Electronic foil with high tensile strength and preparation process thereof

Abstract

The invention discloses a preparation process of an electronic foil with high tensile strength, and aims to improve the mechanical property of the electronic foil by optimizing alloy components and accurately controlling each process step. The process comprises the steps of alloy optimization, smelting, cast rolling, cold rolling, intermediate annealing, finished product annealing and the like. A proper amount of Mg, Mn and Si elements are added into a high-purity aluminum ingot, the smelting temperature is controlled to be 720-760 DEG C, and a cast-rolled aluminum coil is subjected to two times of cold rolling and multiple times of annealing treatment, so that the high-strength electronic foil with a multi-stage gradient microstructure is formed. The tensile strength of the finally prepared electronic foil is larger than or equal to 160 MPa, and the electronic foil has excellent mechanical performance and surface quality and is widely suitable for manufacturing of high-performance electronic products. The tensile strength of the electronic foil is remarkably improved, the defects of a traditional process are overcome, and the method has good industrial application prospects.

Description

Technical Field

[0001] The invention relates to the field of preparation of electronic foil, and more particularly to an electronic foil with high tensile strength and a preparation process thereof. Background Art

[0002] Electronic foil is widely used in the electronics industry, especially in the manufacture of capacitors, lithium batteries and other products. It has been widely recognized for its excellent conductivity and light weight. With the development of modern technology, electronic products tend to be more miniaturized, lightweight and high-performance, and the performance requirements for electronic foil are also increasing, especially in terms of tensile strength.

[0003] At present, the traditional production process of electronic foil mainly includes melting, casting, hot rolling, cold rolling, annealing and other steps. However, since the thickness of electronic foil is usually very thin, the traditional process has great challenges in improving its tensile strength. Especially in the cold rolling and annealing process, since the hardness and toughness of the material are prone to change, it is often difficult to take into account both high strength and high conductivity at the same time. This makes the existing electronic foil products likely to break or have other mechanical properties insufficient when used in high-demand electronic devices. Summary of the invention

[0004] In order to solve the deficiencies of the prior art, an electronic foil with high tensile strength and a preparation process thereof are provided. The specific scheme is as follows:

[0005] A preparation process of an electronic foil with high tensile strength, the preparation process comprising the following steps:

[0006] S1. Alloy optimization: Use high-purity aluminum ingots with a purity of ≥99.8% as the base material, and add Mg, Mn, and Si elements to the aluminum ingots;

[0007] S2. Melting: adding aluminum ingots and alloy elements into a melting furnace in proportion, heating to 720°C to 760°C for melting, so that the alloy elements are evenly distributed in the molten aluminum liquid to form an aluminum alloy with a preliminary microstructure;

[0008] S3, casting and rolling: casting and rolling the molten aluminum liquid;

[0009] S4, first cold rolling;

[0010] S5, intermediate annealing: annealing the aluminum coil after the first cold rolling at a temperature of 310°C to 350°C for 2h to 4h to eliminate the internal stress generated during the cold rolling process and form a primary gradient microstructure;

[0011] S6, second cold rolling;

[0012] S7, finished product annealing: the aluminum coil that has undergone the second cold rolling is subjected to finished product annealing.

[0013] Low temperature annealing is performed at a temperature of 250°C to 280°C for 8 hours to 12 hours to further optimize and form a multi-level gradient microstructure, so that the surface layer of the aluminum foil has fine grains to improve strength, while the interior has larger grains to enhance ductility.

[0014] Furthermore, the mass percentages of Mg, Mn and Si elements in S1 are 0.5% to 1.5% Mg, 0.2% to 0.8% Mn and 0.1% to 0.4% Si respectively.

[0015] Furthermore, after casting and rolling in S3, an aluminum coil with a thickness of 6 mm to 8 mm is formed, and the temperature during casting and rolling is controlled at 590° C. to 620° C.

[0016] Furthermore, the process parameters of the first cold rolling in S4 are to cold roll the cast aluminum coil for the first time, rolling it to a thickness of 1.5 mm to 2.5 mm, controlling the cold rolling speed at 80 m / min to 120 m / min, and setting the rolling pressure at 50 MPa to 80 MPa.

[0017] Furthermore, the process parameters of the second cold rolling in S6 are to cold roll the aluminum coil after intermediate annealing for the second time, rolling it to a thickness of 0.3 mm to 0.6 mm, controlling the cold rolling speed at 100 m / min to 150 m / min, and controlling the rolling pressure at 40 MPa to 70 MPa.

[0018] Furthermore, the temperature of the finished product annealing in S7 is 250-280° C., and the time of the finished product annealing is 8-12 hours.

