc (31), a driving gear (32), a driven gear (33) and a moving member (34); the inner toothed disc (31) is arranged below a fixed vertical plate (15), and the inner toothed disc (31) is connected to the fixed vertical plate (15) via the moving member (34); the moving member (34) drives the inner toothed disc (31) to reciprocate on an output shaft of a driving motor (2); a driving gear (32) is arranged at a central position of the inner toothed disc (31), and the driving gear (32) is fixedly connected to an output end of the driving motor (2); a driven gear (33) is arranged on one side of the driving gear (32), and the driven gear (33) meshes with the driving gear (32); the driving gear (32) drives the driven gear (33) to rotate in the inner toothed disc (31).

3. The chip processing automatic film laminating packaging equipment according to claim 2, characterized in that: A plurality of outer rectangular tubes (312) are arranged in a circular array above the inner toothed disc (31), the outer rectangular tubes (312) are fixedly connected to the fixed vertical plate (15), the inner rectangular tubes (311) are slidably connected inside the outer rectangular tubes (312), the number of the inner rectangular tubes corresponds to the number of the outer rectangular tubes (312), and one end of the inner rectangular tube (311) is connected to one side of the inner toothed disc (31).

4. The chip processing automatic film laminating packaging equipment according to claim 3 is characterized in that: The moving member (34) comprises an electromagnet (341) and a return spring (342). The electromagnet (341) is provided in two groups, one group of the electromagnets (341) is provided below the fixed vertical plate (15), and the other group of the electromagnets (341) is provided above the inner gear disk (31). The electromagnets (341) are coaxially arranged with the output shaft of the drive motor (2), and the two groups of electromagnets (341) have opposite magnetic properties. A return spring (342) is provided inside the electromagnet (341), one end of the return spring (342) is connected to the fixed vertical plate (15), and the other end of the return spring (342) is connected to the inner gear disk (31).

5. The chip processing automatic film laminating packaging equipment according to claim 1, characterized in that: The limiting disk (4) is provided with a vortex limiting groove (41), the diameter of which is larger than the diameter of the chip; a plurality of rotating plates (42) are rotatably arranged on the limiting disk (4), and the rotating plates (42) correspond to each other in pairs; gaps are provided between the rotating plates (42), and the gaps are smaller than the diameter of the coating rod (6); the plurality of rotating plates (42) are located in a straight line, and when the rotating plates (42) swing, the coating rod (6) can move from the end of the vortex limiting groove (41) to the starting section of the vortex limiting groove (41).

6. The chip processing automatic film laminating packaging equipment according to claim 1, characterized in that: The telescopic member (5) comprises a rectangular tube (51), a movable groove (52) and a control spring (53); the rectangular tube (51) is fixedly arranged at one end of the transmission rod (36); a movable groove (52) is provided inside the rectangular tube (51); a control spring (53) is arranged inside the movable groove (52); one end of the control spring (53) is connected to the movable groove (52); and the other end of the control spring (53) is connected to the coating rod (6).

7. The chip processing automatic film laminating packaging equipment according to claim 6, characterized in that: A laminating head (61) is provided at one end of the laminating rod (6), a mounting groove (611) is provided in the laminating head (61), a cutting blade (614) is provided in the mounting groove (611), and a magnet (613) is provided on one side of the cutting blade (614), the magnet (613) is connected to the mounting groove (611) via a compression spring (612), and the connecting end of the compression spring (612) and the magnet (613) is slidably connected.

8. The chip processing automatic film laminating packaging equipment according to claim 1, characterized in that: The loading platform (13) is provided with a storage groove (131), and the diameter of the storage groove (131) is consistent with the diameter of the chip; a V-shaped groove (132) is provided on one side of the storage groove (131), and the V-shaped groove (132) and the storage groove (131) are coaxially arranged.

9. The chip processing automatic film laminating packaging equipment according to claim 8, characterized in that: The V-shaped groove (132) is provided with an identical magnet (613), and the magnet (613) is arranged on one side of the V-shaped groove (132). The laminating rod (6) drives the laminating head (61) to perform periodic circular motion, and the cutting blade (614) moves in contact with the V-shaped groove (132).

10. A chip processing and packaging method, the method adopts any one of the chip processing automatic film laminating and packaging equipment according to claims 1 to 9, characterized in that: The method comprises the following steps: S1: Selecting a suitable loading platform (13) according to the size of the chip, and fixing the loading platform (13) on the conveyor belt (12), driving the conveyor belt (12) to move by the rotation of the conveyor roller (11), and the conveyor belt (12) drives the loading platform (13) to move below the coating roller (14); S2: The coating roller (14) rotates so that the protective film covers the chip, and the electromagnet (341) is energized, so that the inner gear disc (31) moves toward the chip based on the principle that like poles repel each other; S3: The fixed rod (35) is attached to the surface of the chip, and the driving gear (32) is rotated to drive the driven gear (33) to rotate periodically in the inner gear disk (31), and the transmission rod (36) performs periodic circular motion around the fixed rod (35); S4: the transmission rod (36) rotates around the fixed rod (35), and the coating rod (6) moves in the vortex-shaped limiting groove (41) by utilizing the vortex-shaped limiting groove (41) provided on the limiting plate (4); S5: The coating rod (6) moves in the vortex-shaped limiting groove (41) to pull the compression spring (612); when the coating rod (6) moves to the outermost side of the vortex-shaped limiting groove (41), the elastic potential energy of the compression spring (612) is utilized to enable the coating rod (6) to push the rotating plate (42) to achieve reset.

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