Efficient wafer processing system and method

Abstract

The invention discloses an efficient wafer processing system and method, and aims to solve the technical problem of low productivity and output caused by the fact that a current wafer processing section needs to produce according to the number by lot of incoming wafers, and the system comprises a wafer batching module, an AI card control module, a wafer processing module, an unbinding module, a surface mounting module, a wafer mixing detection module and a wafer detection module. The wafer blending module is used for carrying out preliminary auditing on the batch of wafers; the AI card control module is used for identifying wafer system work order combinations which can be combined together after the wafers are fed; the wafer processing module is used for carrying out film pasting, grinding, pasting and cutting processing treatment on the wafer; and the unbinding module is used for manually scanning a wafer ID and a wafer box for unbinding before chip mounting (the system synchronously carries out material mixing to confirm unbinding). According to the invention, the number of wafers processed at a time can be increased under the condition that a sealing and testing factory cannot control incoming materials of the wafers, so that the productivity and efficiency of the wafer processing section are rapidly improved, and the processing cost of the wafer processing section is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to an efficient wafer processing system and method. Background Art

[0002] With the development of semiconductors, the packaging factory is troubled by the problem of low production capacity due to the small number of incoming wafers. When the packaging factory faces small batches of incoming wafers, all workstations become production capacity bottleneck workstations, which is quite a headache. For this reason, an efficient wafer processing system and method are needed to solve the problem.

[0003] In the process of realizing the invention, the inventor found that at least the following problems in the prior art have not been solved, and the traditional wafer processing system and method still have the following problems: 1. The small number of incoming wafers means that the number of wafers in each batch is small, which may affect the production efficiency and cost-effectiveness of the packaging and testing plant. When processing a small number of wafers, the packaging and testing plant may find it difficult to achieve economies of scale, resulting in higher unit costs; 2. The packaging and testing plant usually needs a certain number of wafers to maintain the operating efficiency and optimal utilization of its production equipment. The small number of incoming wafers may increase the idle time of equipment, thereby affecting production capacity and delivery time; 3. Processing a small number of wafers may increase the complexity of supply chain management, especially in resource planning, inventory management and production scheduling. Higher flexibility and precision are required; 4. Some advanced packaging and testing technologies may require a larger wafer level for effective verification and development, so a small number of wafers may limit the application and innovation of new technologies; 5. Customers usually hope that the packaging and testing plant can provide stable production capacity and reliable delivery cycle. A small number of wafers may affect the ability of the packaging and testing plant to meet customer needs, especially in the face of sudden increases in demand or specific orders. To this end, it is necessary to design a new technical solution to solve it. Summary of the invention

[0004] The purpose of the present invention is to provide an efficient wafer processing system and method to solve the technical problem that the current wafer processing section needs to produce by lot according to the number of incoming wafers, resulting in low production capacity and output.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: an efficient wafer processing system and method, comprising a wafer batching module, an AI card control module, a wafer processing module, an unbundling module, a patch module, a wafer mixed material detection module and a wafer inspection module;

[0006] Wafer batching module: used to conduct preliminary review of batches of wafers;

[0007] AI card control module: used to identify the wafer system work order combination that can be combined after wafer feeding;

[0008] Wafer processing module: used for film lamination, grinding, pasting and cutting of wafers;

[0009] Unbinding module: used to manually scan the wafer ID and wafer box for unbinding before patching (the system simultaneously performs mixed material confirmation and ungrouping) to facilitate normal production of the patch station;

[0010] Chip mounting module: used to mount processed wafers;

[0011] Wafer Mixed Material Detection Module: used for 100% wafer mixed material detection in the wafer processing station automation process;

[0012] Wafer inspection module: used for wafer group Ptnlot batch transit inspection to ensure the consistency between system and actual status.

[0013] As a preferred embodiment of the present invention, the wafer batching module includes an IQC detection module, a front film laminating module, a back grinding module, a wafer pasting module and a wafer cutting module.

[0014] As a preferred embodiment of the present invention, the IQC detection module is used to detect whether all the procedures of the wafer processing section are the same; whether all the Boms used in the wafer processing section are the same, and whether the total number of wafers exceeds the set number of wafers;

[0015] Front film lamination module: used for the front film lamination process of the wafer;

[0016] Back grinding module: used for back grinding of wafers;

[0017] Wafer pasting module: used for wafer pasting processing;

[0018] Wafer cutting module: used to cut wafers.

[0019] As a preferred embodiment of the present invention, the AI ​​card control module is used to identify the wafer system work order combination that can be combined after the wafer is fed, specifically the background AI verification: customer, product, thickness, program name, material and process are consistent.

