Flush clamp system and wafer etching method

Abstract

The invention relates to a flush type clamp system and a wafer etching method, the flush type clamp system comprises a tray body, an all-insulated cover plate and a positioning ring, the top end face of the tray body is a flush top plane, the flush top plane is provided with a plurality of wafer placing areas, and the area surrounding the wafer placing areas is a cover plate placing area; the cover plate is provided with openings with the same number as the wafer placing areas, and the cover plate is arranged on the cover plate placing area and can fix wafers in the wafer placing areas and expose the wafers from the openings; the positioning ring is made of an insulating material, is connected between the tray body and the cover plate, and can wrap the bottom end face and the side end face of the edge of a wafer at the same time. According to the invention, edge pattern distortion caused by electric field deflection due to metal area design is eliminated, and the product quality is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer etching, and in particular relates to a flush fixture system and a wafer etching method. Background Art

[0002] After the sapphire wafer has completed the patterning of the photoresist layer on the upper surface in the yellow light process, it enters the etching process to transfer the patterning of the sapphire itself. During this process, a clamping system is required to fix the sapphire wafer.

[0003] There is a clamp system in the prior art, such as Figure 1 to Figure 2 As shown, it includes a lower tray 1 and an upper cover plate 2. Both the upper cover plate 2 and the lower tray 1 are made of Al and mainly play the following roles: (1) carrying multiple wafers; (2) fixing the wafers and providing conditions for cooling the back of the wafers with helium gas; (3) forming an etching system, and potential difference assisting plasma directional etching. Among them, the lower tray 1 is a convex structure, the convex lower tray 1 has a top surface 11 and a step surface 12, an annular groove is provided on the top surface 11, and a sealing ring 3 is installed in the annular groove; the upper cover plate 2 is provided with a lap joint surface adapted to the step surface 12, when the upper cover plate 2 is buckled on the convex lower tray 1, the lap joint surface of the upper cover plate 2 contacts the step surface 12 of the lower tray 1; when the wafer is installed, the lower end surface of the edge of the wafer directly contacts the top surface 11 of the lower tray 1.

[0004] In addition, the steps of the etching process using this conventional fixture system are as follows:

[0005] ① Load the sealing ring on the lower tray;

[0006] ②Put the tray flat;

[0007] ③ Align the matching locator on the sleeve;

[0008] ④ Place the chips into each position one by one;

[0009] ⑤Remove the positioner;

[0010] ⑥Align and put on the upper cover;

[0011] ⑦ Turn it over and fix it with screws from the bottom tray;

[0012] ⑧Send to the ICP transmission chamber for etching.

[0013] The above process is repeated each time etching is performed.

[0014] However, this fixture system in the prior art has the following disadvantages: (1) The wafer loading steps are cumbersome, which increases the probability of introducing microscopic defects; (2) The pattern at the very edge of the wafer is easily distorted due to the edge effect caused by the design of the metal fixture at the corresponding position; (3) The life of the upper cover is 600 times, and the life of the lower tray is 2500 times, which are short and increase the manufacturing cost of the single wafer. Summary of the invention

[0015] In view of the above analysis, the embodiments of the present invention aim to provide a flush fixture system and a wafer etching method to solve one or more of the above problems existing in the prior art.

[0016] The object of the present invention is achieved in that:

[0017] A flush fixture system, comprising:

[0018] A tray body, wherein the top surface of the tray body is a flush top plane, the flush top plane has a plurality of wafer placement areas, and the area surrounding the wafer placement areas is a cover plate placement area;

[0019] A fully insulating cover plate, the cover plate being provided with the same number of openings as the wafer placement area, the cover plate being arranged on the cover plate placement area, and being capable of fixing the wafer in the wafer placement area and exposing the wafer from the openings;

[0020] A positioning ring is made of insulating material, is connected between the tray body and the cover plate, and can simultaneously surround the bottom end surface and the side end surface at the edge of the wafer.

[0021] Furthermore, the positioning ring is in sealing contact with the bottom end surface at the edge of the wafer and is provided with a gap with the side end surface at the edge of the wafer.