[0019] The electronic foil is prepared by a high tensile strength electronic foil preparation process, wherein the electronic foil has a multi-level gradient microstructure and a tensile strength of ≥160MPa.

[0020] Beneficial effects:

[0021] The present invention provides an electronic foil with high tensile strength and a preparation process thereof, which specifically includes the following advantages:

[0022] (1) By adding appropriate amounts of Mg, Mn, and Si elements to high-purity aluminum ingots with a purity of ≥99.8%, the microstructure of the aluminum alloy is significantly optimized, ensuring that the alloy exhibits excellent strength and toughness during the tensile process.

[0023] (2) Through two cold rolling processes and intermediate annealing and finished product annealing, the internal stress generated during the cold rolling process is effectively eliminated, and a multi-level gradient microstructure is formed. This structure not only improves the tensile strength of the electronic foil, but also improves the comprehensive mechanical properties of the material.

[0024] (3) The electronic foil finally obtained has an excellent tensile strength of ≥160 MPa, which is significantly better than the electronic foil prepared by the traditional process. This performance improvement makes the electronic foil of the present invention more suitable for use in electronic devices with high performance requirements, meeting the market demand for high-strength and high-reliability electronic materials.

[0025] (4) Through the fine rolling and annealing process, the uniform thickness of the electronic foil is ensured to meet the needs of high-precision applications while maintaining excellent surface quality. DETAILED DESCRIPTION

[0026] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with examples. The examples are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention.

[0027] Embodiment 1:

[0028] A process for preparing an electronic foil with high tensile strength comprises the following steps:

[0029] (1) Alloy optimization: Use a high-purity aluminum ingot with a purity of 99.9% and add 1.2% Mg, 0.6% Mn, and 0.3% Si.

[0030] (2) Melting: Add aluminum ingots and alloy elements into a melting furnace in proportion, heat to 740°C, maintain for 15 minutes, and melt until the alloy elements are completely dissolved and evenly distributed.

[0031] (3) Casting and rolling: The molten aluminum is cast and rolled at 610°C to form an aluminum coil with a thickness of 7 mm.

[0032] (4) First cold rolling: The cast aluminum coil is subjected to the first cold rolling to a thickness of 2.0 mm at a cold rolling speed of 100 m / min and a rolling pressure of 70 MPa.

[0033] (5) Intermediate annealing: The aluminum coil after the first cold rolling is annealed at 340°C for 3 hours to eliminate internal stress and form a primary gradient microstructure.

[0034] (6) Second cold rolling: The aluminum coil that has undergone intermediate annealing is subjected to a second cold rolling, rolled to a thickness of 0.5 mm, with a cold rolling speed of 120 m / min and a rolling pressure of 60 MPa.

[0035] (7) Finished product annealing: The aluminum coil after the second cold rolling is annealed at 270°C for 10 hours to form a multi-level gradient microstructure.

[0036] (8) Product performance: After testing, the tensile strength of the electronic foil is 165 MPa, the thickness deviation does not exceed ±0.004 mm, and the surface is flat and smooth.

[0037] Embodiment 2:

[0038] A process for preparing an electronic foil with high tensile strength comprises the following steps:

[0039] (1) Alloy optimization: Use a high-purity aluminum ingot with a purity of 99.8%, and add 1.0% Mg, 0.4% Mn, and 0.2% Si.

[0040] (2) Melting: Add aluminum ingots and alloy elements in proportion to the melting furnace, heat to 730°C, maintain for 20 minutes, and melt until the alloy elements are evenly distributed.

[0041] (3) Casting and rolling: The molten aluminum is cast and rolled at 600°C to form an aluminum coil with a thickness of 6 mm.

[0042] (4) First cold rolling: The cast aluminum coil is subjected to the first cold rolling to a thickness of 2.2 mm at a cold rolling speed of 90 m / min and a rolling pressure of 60 MPa.

[0043] (5) Intermediate annealing: The aluminum coil after the first cold rolling is annealed at 320°C for 4 hours to eliminate the internal stress generated during the cold rolling process and form a primary gradient microstructure.

[0044] (6) Second cold rolling: The aluminum coil that has undergone intermediate annealing is subjected to a second cold rolling, rolled to a thickness of 0.4 mm, with a cold rolling speed of 130 m / min and a rolling pressure of 50 MPa.

[0045] (7) Finished product annealing: The aluminum coil after the second cold rolling is annealed at 260°C for 9 hours to form a multi-level gradient microstructure.

[0046] (8) Product performance: After testing, the tensile strength of the electronic foil is 170 MPa, the thickness deviation does not exceed ±0.003 mm, and the surface flatness and smoothness are excellent.

