Manufacturing method of composite conductive film
Through the through-hole processing of the film substrate and the electroplating and thickening of the rotary conductive roller, the problems of poor bonding force and difficulty in conducting connection between the composite fluid-collection conductive layer and the substrate are solved, and efficient and low-cost conductive layer thickening is achieved. Suitable for commercial promotion.
Patent Information
- Application Number
- CN202310874132.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-17
- Publication Date
- 2025-01-17
AI Technical Summary
The composite liquid collector has poor bonding force between the conductive layer and the substrate, high processing cost, and difficulty in connecting the conductive film.
By perforating the film substrate and using thickening electroplating processing equipment to contact the rotating conductive roller and the conductive layer, the conductive current is realized, forming a thickened conductive layer, and solving the bonding force between the conductive layer and the substrate Problems of poor and difficult conductivity connection.
It improves the bonding force between the conductive layer and the substrate, reduces processing costs, simplifies the conductive connection process, improves production efficiency, and forms a conductive film with good adhesion, which is suitable for large-scale commercial applications.
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Figure CN119324092A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a method for manufacturing a conductive film, in particular to a method for manufacturing a composite conductive film. Background Art
[0002] With the advancement of process technology, composite thin film conductive materials (composite current collectors) have been gradually developed and applied. Compared with conventional all-metal thin film current collectors, composite current collectors use a structure of composite conductive film on the surface (single or double sides) of a polymer film substrate, which has the advantages of good tensile strength, light weight, less conductive material consumption, low material cost, and certain flame retardant and explosion-proof effects, showing good development prospects.
[0003] However, in the development process of composite current collectors, there are still a series of problems that need to be solved urgently, such as: the bonding strength between the conductive layer and the substrate, the high cost of the processing process, and the difficulty of conductive connection between the ultra-thin conductive layer and the lead-out connector.
[0004] For example, in the currently common two-step composite current collector manufacturing method, the further processing method for the film that has completed the conductive treatment is to use the method of electroplating thickening by clamping the conductive edges on both sides. There are significant defects such as complex equipment, low resistance requirement for the first step of electroplating square resistor, slow electroplating speed, and poor uniformity, which leads to high comprehensive cost of composite current collector; at the same time, the bonding strength between the polymer film substrate and the metal films on both sides is not high, and there is a risk of falling off and failure under long-term use; in addition, the thickness of the current collector metal layer is too thin, which also brings great challenges to the difficulty of welding with the lead-out electrode and long-term reliability.
[0005] The present invention provides a method for preparing a novel three-dimensional composite conductive film, which can solve the above problems to a certain extent. Summary of the invention
[0007] The purpose of the present invention is to provide a composite conductive film, which adopts through holes and adjustment of different conductive layer thicknesses within a controllable range to solve a series of problems such as poor bonding between the conductive layer and the substrate, high processing cost, and difficulty in connecting the conductive film.
[0008] The present invention provides a method for manufacturing a composite conductive film, which is characterized by: performing the following steps: 101 perforation step: processing the film substrate with regularly distributed through holes; 102 conductive step: performing vacuum coating, chemical coating or ion coating on the A surface, B surface and through hole wall of the film substrate to form an A surface conductive layer, a B surface conductive layer and a through hole wall conductive layer that are mutually conductively connected, and together with the film substrate, they form a primary composite conductive film; 103 thickening step: using thickening electroplating processing equipment to process the A surface conductive layer and / or the B surface conductive layer. The conductive layer and the through-hole wall conductive layer are electroplated to be thickened, and the thickening electroplating processing equipment includes an electroplating tank, a rotating conductive roller and an electroplating solution. The thickening electroplating processing equipment utilizes the rotating conductive roller thereon to contact the A-side conductive layer or the B-side conductive layer. Since the two-side conductive layers and the through-hole wall conductive layer are mutually conductively connected, the electroplating current is conducted to the through-hole wall conductive layer and the other side conductive layer in contact with the electroplating solution, thereby achieving electroplating thickening of the B-side conductive layer, the A-side conductive layer and the through-hole wall conductive layer to form a thickened conductive layer.
[0009] Furthermore, the through holes are regularly distributed and are processed by laser or mechanical means.
[0010] Furthermore, in the thickening step 103, the A-side conductive layer immersed in the plating solution of the thickening electroplating processing equipment is tightly fitted with the rotating conductive roller, and the A-side conductive layer and the rotating conductive roller will not contact the plating solution, thereby achieving electroplating thickening of only the B-side conductive layer and the through-hole wall conductive layer that are not in contact with the rotating conductive roller, thereby preventing the rotating conductive roller and the A-side conductive layer from being electroplated and thickened.
