Vacuum baking mechanism with buffering treatment and vacuum baking method thereof
By introducing buffer chamber and nitrogen jet protection technology into the vacuum baking mechanism, the problems of low vacuum baking efficiency and re-adhesion of water gas are solved, and the process yield and baking efficiency of the substrate are improved.
Patent Information
- Application Number
- CN202310845766.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-11
- Publication Date
- 2025-01-14
AI Technical Summary
The existing vacuum baking technology is inefficient and cannot effectively prevent moisture and gas from re-adhering to the substrate, affecting the yield of subsequent processes.
A vacuum baking mechanism with buffering treatment is designed, including a substrate transfer station, a first buffer cavity and a vacuum baking cavity. The first buffer cavity is used as a buffer zone to vacuum and cool to avoid vacuum baking. The cavity is in direct contact with the atmospheric environment, reducing the time of re-heating and cooling, and protecting the substrate through a nitrogen jet.
It improves vacuum baking efficiency, reduces the chance of the substrate being adsorbed by water gas during the waiting process, and improves the yield and quality of the process.
Smart Images
Figure CN119314917A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a vacuum baking mechanism, and more particularly to a vacuum baking mechanism with buffering treatment and a vacuum baking method thereof. Background Art
[0002] In today's semiconductor process equipment, semiconductor equipment will transport substrates between different chambers to perform different processes on the substrates, such as etching, coating, cleaning, cooling, etc. However, before the substrates wait to enter the chamber, the substrates may come into contact with the air in the atmospheric environment, causing moisture in the air to be adsorbed on the surface of the substrates, thereby affecting the yield of the subsequent processes of the substrates.
[0003] In order to solve the problem of moisture or residues forming on the substrate and affecting the yield of subsequent processes, the substrate is generally baked in a vacuum oven before being transported to the subsequent process machine. The vacuum baking method is to place multiple substrates into the vacuum oven, close the gate and evacuate the air in the vacuum oven, and then heat and bake to remove moisture or residues on the substrate. After baking is completed, the gate is opened and the substrate is taken out and transported to the subsequent process machine for process operation. However, there are several problems with this approach: First, it takes a long time to evacuate the vacuum oven to reach a vacuum state, and the vacuum must be broken when the substrate is taken out. Each batch of substrates in and out will repeat this cycle, which takes a long time and will greatly reduce the efficiency of the vacuum oven.
[0004] Second, each batch of substrates entering and exiting will require repeated heating and cooling procedures, which will also take a considerable amount of time and affect the efficiency of the vacuum oven.
[0005] Third, since the subsequent process will need to process the substrates one by one, the multiple substrates after vacuum baking may cause moisture to re-attach to the substrates while waiting for the subsequent process, thereby reducing the effect of vacuum baking.
[0006] From the above description, it can be seen that the vacuum oven in the prior art is not ideal in terms of efficiency and baking effect. Therefore, how to solve the above problems has become a major issue for the industry. Summary of the invention
[0007] The main purpose of the present application is to improve the low baking efficiency of the previous vacuum oven and the problem that the vacuum oven cannot solve the re-adhesion of water vapor.
[0008] The aforementioned purpose does not preclude the existence of other purposes. Any purpose that can be derived from the description, claims, or drawings by a person skilled in the art is also included in the purpose of this application. Therefore, the purpose of this application is not limited to the aforementioned purposes.
[0009] To achieve the above objectives, the present application provides a vacuum baking mechanism with buffering treatment, which is connected to a process mechanism to bake multiple substrates. The vacuum baking mechanism includes: a substrate transfer station, a first buffer chamber and a vacuum baking chamber. The substrate transfer station is adjacent to the process mechanism, and the substrate transfer station includes a transfer transmission module, which is used to pick up and place these substrates; the first buffer chamber is adjacent to the substrate transfer station, and the first buffer chamber includes a first buffer gate, a plurality of first transmission modules stacked in a vertical direction, and a first baking inlet and outlet, the first buffer gate is adjacent to the substrate transfer station, and these substrates enter and exit the first buffer chamber through the first buffer gate, and these first transmission modules are arranged between the first buffer gate and the first baking inlet and outlet, and are used to receive or output each substrate in and out of the first buffer gate or the first baking inlet and outlet, and the first vacuum module performs vacuuming when the first buffer gate is closed; the vacuum baking chamber is connected to the first buffer chamber, and the vacuum baking chamber includes a first baking gate connected to the first baking inlet and outlet and a baking module, the first baking gate controls the connection between the vacuum baking chamber and the first buffer chamber, and the baking module performs vacuum baking on these substrates.
[0010] In a preferred embodiment of the present application, the substrate transfer station further includes a vertical lifting module connected to the transfer transmission module, and the vertical lifting module controls the transfer transmission module to move vertically in the substrate transfer station.
