LED illuminating lamp heat management system based on multi-source data analysis

Abstract

The invention discloses an LED illuminating lamp heat management system based on multi-source data analysis, relates to the technical field of lamp heat management, and solves the technical problem that in the prior art, an LED illuminating lamp cannot analyze the heat influence during operation, so that the heat influence cannot be accurately analyzed, and the heat management efficiency is indirectly reduced. The method specifically comprises the steps that heat influence analysis is conducted on the LED illuminating lamp, the influence degree of the surrounding environment in the lamp operation process is deduced through heat influence analysis of different positions where the LED illuminating lamp is located, and therefore lamp heat treatment monitoring and early warning are conducted according to the environment influence degree in combination with heat management analysis, and the operation stability and safety of the LED illuminating lamp are improved; the operation efficiency and the heat management efficiency of the LED illuminating lamp are ensured; the internal heat conduction path of the heat pipe body is analyzed, whether the internal real-time heat management effect of the heat pipe body meets the requirement or not is deduced according to internal heat conduction analysis of the heat pipe body, and the situation that the running temperature in the heat pipe body is too high due to abnormal heat conduction performance in the heat pipe body is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of lamp thermal management, and in particular to a thermal management system for LED lighting lamps based on multi-source data analysis. Background Art

[0002] LED lighting has many advantages that traditional light sources cannot match and has a broad market prospect; however, a series of problems such as poor reliability, lack of relevant standards, and high prices currently plague the development of the LED lighting industry, especially the thermal management problem in high-brightness LED lighting systems.

[0003] The patent with announcement number CN109578956A discloses a thermal management system for LED lighting lamps, including an ion wind generating device, an electric heating device and an LED lighting device; the ion wind generating device is provided with an air inlet and an air outlet; the electric heating device is located at the rear side of the air outlet, and is connected to an external power source through a heating circuit and obtains electric energy converted into heat energy; the LED lighting device is located at the rear side of the electric heating device; a temperature sensor for real-time monitoring of the temperature of the LED lighting device is provided on the LED lighting device, and a temperature controller for adjusting the voltage of the heating circuit according to the monitoring result of the temperature sensor, thereby changing the heat energy output by the electric heating device, is provided on the heating circuit. The system effectively solves the problem that the ion wind generating device lacks a heating function in a low temperature environment, switches the system working state under different conditions, realizes the thermal management of the LED lighting device, and improves the life and reliability of the LED lighting lamp.

[0004] However, in the prior art, LED lighting cannot analyze the thermal impact during operation, so that the thermal impact cannot be accurately analyzed, which indirectly causes a decrease in thermal management efficiency. In addition, the heat conduction path cannot be analyzed during the thermal management process, which reduces the management effect. At the same time, the temperature distribution of the lamp cannot be detected, and the real-time operating efficiency of the lamp cannot be guaranteed.

[0005] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0006] The purpose of the present invention is to solve the above-mentioned problems and to propose a thermal management system for LED lighting based on multi-source data analysis.

[0007] The purpose of the present invention can be achieved through the following technical solutions:

[0008] The LED lighting lamp thermal management system based on multi-source data analysis includes a lamp thermal management platform, and the lamp thermal management platform is communicatively connected with a thermal impact analysis unit, a heat conduction path analysis unit and a distribution state detection unit;

[0009] The LED lighting lamp is marked as the heat pipe body. The thermal impact analysis unit collects the thermal impact information and substitutes it into the formula to obtain the thermal impact analysis coefficient during the operation of the heat pipe body. According to the thermal impact analysis coefficient comparison, it is inferred whether the heat pipe body is affected by the location environment during real-time operation. If yes, position planning is carried out. If not, the thermal conduction path analysis unit is used to analyze the internal thermal conduction path of the heat pipe body, and the thermal conduction peak information and thermal conduction speed information are collected. According to the information comparison, it is inferred whether the thermal conduction path analysis is qualified. If not, thermal conduction regulation is carried out. If yes, the temperature distribution state is detected by the distribution state detection unit, and the outer shell of the heat pipe body is marked as the thermal conduction surface and divided into several sub-areas. The distribution temperature data and distribution time data are obtained. According to the data analysis, it is inferred whether the distribution state detection is qualified. If yes, monitoring continues. If not, state control is carried out.

