Pressing device for wafer adsorption

Abstract

The invention relates to a pressing device for wafer adsorption. The pressing device comprises side protection plates distributed in the left-right direction, a rear side fixing plate installed on the side protection plates and distributed in the vertical direction, and a wafer pressing execution mechanism. The wafer pressing execution mechanism sequentially comprises an upper connecting plate, a middle connecting plate, a lower connecting plate and a pressing disc from top to bottom, the driving end of the lead screw motor is connected with the middle of the upper connecting plate below, and the lower connecting plate is connected with the pressing disc below. According to the invention, the wafer can be compressed when the wafer carrying table adsorbs the wafer, so that the wafer is tightly attached to the processing carrying table, and the wafer is ensured to be flat as much as possible.

Description

Technical Field

[0001] The present invention relates to the technical field related to wafer processing, and in particular to a pressing device for wafer adsorption. Background Art

[0002] During the wafer cutting process, due to the large warping deformation of the wafer, it is difficult for the wafer adsorption stage to adsorb the wafer. Since it cannot be adsorbed, the wafer shakes after the stage rotates, making it impossible to perform subsequent cutting processing. On the other hand, the deformation of the wafer is irregular, and it needs to be evenly pressed to prevent the wafer from cracking.

[0003] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a wafer adsorption clamping device to make it more valuable for industrial use. Summary of the invention

[0004] In order to solve any of the above technical problems, the purpose of the present invention is to provide a clamping device for wafer adsorption.

[0005] To achieve the above object, the present invention adopts the following technical solution:

[0006] A wafer adsorption clamping device comprises side guard plates distributed along the left and right directions, a rear fixing plate installed on the side guard plates and distributed along the vertical direction, and a wafer pressing actuator;

[0007] The cylinder installed on the rear fixing plate drives the motor fixing plate below to move in the vertical direction. A lead screw motor is installed at the bottom of the motor fixing plate. The lead screw motor drives the wafer pressing actuator below to move in the vertical direction.

[0008] The wafer pressing actuator includes an upper connecting plate, a middle connecting plate, a lower connecting plate and a clamping plate from top to bottom, the driving end of the lead screw motor is connected to the middle of the upper connecting plate below, and the lower connecting plate is connected to the clamping plate below;

[0009] The upper connecting plate and the middle connecting plate are connected together through a plurality of pins and fastening rings. The pins pass through the fastening ring and the upper connecting plate from top to bottom in sequence and are then locked on the middle connecting plate by screws.

[0010] The middle connecting plate and the lower connecting plate are connected together through a plurality of pin shafts 2 and a fastening ring. The pin shafts 2 pass through the fastening ring and the middle connecting plate from top to bottom and then are embedded in the lower connecting plate below.

[0011] A spring is installed on the pin shaft 2 between the middle connecting plate and the lower connecting plate, and a plurality of spring sheets are installed between the upper connecting plate and the lower connecting plate.

[0012] As a further improvement of the present invention, an air blowing fixing plate is installed at the front end of the side guard plate, and an air blowing mechanism distributed along the left-right direction is installed at the bottom of the air blowing fixing plate.

[0013] As a further improvement of the present invention, the air blowing mechanism is inclined toward one side of the wafer pressing actuator below.

[0014] As a further improvement of the present invention, a fine-tuning mechanism is arranged between the rear fixed plate and the cylinder, the fine-tuning mechanism includes a left fixed plate, a right fixed plate and a connecting plate, the right side of the connecting plate is installed on the rear fixed plate, the left side of the connecting plate is sequentially installed from left to right with a left fixed plate, an adjusting fixed plate is installed on the connecting plate between the left fixed plate and the right fixed plate, an adjusting movable plate is installed on the connecting plate above the adjusting fixed plate, and an adjusting bolt installed on the adjusting fixed plate along the vertical direction is connected to the adjusting movable plate above.

[0015] As a further improvement of the present invention, nut one and nut two are installed in sequence from top to bottom on pin shaft one between the fastening ring and the upper connecting plate.

[0016] As a further improvement of the present invention, a sleeve is installed on an upper connecting plate on an outer side of the pin shaft.

[0017] As a further improvement of the present invention, a sleeve is installed on the middle connecting plate outside the second pin shaft.

[0018] By means of the above scheme, the present invention has at least the following advantages:

[0019] The present invention can press the wafer during the adsorption process of the wafer stage, so that the wafer and the processing stage are closely fitted, ensuring that the wafer is as flat as possible.

[0020] During the compacting process, the present invention is provided with a cylinder for preliminary pre-compression, and then fine compaction is performed according to the lead screw motor to achieve compaction with a two-level distribution, thereby preventing direct downward pressure from damaging the wafer.