[0020] As a preferred embodiment of the present invention, the efficient wafer processing method described above includes the following steps of wafer processing:

[0021] S1. First, batch the wafers, then perform bonding on the batch-processed wafers, and then perform wire bonding on the bonded wafers;

[0022] S2. After the wafer is wire bonded, it is sealed, lettering and ball implantation are performed on the sealed wafer, and then the sealed, lettered and ball implanted wafer is cut;

[0023] S3. The cut wafer is then inspected by an O / S inspection device, and then by an appearance inspection device for automatic appearance inspection, and then by an aging inspection device for its aging degree, and finally by an electrical inspection device for electrical inspection;

[0024] S4. Perform lettering processing on the wafer after inspection, and finally perform automatic appearance inspection on the wafer after lettering processing.

[0025] As a preferred embodiment of the present invention, the specific steps of batch processing the wafers in step S1 are as follows:

[0026] H1. First, materials are fed through PMC, and then delivered by the warehouse;

[0027] H2. After IQC inspection and flexible configuration of Wafer MK batching station, the front side filming process is carried out, and then the back side grinding process is carried out on the wafer after the front side filming process;

[0028] H3. Then put the processed wafer into the laser cutting equipment for cutting;

[0029] H4. Finally, the cut wafers are irradiated with ultraviolet light.

[0030] As a preferred embodiment of the present invention, the front film lamination, back grinding and laser cutting processes are all batch-passed and produced in one go.

[0031] As a preferred embodiment of the present invention, in step H4, the cut wafer is subjected to ultraviolet irradiation treatment, during which the wafer ID = material ID; cass number mixing card control; the number of pieces scanned by a single cass is less than or equal to 13 pieces.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1. The present invention can increase the number of wafers processed at a time when the packaging and testing plant cannot control the incoming wafers, so that the production capacity and efficiency of the wafer processing section are rapidly improved, and the processing cost of the wafer processing section is effectively reduced.

[0034] 2. The present invention can improve the efficiency of the wafer processing section of the packaging plant and reduce the production capacity pressure of the packaging and testing plant while ensuring quality.

[0035] 3. The present invention can be carried out without violating the mixing requirements of each customer, and can be adapted to speed up the production of products of all customers.

[0036] 4. The present invention effectively reduces the product waiting time FCT and effectively improves the equipment utilization rate and production capacity of the packaging and testing plant. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0038] Figure 1 A diagram of an efficient wafer processing system of the present invention;

[0039] Figure 2 The flowchart of the efficient wafer processing method of the present invention is as follows;

[0040] Figure 3 This is a program logic diagram of the efficient wafer processing method of the present invention. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0042] Embodiment 1: An efficient wafer processing system and method, see Figures 1 to 3 , including wafer batching module, AI card control module, wafer processing module, unbundling module, patch module, wafer mixing detection module and wafer inspection module;

[0043] Wafer batching module: used to conduct preliminary review of batches of wafers;

[0044] AI card control module: used to identify the wafer system work order combination that can be combined after wafer feeding;

[0045] Wafer processing module: used for film lamination, grinding, pasting and cutting of wafers;

[0046] Unbinding module: used to manually scan the wafer ID and wafer box for unbinding before patching (the system simultaneously performs mixed material confirmation and ungrouping) to ensure normal production of the patch station;

[0047] Chip mounting module: used to mount processed wafers;

[0048] Wafer Mixed Material Detection Module: used for 100% wafer mixed material detection in the wafer processing station automation process;

[0049] Wafer inspection module: used for wafer group Ptnlot batch transit inspection to ensure the consistency between system and actual status.

[0050] Specifically, the wafer batching module includes an IQC detection module, a front film laminating module, a back grinding module, a wafer pasting module and a wafer cutting module.

[0051] Furthermore, the IQC detection module is used to detect whether all the procedures of the wafer processing section are the same; whether all the Boms used in the wafer processing section are the same, and whether the total number of wafers exceeds the set number of wafers;

[0052] Front film lamination module: used for the front film lamination process of the wafer;

[0053] Back grinding module: used for back grinding of wafers;

[0054] Wafer pasting module: used for wafer pasting processing;

[0055] Wafer cutting module: used to cut wafers.

[0056] Furthermore, the AI ​​card control module is used to identify the wafer system work order combination that can be combined after the wafer is fed, specifically for background AI verification: customer, product, thickness, program name, material and process are consistent.