[0022] Furthermore, the positioning ring includes a first ring assembly and a second ring assembly, the longitudinal cross-section of the solid part of the first ring assembly is an L-shaped structure, having a horizontal portion and a vertical portion, and both the horizontal portion and the vertical portion are annular structures; the second ring assembly is arranged on the horizontal portion and can be sealed in contact with the bottom end surface at the edge of the chip; the vertical portion is arranged on the horizontal portion, extending upward on the outer side of the peripheral side end surface of the chip, and there is a gap between the vertical portion and the peripheral side end surface of the chip.

[0023] Furthermore, the longitudinal cross-section of the solid part of the second ring assembly is hemispherical, approximately hemispherical or rectangular.

[0024] Furthermore, the longitudinal cross-section of the transverse portion is a rectangle; and the longitudinal cross-section of the vertical portion is a rectangle or a right-angled trapezoid.

[0025] Furthermore, the longitudinal cross-section of the vertical portion is a rectangle, the gap between the vertical portion and the peripheral side end face of the chip is a regular circular ring space, and the longitudinal cross-section of the circular ring space is also a rectangle; or, the longitudinal cross-section of the vertical portion is a right-angled trapezoid, the inner side wall of the vertical portion is an inclined surface, the vertical portion is a structure that is narrow at the top and wide at the bottom, and the gap between the vertical portion and the peripheral side end face of the chip is an annular space that is larger at the top and smaller at the bottom.

[0026] Furthermore, the first ring assembly and the second ring assembly are an integral structure and are both made of polymer materials.

[0027] Furthermore, the first ring component is a C, H organic polymer material containing a benzene ring or a polymer composite material mixed with glass fiber and C fiber; the second ring component is a highly elastic silicone rubber material.

[0028] Furthermore, a plurality of annular mounting grooves are provided on the tray body at positions corresponding to the wafer placement areas, the transverse portion is installed in the annular mounting grooves, and the groove depth of the annular mounting grooves is equal to the height of the transverse portion.

[0029] Furthermore, a plurality of pressing claws are provided on the cover plate, and the pressing claws are configured to press the edge of the wafer.

[0030] Further, the longitudinal section of the transverse portion is a rectangle, the length of the rectangle is W1, and the height of the rectangle is H1;

[0031] The longitudinal section of the vertical portion at the position of the pressing claw is a first right-angled trapezoid, and the longitudinal section of the vertical portion at the position of the skirt is a second right-angled trapezoid; the first right-angled trapezoid has a first height, a first upper base and a first lower base, and the second right-angled trapezoid has a second height, a second upper base and a second lower base; wherein the height of the first height is H2, the height of the second height is H3, the length of the first upper base is W3, the length of the second upper base is W2, and the lengths of the first lower base and the second lower base are both W4;

[0032] W1>W3>W2 and W1>3*W2;

[0033] W1 = 2.0 ~ 4.0 mm, H1 = 2.00 ~ 3.0 mm; H2 is smaller than the thickness of the wafer; H3 = 3.0 ~ 4.0 mm.

[0034] Further, the longitudinal cross-section of the solid portion of the second ring assembly is hemispherical;

[0035] The diameter of the hemisphere is D=1200±50 μm.

[0036] On the other hand, a wafer etching method is provided. Before entering the ICP etcher, the wafer is loaded using the above-mentioned flush fixture system, and after loading, the wafer is sent to the ICP transmission chamber for etching.

[0037] Furthermore, the flush fixture system is used to load the film, and the steps are as follows:

[0038] Step 1: Lay the tray body flat;

[0039] Step 2: Place wafers one by one in each wafer position on the tray body;

[0040] Step 3: Put the cover plate on the tray body;

[0041] Step 4: Flip the tray body and the cover plate as a whole so that the bottom surface of the tray body faces upward, and screw the tray body and the cover plate into place through the tray body to complete the installation.

[0042] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0043] a) The flush fixture system provided by the present invention adopts a fully flat tray body and a fully insulated cover plate, thereby eliminating edge pattern distortion caused by electric field deflection caused by the metal area design, thereby improving product quality.

[0044] b) The flush-type clamp system provided by the present invention has an increased cover thickness, and the areas of the tray body that are easily etched are more resistant to etching and are replaceable, thereby extending the overall life of the clamp system: the life of the upper cover is increased to 3,000 times; the single use life of the tray body is increased to 5,000 times, and after replacing the positioning ring, it can continue to be used 5,000 times. In theory, the tray body can be used indefinitely, thereby reducing the single-piece manufacturing cost.