[0010] As a preferred embodiment of the present invention, the thermal impact information includes a deviation value between the floating speed of the ambient environment parameter value at the corresponding position and the floating speed of the same type of parameter value inside the heat pipe body when the heat pipe body of the same specification is at different positions, and is set as a label PC;

[0011] The average floating span of the internal parameters of the heat pipe body during the low span rising trend stage of the surrounding environmental parameters, and the continuous update speed of the peak value of the internal parameters of the heat pipe body during the high span rising trend stage of the surrounding environmental parameters, set the label S 升 and V 升 ;

[0012] The floating speed of the constant value corresponding to the internal parameter setting of the heat pipe body during the low span downward trend stage of the ambient environment parameters, and the instantaneous increase span of the deviation value corresponding to the actual value of the internal parameter of the heat pipe body and the constant value during the high span downward trend stage of the ambient environment parameters, set the label F 降 and K 降 .

[0013] As a preferred embodiment of the present invention, the formula is:

[0014] Among them, R is the thermal impact analysis coefficient, v1, v2, v3, v4, and v5 are respectively the preset proportional coefficients, and e is a natural constant. β is used as an error correction factor and its value is 0.98.

[0015] As a preferred embodiment of the present invention, if the thermal impact analysis coefficient exceeds the thermal impact analysis coefficient threshold, a high thermal impact signal is generated; if the thermal impact analysis coefficient does not exceed the thermal impact analysis coefficient threshold, a low thermal impact signal is generated.

[0016] As a preferred embodiment of the present invention, the thermal conductivity peak information and the thermal conductivity rate information are respectively the highest peak value of the temperature inside the heat pipe body corresponding to the non-overlapping time period of the temperature rise period and the temperature control period within the thermal management period, and the maximum deviation value of the thermal conductivity rate at each position inside the heat pipe body during temperature control within the thermal management period.

[0017] As a preferred embodiment of the present invention, if the thermal conductivity peak information exceeds the maximum temperature peak threshold, or the thermal conductivity speed information exceeds the thermal conductivity speed maximum deviation threshold, a path abnormality signal is generated; if the thermal conductivity peak information does not exceed the maximum temperature peak threshold, and the thermal conductivity speed information does not exceed the thermal conductivity speed maximum deviation threshold, a path normal signal is generated.

[0018] As a preferred embodiment of the present invention, the distributed temperature data and the distributed time data are respectively the temperature numerical ratio of the maximum surface temperature of any heat-conducting surface sub-area to the internal and external temperature difference of the corresponding sub-area when the heat pipe body is starting to operate, and the deviation time of the moment when the surface temperature of any heat-conducting surface sub-area rises and the internal temperature of the heat pipe body rises when the heat pipe body is in the thermal management period.

[0019] As a preferred embodiment of the present invention, if the distributed temperature data exceeds the temperature value ratio threshold and the distributed duration data does not exceed the deviation duration threshold, a distribution high efficiency signal is generated; if the distributed temperature data does not exceed the temperature value ratio threshold, or the distributed duration data exceeds the deviation duration threshold, a distribution low efficiency signal is generated.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. In the present invention, a thermal impact analysis is performed on the LED lighting lamp. The degree of influence of the surrounding environment during the operation of the lamp is inferred through the thermal impact analysis of different locations of the LED lighting lamp, so that the lamp heat treatment monitoring and early warning are performed according to the degree of environmental influence combined with thermal management analysis, thereby improving the operating stability and safety of the LED lighting lamp and ensuring the operating efficiency and thermal management efficiency of the LED lighting lamp;

[0022] Analyze the internal heat conduction path of the heat pipe body, and infer whether the real-time thermal management effect inside the heat pipe body meets the requirements based on the internal heat conduction analysis of the heat pipe body, so as to avoid abnormal thermal conductivity inside the heat pipe body causing excessively high operating temperature inside the heat pipe body, resulting in reduced luminous efficiency of the chip inside the heat pipe body, accelerated light decay, and reduced service life.