[0011] In a preferred embodiment of the present application, there are multiple first buffer gates, and there are multiple first buffer gates, and these first buffer gates are respectively arranged corresponding to the positions of these first transmission modules.
[0012] In a preferred embodiment of the present application, the first buffer cavity further includes a first cooling module for cooling the substrates.
[0013] In a preferred embodiment of the present application, the first buffer chamber includes a first nitrogen module, which is disposed between the first buffer gate and the first baking inlet and outlet for spraying gas to the substrates.
[0014] In a preferred embodiment of the present application, it also includes a second buffer chamber adjacent to the substrate transfer station and connected to the vacuum baking chamber. The second buffer chamber includes a second buffer gate, a plurality of second transmission modules stacked in a vertical direction, a second baking inlet and outlet, and a third vacuum module. The second buffer gate is adjacent to the substrate transfer station. The substrates enter and exit the second buffer chamber through the second buffer gate. The second transmission modules are arranged corresponding to the entry and exit positions of the substrates to receive or output each substrate in and out of the second buffer gate or the second baking inlet and outlet, and the third vacuum module performs vacuuming when the second buffer gate is closed.
[0015] In a preferred embodiment of the present application, the substrate transfer station, the first buffer chamber, the second buffer chamber and the vacuum baking chamber are square, the first buffer chamber and the second buffer chamber are respectively arranged on two adjacent sides of the substrate transfer station, and the first buffer chamber and the second buffer chamber are also respectively connected to two adjacent sides of the vacuum baking chamber, so that the substrate transfer station, the first buffer chamber, the second buffer chamber and the vacuum baking chamber are combined in a field shape.
[0016] In a preferred embodiment of the present application, the vacuum baking chamber further includes a second baking gate connected to the second baking inlet and outlet, and the second baking gate controls the communication between the vacuum baking chamber and the second buffer chamber.
[0017] In a preferred embodiment of the present application, the second buffer chamber further includes a second cooling module for cooling the substrates.
[0018] In a preferred embodiment of the present application, there are multiple second buffer gates, and these second buffer gates are arranged corresponding to the positions of these second transmission modules.
[0019] In a preferred embodiment of the present application, the second buffer chamber includes a second nitrogen module, which is disposed between the second buffer gate and the second baking inlet and outlet for spraying gas to the substrates.
[0020] In another embodiment of the present application, the present application provides a vacuum baking method with buffering treatment, which is used to bake multiple substrates. The vacuum baking method includes the following steps: step S1, step S2, and step S3. In step S1: the first buffer gate is opened, and the input substrates are placed into the first buffer cavity by using the transfer transmission module, so as to place the substrates respectively on the first transmission modules, and when the first buffer gate is closed, the first vacuum pumping module vacuumizes the first buffer cavity; in step S2: the first baking gate is opened, and the substrates are placed into the baking module by using the first transmission modules, and the first baking gate is closed to vacuum bake the substrates; in step S3: the first baking gate is opened again, and the substrates that have been baked are taken out of the vacuum baking cavity by the first transmission modules and placed in the first buffer cavity.
[0021] In a preferred embodiment of the present application, after step S3, a step S4 is further included: opening the first buffer gate to output one or all of the substrates, and spraying the substrates through a first nitrogen module disposed in the first buffer chamber.
[0022] In a preferred embodiment of the present application, a step P1 is also included after step S1: a second buffer gate adjacent to the substrate transfer station is opened, and another batch of these substrates are continuously input into a second buffer cavity adjacent to the substrate transfer station and connected to the vacuum baking cavity by using a transfer transmission module, so as to place these substrates respectively on a plurality of second transmission modules stacked at intervals in a vertical direction; when the second buffer gate is closed, a third vacuum module vacuums the second buffer cavity.
[0023] In a preferred embodiment of the present application, a step P2 is also included after step S3: a second baking gate that controls the vacuum baking chamber to be connected to the second buffer chamber is opened, and the substrates are placed in the baking module through the second transmission modules, and the second baking gate is closed to vacuum bake the substrates.
[0024] In a preferred embodiment of the present application, a step P3 is also included after step P2: the first buffer gate is opened, and another batch of these substrates are continuously input to these first transfer modules using the transfer transmission module, and the second baking gate is opened again, and the substrates that have been baked are taken out from the vacuum baking chamber through these second transfer modules and placed in the second buffer chamber.
[0025] In a preferred embodiment of the present application, a step P4 is further included after step P3: opening the second buffer gate to output one or all of the substrates, and spraying the baked substrates through a second nitrogen module disposed in the second buffer chamber.
[0026] Based on the above technical features, this application includes the following features: 1. The first buffer chamber is used as a buffer for the vacuum baking chamber to avoid direct contact between the vacuum baking chamber and the atmospheric environment, which would cause the vacuum baking chamber to need to be re-evacuated before baking the next batch of substrates. This greatly reduces the preparation time required for vacuum baking in the vacuum baking chamber and improves baking efficiency.