[0045] c) The flush fixture system method provided by the present invention makes the steps of loading wafers simpler and easier to operate, thereby improving wafer loading efficiency and reducing the probability of contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this specification. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0047] Figure 1 It is a cross-sectional schematic diagram of a clamp system at the pressure claw in the prior art;

[0048] Figure 2 It is a cross-sectional schematic diagram of a clamp system at the skirt in the prior art;

[0049] Figure 3 A schematic cross-sectional view of the flush-type clamp system provided by the present invention at the pressure claw;

[0050] Figure 4 A schematic cross-sectional view of the flush-type clamp system provided by the present invention at the skirt;

[0051] Figure 5 A cross-sectional schematic diagram of a positioning ring at a pressing claw provided by the present invention;

[0052] Figure 6 A cross-sectional schematic diagram of a positioning ring at a skirt provided by the present invention;

[0053] Figure 7 A schematic cross-sectional structure diagram of a tray body of the flush-type clamp system provided by the present invention;

[0054] Figure 8 A schematic diagram of the cross-sectional structure of the pressure claws on the cover plate of the flush-type clamp system provided by the present invention;

[0055] Fig. 9 A schematic diagram of the planar structure of the flush-type clamp system provided by the present invention;

[0056] Fig.10 This is an electron microscope image of a 0.4 mm pattern on the edge of a wafer obtained using a conventional platform raised lower tray;

[0057] Fig.11 This is an electron microscope image of a 0.4 mm pattern of a wafer edge obtained using the tray body having a flush top surface of the present invention.

[0058] Reference numerals:

[0059] 1. Lower tray; 11. Top surface; 12. Step surface; 2. Upper cover; 3. Sealing ring;

[0060] 100, tray body; 101, flush top plane; 102, annular mounting groove;

[0061] 200, cover plate; 201, pressing claw; 2011, first step surface; 2012, second step surface;

[0062] 300, positioning ring; 301, first ring assembly; 3011, horizontal portion; 3012, vertical portion; 302, second ring assembly;

[0063] 400. Chip. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. It should be noted that, in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined, separated, interchanged and / or rearranged with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0065] In the accompanying drawings, the size and relative size of components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments may be implemented differently, a specific process sequence may be performed in a different order than described. For example, two successively described processes may be performed substantially simultaneously or in an order opposite to the order described. In addition, the same reference numerals represent the same components.

[0066] The terms used here are for the purpose of describing specific embodiments, and are not intended to be restrictive. As used here, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, it is explained that there are stated features, integral bodies, steps, operations, parts, assemblies and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups. It should also be noted that, as used here, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values ​​and / or the values ​​provided that will be recognized by those of ordinary skill in the art.

[0067] Example 1

[0068] A specific embodiment of the present invention, as Figures 3 to 9 As shown, a flush type clamp system is disclosed, comprising:

[0069] A tray body 100, wherein the top surface of the tray body 100 is a flush top plane 101, and the flush top plane 101 has a plurality of wafer placement areas, and the area surrounding the wafer placement areas is a cover plate placement area;

[0070] A fully insulating cover plate 200, wherein the cover plate 200 is provided with the same number of openings as the wafer placement area, and the cover plate 200 is arranged on the cover plate placement area, and the wafer 400 can be fixed in the wafer placement area and exposed from the openings;

[0071] A positioning ring 300, which is made of insulating material, is connected between the tray body 100 and the cover plate 200, and can simultaneously surround the bottom end surface and the side end surface of the edge of the wafer 400;

[0072] The positioning ring 300 is in sealing contact with the bottom end surface at the edge of the wafer 400 , and a gap is provided between the positioning ring 300 and the side end surface at the edge of the wafer 400 .

[0073] It should be noted that the flush top plane 101 in this embodiment means that there is no raised platform or recessed sinking area on the tray body 100 for placing the chip 400, and there is no height difference between the chip placement area and the cover placement area. The two are located on the same plane, which is the only top surface of the tray body 100.

[0074] In this embodiment, the tray body 100 is made of Al material, the tray body 100 is processed to be level on the entire surface, and the cover plate placement area is on the flush top plane 101 .

[0075] In this embodiment, the shape of the opening on the cover plate 200 is the same as the shape of the wafer 400 , the size of the opening is larger than the size of the wafer 400 , and the number of the openings is the same as the number of wafer placement areas on the tray body 100 .