[0023] 2. In the present invention, after the heat impact analysis and the heat conduction path analysis are both qualified, the temperature distribution state of the heat pipe body is detected to infer whether the temperature distribution state of each position in the heat pipe body is qualified, so as to facilitate real-time monitoring of the temperature impact of each part of the heat pipe body, accurately distinguish the degree of temperature impact at different positions, facilitate timely adjustment, and improve the thermal management pertinence of the heat pipe body;

[0024] Analyze the management efficiency inside the heat pipe body, and infer whether the real-time operating status of the heat pipe body can continue to operate stably through thermal management efficiency analysis and detection. Monitor the operating performance of the heat pipe body in real time to facilitate timely performance regulation when the operating performance is abnormal. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0026] Figure 1 This is a principle block diagram of Embodiment 1 of the present invention;

[0027] Figure 2 This is a principle block diagram of the second embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0030] Embodiment 1

[0031] This embodiment performs heat management on the LED lighting lamp, so as to analyze and regulate the LED lighting lamp through heat control, thereby improving the operating efficiency of the lamp; please refer to Figure 1 As shown, the LED lighting lamp thermal management system based on multi-source data analysis includes a lamp thermal management platform, wherein the lamp thermal management platform is communicatively connected with a thermal impact analysis unit, a heat conduction path analysis unit and a distribution state detection unit;

[0032] The lamp thermal management platform generates a thermal impact analysis signal and sends the thermal impact analysis signal to the thermal impact analysis unit. After receiving the thermal impact analysis signal, the thermal impact analysis unit performs a thermal impact analysis on the LED lighting lamp. The thermal impact analysis of different locations of the LED lighting lamp is used to infer the degree of influence of the surrounding environment during the operation of the lamp. Based on the degree of environmental influence combined with the thermal management analysis, the lamp heat treatment monitoring and early warning are performed, which improves the operating stability and safety of the LED lighting lamp and ensures the operating efficiency and thermal management efficiency of the LED lighting lamp.

[0033] The LED lighting lamp is marked as a heat pipe body, and the corresponding speed ratio deviation value between the floating speed of the numerical value of the surrounding environmental parameter at the corresponding position and the floating speed of the numerical value of the same type of parameter inside the heat pipe body is obtained when the heat pipe body of the same specification is in different positions, and the corresponding speed ratio deviation value between the floating speed of the numerical value of the surrounding environmental parameter at the corresponding position and the floating speed of the numerical value of the same type of parameter inside the heat pipe body when the heat pipe body of the same specification is in different positions is marked as PC; wherein the environmental parameters are represented by heat-related parameters such as temperature and humidity; it can be understood that temperature and humidity can affect the temperature and heat dissipation performance of the lamp;

[0034] At the same time, the floating trend of the same type of parameters inside the heat pipe body during the floating stage of the surrounding environment parameters is obtained, and the specific floating trend is obtained by collecting the real-time floating parameter values; according to the floating trend of the internal parameters of the heat pipe body, the mean value of the rising floating span of the internal parameters of the heat pipe body during the low span rising trend stage of the surrounding environment parameters, and the continuous updating speed of the peak value of the internal parameters of the heat pipe body during the high span rising trend stage of the surrounding environment parameters are obtained, and the mean value of the rising floating span of the internal parameters of the heat pipe body during the low span rising trend stage of the surrounding environment parameters, and the continuous updating speed of the peak value of the internal parameters of the heat pipe body during the high span rising trend stage of the surrounding environment parameters are marked as S respectively. 升 and V 升 ;

[0035] The corresponding numerical floating speed of the constant value set by the internal parameter of the heat pipe body during the low span downward trend stage of the ambient environment parameter, and the instantaneous increase span of the deviation value between the actual numerical value of the internal parameter of the heat pipe body and the constant value during the high span downward trend stage of the ambient environment parameter, and the corresponding numerical floating speed of the constant value set by the internal parameter of the heat pipe body during the low span downward trend stage of the ambient environment parameter, and the instantaneous increase span of the deviation value between the actual numerical value of the internal parameter of the heat pipe body and the constant value during the high span downward trend stage of the ambient environment parameter are marked as F respectively. 降 and K 降 ;