[0027] Second, the first buffer chamber can be used as a cooling waiting area for these substrates after baking, so as to avoid a large temperature drop in the vacuum baking chamber and the need to reheat the temperature when baking the next batch of substrates, thereby reducing the preparation time required for the vacuum baking chamber temperature rise and fall operations.
[0028] 3. The first buffer chamber is provided to avoid the substrates being directly exposed to the atmosphere and waiting for subsequent processes after being taken out of the vacuum baking chamber. This can reduce the waiting time for the substrates to be exposed to the atmosphere, thereby reducing the situation where the substrates are re-adsorbed by water vapor, thereby improving the yield and quality of the process. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 It is a schematic top view of the first embodiment of the present application; Figure 2 It is a right side cross-sectional schematic diagram of the first embodiment of the present application; Figure 3 It is a top view schematic diagram of the second embodiment of the present application; Figure 4 It is a schematic cross-sectional view of the right side of the substrate transfer station and the second buffer chamber of the second embodiment of the present application; Figure 5 It is a schematic cross-sectional diagram of the rear side of the second buffer chamber and the vacuum baking chamber of the second embodiment of the present application; Figure 6 This is a schematic diagram of the steps of a vacuum baking method according to an embodiment of the present application; Figure 7 This is a schematic diagram of the steps of a vacuum baking method according to another embodiment of the present application.
[0030] Description of Reference Numerals 100A, 100B: Vacuum baking mechanism 1: Process mechanism 2: Substrate 3: Loading station 4: Process chamber 5: Conveying mechanism 6: Loading station 10: Substrate transfer station 11:Transfer module 12:Vertical lifting module 20: First buffer chamber 21: First buffer gate 22: First transmission module 23: First baking inlet and outlet 24: First vacuum module 25: First cooling module 26: First nitrogen module 30: Vacuum baking chamber 31: First baking gate 32: Baking module 33: Second vacuum module 34: Second baking gate 40: Second buffer chamber 41: Second buffer gate 42: Second transmission module 43: Second baking inlet and outlet 44: the third vacuum module 45: the second cooling module 46: Second nitrogen module 200: Vacuum baking method S1: Step S2: Step S3: Step S4: Step P1: Step P2: Step P3: Step P4: Step. DETAILED DESCRIPTION
[0031] In order to facilitate the description of the central idea of the present application in the above invention content column, it is now expressed in specific embodiments. Various objects in the embodiments are described according to the proportions, sizes, deformations or displacements suitable for the description, rather than being drawn according to the proportions of the actual elements.
[0032] The following describes in detail exemplary embodiments of the present application with reference to the accompanying drawings, and is not intended to limit the technical principles of the present application to the specific disclosed embodiments. Rather, the scope of the present application is limited only by the claims, covering alternatives, modifications, and equivalents.
[0033] See also Figure 1 to Figure 2 As shown, in this embodiment, the present application provides a vacuum baking mechanism 100A with buffering treatment, which is connected to a process mechanism 1 to bake multiple substrates 2. The vacuum baking mechanism 100A includes: a substrate transfer station 10, a first buffer chamber 20 and a vacuum baking chamber 30. The aforementioned process mechanism 1 is used for coating, etching, and cleaning, and is connected with multiple interconnected mechanisms, chambers or stations. The process mechanism 1 is a continuous process equipment in this embodiment, which may include a loading station 3, multiple process chambers 4 combined in series, and a loading station 6. These substrates 2 can complete the coating, etching, and cleaning processes at the aforementioned stations or chambers, but the present application is not necessarily limited to connecting continuous process equipment. In the embodiment of the present application, the substrate 2 can be a wafer, a chip, a circuit carrier (for example: PCB) and other objects.
[0034] In the embodiment of the vacuum baking mechanism 100A, the substrate transfer station 10 is adjacent to the process mechanism 1. The so-called adjacent here means that the substrate transfer station 10 is closer to the process mechanism 1 than other modules of the present application and actually performs pick-and-place operations with the process mechanism 1, and does not refer to a physically closer relationship. The substrate transfer station 10 includes a transfer transmission module 11 and a vertical lifting module 12. The transfer transmission module 11 is connected to the vertical lifting module 12. The transfer transmission module 11 is located between the process mechanism 1 and the first buffer chamber 20 to take out or put in these substrates 2. The vertical lifting module 12 controls the transfer transmission module 11 to move vertically in the substrate transfer station 10 to distribute these substrates 2 to the first buffer chamber 20.