[0011] Furthermore, the rotating conductive roller is a stacked rotating conductive roller in which annular electrode regions and annular insulating regions are alternately stacked along the length direction of its axis, and the width of the annular electrode regions and the width of the annular insulating regions can be adjusted as needed.
[0012] Furthermore, the electroplating currents of different magnitudes are applied to the annular electrode regions at different positions to adjust the thickening speed of the thickened conductive layer corresponding to the annular electrode regions.
[0013] Furthermore, the annular electrode region is arranged corresponding to a region of the film substrate where there is no through hole.
[0014] Furthermore, the annular insulating area is arranged corresponding to the area of the film substrate where the through holes are arranged, so as to prevent the surface of the annular electrode area of the rotating conductive roller from being thickened by electroplating.
[0015] Furthermore, in the thickening step 103, the primary composite conductive film is subjected to multiple thickening electroplating processes on the A-side conductive layer and / or the B-side conductive layer and the through-hole wall conductive layer in the traveling direction by a plurality of the rotating conductive rollers.
[0016] Furthermore, the multiple thickening electroplating processes are to first electroplate the thickened conductive layer on the A-side conductive layer and the through-hole wall conductive layer; and then electroplate the thickened conductive layer on the B-side conductive layer and the through-hole wall conductive layer.
[0017] Alternatively, the thickened conductive layer is electroplated multiple times on the A-side conductive layer and the B-side conductive layer alternately. During the process of alternating electroplating of the thickened conductive layer on the A-side conductive layer and the B-side conductive layer, the thickened conductive layer is electroplated on the through-hole wall conductive layer.
[0018] Furthermore, during the multiple thickening electroplating processes, the number of rotating conductive rollers used for the thickening conductive layer electroplating of the A-side conductive layer and the B-side conductive layer is the same or different.
[0019] Preferably, the thickening electroplating processing equipment is provided with at least one online thickness detection device, which controls the corresponding electroplating current value through thickness dimension signal feedback, thereby achieving accurate control of the thickening dimension.
[0020] The present invention proposes a method for making a composite conductive film, which uses a thickening electroplating processing device to electroplate and thicken the primary composite conductive film. Specifically, the electroplating current is introduced by contacting a rotating conductive roller with a conductive layer on one side of the primary composite conductive film. The electroplating current only needs a short distance to pass through the conductive layer of the through-hole wall to reach the conductive layer on the other side in contact with the electroplating solution, thereby achieving electroplating and thickening of the conductive layer on the other side. Compared with the current electroplating thickening method of conducting electricity at two edges, it can greatly improve production efficiency and has low requirements for conductive pretreatment. At the same time, it can also achieve different electroplating currents for different width position areas, and can thicken or thin the electroplated film layer in a specific area to meet more flexible market needs. The composite conductive film made by this method has controllable thickness in the width direction, low cost, good adhesion and strong functionality of the formed conductive layer, and can effectively solve the problem of difficult conductive connection between the ultra-thin conductive layer and the lead-out connector, which is suitable for large-scale commercial promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 Schematic diagram of a method for preparing a composite conductive film;
[0023] Figure 2 It is a schematic diagram of the structure of the superimposed rotating conductive roller;
[0024] Figure 3 It is a schematic diagram of the structure of the thickening electroplating processing equipment;
[0025] Figure 4 It is a schematic diagram of the corresponding positions of the superimposed rotating conductive roller and the film substrate;
[0026] Figure 5 is a schematic diagram of the structure of the composite conductive film;
[0027] In the figure, 1 is a film substrate; 2 is a rotating conductive roller; 3 is a thickening electroplating processing equipment; 4 is a stacked rotating conductive roller, 5 is a through hole; 51 is a first through hole, 52 is a second through hole, 6 is a through hole wall conductive layer; 7 is an A-side conductive layer; 8 is a B-side conductive layer, 9 is a thickening conductive layer, 10 is a plating solution, 11 is a primary composite conductive film; 401 is a first annular insulating region 1; 402 is a first annular electrode region 1; 411 is a second annular insulating region 1; 412 is a first The second circular electrode area 1; 421 is the third circular insulating area 1; 422 is the third circular electrode area 1; 403 is the first circular insulating area 2; 404 is the first circular electrode area 2; 413 is the second circular insulating area 2; 414 is the second circular electrode area 2; 423 is the third circular insulating area 2; 424 is the third circular electrode area 2; a is the first type of thickening electroplating processing equipment; b is the second type of thickening electroplating processing equipment; c is the first type of thickening electroplating processing equipment. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0029] The present invention provides a method for preparing a composite conductive film. Figure 1As shown, it is characterized in that: it is carried out in the following steps: 101 perforation step: the film substrate is processed with regularly distributed through holes; the through holes in the film substrate are regularly distributed, and the irregular through holes are obtained by laser processing or mechanical processing, preferably by laser processing; the film substrate 1 is divided into at least two strip areas in the width direction, and the through holes are arranged at different densities in different strip areas; the through holes arranged in different strip areas are different in area, and the distribution density of the areas of the through holes in different strip areas is the same or different, preferably, the shape of the through holes is circular, the area of the through holes accounts for less than 1% of the area of the entire area of the through holes arranged in the film substrate 1, and the area of the through holes is between 3 square micrometers and 3 square millimeters; the setting of the through holes can effectively Enhance the bonding force between the subsequent conductive layer and the film substrate; 102 Conductive link: vacuum coating, chemical coating or ion coating is performed on the A surface, B surface and through-hole wall of the film substrate to form interconnected A surface conductive layer, B surface conductive layer and through-hole wall conductive layer, which together with the film substrate form a primary composite conductive film; generally, the A surface conductive layer, the B surface conductive layer and the through-hole wall conductive layer have the same thickness and are made of the same material; 103 Thickening link: use thickening electroplating processing equipment to electroplating thicken the A surface conductive layer and / or the B surface conductive layer and the through-hole wall conductive layer, the thickening electroplating processing equipment uses a rotating conductive roller thereon to contact the A surface conductive layer or the B surface conductive layer, and applies an electroplating current to the B surface conductive layer or the A surface conductive layer for electroplating thickening to form a thickened conductive layer; such as Figure 3 As shown, the A-side conductive layer immersed in the plating solution (10) of the thickening electroplating processing equipment is tightly fitted with the rotating conductive roller (2), and the A-side conductive layer and the rotating conductive roller (2) will not contact the plating solution (10), thereby achieving electroplating thickening of only the B-side conductive layer and the through-hole wall conductive layer that are not in contact with the rotating conductive roller (2), thereby preventing the rotating conductive roller and the A-side conductive layer from being electroplated and thickened.
[0030] like Figure 2 As shown, the rotating conductive roller is a superimposed rotating conductive roller (4) in which the annular electrode area and the annular insulating area are alternately superimposed along the length direction of the axis, and different plating currents are applied to the annular electrode areas at different positions to adjust the thickening speed of the thickened conductive layer corresponding to the annular electrode areas. Figure 2As shown in, the first annular insulating region 1 (401) and the first annular electrode region 1 (402) are arranged alternately; the second annular insulating region 1 (411) and the second annular electrode region 1 (412) are arranged alternately; the third annular insulating region 1 (421) and the third annular electrode region 1 (422) are arranged alternately. When the first annular electrode region 1 (402), the second annular electrode region 1 (412) and the third annular electrode region 1 (422) are in close contact with the A-side conductive layer, the electroplating current is released to thicken the B-side conductive layer and the through-hole wall conductive layer, the annular electrode region transfers the electroplating current to the A-side conductive layer, and the A-side conductive layer further transfers the electroplating current to the adjacent through-hole wall conductive layer and the B-side conductive layer, and the electroplating solution electroplates and thickens the through-hole wall conductive layer and the B-side conductive layer, but does not electroplating and thicken the A-side conductive layer and the annular electrode region. When the first circular electrode region 1 (402), the second circular electrode region 1 (412) and the third circular electrode region 1 (422) are in close contact with the B-side conductive layer, the electroplating current is released to thicken the A-side conductive layer and the through-hole wall conductive layer, the circular electrode region transfers the electroplating current to the B-side conductive layer, and the B-side conductive layer then transfers the electroplating current to the adjacent through-hole wall conductive layer and the A-side conductive layer, and the electroplating solution electroplates and thickens the through-hole wall conductive layer and the A-side conductive layer, but does not electroplating and thicken the B-side conductive layer and the circular conductive electrode region. Figure 5 The composite conductive film is formed by applying different electroplating currents to the primary composite film substrate 11 through the first circular electrode region 1 (402), the second circular electrode region 1 (412) and the third circular electrode region 1 (422), for example, the electroplating current applied by the first circular electrode region 1 (402) is greater than the electroplating current applied by the second circular electrode region 1 (412) and the electroplating current applied by the third circular electrode region 1 (422), so that the thickened conductive layer 9 can be obtained in two distribution forms: a smaller thickness in the middle and a larger thickness on both sides, or a larger thickness in the middle and a smaller thickness on both sides. Figure 5 As shown, the composite conductive film (11) obtained by the composite conductive film manufacturing method of the present invention has the thickened conductive layer (9) arranged on the A-side conductive layer (7), and the thickened conductive layer (9) is distributed in a form of having a smaller thickness in the middle and a larger thickness on both sides. Such an arrangement can meet the connection requirements between the composite conductive film and the lead-out wiring, and the conductive layer of the composite conductive film is made into a structure in which the conductive layer is thinner in most areas and the conductive layer is thicker in one or two edge areas, so as to enable better welding and lead-out. It should be noted that the present invention only shows Figure 5 The distribution form in which the thickness in the middle is smaller and the thickness on both sides is larger, and other distribution forms, such as the distribution form in which the thickness in the middle is larger and the thickness on both sides is smaller, also fall within the protection scope of the present invention.