[0036] The above collected data are uniformly marked as thermal impact information, and substituted into the formula to obtain the thermal impact analysis coefficient during the operation of the heat pipe body. The formula is: Among them, R is the thermal impact analysis coefficient, v1, v2, v3, v4, and v5 are respectively the preset proportional coefficients, and e is a natural constant. β is an error correction factor with a value of 0.98;

[0037] Compare the TIA coefficient during the operation of the heat pipe body with the TIA coefficient threshold:

[0038] If the thermal impact analysis coefficient during the operation of the heat pipe body exceeds the thermal impact analysis coefficient threshold, it is inferred that the heat pipe body is affected by the location environment during real-time operation, and a high thermal impact signal is generated and sent to the lamp thermal management platform. After receiving the high thermal impact signal, the lamp thermal management platform resets the use position of the heat pipe body. When the current position causes a high thermal impact on the heat pipe body of the corresponding specification during historical operation, the heat pipe body specification is replaced at the current position, and the heat pipe body environment is controlled when the environmental impact at the current position is large.

[0039] If the thermal impact analysis coefficient during the operation of the heat pipe body does not exceed the thermal impact analysis coefficient threshold, it is inferred that the heat pipe body is not affected by the location environment during real-time operation, and a low thermal impact signal is generated and sent to the lamp thermal management platform;

[0040] At the same time, a heat conduction path analysis signal is generated and sent to the heat conduction path analysis unit. After receiving the heat conduction path analysis signal, the heat conduction path analysis unit analyzes the heat conduction path inside the heat pipe body, and infers whether the real-time thermal management effect inside the heat pipe body meets the requirements based on the heat conduction analysis inside the heat pipe body, so as to avoid abnormal thermal conductivity inside the heat pipe body causing the operating temperature inside the heat pipe body to be too high, resulting in reduced luminous efficiency of the chip inside the heat pipe body, accelerated light decay, and reduced service life;

[0041] When the internal temperature of the heat pipe body rises to the set temperature during operation, thermal management is performed and the thermal management period is obtained as the starting point at the current time. The maximum peak value of the internal temperature of the heat pipe body corresponding to the non-overlapping time of the temperature rise period and the temperature control period in the thermal management period is obtained. At the same time, the maximum deviation value of the heat conduction speed at each position inside the heat pipe body during temperature control in the thermal management period is obtained. The maximum peak value of the internal temperature of the heat pipe body corresponding to the non-overlapping time of the temperature rise period and the temperature control period in the thermal management period and the maximum deviation value of the heat conduction speed at each position inside the heat pipe body during temperature control in the thermal management period are marked as thermal conduction peak information and thermal conduction speed information, respectively, and compared with the temperature maximum peak threshold and the thermal conduction speed maximum deviation threshold, respectively:

[0042] If the highest peak value of the internal temperature of the heat pipe body corresponding to the non-overlapping time of the temperature rise period and the temperature control period during the thermal management period exceeds the highest temperature peak threshold, or the maximum deviation value of the heat conduction speed at each position inside the heat pipe body during the temperature control during the thermal management period exceeds the maximum deviation value threshold of the heat conduction speed, it is inferred that the internal heat conduction path analysis of the heat pipe body during the thermal management period is unqualified, and a path abnormality signal is generated and sent to the lamp thermal management platform. After receiving the path abnormality signal, the lamp thermal management platform replaces the thermal conductive materials at each position inside the heat pipe body. At the same time, when the thermal conductive material inside the heat pipe body has a large deviation corresponding to the thermal conductive speed, manual intervention is performed to prevent a certain position from being continuously at high temperature and having a temperature difference, causing damage to the internal components of the heat pipe body;