[0076] In this embodiment, the cover plate 200 is provided with a plurality of pressure claws 201, each opening is provided with a plurality of pressure claws 201, the pressure claws 201 extend toward the center of the opening, and the pressure claws 201 are configured to press the edge of the wafer 400. That is to say, a plurality of pressure claws 201 are radially and evenly arranged at the top of each opening on the cover plate 200, and the radial extension length of the pressure claws 201 is based on the ability to press the edge position of the wafer 400 without affecting the etching. Among them, the pressure claws 201 are provided with a step structure, and the edge of the wafer 400 is fixed in the space defined by the step structure, and the step structure has a first step surface 2011 and a second step surface 2012, the first step surface 2011 is in compression contact with the top surface of the edge of the wafer, and the second step surface 2012 is in compression contact with the top surface of the vertical portion 3012.

[0077] In this embodiment, a vertically arranged helium channel is provided in the area below each wafer 400, that is, the wafer placement area on the tray body 100, for communicating He gas.

[0078] In this embodiment, the positioning ring 300 includes a first ring component 301 and a second ring component 302. The longitudinal cross-section of the solid part of the first ring component 301 is an L-shaped structure, having a horizontal portion 3011 and a vertical portion 3012, and the horizontal portion 3011 and the vertical portion 3012 are both annular structures; the second ring component 302 is arranged on the horizontal portion 3011, and can be sealed in contact with the bottom end surface at the edge of the chip 400; the vertical portion 3012 is arranged on the horizontal portion 3011, extending upward on the outer side of the peripheral side end surface of the chip 400, and there is a gap between the vertical portion 3012 and the peripheral side end surface of the chip 400 to prevent jamming.

[0079] In one optional embodiment, the longitudinal cross section of the solid part of the second ring assembly 302 is hemispherical, approximately hemispherical, rectangular or other polygonal. The second ring assembly 302 with a hemispherical longitudinal cross section can also be understood as a convex ring arranged on the surface of the transverse portion 3011 of the first ring assembly 301, and the longitudinal cross section of the convex ring can be hemispherical, approximately hemispherical, rectangular or other polygonal. The number of convex rings can be one or more.

[0080] In one optional embodiment, the longitudinal cross-section of the horizontal portion 3011 is a rectangle; the longitudinal cross-section of the vertical portion 3012 can be a rectangle or a right-angled trapezoid.

[0081] In the technical solution in which the vertical section of the vertical portion 3012 is a rectangle, the gap between the vertical portion 3012 and the peripheral end surface of the wafer 400 is a regular annular space, and the longitudinal section of the annular space is also a rectangle.

[0082] In the technical solution in which the longitudinal section of the vertical portion 3012 is a right-angled trapezoid, the inner side wall of the vertical portion 3012 is an inclined surface, the vertical portion 3012 is a structure that is narrow at the top and wide at the bottom, and the gap between the vertical portion 3012 and the outer peripheral side end surface of the chip 400 is an annular space that is larger at the top and smaller at the bottom.

[0083] In this embodiment, the positioning ring 300 is a whole, that is, the first ring component 301 and the second ring component 302 are an integral structure.

[0084] In one of the optional embodiments, the first ring assembly 301 and the second ring assembly 302 are made of polymer materials. Exemplarily, the polymer material for preparing the first ring assembly 301 includes C, H organic polymer materials containing benzene rings or polymer composite materials mixed with glass fibers and C fibers. The first ring assembly 301 made of polymer materials has high hardness and is resistant to etching, which means that the polymer material of the gap between the edge of the wafer 400 and the skirt in the skirt area is more resistant to etching, and damage to the tray body 100 is limited. The second ring assembly 302 is a highly elastic silicone rubber material. Since both the first ring assembly 301 and the second ring assembly 302 are made of polymer materials, the molecules at the atomic level are mainly C and H, and can be processed in an integrated manner, while polymer materials and metal Al materials cannot be processed in an integrated manner.

[0085] In this embodiment, a plurality of annular mounting grooves 102 are provided on the tray body at positions corresponding to the wafer placement areas, and the transverse portion 3011 of the positioning ring 300 is installed in the annular mounting groove 102. The groove depth of the annular mounting groove 102 is equal to the height of the transverse portion 3011. The top surface of the transverse portion 3011 is flush with the top surface of the tray body, and the vertical portion 3012 of the positioning ring 300 extends in the lateral direction of the outer peripheral side end surface of the wafer 400.