[0031] like Figure 3 The figure is a schematic diagram of the structure of the thickening electroplating processing equipment, which includes an electroplating tank, a plurality of rotating conductive rollers (2) and an electroplating solution (10). The primary composite conductive film (11) is subjected to multiple thickening electroplating processes on the A-side conductive layer and / or the B-side conductive layer and the through-hole wall conductive layer in the traveling direction by the plurality of rotating conductive rollers (2). Figure 3 As shown in a, the first thickening electroplating processing equipment comprises four rotating conductive rollers (2), which can only perform electroplating thickening on a single side of the primary composite conductive film (11) and the through-hole wall conductive layer. For example, when the B-side conductive layer and the through-hole wall conductive layer are electroplated and thickened, the A-side conductive layer immersed in the electroplating solution (10) is in close contact with the rotating conductive roller (2), and the rotating conductive roller (2) discharges the primary composite conductive film (11), and the electroplating current passes through the A-side conductive layer and is introduced into the through-hole wall conductive layer and the B-side conductive layer, so that the surface of the B-side conductive layer and the through-hole wall conductive layer is electroplated and thickened to form the thickened conductive layer. Since the A-side conductive layer is closely fitted with the rotating conductive roller (2), the rotating conductive roller (2) and the A-side conductive layer can be prevented from being electroplated and thickened. When the A-side conductive layer and the through-hole wall conductive layer are electroplated to be thickened, the B-side conductive layer immersed in the electroplating solution (10) is in close contact with the rotating conductive roller (2), and the rotating conductive roller (2) discharges the primary composite conductive film (11). The electroplating current passes through the B-side conductive layer and is introduced into the through-hole wall conductive layer and the A-side conductive layer, so that the surfaces of the A-side conductive layer and the through-hole wall conductive layer are electroplated to be thickened to form the thickened conductive layer. Since the B-side conductive layer is closely fitted to the rotating conductive roller (2), the rotating conductive roller (2) and the B-side conductive layer can be prevented from being electroplated to be thickened. Figure 3b shows the second type of thickening electroplating processing equipment, wherein the multiple thickening electroplating processing can realize the simultaneous electroplating thickening of the A surface conductive layer, the B surface conductive layer and the through-hole wall conductive layer, and the multiple thickening electroplating processing is to first electroplate the A surface conductive layer and the through-hole wall conductive layer with the thickening conductive layer, and then electroplate the B surface conductive layer and the through-hole wall conductive layer with the thickening conductive layer. The primary composite conductive film (11) is subjected to multiple rotating conductive rollers (2) to perform multiple electroplating thickening on the A surface conductive layer and the through-hole wall conductive layer, and then the primary composite conductive film (11) is subjected to a reversing treatment, and the B surface conductive layer and the through-hole wall conductive layer are subjected to multiple electroplating thickening on the multiple rotating conductive rollers (2), and a thickening conductive layer is added to each of the A surface conductive layer and the B surface conductive layer. Figure 3c shows the third type of thickening electroplating processing equipment, wherein the multiple thickening electroplating processes alternately perform multiple rounds of electroplating of the thickened conductive layer on the A-side conductive layer and the B-side conductive layer, and during the process of alternately electroplating the thickened conductive layer on the A-side conductive layer and the B-side conductive layer, the thickened conductive layer is electroplated on the through-hole wall conductive layer. The third type of thickening electroplating processing equipment comprises a plurality of rotating conductive rollers (2), and each time the primary composite conductive film (11) passes through a single rotating conductive roller (2), it will be turned over, that is, the plurality of rotating conductive rollers (2) sequentially perform thickening electroplating on the A-side conductive layer and the B-side conductive layer of the primary composite conductive film (11), and the electroplating thickening sequence is A-side conductive layer-B-side conductive layer-A-side