[0021] In the process of secondary distributed pressing of the present invention, the elastic sheet and the spring provided on the wafer pressing actuator can play a buffering role, prevent overpressure, and protect the wafer.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a structural schematic diagram of a wafer adsorption clamping device of the present invention;

[0025] Figure 2 yes Figure 1 Structural diagram of the fine-tuning mechanism;

[0026] Figure 3 yes Figure 1 A schematic diagram of the structure of the wafer pressing actuator;

[0027] Figure 4 yes Figure 3 Schematic diagram of the internal structure.

[0028] The meanings of the various reference numerals in the figures are as follows.

[0029] Blowing fixed plate 1, fine adjustment mechanism 2, side guard plate 3, rear side fixed plate 4, wafer pressing actuator 5, screw motor 6, motor fixed plate 7, cylinder 8, blowing mechanism 9;

[0030] Left fixed plate 201, adjustment fixed plate 202, adjustment bolt 203, adjustment movable plate 204, right fixed plate 205, connecting plate 206;

[0031] Pin shaft 1 501 , fastening ring 502 , nut 1 503 , spring piece 504 , lower connecting plate 505 , clamping plate 506 , middle connecting plate 507 , upper connecting plate 508 , pin shaft 2 509 , spring 510 , sleeve 511 , screw 512 , nut 2 513 . DETAILED DESCRIPTION

[0032] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0033] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0034] like Figure 1 to Figure 4 As shown, a wafer adsorption clamping device comprises a side guard plate 3 distributed along the left-right direction, a rear side fixing plate 4 installed on the side guard plate 3 and distributed along the vertical direction, and a wafer pressing actuator 5. The cylinder 8 installed on the rear side fixing plate 4 drives the motor fixing plate 7 below to move in the vertical direction, and a lead screw motor 6 is installed at the bottom of the motor fixing plate 7, and the lead screw motor 6 drives the wafer pressing actuator 5 below to move in the vertical direction.

[0035] 1. A fine adjustment mechanism 2 is provided between the rear fixing plate 4 and the cylinder 8. The fine adjustment mechanism 2 includes a left fixing plate 201, a right fixing plate 205 and a connecting plate 206. The right side of the connecting plate 206 is installed on the rear fixing plate 4. The left fixing plate 201 and the right fixing plate 205 are installed on the left side of the connecting plate 206 from left to right. An adjustment plate 202 is installed on the connecting plate 206 between the left fixing plate 201 and the right fixing plate 205. An adjustment movable plate 204 is installed on the connecting plate 206 above the adjustment plate 202. The adjustment bolt 203 installed on the adjustment plate 202 along the vertical direction is connected to the upper adjustment movable plate 204. This allows the left fixing plate 201 and the right fixing plate 205 to be finely adjusted and moved on the connecting plate 206.

[0036] 2. Wafer pressing actuator 5:

[0037] The wafer pressing actuator 5 includes an upper connecting plate 508, a middle connecting plate 507, a lower connecting plate 505 and a clamping plate 506 from top to bottom. The driving end of the screw motor 6 is connected to the middle part of the upper connecting plate 508 below, and the lower connecting plate 505 is connected to the clamping plate 506 below.

[0038] The upper connecting plate 508 and the middle connecting plate 507 are connected together through a plurality of pins 501 and fastening rings 502 . The pins 501 pass through the fastening rings 502 and the upper connecting plate 508 from top to bottom and are then locked on the middle connecting plate 507 by screws 512 .

[0039] The middle connecting plate 507 and the lower connecting plate 505 are connected together through a plurality of second pins 509 and a fastening ring 502 . The second pins 509 pass through the fastening ring 502 and the middle connecting plate 507 from top to bottom and then are embedded in the lower connecting plate 505 below.

[0040] A spring 510 is installed on the second pin shaft 509 between the middle connecting plate 507 and the lower connecting plate 505 , and a plurality of spring sheets 504 are installed between the upper connecting plate 508 and the lower connecting plate 505 .

[0041] Nut 1 503 and nut 2 513 are sequentially installed from top to bottom on the pin 1 501 between the fastening ring 502 and the upper connecting plate 508. A sleeve 511 is installed on the upper connecting plate 508 outside the pin 1 501. A sleeve 511 is installed on the middle connecting plate 507 outside the pin 2 509.

[0042] 3. A blowing fixing plate 1 is installed at the front end of the side guard plate 3, and a blowing mechanism 9 distributed along the left and right directions is installed at the bottom of the blowing fixing plate 1. The blowing mechanism 9 is inclined toward one side of the wafer pressing actuator 5 below.