[0086] In this embodiment, Figures 5 and 6 The longitudinal cross-sectional shapes and dimension parameters of the transverse portion 3011 and the vertical portion 3012 of the first ring assembly 301 and the solid portion of the second ring assembly 302 are shown.

[0087] The vertical cross section of the solid part of the horizontal portion 3011 is a rectangle, the length of the rectangle is W1, the height of the rectangle is H1, W1 = 2.0 ~ 4.0 mm, H1 = 2.00 ~ 3.0 mm, this parameter design is convenient for the processing and later assembly of the positioning ring 300;

[0088] The longitudinal cross-section of the solid part of the vertical portion 3012 is a right-angled trapezoid, the longitudinal cross-section of the vertical portion 3012 at the position of the pressure claw 201 is a first right-angled trapezoid, and the longitudinal cross-section of the vertical portion 3012 at the position of the skirt is a second right-angled trapezoid; the first right-angled trapezoid has a first height, a first upper base and a first lower base, and the second right-angled trapezoid has a second height, a second upper base and a second lower base; wherein, the height of the first height is H2, the height of the second height is H3, the length of the first upper base is W3, the length of the second upper base is W2, the lengths of the first lower base and the second lower base are both W4, W1>W3>W2 and W1>3*W2, this arrangement is conducive to more precise sliding downward and positioning of the chip 400.

[0089] H2 is smaller than the thickness of the wafer 400 , which is generally 600-1300 μm. Since the step depth of the pressing claw 201 on the cover plate 200 is equal to the thickness of the wafer 400 , H2 is usually smaller than the step depth of the pressing claw 201 on the cover plate 200 .

[0090] H3 is much larger than the thickness of the wafer 400, H3 = 3.0 ~ 4.0mm;

[0091] In one preferred embodiment, the longitudinal cross-section of the solid part of the second ring assembly 302 is hemispherical, and its diameter parameter is set according to the size parameter of the transverse part 3011 of the first ring assembly 301. Exemplarily, the second ring assembly 302 is provided with only one hemispherical convex ring, and the diameter D of the hemispherical ring is about 1200 μm, such as D=1200±50 μm, which can play a good sealing role, enhance the stress effect on the edge, and accelerate the etching rate.

[0092] In this embodiment, the cover plate 200 is made of a fully insulating material, such as quartz, insulating ceramics, polymer materials or composite polymer materials with good thermal conductivity, etc. Because the top surface of the tray body 100 is a completely flat plane, and the cover plate 200 is insulating, this means that the metal design difference at the edge of the wafer is too large, the electric field offset is almost non-existent, and there is no risk of distortion of the edge pattern. In this way, the cover plate 200 and the pressure claw 201 can be designed to be thicker, at least 6 times the thickness of the traditional Al cover plate, and the service life is also longer. Preferably, the thickness of the cover plate 200 in this example is 3-5mm, and the thickness parameter of the pressure claw 201 is 0.5-2mm.

[0093] This embodiment also provides a wafer etching method. Before entering the ICP etcher, the wafer is loaded using the flush-type fixture system described above in this embodiment. After loading, the wafer is sent to the ICP transmission chamber for etching.

[0094] The process of loading a film using the flush-type fixture system includes steps 1 to 4. The steps of loading a film are:

[0095] Step 1: Lay the tray body 100 flat;

[0096] Step 2: Place the wafers 400 one by one in each wafer position on the tray body 100;

[0097] Step 3: Put the cover plate 200 on the tray body 100;

[0098] Step 4: Flip the tray body 100 and the cover plate 200 as a whole, so that the bottom surface of the tray body 100 faces upward, and screw the tray body 100 to fix the tray body 100 and the cover plate 200 to complete the installation.

[0099] The wafer etching method further includes step 5: after the wafer loading is completed, the tray body 100 and the cover plate 200 are flipped over again, and sent to the ICP transmission chamber for etching, and the etching is performed according to the set parameters to complete the etching of the wafer 400.

[0100] From the above, it can be seen that the chip etching using the existing convex lower tray clamping system includes 8 steps, while the chip etching method using the flush type clamping system in the present application only requires 5 steps, which is simpler to operate and has higher loading efficiency.