[0035] In one embodiment of the present application, the transfer module 11 includes a plurality of transfer rollers that transfer on both sides of the substrates 2 to transfer the substrates 2. In one embodiment of the present application, the power source of the vertical lifting module 12 can be a servo motor, a stepper motor, a pneumatic cylinder, a hydraulic cylinder, etc., but the present application is not limited thereto. In another embodiment of the present application, the transfer module 11 can also use a robotic arm (e.g., a six-axis robotic arm) to take out or put in the substrates 2 between the process mechanism 1 and the first buffer chamber 20.
[0036] The first buffer chamber 20 is adjacent to the substrate transfer station 10, that is, the substrate transfer station 10 is located between the process mechanism 1 and the first buffer chamber 20, and the first buffer chamber 20 can receive the substrates 2 from the substrate transfer station 10. The first buffer chamber 20 includes a first buffer gate 21, a plurality of first transfer modules 22 stacked at intervals in a vertical direction, a first baking inlet and outlet 23, and a first vacuum module 24.
[0037] Furthermore, the first buffer gate 21 is adjacent to the substrate transfer station 10, and the connection between the substrate transfer station 10 and the first buffer chamber 20 is controlled by the first buffer gate 21, and the substrates 2 can enter and exit the first buffer chamber 20 through the first buffer gate 21. In the embodiment of the present application, the first buffer gate 21 is opened and closed by pivoting, so that the substrates 2 can enter and exit the first buffer chamber 20. In addition, the first buffer gate 21 can also be opened by sliding to both sides or moving up and down, so that the substrates 2 can pass through the first buffer gate 21, so the present invention is not limited to the first buffer gate 21 opened and closed by pivoting.
[0038] The first baking inlet and outlet 23 is adjacent to the vacuum baking chamber 30, and these first transmission modules 22 are arranged between the first buffer gate 21 and the first baking inlet and outlet 23 to receive or output each substrate 2 in and out of the first buffer gate 21 or the first baking inlet and outlet 23. That is, these substrates 2 can move between the substrate transfer station 10, the first buffer chamber 20 and the vacuum baking chamber 30. In one embodiment of the present application, these first transmission modules 22 include a plurality of transmission rollers to transmit these substrates 2, but the present application is not limited thereto. When these substrates 2 are in the first buffer chamber 20, the first buffer gate 21 is closed and the first vacuum module 24 is used to evacuate the first buffer chamber 20 to make the first buffer chamber 20 in a vacuum state to prevent these substrates 2 from contacting the air. In a preferred embodiment of the present application, the pressure value in the first buffer chamber 20 can be 1x10 -1 Torr to 1x10 -3 Between the support.
[0039] In one embodiment of the present application, there can be multiple first buffer gates 21, and these first buffer gates 21 are respectively arranged corresponding to the positions of these first transmission modules 22 to respectively input and output these substrates 2. The advantage of this is that the first buffer chamber 20 can independently open and close these first buffer gates 21 to take and put one of these substrates 2. When one of the first buffer gates 21 is opened, too much air will not enter the first buffer chamber 20, so that the first buffer chamber 20 can be more easily maintained in an isolated state, thereby reducing the contact between these substrates 2 and the external air.
[0040] The vacuum baking chamber 30 is connected to the first buffer chamber 20 to receive the substrates 2 from the first buffer chamber 20 or output the substrates 2 to the first buffer chamber 20. The vacuum baking chamber 30 includes a first baking gate 31 connected to the first baking inlet and outlet 23, a baking module 32 and a second vacuum pumping module 33. The first baking gate 31 controls the connection between the vacuum baking chamber 30 and the first buffer chamber 20, so that the first transmission modules 22 can transmit the substrates 2 to the vacuum baking chamber 30, so that the baking module 32 can bake the substrates 2. In one embodiment of the present application, there are multiple baking modules 32, which are respectively arranged at intervals and overlapped positions corresponding to the first transmission modules 22, and can independently bake a single substrate 2. Further, the substrates 2 can be baked by heat radiation.
[0041] In one embodiment of the present application, the vacuum baking chamber 30 further includes a second vacuum pumping module 33, which is used to evacuate the vacuum baking chamber 30, so that the vacuum baking chamber 30 is in a vacuum state and the substrates 2 are vacuum baked. In a preferred embodiment of the present application, the pressure value in the vacuum baking chamber 30 can be between 1x10 -2 Torr to 1x10 -8 The vacuum baking chamber 30 must have a vacuum degree greater than that of the first buffer chamber 20 .