[0047] Embodiment 3:

[0048] A process for preparing an electronic foil with high tensile strength comprises the following steps:

[0049] (1) Alloy optimization: Use a high-purity aluminum ingot with a purity of 99.9% and add 1.5% Mg, 0.8% Mn, and 0.4% Si.

[0050] (2) Melting: Add aluminum ingots and alloy elements into the melting furnace in proportion, heat to 750°C, and maintain for 10 minutes to ensure that the alloy elements are completely dissolved and evenly distributed.

[0051] (3) Casting and rolling: The molten aluminum is cast and rolled at 620°C to form an aluminum coil with a thickness of 8 mm.

[0052] (4) First cold rolling: The cast aluminum coil is subjected to the first cold rolling to a thickness of 2.5 mm at a cold rolling speed of 110 m / min and a rolling pressure of 80 MPa.

[0053] (5) Intermediate annealing: The aluminum coil after the first cold rolling is annealed at 350°C for 2 hours to eliminate internal stress to the maximum extent and form a primary gradient microstructure.

[0054] (6) Second cold rolling: The aluminum coil after intermediate annealing is subjected to a second cold rolling to a thickness of 0.6 mm, with a cold rolling speed of 150 m / min and a rolling pressure of 70 MPa.

[0055] (7) Finished product annealing: The aluminum coil after the second cold rolling is annealed at 280°C for 8 hours to further optimize the multi-level gradient microstructure.

[0056] (8) Product performance: After testing, the tensile strength of the electronic foil reached 175MPa, the thickness deviation did not exceed ±0.002mm, and the surface finish was extremely high, making it suitable for high-precision electronic applications.

[0057] Comparative Example:

[0058] Electronic foil produced using traditional technology

[0059] The tensile strength of the electronic foils prepared in Examples 1 to 3 and the comparative example was tested, and the test results are shown in the following table:

[0060] sample Tensile strength(MPa) Comparative Example 140 Example 1 165 Example 2 170 Example 3 175

[0061] It can be seen from the above table that the tensile strength of the electronic foil obtained through the optimization of the present technical solution is improved compared with the tensile strength of the electronic foil produced by the traditional production process.

[0062] As a further improvement, the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A process for preparing an electronic foil with high tensile strength, characterized in that: The preparation process comprises the following steps: S1. Alloy optimization: Use high-purity aluminum ingots with a purity of ≥99.8% as the base material, and add Mg, Mn, and Si elements to the aluminum ingots; S2. Melting: adding aluminum ingots and alloy elements into a melting furnace in proportion, heating to 720°C to 760°C for melting, so that the alloy elements are evenly distributed in the molten aluminum liquid to form an aluminum alloy with a preliminary microstructure; S3, casting and rolling: casting and rolling the molten aluminum liquid; S4, first cold rolling; S5, intermediate annealing: annealing the aluminum coil after the first cold rolling at a temperature of 310°C to 350°C for 2h to 4h to eliminate the internal stress generated during the cold rolling process and form a primary gradient microstructure; S6, second cold rolling; S7, finished product annealing: the aluminum coil after the second cold rolling is subjected to finished product annealing to form a multi-level gradient microstructure.

2. The process for preparing an electronic foil with high tensile strength according to claim 1, characterized in that: The mass percentages of Mg, Mn and Si elements in S1 are 0.5% to 1.5% Mg, 0.2% to 0.8% Mn and 0.1% to 0.4% Si respectively.

3. The process for preparing an electronic foil with high tensile strength according to claim 1, characterized in that: After casting and rolling in S3, an aluminum coil with a thickness of 6 mm to 8 mm is formed, and the temperature during casting and rolling is controlled at 590° C. to 620° C.

4. The process for preparing an electronic foil with high tensile strength according to claim 1, characterized in that: The process parameters of the first cold rolling in S4 are to cold roll the cast aluminum coil for the first time, rolling it to a thickness of 1.5 mm to 2.5 mm, controlling the cold rolling speed at 80 m / min to 120 m / min, and setting the rolling pressure at 50 MPa to 80 MPa.

5. The process for preparing an electronic foil with high tensile strength according to claim 1, characterized in that: The process parameters of the second cold rolling in S6 are to cold roll the aluminum coil after intermediate annealing for the second time, rolling it to a thickness of 0.3mm to 0.6mm, controlling the cold rolling speed at 100m / min to 150m / min, and controlling the rolling pressure at 40MPa to 70MPa.

6. The process for preparing an electronic foil with high tensile strength according to claim 1, characterized in that: The temperature of the finished product annealing in S7 is 250-280°C, and the time of the finished product annealing is 8-12 hours.

7. The electronic foil prepared by any one of the preparation processes described in claims 1 to 6, characterized in that: The electronic foil has a multi-level gradient microstructure and a tensile strength of ≥160MPa.