[0101] Fig.10 The electron microscope image of the 0.4 mm pattern of the wafer edge obtained using the conventional platform raised lower tray is shown. Fig.11 The electron microscope image of the wafer edge 0.4 mm pattern obtained by using the tray body with a flush top plane in this embodiment is shown. From the comparison of the above two images, it can be seen that the latter is more symmetrical than the former.

[0102] Compared with the prior art, the flush fixture system and wafer etching method provided in this embodiment have the following beneficial effects:

[0103] 1. The fully flat tray body and fully insulated cover plate are used to eliminate edge pattern distortion caused by electric field deflection caused by metal area design, thus improving product quality.

[0104] 2. The thickness of the cover plate is increased, and the easily etched areas of the tray body are more resistant to etching and can be replaced, which extends the overall life of the fixture system: the life of the upper cover is increased to 3,000 times; the single use of the tray body is increased to 5,000 times. After replacing the positioning ring, it can continue to be used 5,000 times. In theory, the tray body can be used indefinitely, thereby reducing the manufacturing cost of a single piece.

[0105] 3. The steps of loading wafers are simpler and easier to operate, which improves the loading efficiency and reduces the probability of contamination.

[0106] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the present application in detail. It should be understood that the above description is only the specific implementation method of the present application and is not intended to limit the scope of protection of the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A flush fixture system, characterized in that: include: A tray body, wherein the top surface of the tray body is a flush top plane, the flush top plane has a plurality of wafer placement areas, and the area surrounding the wafer placement areas is a cover plate placement area; A fully insulating cover plate, the cover plate being provided with the same number of openings as the wafer placement area, the cover plate being arranged on the cover plate placement area, and being capable of fixing the wafer in the wafer placement area and exposing the wafer from the openings; A positioning ring is made of insulating material, is connected between the tray body and the cover plate, and can simultaneously surround the bottom end surface and the side end surface at the edge of the wafer.

2. The flush fixture system according to claim 1, characterized in that: The positioning ring is in sealing contact with the bottom end surface at the edge of the wafer and is arranged with a gap with the side end surface at the edge of the wafer.

3. The flush fixture system according to claim 2, characterized in that: The positioning ring includes a first ring assembly and a second ring assembly. The longitudinal cross-section of the solid part of the first ring assembly is an L-shaped structure, having a horizontal portion and a vertical portion, and both the horizontal portion and the vertical portion are annular structures; the second ring assembly is arranged on the horizontal portion and can be sealed and contacted with the bottom end surface at the edge of the wafer; the vertical portion is arranged on the horizontal portion, extending upward on the outer side of the peripheral side end surface of the wafer, and there is a gap between the vertical portion and the peripheral side end surface of the wafer.

4. The flush fixture system according to claim 3, characterized in that: The longitudinal cross-section of the solid part of the second ring component is hemispherical, approximately hemispherical or rectangular.

5. The flush fixture system according to claim 3, characterized in that: The longitudinal cross-section of the horizontal portion is a rectangle; the longitudinal cross-section of the vertical portion is a rectangle or a right-angled trapezoid.

6. The flush fixture system according to claim 5, characterized in that: The vertical portion has a rectangular longitudinal section, and the gap between the vertical portion and the peripheral side end surface of the wafer is a regular annular space, and the longitudinal section of the annular space is also a rectangle; or, The vertical portion has a longitudinal cross section of a right-angled trapezoid, an inner side wall of the vertical portion is an inclined surface, the vertical portion is a structure that is narrow at the top and wide at the bottom, and a gap between the vertical portion and the peripheral side end surface of the wafer is an annular space that is larger at the top and smaller at the bottom.

7. The flush fixture system according to claim 3, characterized in that: The first ring assembly and the second ring assembly are an integral structure and are both made of polymer materials.

8. The flush fixture system according to claim 7, characterized in that: The first ring component is a C, H organic polymer material containing a benzene ring or a polymer composite material mixed with glass fiber and C fiber; the second ring component is a highly elastic silicone rubber material.

9. The flush fixture system according to claim 3, characterized in that: A plurality of annular mounting grooves are arranged on the tray body at positions corresponding to the wafer placement area, the transverse portion is installed in the annular mounting grooves, and the groove depth of the annular mounting grooves is equal to the height of the transverse portion.

10. A wafer etching method, characterized in that: Before entering the ICP etcher, the flat fixture system according to any one of claims 1 to 9 is used to load the wafer, and after loading, the wafer is sent to the ICP transmission chamber for etching.

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