[0042] In an actual working situation, the substrate transfer station 10 sequentially inputs the substrates 2 into the first buffer chamber 20, closes the first buffer gate 21, and performs low-degree vacuuming of the first buffer chamber 20 by the first vacuuming module 24. Next, the first baking gate 31 is opened, and the first transfer module 22 inputs all the substrates 2 into the vacuum baking chamber 30 at once, and then the first baking gate 31 is closed, and the second vacuuming module 33 performs vacuuming and the baking module 32 performs baking, thereby achieving the purpose of vacuum baking these substrates 2. It should be noted that since the vacuum baking chamber 30 itself is already in a vacuum state, although the opening of the first baking gate 31 will make the vacuum baking chamber 30 communicate with the first buffer chamber 20, thereby reducing the vacuum degree of the vacuum baking chamber 30. However, after all the substrates 2 are input into the vacuum baking chamber 30 and the first baking gate 31 is closed, the vacuum degree of the vacuum baking chamber 30 can be raised to a higher vacuum degree by only performing the vacuum pumping operation through the second vacuum pumping module 33. After all the substrates 2 are vacuum baked, the first baking gate 31 can be opened, and the first transmission module 22 receives all the substrates 2 in the vacuum baking chamber 30 at once, that is, the first buffer chamber 20 completes the reception of the substrates 2. Finally, the substrates 2 are placed one by one from the first buffer chamber 20 to the substrate transfer station 10 for the substrate transfer station 10 to perform the subsequent operation of outputting the substrates 2.
[0043] In one embodiment of the present application, the first buffer chamber 20 may further include a first cooling module 25, which is disposed on a side of the first transmission module 22 adjacent to the substrate 2 to cool the substrates 2 that have completed baking, thereby shortening the cooling buffer time of the substrates 2. In the embodiment of the present application, the first cooling module 25 may adopt contact cooling or non-contact cooling, such as air cooling, wind cooling, water cooling, and cooling plate cooling.
[0044] In one embodiment of the present application, the first buffer chamber 20 may include a first nitrogen module 26, which may be disposed between the first buffer gate 21 and the first baking inlet and outlet 23 to spray air to the substrates 2. For example, when the substrates 2 are to be output from the first buffer gate 21, the first nitrogen module 26 may spray air to the substrates 2 with low-temperature nitrogen to form a protective film on the surface of the substrates 2, delaying or reducing the time or probability of the substrates 2 being reattached by water vapor in the atmosphere after leaving the first buffer chamber 20. In addition, the first nitrogen module 26 may also cool the substrates 2 that have been baked to shorten the cooling time of the substrates 2.
[0045] See also Figures 3 to 5 As shown, in the embodiment of the vacuum baking mechanism 100B, the difference from the embodiment of the vacuum baking mechanism 100A is that the vacuum baking mechanism 100B further includes a second buffer chamber 40. The vacuum baking mechanism 100B can be connected to a conveying mechanism 5, which is adjacent to the loading stations 3 of the two process mechanisms 1 in this embodiment and is located between the two loading stations 3. The conveying mechanism 5 transfers the substrate 2 between the two loading stations 3 and the vacuum baking mechanism 100B. In this embodiment, the substrate transfer station 10, the first buffer chamber 20, the second buffer chamber 40 and the vacuum baking chamber 30 are square, the first buffer chamber 20 and the second buffer chamber 40 are respectively arranged on the two adjacent sides of the substrate transfer station 10, and the first buffer chamber 20 and the second buffer chamber 40 are also respectively connected to the two adjacent sides of the vacuum baking chamber 30, so that the substrate transfer station 10, the first buffer chamber 20, the second buffer chamber 40 and the vacuum baking chamber 30 are combined in a field shape. Thus, when the first buffer chamber 20 or the second buffer chamber 40 is taking or placing the substrates 2, the other buffer chamber can perform cooling buffering or baking of the substrates 2. Alternatively, when one buffer chamber is waiting to take out the substrates 2 being baked, the other buffer chamber can import the substrates 2 from the substrate transfer station 10. The two buffer chambers import and export the substrates 2 at different time points to reduce the idle time of the vacuum baking chamber 30 and improve the overall operation efficiency.
[0046] In an embodiment of the present application, please refer to Figure 4 and Figure 5 As shown, Figure 4 and Figure 5 The second buffer chamber 40 is adjacent to the substrate transfer station 10 (such as Figure 4 ), and the second buffer chamber 40 is connected to the vacuum baking chamber 30 (as shown Figure 5 As shown in FIG. 1 , the second buffer chamber 40 can receive the substrates 2 from the substrate transfer station 10. The second buffer chamber 40 includes a second buffer gate 41, a plurality of second transmission modules 42 stacked in a vertical direction, a second baking inlet and outlet 43, and a third vacuum module 44.
[0047] The second buffer gate 41 is adjacent to the substrate transfer station 10, and the connection between the substrate transfer station 10 and the second buffer chamber 40 is controlled by the second buffer gate 41, and the substrates 2 enter and exit the second buffer chamber 40 through the second buffer gate 41. The second transmission modules 42 are arranged corresponding to the entry and exit positions of the substrates 2, and are used to receive or output each substrate 2 in and out of the second buffer gate 41 or the second baking inlet and outlet 43. In one embodiment of the present application, the second transmission modules 42 include a plurality of transmission rollers to transmit the substrates 2, but the present application is not limited thereto. The second buffer gate 41, the second transmission module 42, the second baking inlet and outlet 43, and the third vacuum module 44 have the same functions as the first buffer gate 21, the first transmission module 22, the first baking inlet and outlet 23, and the first vacuum module 24.
