Chip assembly method and electronic equipment

Abstract

The invention provides a chip assembly method and electronic equipment. The chip assembling method comprises the steps that a printing plate is arranged on a substrate, a containing cavity used for containing a chip is formed between the substrate and the printing plate, the printing plate is provided with a through groove, and the through groove is communicated with the containing cavity; and the glue on the side, away from the base plate, of the printing plate is filled into the through groove through a blade coating technology. According to the invention, the assembly efficiency and the assembly consistency of the chip can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic assembly, and more specifically, to a chip assembly method and electronic equipment. Background Art

[0002] In the prior art, chips are usually assembled on substrates by dispensing underfill glue. However, the dispensing underfill glue method requires dispensing glue one by one in the dispensing area of ​​the chip, resulting in low assembly efficiency and assembly consistency of the chip.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0004] One purpose of the present application is to provide a new technical solution for a chip assembly method and an electronic device.

[0005] According to a first aspect of the present application, a chip assembly method is provided, wherein the chip assembly method comprises:

[0006] A printing plate is arranged on the substrate to form a receiving cavity for receiving the chip between the substrate and the printing plate, wherein the printing plate has a through groove, and the through groove is communicated with the receiving cavity;

[0007] The glue on the side of the printing plate facing away from the substrate is filled into the through groove by using a scraping process.

[0008] Optionally, the printing plate includes a first groove, and the accommodation cavity is formed between the first groove and the substrate.

[0009] Optionally, the first groove and the through groove are arranged at intervals.

[0010] Optionally, a distance between a bottom end of the through groove and an upper surface of the substrate is smaller than a distance between an upper surface of the chip and an upper surface of the substrate.

[0011] Optionally, the substrate includes a second groove, and the accommodation cavity is formed between the second groove and the printing plate.

[0012] Optionally, the second groove includes a filling portion, and the filling portion is communicated with the through groove.

[0013] Optionally, before the glue on the side of the printing plate facing away from the substrate is filled into the through groove by using a scraping process, the method further includes:

[0014] Glue is arranged on a side of the printing plate facing away from the base plate.

[0015] Optionally, the printing plate is provided with a plurality of through slots;

[0016] The glue on the side of the printing plate facing away from the substrate is filled into the plurality of through grooves by using a scraping process.

[0017] Optionally, after the glue on the side of the printing plate facing away from the substrate is filled into the through groove by using a scraping process, the method further comprises:

[0018] The glue is heated by a heating process to fill the glue between the chip and the substrate.

[0019] According to a second aspect of the present application, an electronic device is provided, wherein the electronic device is manufactured using the chip assembly method as described in any one of the first aspects.

[0020] The chip assembly method in the present application, by setting a printed board with through grooves on a substrate, allows the present application to fill glue into a designated area through a scraping process and through grooves, thereby effectively improving chip assembly efficiency and assembly consistency.

[0021] Other features and advantages of the present application will become apparent from the following detailed description of exemplary implementations of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0023] Figure 1 It is a flow chart of a chip assembly method in one embodiment of the present application.

[0024] Figure 2 It is a bottom view of a printed board in one embodiment of the present application.

[0025] Figure 3 It is a top view of a printed board in one embodiment of the present application.

[0026] Figure 4 It is a schematic diagram of the structure of setting a printed board on a substrate in one embodiment of the present application.

[0027] Figure 5 It is a structural schematic diagram of an embodiment of the present application in which a scraping process is used to fill the glue on the side of the printing plate facing away from the substrate into the through groove.

[0028] Figure 6 It is a schematic diagram of the structure of filling glue in the through groove in one embodiment of the present application.

[0029] Figure 7 It is a schematic diagram of the structure after the glue is heated by a heating process in one embodiment of the present application.

[0030] Figure 8It is a schematic diagram of the structure after removing the printing plate in one embodiment of the present application.

[0031] Description of reference numerals:

[0032] 1. Printing plate; 11. Through groove; 12. First groove;

[0033] 2. substrate; 21. second groove; 211. filling part;

[0034] 3. Chip;

[0035] 4. Accommodating cavity;

[0036] 5. Glue;

[0037] 6. Scraper. DETAILED DESCRIPTION

[0038] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0039] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0040] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0041] According to an embodiment of the present application, an electronic device is provided, which may be a mobile phone, a tablet computer, a personal digital assistant, a television, a smart wearable product, a virtual reality terminal device, an augmented reality terminal device, a rechargeable small household appliance (such as a soybean milk machine, a sweeping robot), a drone, a radar, an aerospace device, and a vehicle-mounted device, etc. The electronic device includes a chip 3, and the chip 3 is mounted on a substrate 2.