conductive layer-B-side conductive layer..., so that a thickened conductive layer is added to each of the A-side conductive layer and the B-side conductive layer. It should be noted that in the above process, the thickened conductive layer is electroplated on the through-hole wall conductive layer. It should be particularly pointed out that in the above-described method for thickening the conductive layer, when the B-side conductive layer contacts the rotating conductive roller (2), the rotating conductive roller (2) performs electroplating thickening on the A-side conductive layer and the through-hole wall conductive layer; when the A-side conductive layer contacts the rotating conductive roller (2), the rotating conductive roller (2) performs electroplating thickening on the B-side conductive layer and the through-hole wall conductive layer. In other words, the rotating conductive roller (2) only thickens the uncontacted conductive layer and the through-hole wall conductive layer, and the contacted conductive layer does not change. In the above-mentioned multiple thickening electroplating processes, the number of the rotating conductive rollers (2) for electroplating the thickened conductive layer on the A-side conductive layer and the B-side conductive layer is the same or different. In the embodiment of the present invention, the number of the rotating conductive rollers (2) for electroplating the thickened conductive layer on the A-side conductive layer and the B-side conductive layer is the same, but the situation where the number is different also falls within the protection scope of the patent of the present invention. Preferably, the thickening electroplating processing equipment is provided with at least one online thickness detection device, which controls the corresponding electroplating current value through thickness dimension signal feedback, thereby achieving accurate control of the thickening dimension.
[0032] like Figure 4The figure is a schematic diagram of the corresponding positions of the stacked rotating conductive roller 4 and the primary composite conductive film (11), wherein the annular electrode region is arranged correspondingly in the region of the film substrate (1) without the through hole, and the annular insulating region is arranged correspondingly in the region of the film substrate where the through hole is arranged, so as to prevent the surface of the annular electrode region of the rotating conductive roller from being electroplated and thickened. Two types of through holes are arranged on the film substrate (1), namely, a first through hole (51) and a second through hole (52), and the areas of the first through hole (51) and the second through hole (52) are different. In this embodiment, the area of the second through hole (52) is smaller than that of the first through hole (51). For example, the first circular electrode region 1 (401) is arranged correspondingly in the region of the thin film substrate (1) where the second through hole (52) is not present, and the first circular insulating region 1 (402) is arranged correspondingly in the region of the thin film substrate (1) where the second through hole (52) is present; the second circular electrode region 1 (411) is arranged correspondingly in the region of the thin film substrate (1) where the second through hole (52) is not present, and the second circular insulating region 1 (412) is arranged correspondingly in the region of the thin film substrate (1) where the second through hole (52) is present; the third circular electrode region 1 (421) is arranged correspondingly in the region of the thin film substrate (1) where the second through hole (52) is not present, and the third circular insulating region 1 (422) is arranged correspondingly in the region of the thin film substrate (1) where the second through hole 52 is present; The first circular ring electrode region 2 (403) is arranged correspondingly in the region of the film substrate (1) where there is no first through hole (51), and the first circular ring insulating region 2 (404) is arranged correspondingly in the region of the film substrate 1 where the first through hole 51 is arranged; the second circular ring electrode region 2 (413) is arranged correspondingly in the region of the film substrate 1 where there is no first through hole 51, and the second circular ring insulating region 2 (414) is arranged correspondingly in the region of the film substrate 1 where the first through hole 51 is arranged; the third circular ring electrode region 2 (423) is arranged correspondingly in the region of the film substrate 1 where there is no first through hole 51, and the third circular ring insulating region 2 (424) is arranged correspondingly in the region of the film substrate 1 where the first through hole 51 is arranged; such an arrangement can prevent the circular ring electrode region from being thickened by electroplating.