[0048] In one embodiment of the present application, the vacuum baking chamber 30 also includes a second baking gate 34 connected to the second baking inlet and outlet 43. The second baking gate 34 controls the connection between the vacuum baking chamber 30 and the second buffer chamber 40, so that the second transmission modules 42 can transfer the substrates 2 to the vacuum baking chamber 30, so that the baking modules 32 can perform vacuum baking on the substrates 2.
[0049] In one embodiment of the present application, the second buffer chamber 40 further includes a second cooling module 45, which is disposed on a side of the second transfer module 42 adjacent to the substrate 2 to cool the baked substrates 2. In the embodiment of the present application, the second cooling module 45 can adopt contact cooling or non-contact cooling, such as air cooling, wind cooling, water cooling, and cooling plate cooling.
[0050] In one embodiment of the present application, there are multiple second buffer gates 41, which are arranged corresponding to the positions of the second transmission modules 42 to input or output the substrates 2 separately or in full. The implementation and effect of the second buffer gate 41 are the same as those of the first buffer gate 21, and will not be described again.
[0051] In one embodiment of the present application, the second buffer chamber 40 includes a second nitrogen module 46, which is disposed between the second buffer gate 41 and the second baking inlet and outlet 43 to spray air to the substrates 2. The implementation and effect of the second nitrogen module 46 are the same as those of the first nitrogen module 26, and will not be described in detail.
[0052] See also Figure 6 As shown, in another embodiment of the present application, the present application provides a vacuum baking method 200 with buffering treatment, which is used to bake a plurality of substrates 2. The vacuum baking method 200 includes the following steps: In step S1: the first buffer gate 21 is opened, and the input substrates 2 are placed into the first buffer chamber 20 by using the transfer module 11, so as to place the substrates 2 on the first transfer modules 22 respectively. When the first buffer gate 21 is closed, the first vacuum module 24 vacuumizes the first buffer chamber 20. In step S2: the first baking gate 31 is opened, and the substrates 2 are placed in the baking module 32 by using the first transfer modules 22, and the first baking gate 31 is closed to vacuum bake the substrates 2. In step S3: the first baking gate 31 is opened again, and the substrates 2 are taken out of the vacuum baking chamber 30 by the first transfer modules 22 and placed in the first buffer chamber 20.
[0053] In one embodiment of the present application, a step S4 is further included after step S3. In step S4, the first buffer gate 21 is opened to output one or all of the substrates 2, and the first nitrogen module 26 disposed in the first buffer chamber 20 is used to spray the substrates 2 that have completed baking. After step S4, the first buffer chamber 20 continues to cycle through the operations of step S1, step S2, step S3, and step S4. The advantage of this embodiment is that the first nitrogen module 26 can form a protective film on the surface of the substrates 2 to delay or reduce the time or probability of the substrate 2 being reattached by water vapor in the atmosphere.
[0054] Please refer to Figure 7 As shown, Figure 7 Schematic diagram of the relationship between the vacuum baking method 200 and time. In another embodiment of the present application, a step P1 is included after step S1. In step P1, the second buffer gate 41 is opened, and the transfer transmission module 11 is used to continue to input another batch of these substrates 2 into the second buffer chamber 40, so as to place these substrates 2 respectively on these second transmission modules 42. When the second buffer gate 41 is closed, the third vacuum module 44 vacuumizes the second buffer chamber 40. The present application does not limit steps P1, S2, and S3 to Figure 7The order relationship shown is before, after, or between the two, that is, step P1 can be before or after step S2 and step S3; step P1 can also be between step S2 and step S3, etc. For example, in an actual working situation, after the substrate 2 is placed in the first buffer chamber 20, when the first buffer chamber 20 is vacuumed, another batch of substrates 2 can be placed from the substrate transfer station 10 into the second buffer chamber 40, thereby improving the overall operating efficiency.
[0055] In one embodiment of the present application, a step P2 is further included after step S3 . In step P2 , the second baking gate 34 is opened, the substrates 2 are placed in the baking module 32 through the second transfer modules 42 , and the second baking gate 34 is closed to perform vacuum baking on the substrates 2 .