[0042] In the traditional technical scheme, the assembly of chip 3 usually adopts the bottom filling glue dispensing method, that is, a piezoelectric valve and a nozzle are used to dispense glue one by one on the area to be dispensed on the substrate 2. However, the one-by-one dispensing method requires that each chip 3 be operated one by one, which seriously affects the low assembly efficiency of chip 3. In addition, the one-by-one dispensing method is also prone to abnormalities such as insufficient glue and overflow due to the warping of the substrate 2, resulting in poor assembly consistency of chip 3, which seriously affects the assembly quality of chip 3.

[0043] Therefore, if Figures 4 to 8 As shown, according to another embodiment of the present application, a chip assembly method is provided, wherein the chip assembly method is used to assemble a chip 3 on a substrate 2 .

[0044] Among them, the chip assembly method described in the present application first sets a printed board 1 on a substrate 2 so that a receiving cavity 4 for accommodating a chip 3 can be formed between the substrate 2 and the printed board 1, and then a scraping process is used to fill the glue 5 on the side of the printed board 1 away from the substrate 2 into the through groove 11.

[0045] Thus, since the printed board 1 has a through groove 11, and the through groove 11 is connected to the accommodating cavity 4, the present application can use the scraping process and the through groove 11 to fill the glue 5 on the side of the printed board 1 away from the substrate 2 into multiple areas to be filled on the substrate 2. Compared with the traditional bottom filling glue dispensing method, the present application can complete the glue filling of multiple areas to be filled at one time through the scraping process, which greatly improves the assembly efficiency of the chip 3. Moreover, due to the process characteristics of the scraping process and the setting of the through groove 11 of the printed board 1, the same amount of glue 5 can be filled in multiple areas to be filled at the same time. Therefore, compared with the traditional bottom filling glue dispensing method, it also avoids the occurrence of insufficient glue and overflow in the area to be filled, effectively enhancing the assembly consistency and assembly quality of the chip 3.

[0046] In addition, the shape of the through groove 11 described in the present application can be rectangular, square, circular, elliptical or triangular, etc., and technicians in this field can choose according to actual needs, and the present application does not make any specific restrictions here.

[0047] It should be noted that the area to be filled described in the present application refers to the storage area of ​​the glue 5, so that the glue 5 is closer to the connecting surface between the chip 3 and the substrate 2, and then when the glue 5 is cured by heating or other curing methods, the glue 5 can be filled between the chip 3 and the substrate 2 by capillary action.

[0048] In one embodiment, the printing board 1 includes a first groove 12 , and the accommodation cavity 4 is formed between the first groove 12 and the substrate 2 .

[0049] Specifically, Figure 2 and Figure 4 As shown, the printed board 1 of the present application is provided with a first groove 12 in the direction toward the substrate 2 , and a plurality of the first grooves 12 are provided, and the plurality of the first grooves 12 can form a plurality of accommodating cavities 4 for accommodating the chip 3 with the substrate 2 .

[0050] Therefore, the present application effectively expands the accommodating cavity 4 between the printed board 1 and the substrate 2 by setting the first groove 12 on the printed board 1, so that when the printed board 1 is placed on the substrate 2, it is possible to avoid hard contact and damage between the printed board 1 and the chip 3, thereby ensuring the assembly quality of the chip 3.

[0051] Among them, the shape of the first groove 12 of the present application can be rectangular, square, circular, elliptical or triangular, etc., and technical personnel in this field can choose according to actual needs, and the present application does not make any specific restrictions here.

[0052] In one embodiment, the first groove 12 is spaced apart from the through groove 11 .

[0053] Specifically, Figure 2 As shown, the present application arranges the first groove 12 on the printed board 1 and the through groove 11 at intervals, so that when the glue 5 on the side of the printed board 1 away from the substrate 2 is filled into multiple to-be-filled areas on the substrate 2 using a scraping process and the through groove 11, it is possible to prevent the glue 5 from directly flowing into the accommodating cavity 4 and then adhering to the upper surface of the chip 3, resulting in poor heat dissipation performance of the chip 3, thereby effectively ensuring the performance of the chip 3.

[0054] In one embodiment, the distance between the bottom end of the through groove 11 and the upper surface of the substrate 2 is smaller than the distance between the upper surface of the chip 3 and the upper surface of the substrate 2 .