[0033] The present invention proposes a method for making a composite conductive film, which uses a thickening electroplating processing device to electroplate and thicken the primary composite conductive film. Specifically, the electroplating current is introduced by contacting a rotating conductive roller with a conductive layer on one side of the primary composite conductive film. The electroplating current only needs a short distance to pass through the conductive layer of the through-hole wall to reach the conductive layer on the other side in contact with the electroplating solution, thereby achieving electroplating and thickening of the conductive layer on the other side. Compared with the current electroplating thickening method of conducting electricity at two edges, it can greatly improve production efficiency and has low requirements for conductive pretreatment. At the same time, it can also achieve different electroplating currents for different width position areas, and can thicken or thin the electroplated film layer in a specific area to meet more flexible market needs. The composite conductive film made by this method has controllable thickness in the width direction, low cost, good adhesion and strong functionality of the formed conductive layer, and can effectively solve the problem of difficult conductive connection between the ultra-thin conductive layer and the lead-out connector, which is suitable for large-scale commercial promotion and application.
[0034] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims
1. A method for preparing a composite conductive film, characterized in that: Proceed as follows: 101: Perforation process: performing regularly distributed through-hole processing on the film substrate; 102: Conductive step: vacuum coating, chemical coating or ion coating is performed on the A surface, B surface and through-hole wall of the film substrate to form an A surface conductive layer, a B surface conductive layer and a through-hole wall conductive layer which are interconnected and conductively connected to form a primary composite conductive film together with the film substrate; 103: Thickening step: The A-side conductive layer and / or the B-side conductive layer and the through-hole wall conductive layer are electroplated and thickened using thickening electroplating processing equipment. The thickening electroplating processing equipment uses a rotating conductive roller thereon to contact the A-side conductive layer or the B-side conductive layer, and applies an electroplating current to the B-side conductive layer or the A-side conductive layer and the through-hole wall conductive layer to perform electroplating thickening to form a thickened conductive layer.
2. The method for manufacturing a composite conductive film according to claim 1, characterized in that: The through holes are regularly distributed and are processed by laser or mechanical means.
3. The method for manufacturing a composite conductive film according to claim 1, characterized in that: In the 103 thickening step, the A-side conductive layer immersed in the plating solution of the thickening electroplating processing equipment is tightly fitted with the rotating conductive roller, so that only the B-side conductive layer and the through-hole wall conductive layer that are not in contact with the rotating conductive roller are electroplated and thickened, avoiding the rotating conductive roller and the A-side conductive layer from being electroplated and thickened.
4. The method for manufacturing a composite conductive film according to claim 3, characterized in that: The rotating conductive roller is a stacked rotating conductive roller in which annular electrode areas and annular insulating areas are alternately stacked along the length direction of the axis.
5. The method for manufacturing a composite conductive film according to claim 4, characterized in that: The electroplating currents of different magnitudes are applied to the annular electrode regions at different positions to adjust the thickening speed of the thickened conductive layer corresponding to the annular electrode regions.
6. The method for manufacturing a composite conductive film according to claim 4, characterized in that: The annular electrode region is arranged correspondingly to the region of the film substrate without the through hole.
7. The method for making a composite conductive film according to claim 4, characterized in that: The annular insulating area is arranged corresponding to the area where the through hole is arranged on the film substrate, so as to prevent the surface of the annular electrode area of the rotating conductive roller from being thickened by electroplating.
8. The method for manufacturing a composite conductive film according to claim 3, characterized in that: In the thickening step 103, the primary composite conductive film is subjected to multiple thickening electroplating processes on the A-side conductive layer and / or the B-side conductive layer and the through-hole wall conductive layer in the traveling direction by a plurality of rotating conductive rollers.
9. The method for manufacturing a composite conductive film according to claim 8, characterized in that: The multiple thickening electroplating processes are firstly electroplating the thickened conductive layer on the A surface conductive layer and the through hole wall conductive layer, and then electroplating the thickened conductive layer on the B surface conductive layer and the through hole wall conductive layer; Alternatively, the thickened conductive layer is electroplated multiple times alternately on the A-side conductive layer and the B-side conductive layer. During the process of alternately electroplating the thickened conductive layer on the A-side conductive layer and the B-side conductive layer, the thickened conductive layer is electroplated on the through-hole wall conductive layer.
10. The method for manufacturing a composite conductive film according to claim 9, characterized in that: During the multiple thickening electroplating processes, the number of the rotating conductive rollers used for the thickening conductive layer electroplating of the A-side conductive layer and the B-side conductive layer is the same or different.
11. The method for manufacturing a composite conductive film according to claim 1, characterized in that: The thickening electroplating processing equipment is provided with at least one online thickness detection device, which controls the corresponding electroplating current value through thickness dimension signal feedback, thereby achieving accurate control of the thickening dimension.