[0056] In one embodiment of the present application, a step P3 is further included after step P2. In step P3, the first buffer gate 31 is opened, and the transfer transmission module 11 is used to continue to input another batch of these substrates 2 to these first transmission modules 22, and the second baking gate 34 is opened again, and the substrates 2 that have been baked are taken out from the vacuum baking chamber 30 through the second transmission modules 42 and placed in the second buffer chamber 40. However, the present application is not limited to steps P2, P3, and S4. Figure 7 The order relationship shown is before, after, or between the two, that is, step S4 can be before or after step P2 and step P3; step S4 can also be between step P2 and step P3, etc. For example, in an actual working situation, if the baked substrates 2 are placed in the first buffer chamber 20, and the first buffer chamber 20 places these substrates 2 one by one in the substrate transfer station 10, the substrates 2 in the second buffer chamber 40 can be placed in the idle baking module 32. The first buffer chamber 20 and the second buffer chamber 40 are used to perform operations on different batches of substrates 2 at different time points to improve the overall operation efficiency.
[0057] In one embodiment of the present application, a step P4 is further included after step P3. In step P4, the second buffer gate 41 is opened to output one or all of the substrates 2, and a second nitrogen module 46 is used to spray the baked substrates 2. The present application does not limit step S1 to be performed in steps P2, P3, and P4. Figure 7 The front and back order relationship shown in the figure can be adjusted according to the actual working situation. Figure 7 As shown, the time relationship between steps S1 to S4 and steps P1 to P4 is only represented by the time axis, and there is no situation where step S2 must be executed after step P1 is executed, or step S4 must be executed after step P2 is executed.
[0058] In summary, this application includes the following technical features: 1. The first buffer chamber 20 is used as a buffer for the vacuum baking chamber 30 to avoid direct contact between the vacuum baking chamber 30 and the atmosphere. Before the vacuum baking chamber 30 bakes the next batch of substrates 2, the time for re-evacuating the vacuum baking chamber 30 can be reduced to improve the baking efficiency.
[0059] 2. The first buffer chamber 20 can be used as a cooling waiting area for the substrates 2 after baking, so as to avoid a significant cooling of the vacuum baking chamber 30. When the next batch of substrates 2 needs to be baked, the vacuum baking chamber 30 will heat up again to reduce the preparation time required for the vacuum baking chamber heating and cooling operations.
[0060] 3. By providing a plurality of first buffer gates 21, the first buffer chamber 20 can open and close the first buffer gates 21 respectively, so that when the first buffer gates 21 are opened, too much air will not enter the first buffer chamber 20, making it easier for the first buffer chamber 20 to maintain an isolated state. This reduces the chances of the substrates 2 coming into contact with air, and further improves the process yield of the substrates 2.
[0061] 4. By disposing the second buffer chamber 40 , in cooperation with the first buffer chamber 20 and the second buffer chamber 40 , the first buffer chamber 20 and the second buffer chamber 40 can input the substrates 2 for vacuum baking at different time points, thereby improving the overall operating efficiency.
[0062] The aforementioned effects do not prevent the existence of other effects. If a person skilled in the art can derive effects from the description, claims, or drawings, the effects are also included in the effects of the present application. Therefore, the effects of the present application are not limited to the aforementioned effects.
[0063] The above embodiments are only used to illustrate the present application, and are not used to limit the scope of the present application. All modifications or changes made according to the spirit of the present application are within the scope of protection intended by the present application.
Claims
1. A vacuum baking mechanism with buffering treatment, which is connected to a process mechanism to bake multiple substrates, characterized in that: The vacuum baking mechanism comprises: A substrate transfer station adjacent to the process mechanism includes a transfer module for picking up and placing the substrates; a first buffer chamber adjacent to the substrate transfer station, comprising a first buffer gate, a plurality of first transmission modules stacked in a vertical direction, a first baking inlet and outlet, and a first vacuum module, the first buffer gate being adjacent to the substrate transfer station, the substrates passing through the first buffer gate to enter and exit the first buffer chamber, the first transmission modules being disposed between the first buffer gate and the first baking inlet and outlet to receive or output each substrate to enter and exit the first buffer gate or the first baking inlet and outlet, and the first vacuum module performing vacuuming when the first buffer gate is closed; and A vacuum baking chamber connected to the first buffer chamber comprises a first baking gate connected to the first baking inlet and outlet and a baking module. The first baking gate controls the connection between the vacuum baking chamber and the first buffer chamber. The baking module performs vacuum baking on the substrates.
2. The vacuum baking mechanism with buffering treatment according to claim 1, characterized in that: The substrate transfer station also includes a vertical lifting module connected to the transfer transmission module, and the vertical lifting module controls the transfer transmission module to move vertically in the substrate transfer station.
3. The vacuum baking mechanism with buffering treatment according to claim 1, characterized in that: There are a plurality of first buffer gates, and the first buffer gates are respectively arranged corresponding to the positions of the first transmission modules.
4. The vacuum baking mechanism with buffering treatment according to claim 1, characterized in that: The first buffer cavity also includes a first cooling module for cooling the substrates.