[0055] Specifically, Figure 4 As shown, the distance between the bottom end of the through groove 11 of the present application and the upper surface of the substrate 2 is h, and the distance between the upper surface of the chip 3 and the upper surface of the substrate 2 is w.

[0056] Therefore, the present application sets the distance h between the bottom end of the through groove 11 and the upper surface of the substrate 2 to be smaller than the distance w between the upper surface of the chip 3 and the upper surface of the substrate 2, so that when the glue 5 on the side of the printed board 1 away from the substrate 2 is filled into the through groove 11 by the scraping process, it is further avoided that the glue 5 flows into the accommodating cavity 4 and then adheres to the upper surface of the chip 3, resulting in poor heat dissipation performance of the chip 3, thereby effectively ensuring the assembly quality of the chip 3 and the performance of the chip 3.

[0057] In one embodiment, the substrate 2 includes a second groove 21 , and the accommodation cavity 4 is formed between the second groove 21 and the printing board 1 .

[0058] Specifically, Figure 4As shown, the upper surface of the substrate 2 of the present application is provided with a second groove 21 , and a plurality of the second grooves 21 are provided. The plurality of the second grooves 21 can form a plurality of accommodating cavities 4 for accommodating the chip 3 together with the printed board 1 .

[0059] Therefore, the present application effectively expands the accommodating cavity 4 between the printed board 1 and the substrate 2 by setting the second groove 21 on the substrate 2, so that when the printed board 1 is placed on the substrate 2, it is possible to avoid hard contact and damage between the printed board 1 and the chip 3, thereby ensuring the assembly quality of the chip 3.

[0060] In one embodiment, the second groove 21 includes a filling portion 211 , and the filling portion 211 is communicated with the through groove 11 .

[0061] Specifically, Figure 5 and Figure 6 As shown, the present application provides a filling portion 211 on the second groove 21 , and the filling portion 211 is connected with the through groove 11 , so that the filling portion 211 and the through groove 11 together form a to-be-filled area on the substrate 2 .

[0062] Thus, when the glue 5 on the side of the printed board 1 facing away from the substrate 2 is filled into the through groove 11 by adopting the scraping process, an appropriate amount of glue 5 is stored in the area to be filled formed by the filling portion 211 and the through groove 11, thereby effectively avoiding the phenomenon of poor fixing effect between the chip 3 and the substrate 2 due to insufficient glue, thereby further improving the assembly quality of the chip 3.

[0063] In one embodiment, before the glue 5 on the side of the printing plate 1 facing away from the substrate 2 is filled into the through groove 11 by using a scraping process, the method further includes: disposing glue 5 on the side of the printing plate 1 facing away from the substrate 2 .

[0064] Specifically, Figure 5 As shown, the present application can select different types of glue 5 according to the assembly requirements between the chip 3 and the substrate 2, for example, cyanoacrylate glue 5, epoxy resin glue 5, UV glue or acrylic glue 5 can be selected.

[0065] Among them, depending on the type of the selected glue 5, for example, when the glue 5 is cyanoacrylate glue 5, epoxy resin glue 5, UV glue or acrylic glue 5, it can be cured by moisture curing, heat curing, UV (Ultraviolet Rays) curing and visible light curing, etc., and technicians in this field can make a choice according to actual needs, and this application does not make any specific restrictions here.

[0066] In one embodiment, the printing plate 1 is provided with a plurality of through grooves 11 ; the glue 5 on the side of the printing plate 1 away from the substrate 2 is filled into the plurality of through grooves 11 by using a scraping process.

[0067] Specifically, the printed board 1 of the present application may be provided with a plurality of through slots 11, and the shapes of the plurality of through slots 11 may be the same or different. Thus, according to the different structures and arrangements of the chips 3 on the substrate 2, different printed boards 1 may be selected for adaptation, which effectively improves the assembly efficiency of the chips 3 and reduces the assembly cost of the chips 3.

[0068] Among them, Figure 2 and Figure 3 As shown, the through grooves 11 on the printed board 1 described in the present application can be arranged in a matrix layout. Of course, the through grooves 11 can also be arranged in a peripheral layout, a linear layout or a staggered layout, etc. Those skilled in the art can choose according to actual needs, and the present application does not make any specific restrictions here.

[0069] In one embodiment, after the glue 5 on the side of the printed board 1 facing away from the substrate 2 is filled into the through groove 11 by a scraping process, the method further includes: heating the glue 5 by a heating process to fill the glue 5 between the chip 3 and the substrate 2 .