[0057] It is worth noting that the steps of the efficient wafer processing method are as follows:

[0058] S1. First, batch the wafers, then perform bonding on the batch-processed wafers, and then perform wire bonding on the bonded wafers;

[0059] S2. After the wafer is wire bonded, it is sealed, lettering and ball implantation are performed on the sealed wafer, and then the sealed, lettered and ball implanted wafer is cut;

[0060] S3. The cut wafer is then inspected by an O / S inspection device, and then by an appearance inspection device for automatic appearance inspection, and then by an aging inspection device for its aging degree, and finally by an electrical inspection device for electrical inspection;

[0061] S4. Perform lettering processing on the wafer after inspection, and finally perform automatic appearance inspection on the wafer after lettering processing.

[0062] It is worth noting that the specific steps of batch processing of wafers in step S1 are as follows:

[0063] H1. First, materials are fed through PMC, and then delivered by the warehouse;

[0064] H2. After IQC inspection and flexible configuration of Wafer MK batching station, the front side filming process is carried out, and then the back side grinding process is carried out on the wafer after the front side filming process;

[0065] H3. Then put the processed wafer into the laser cutting equipment for cutting;

[0066] H4. Finally, the cut wafers are irradiated with ultraviolet light.

[0067] It is worth mentioning that the front film lamination, back grinding and laser cutting processes are all batch-passed and produced in one go.

[0068] It is worth emphasizing that in step H4, the cut wafers are subjected to ultraviolet irradiation treatment. In this process, wafer ID = material feeding ID; cass number mixed material card control; the number of pieces scanned by a single cass is less than or equal to 13 pieces.

[0069] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the attached claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0070] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An efficient wafer processing system, characterized by: Including wafer batching module, AI card control module, wafer processing module, unbundling module, patch module, wafer mixed material detection module and wafer inspection module; Wafer batching module: used to conduct preliminary review of batches of wafers; AI card control module: used to identify the wafer system work order combination that can be combined after wafer feeding; Wafer processing module: used for film lamination, grinding, pasting and cutting of wafers; Unbinding module: used to manually scan the wafer ID and wafer box for unbinding before patching, so as to facilitate normal production of the patch station; Chip mounting module: used to mount processed wafers; Wafer Mixed Material Detection Module: used for 100% wafer mixed material detection in the wafer processing station automation process; Wafer inspection module: used for wafer group Ptnlot batch transit inspection to ensure the consistency between system and actual status.

2. The efficient wafer processing system according to claim 1, characterized in that: The wafer batching module includes an IQC detection module, a front film attaching module, a back grinding module, a wafer pasting module and a wafer cutting module.

3. The efficient wafer processing system according to claim 2, characterized in that: The IQC detection module is used to detect whether all the procedures of the wafer processing section are the same; whether all the Boms used in the wafer processing section are the same, and whether the total number of wafers exceeds the set number of wafers; Front film lamination module: used for the front film lamination process of the wafer; Back grinding module: used for back grinding of wafers; Wafer pasting module: used for wafer pasting processing; Wafer cutting module: used to cut wafers.

4. The efficient wafer processing system according to claim 1, characterized in that: The AI ​​card control module is used to identify the wafer system work order combination that can be combined after the wafer is fed, specifically the background AI verification: customer, product, thickness, program name, material and process are consistent.

5. The efficient wafer processing method according to claim 1, characterized in that: The steps of wafer processing are as follows: S1. First, batch the wafers, then perform bonding on the batch-processed wafers, and then perform wire bonding on the bonded wafers; S2. After the wafer is wire bonded, it is sealed, lettering and ball implantation are performed on the sealed wafer, and then the sealed, lettered and ball implanted wafer is cut; S3. The cut wafer is then inspected by an O / S inspection device, and then by an appearance inspection device for automatic appearance inspection, and then by an aging inspection device for its aging degree, and finally by an electrical inspection device for electrical inspection; S4. Perform lettering processing on the wafer after inspection, and finally perform automatic appearance inspection on the wafer after lettering processing.

6. The efficient wafer processing method according to claim 5, characterized in that: The specific steps of batch processing the wafers in step S1 are as follows: H1. First, materials are fed through PMC, and then delivered by the warehouse; H2. After IQC inspection and flexible configuration of Wafer MK batching station, the front side filming process is carried out, and then the back side grinding process is carried out on the wafer after the front side filming process; H3. Then put the processed wafer into the laser cutting equipment for cutting; H4. Finally, the cut wafers are irradiated with ultraviolet light.

7. The efficient wafer processing system according to claim 6, characterized in that: The front film lamination, back grinding and laser cutting processes are all batch-processed and produced in one go.

8. The efficient wafer processing system according to claim 6, characterized in that: In the step H4, the cut wafers are subjected to ultraviolet irradiation treatment. In this process, the wafer ID = the material ID; the cass number is mixed material card control; the number of pieces scanned by a single cass is less than or equal to 13 pieces.

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