5. The vacuum baking mechanism with buffering treatment according to claim 1, characterized in that: The first buffer chamber includes a first nitrogen module, which is disposed between the first buffer gate and the first baking inlet and outlet and is used for spraying air to the substrates.
6. The vacuum baking mechanism with buffering treatment according to claim 1, characterized in that: It also includes a second buffer chamber adjacent to the substrate transfer station and connected to the vacuum baking chamber, the second buffer chamber includes a second buffer gate, a plurality of second transmission modules stacked in a vertical direction, a second baking inlet and outlet, and a third vacuum pumping module. The second buffer gate is adjacent to the substrate transfer station, and the substrates enter and exit the second buffer chamber through the second buffer gate. The second transmission modules are arranged corresponding to the entry and exit positions of the substrates to receive or output each substrate in and out of the second buffer gate or the second baking inlet and outlet, and the third vacuum pumping module performs vacuum pumping when the second buffer gate is closed.
7. The vacuum baking mechanism with buffering treatment according to claim 6, characterized in that: The substrate transfer station, the first buffer cavity, the second buffer cavity and the vacuum baking cavity are square in shape. The first buffer cavity and the second buffer cavity are respectively arranged on two adjacent side surfaces of the substrate transfer station, and the first buffer cavity and the second buffer cavity are also respectively connected to two adjacent side surfaces of the vacuum baking cavity, so that the substrate transfer station, the first buffer cavity, the second buffer cavity and the vacuum baking cavity are combined in a field shape.
8. The vacuum baking mechanism with buffering treatment according to claim 6, characterized in that: The vacuum baking cavity further includes a second baking gate connected to the second baking inlet and outlet, and the second baking gate controls the communication between the vacuum baking cavity and the second buffer cavity.
9. The vacuum baking mechanism with buffering treatment according to claim 6, characterized in that: The second buffer cavity also includes a second cooling module for cooling the substrates.
10. The vacuum baking mechanism with buffering treatment according to claim 6, characterized in that: There are a plurality of the second buffer gates, and the second buffer gates are arranged corresponding to the positions of the second transmission modules.
11. The vacuum baking mechanism with buffering treatment according to claim 6, characterized in that: The second buffer chamber includes a second nitrogen module, which is disposed between the second buffer gate and the second baking inlet and outlet for spraying air to the substrates.
12. A vacuum baking method with buffering treatment, implemented based on the vacuum baking mechanism with buffering treatment according to claim 1, for baking these substrates, characterized in that: The vacuum baking method comprises the following steps: Step S1: the first buffer gate is opened, and the input substrates are placed into the first buffer cavity by using the transfer transmission module, so as to place the substrates on the first transmission modules respectively. When the first buffer gate is closed, the first vacuum module vacuumizes the first buffer cavity; Step S2: the first baking gate is opened, the substrates are placed in the baking module by using the first transfer modules, and the first baking gate is closed to perform vacuum baking on the substrates; and Step S3: the first baking gate is opened again, and the baked substrates are taken out from the vacuum baking chamber through the first transfer modules and placed in the first buffer chamber.
13. A vacuum baking method with buffering treatment according to claim 12, characterized in that: After step S3, a step S4 is further included: opening the first buffer gate to output one or all of the substrates, and spraying the substrates through a first nitrogen module disposed in the first buffer chamber.
14. The vacuum baking method with buffering treatment according to claim 12, characterized in that: After step S1, a step P1 is also included: a second buffer gate adjacent to the substrate transfer station is opened, and another batch of these substrates are continuously input into a second buffer chamber adjacent to the substrate transfer station and connected to the vacuum baking chamber by using the transfer transmission module, so as to place these substrates respectively on a plurality of second transmission modules stacked at intervals in a vertical direction; when the second buffer gate is closed, a third vacuum pumping module vacuums the second buffer chamber.
15. A vacuum baking method with buffering treatment according to claim 14, characterized in that: After step S3, a step P2 is also included: a second baking gate that controls the vacuum baking chamber to communicate with the second buffer chamber is opened, the substrates are placed in the baking module through the second transmission modules, and the second baking gate is closed to vacuum bake the substrates.
16. A vacuum baking method with buffering treatment according to claim 15, characterized in that: After step P2, a step P3 is also included: the first buffer gate is opened, and another batch of these substrates are continuously input to these first transmission modules by using the transfer transmission module, and the second baking gate is opened again, and the substrates that have been baked are taken out from the vacuum baking chamber through these second transmission modules and placed in the second buffer chamber.
17. A vacuum baking method with buffering treatment according to claim 16, characterized in that: After step P3, a step P4 is further included: opening the second buffer gate to output one or all of the substrates, and spraying the baked substrates through a second nitrogen module disposed in the second buffer chamber.