[0043] If the highest peak value of the internal temperature of the heat pipe body corresponding to the non-overlapping time of the temperature rise period and the temperature control period in the thermal management period does not exceed the temperature highest peak threshold, and the maximum deviation value of the heat conduction speed at each position inside the heat pipe body during the temperature control in the thermal management period does not exceed the thermal conduction speed maximum deviation value threshold, it is inferred that the internal heat conduction path analysis of the heat pipe body in the thermal management period is qualified, and a path normal signal is generated and sent to the lamp thermal management platform;

[0044] At the same time, a distribution state detection signal is generated and sent to a distribution state detection unit. After receiving the distribution state detection signal, the distribution state detection unit detects the temperature distribution state of the heat pipe body after the thermal impact analysis and the heat conduction path analysis are both qualified, and infers whether the temperature distribution state of each position in the heat pipe body is qualified, so as to monitor the temperature influence of each part of the heat pipe body in real time, accurately distinguish the degree of temperature influence at different positions, and facilitate timely adjustment, thereby improving the thermal management pertinence of the heat pipe body;

[0045] The outer shell of the heat pipe body is marked as a heat conduction surface and divided into several sub-areas, and the temperature value ratio of the maximum surface temperature of any heat conduction surface sub-area and the difference between the internal and external temperatures of the corresponding sub-area when the heat pipe body is running at the start-up time is obtained. At the same time, the time deviation between the rise of the surface temperature of any heat conduction surface sub-area and the rise of the internal temperature of the heat pipe body when the heat pipe body is in the thermal management period is obtained. It can be understood that the higher the surface temperature of the sub-area, the better the corresponding heat dissipation efficiency;

[0046] The temperature value ratio of the maximum surface temperature of any heat conduction surface sub-area during the start-up operation of the heat pipe body to the internal and external temperature difference of the corresponding sub-area, and the deviation time of the surface temperature rise of any heat conduction surface sub-area and the internal temperature rise of the heat pipe body when the heat pipe body is in the thermal management period are marked as distribution temperature data and distribution time data, respectively, and compared with the temperature value ratio threshold and deviation time threshold respectively:

[0047] If the temperature value ratio of the maximum surface temperature of any heat-conducting surface sub-area to the difference between the internal and external temperatures of the corresponding sub-area when the heat pipe body is running at the start-up time exceeds the temperature value ratio threshold, and the deviation time between the rise of the surface temperature of any heat-conducting surface sub-area and the rise of the internal temperature of the heat pipe body when the heat pipe body is in the thermal management period does not exceed the deviation time threshold, it is inferred that the heat pipe body heat-conducting surface distribution state detection is qualified, and a distribution high-efficiency signal is generated and sent to the lamp thermal management platform;

[0048] If the temperature value ratio of the maximum surface temperature of any heat-conducting surface sub-area to the difference between the internal and external temperatures of the corresponding sub-area when the heat pipe body is running and starting operation does not exceed the temperature value ratio threshold, or the deviation time between the rise of the surface temperature of any heat-conducting surface sub-area and the rise of the internal temperature of the heat pipe body when the heat pipe body is in the thermal management period exceeds the deviation time threshold, it is inferred that the heat-conducting surface distribution state detection of the heat pipe body is unqualified, and a distribution inefficiency signal is generated and sent to the lamp thermal management platform. After receiving the distribution inefficiency signal, the lamp thermal management platform replaces the heat-conducting surface material inside the heat pipe body and monitors the sub-area with continuous high temperature in real time to avoid excessive use that reduces the thermal conductivity so that it cannot play a heat conduction role during operation;

[0049] Embodiment 2

[0050] This embodiment is based on the previous embodiment, and a management efficiency analysis unit is added. Figure 2 As shown, the lamp thermal management platform generates a management efficiency analysis signal and sends the management efficiency analysis signal to the management efficiency analysis unit. After receiving the management efficiency analysis signal, the management efficiency analysis unit analyzes the management efficiency in the heat pipe body, and infers whether the real-time operating state of the heat pipe body can continue to operate stably through thermal management efficiency analysis detection, and monitors the operating performance of the heat pipe body in real time, so as to facilitate timely performance regulation when the operating performance is abnormal;