[0043] The working process of the present invention is briefly described as follows:

[0044] After the wafer is transported to the adsorption carrier, the cylinder 8 is activated to initially press down, and then the screw motor 6 moves to drive the wafer pressing actuator 5 to move downward, so that the clamping plate 506 in the wafer pressing actuator 5 presses the wafer. In the process of pressing the wafer, the spring 510 installed on the pin shaft 501 of the lower connecting plate 505 and the middle connecting plate 507 will also shrink to buffer part of the deformation and ensure uniform compression of the wafer.

[0045] The present invention presses the wafer during the adsorption process of the wafer stage, so that the wafer fits tightly with the processing stage, ensuring that the wafer is as flat as possible, and the wafer can be firmly adsorbed without displacement during the movement and cutting of the vacuum adsorption platform, thereby ensuring the cutting production of the wafer.

[0046] During the clamping process, a cylinder is provided for initial pre-compression, and then a lead screw motor is used for fine clamping to achieve two-level distribution for clamping, preventing direct downward pressure from damaging the wafer.

[0047] During the secondary distributed pressing process, the springs and springs provided on the wafer pressing actuator can play a buffering role, prevent overpressure, and protect the wafer.

[0048] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0049] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A wafer adsorption clamping device, comprising side guard plates (3) distributed along the left-right direction, a rear fixing plate (4) installed on the side guard plates (3) and distributed along the vertical direction, and a wafer pressing actuator (5); characterized in that: A cylinder (8) installed on the rear side fixing plate (4) drives the motor fixing plate (7) below to move in the vertical direction. A lead screw motor (6) is installed at the bottom of the motor fixing plate (7). The lead screw motor (6) drives the wafer pressing actuator (5) below to move in the vertical direction. The wafer pressing actuator (5) comprises, from top to bottom, an upper connecting plate (508), a middle connecting plate (507), a lower connecting plate (505) and a clamping plate (506); the driving end of the lead screw motor (6) is connected to the middle of the upper connecting plate (508) below, and the lower connecting plate (505) is connected to the clamping plate (506) below; The upper connecting plate (508) and the middle connecting plate (507) are connected together via a plurality of pin shafts (501) and a fastening ring (502); the pin shaft (501) passes through the fastening ring (502) and the upper connecting plate (508) in sequence from top to bottom and is then locked on the middle connecting plate (507) via a screw (512); The middle connecting plate (507) and the lower connecting plate (505) are connected together through a plurality of second pins (509) and a fastening ring (502), and the second pins (509) pass through the fastening ring (502) and the middle connecting plate (507) in sequence from top to bottom and are then embedded in the lower connecting plate (505) below; A spring (510) is installed on the second pin shaft (509) between the middle connecting plate (507) and the lower connecting plate (505), and a plurality of spring sheets (504) are installed between the upper connecting plate (508) and the lower connecting plate (505).

2. The wafer adsorption clamping device according to claim 1, characterized in that: An air blowing fixing plate (1) is installed at the front end of the side guard plate (3), and an air blowing mechanism (9) distributed along the left-right direction is installed at the bottom of the air blowing fixing plate (1).

3. The wafer adsorption clamping device according to claim 2, characterized in that: The air blowing mechanism (9) is inclined toward one side of the wafer pressing actuator (5) below.

4. The wafer adsorption clamping device according to claim 1, characterized in that: A fine adjustment mechanism (2) is provided between the rear fixing plate (4) and the cylinder (8), the fine adjustment mechanism (2) comprising a left fixing plate (201), a right fixing plate (205) and a connecting plate (206), the right side of the connecting plate (206) being mounted on the rear fixing plate (4), the left fixing plate (201) and the right fixing plate (205) being mounted on the left side of the connecting plate (206) in sequence from left to right, an adjusting fixed plate (202) being mounted on the connecting plate (206) between the left fixing plate (201) and the right fixing plate (205), an adjusting movable plate (204) being mounted on the connecting plate (206) above the adjusting fixed plate (202), and an adjusting bolt (203) mounted on the adjusting fixed plate (202) in a vertical direction being connected to the adjusting movable plate (204) above.

5. The wafer adsorption clamping device according to claim 1, characterized in that: Nut 1 (503) and nut 2 (513) are installed in sequence from top to bottom on pin shaft 1 (501) between the fastening ring (502) and the upper connecting plate (508).

6. The wafer adsorption clamping device according to claim 1, characterized in that: A sleeve (511) is installed on the upper connecting plate (508) outside the pin shaft 1 (501).

7. The wafer adsorption clamping device according to claim 1, characterized in that: A sleeve (511) is installed on the middle connecting plate (507) outside the second pin shaft (509).

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