[0070] Specifically, Figure 6 and Figure 7 As shown, the present application heats the glue 5 so that the glue 5 can fill the gap between the chip 3 and the substrate 2 through capillary action, thereby effectively dispersing and reducing the stress of the solder joints between the chip 3 and the substrate 2, and reducing the risk of solder joint breakage due to factors such as thermal expansion coefficient mismatch, mechanical shock or falling, etc.

[0071] According to a chip assembly method provided by the present application, see Figure 1 The chip assembly method includes the following steps S101-S102:

[0072] S101, placing a printed board 1 on a substrate 2 to form a receiving cavity 4 for receiving a chip 3 between the substrate 2 and the printed board 1, wherein the printed board 1 has a through groove 11, and the through groove 11 is connected to the receiving cavity 4;

[0073] like Figure 4 As shown, the printed board 1 provided here may include only one through slot 11 , or may include two or more through slots 11 , so as to effectively ensure the assembly efficiency of the chip 3 .

[0074] S102 , using a scraping process to fill the glue 5 on the side of the printing plate 1 facing away from the substrate 2 into the through groove 11 .

[0075] like Figure 5 As shown, the scraping process used here includes a scraper 6 , and the scraper 6 is used to fill the glue 5 on the side of the printing plate 1 facing away from the substrate 2 into the through groove 11 .

[0076] In one embodiment, see Figures 4 to 8 The chip assembly method may further include the following steps A1 to A5:

[0077] A1, a printed board 1 is arranged on a substrate 2 to form a receiving cavity 4 for receiving a chip 3 between the substrate 2 and the printed board 1, wherein the printed board 1 has a through groove 11, and the through groove 11 is connected to the receiving cavity 4;

[0078] A2, providing glue 5 on the side of the printing plate 1 facing away from the substrate 2;

[0079] A3, using a scraping process to fill the glue 5 on the side of the printing plate 1 away from the substrate 2 into the through groove 11;

[0080] A4, heating the glue 5 by a heating process to fill the glue 5 between the chip 3 and the substrate 2

[0081] A5, remove the printing plate 1.

[0082] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0083] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A chip assembly method, characterized in that: The chip assembly method comprises: A printing plate (1) is arranged on a substrate (2) to form a receiving cavity (4) for receiving a chip (3) between the substrate (2) and the printing plate (1), wherein the printing plate (1) has a through groove (11) which is in communication with the receiving cavity (4); The glue (5) on the side of the printing plate (1) facing away from the substrate (2) is filled into the through groove (11) by using a scraping process.

2. The chip assembly method according to claim 1, characterized in that: The printing plate (1) comprises a first groove (12), and the accommodation cavity (4) is formed between the first groove (12) and the substrate (2).

3. The chip assembly method according to claim 2, characterized in that: The first groove (12) and the through groove (11) are arranged at intervals.

4. The chip assembly method according to claim 3, characterized in that: The distance between the bottom end of the through groove (11) and the upper surface of the substrate (2) is smaller than the distance between the upper surface of the chip (3) and the upper surface of the substrate (2).

5. The chip assembly method according to claim 1, characterized in that: The base plate (2) comprises a second groove (21), and the accommodation cavity (4) is formed between the second groove (21) and the printing plate (1).

6. The chip assembly method according to claim 5, characterized in that: The second groove (21) comprises a filling portion (211), and the filling portion (211) is in communication with the through groove (11).

7. The chip assembly method according to claim 1, characterized in that: Before the glue (5) on the side of the printing plate (1) facing away from the substrate (2) is filled into the through groove (11) by using a scraping process, the method further comprises: Glue (5) is provided on the side of the printing plate (1) facing away from the substrate (2).

8. The chip assembly method according to claim 6, characterized in that: The printing plate (1) is provided with a plurality of through slots (11); The glue (5) on the side of the printing plate (1) facing away from the substrate (2) is filled into the plurality of through grooves (11) by using a scraping process.

9. The chip assembly method according to claim 1, characterized in that: After the glue (5) on the side of the printing plate (1) facing away from the substrate (2) is filled into the through groove (11) by using a scraping process, the method further comprises: The glue (5) is heated by a heating process, so as to fill the glue (5) between the chip (3) and the substrate (2).

10. An electronic device, characterized in that: The electronic device is prepared by the chip assembly method according to any one of claims 1 to 9.

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