[0051] Obtain the maximum span value of the temperature rise when the surrounding temperature rises when the light source inside the heat pipe body is running and the heat transfer surface is not conducting heat. The heat generated by the light source causes the ambient temperature around the light source to rise, but there is a distance between the light source and the heat transfer surface, and there is a matching gap in the middle;

[0052] At the same time, the internal temperature value floating speed rise value corresponding to the external temperature floating moment of the heat transfer surface when there is no hot spot inside the heat pipe body is obtained, and the shortest time taken for the internal temperature of the heat transfer surface to drop to the external temperature when there is a hot spot inside the heat pipe body is collected; the value ratio is calculated based on the collected speed rise value and the shortest time taken, and the influence of the unit is eliminated to obtain the ratio of the two values, and the technical solution collects the influence of the floating of the two values, that is, the faster the speed rise value or the shorter the cooling time, the more likely the heat transfer surface is to be affected by the outside world, and vice versa, the slower the speed rise value or the longer the cooling time takes, the lower the heat transfer efficiency of the heat transfer surface;

[0053] The internal temperature value floating speed rise value corresponding to the external temperature floating time of the heat transfer surface when there is no hot spot inside the heat pipe body, and the shortest time taken for the internal temperature of the heat transfer surface to drop to the external temperature when there is a hot spot inside the heat pipe body are compared with the corresponding threshold ranges:

[0054] If any of the data of the floating speed rise value of the internal temperature value corresponding to the floating time of the external temperature of the heat-conducting surface when there is no hot spot inside the heat pipe body, and the shortest time taken for the internal temperature of the heat-conducting surface to drop to the external temperature when there is a hot spot inside the heat pipe body is not within the corresponding threshold range, it is inferred that the thermal management efficiency analysis of the heat pipe body is abnormal, and a thermal management rectification signal is generated and sent to the lamp thermal management platform. After receiving the thermal management rectification signal, the lamp thermal management platform replaces the thermal surface material of the heat pipe body and monitors and controls the thermal surface environment;

[0055] If any of the data of the floating speed rise value of the internal temperature value corresponding to the floating time of the external temperature of the heat conducting surface when there is no hot spot inside the heat pipe body, and the shortest time taken for the internal temperature of the heat conducting surface to drop to the external temperature when there is a hot spot inside the heat pipe body are within the corresponding threshold range, it is inferred that the thermal management efficiency analysis of the heat pipe body is normal, and a qualified thermal management efficiency signal is generated and sent to the lamp thermal management platform;

[0056] The above formulas are obtained by collecting a large amount of data and performing software simulation, and a formula close to the actual value is selected. The coefficients in the formula are set by technicians in this field according to actual conditions;

[0057] When the present invention is in use, the LED lighting lamp is marked as the heat pipe body, and the thermal impact analysis unit collects thermal impact information and substitutes it into the formula to obtain the thermal impact analysis coefficient during the operation of the heat pipe body. According to the thermal impact analysis coefficient, it is inferred whether the heat pipe body is affected by the location environment during real-time operation. If yes, position planning is performed. If not, the thermal conduction path analysis unit is used to analyze the internal heat conduction path of the heat pipe body, and the thermal conduction peak information and thermal conduction speed information are collected. According to the information comparison, it is inferred whether the thermal conduction path analysis is qualified. If not, thermal conduction regulation is performed. If yes, the temperature distribution state is detected by the distribution state detection unit, and the outer shell of the heat pipe body is marked as a thermal conduction surface and divided into a number of sub-areas, and the distribution temperature data and the distribution time data are obtained. According to the data analysis, it is inferred whether the distribution state detection is qualified. If yes, monitoring is continued. If not, state control is performed.

[0058] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The LED lighting thermal management system based on multi-source data analysis is characterized by: It includes a lamp thermal management platform, and the lamp thermal management platform is communicatively connected with a heat impact analysis unit, a heat conduction path analysis unit and a distribution state detection unit; The LED lighting lamp is marked as the heat pipe body. The thermal impact analysis unit collects the thermal impact information and substitutes it into the formula to obtain the thermal impact analysis coefficient during the operation of the heat pipe body. According to the thermal impact analysis coefficient comparison, it is inferred whether the heat pipe body is affected by the location environment during real-time operation. If yes, position planning is carried out. If not, the thermal conduction path analysis unit is used to analyze the internal thermal conduction path of the heat pipe body, and the thermal conduction peak information and thermal conduction speed information are collected. According to the information comparison, it is inferred whether the thermal conduction path analysis is qualified. If not, thermal conduction regulation is carried out. If yes, the temperature distribution state is detected by the distribution state detection unit, and the outer shell of the heat pipe body is marked as the thermal conduction surface and divided into several sub-areas. The distribution temperature data and distribution time data are obtained. According to the data analysis, it is inferred whether the distribution state detection is qualified. If yes, monitoring continues. If not, state control is carried out.

2. The LED lighting lamp thermal management system based on multi-source data analysis according to claim 1, characterized in that: The thermal impact information includes the corresponding speed ratio deviation value between the floating speed of the ambient environment parameter value at the corresponding position and the floating speed of the same type of parameter value inside the heat pipe body when the heat pipe body of the same specification is at different positions, and is set as PC; The average floating span of the internal parameters of the heat pipe body during the low span rising trend stage of the surrounding environmental parameters, and the continuous update speed of the peak value of the internal parameters of the heat pipe body during the high span rising trend stage of the surrounding environmental parameters, set the label S 升 and V 升 ; The floating speed of the constant value corresponding to the internal parameter setting of the heat pipe body during the low span downward trend stage of the ambient environment parameters, and the instantaneous increase span of the deviation value corresponding to the actual value of the internal parameter of the heat pipe body and the constant value during the high span downward trend stage of the ambient environment parameters, set the label F 降 and K 降 .

3. The LED lighting lamp thermal management system based on multi-source data analysis according to claim 2, characterized in that: The formula is: Among them, R is the thermal impact analysis coefficient, v1, v2, v3, v4, and v5 are respectively the preset proportional coefficients, and e is a natural constant. β is used as an error correction factor and its value is 0.

98.

4. The LED lighting lamp thermal management system based on multi-source data analysis according to claim 3, characterized in that: If the thermal impact analysis coefficient exceeds the thermal impact analysis coefficient threshold, a high thermal impact signal is generated; if the thermal impact analysis coefficient does not exceed the thermal impact analysis coefficient threshold, a low thermal impact signal is generated.

5. The LED lighting lamp thermal management system based on multi-source data analysis according to claim 1, characterized in that: The thermal conductivity peak information and thermal conductivity speed information are respectively the highest peak value of the internal temperature of the heat pipe body corresponding to the non-overlapping time of the temperature rise period and the temperature control period during the thermal management period, and the maximum deviation value of the thermal conductivity speed at each position inside the heat pipe body during temperature control during the thermal management period.

6. The LED lighting lamp thermal management system based on multi-source data analysis according to claim 5, characterized in that: If the thermal conductivity peak value information exceeds the maximum temperature peak value threshold, or the thermal conductivity speed information exceeds the thermal conductivity speed maximum deviation value threshold, a path abnormality signal is generated; If the thermal conductivity peak value information does not exceed the temperature maximum peak value threshold, and the thermal conductivity speed information does not exceed the thermal conductivity speed maximum deviation value threshold, a path normal signal is generated.

7. The LED lighting lamp thermal management system based on multi-source data analysis according to claim 1, characterized in that: The distribution temperature data and distribution time data are respectively the temperature numerical ratio of the maximum surface temperature of any heat conduction surface sub-area to the internal and external temperature difference of the corresponding sub-area when the heat pipe body is starting to run, and the deviation time between the rise of the surface temperature of any heat conduction surface sub-area and the rise of the internal temperature of the heat pipe body when the heat pipe body is in the thermal management period.

8. The LED lighting lamp thermal management system based on multi-source data analysis according to claim 7, characterized in that: If the distribution temperature data exceeds the temperature value ratio threshold and the distribution duration data does not exceed the deviation duration threshold, a distribution high efficiency signal is generated; if the distribution temperature data does not exceed the temperature value ratio threshold, or the distribution duration data exceeds the deviation duration threshold, a distribution low efficiency signal is generated.

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