PCB circuit board

Abstract

The invention belongs to the technical field of circuit boards, and particularly relates to a PCB (Printed Circuit Board), which comprises a glass fiber substrate I, a glass fiber substrate II, a conductive layer, a BGA (Ball Grid Array) bonding pad, a cap via hole, a plug-in connection bridge, a self-locking splicing assembly and a heat dissipation assembly, and is characterized in that the conductive layer is welded at the top of the glass fiber substrate I and the top of the glass fiber substrate II; the surface of the plug-in connection bridge is fixedly connected with the two ends of the glass fiber substrate II, the BGA bonding pad is welded to the middle of the glass fiber substrate I and the middle of the glass fiber substrate II, and the cap via holes are formed in the glass fiber substrate I and the glass fiber substrate II; according to the device, the hook reed is clamped into the glass fiber substrate II and is stably connected with the glass fiber substrate II through the arc-shaped reed which is specially made through telescopic deformation; and after clamping, the non-conductive polyimide strip which is originally positioned in the via hole of the cap and is used for preventing stress fracture of the circuit board is extruded, and the conductive silver-plated copper particle epoxy resin strip is extruded into the via hole, so that electrical connection is formed.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit boards, and in particular relates to a PCB circuit board. Background Art

[0002] PCB circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is based on an insulating board, cut into a certain size, with at least one conductive pattern attached to it, and is provided with holes (such as component holes, fastening holes, metallized holes, etc.). It is used to replace the chassis for installing electronic components in the past and to realize the interconnection between electronic components.

[0003] After searching, the Chinese patent with the publication number of "CN210053645U" disclosed a PCB circuit board. By setting a plurality of grooves on the central ground pad, and the grooves are symmetrically arranged on the central ground pad, this structural design makes the central ground pad smaller. In the process of SMT mounting, the heat generated at the welding position of the central ground pad is easily dissipated from the grooves, so that the central ground pad will not generate bubbles, thereby solving the problem that the existing PCB circuit board has too large a central ground pad and the heat is not easy to dissipate, so that many bubbles are generated on the pad, resulting in the central ground pad being not firmly welded. For another example, the Chinese patent with the publication number of "CN211090139U" disclosed a PCB circuit board, including a substrate, a plurality of pads 1, a plurality of copper wires, perforations, copper sleeves and pads 2. The above device effectively prevents the peeling of the copper pad when the PCB board has been used and the breakage of the copper wire when it is used again, so that the PCB circuit board can be used repeatedly, greatly reducing loss and waste, and saving teaching costs.

[0004] For the connection of spliced ​​double-layer or multi-layer PCB circuit boards, the traditional device generally draws a groove at the connection of the two PCB boards to make the connection part thinner and easier to break, and the depth and width of the groove need to be precisely controlled to ensure that it is easy to separate and does not affect the strength of the board. Although this process design is simple, it is not flexible enough to use because there are vias in the connection part of the PCB board, and the vias are filled with corresponding conductive materials and non-conductive materials. The width cannot be adjusted according to actual needs, and thus the splicing effect of multiple sets of circuit boards cannot be achieved; in addition, the waterproof and heat dissipation functions of the PCB circuit board are poor, and the PCB circuit board is often damaged and cannot be used because of the large amount of water and heat that cannot be dissipated.

[0005] Therefore, a PCB circuit board is designed to solve the above problems. Summary of the invention

[0006] To solve the problems raised in the above background technology, the present invention provides a PCB circuit board to solve the problems of splicing multiple groups of circuit boards, switching between conductive and non-conductive materials in via holes, and preventing overheating of the circuit board.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a PCB circuit board, comprising a glass fiber substrate 1, a glass fiber substrate 2, a conductive layer, a BGA pad, a cap via, an insert-type connecting bridge, a self-locking splicing component and a heat dissipation component, wherein the conductive layer is welded on the top of the glass fiber substrate 1 and the glass fiber substrate 2, the surface of the insert-type connecting bridge is fixedly connected to the two ends of the glass fiber substrate 2, the BGA pad is welded on the middle of the glass fiber substrate 1 and the glass fiber substrate 2, the cap via is installed inside the glass fiber substrate 1 and the glass fiber substrate 2, the self-locking splicing component is installed on the two ends of the glass fiber substrate 1, and the heat dissipation component is installed on the top of the glass fiber substrate 1 and the glass fiber substrate 2;

[0008] The plug-in connecting bridge is used to connect the glass fiber substrate one and the glass fiber substrate two, the BGA pad is used to connect high-density integrated circuits and chipsets, the conductive layer is used to transmit current and signals, the cap via is used to optimize electrical connections and reduce electromagnetic radiation and interference, the self-locking splicing component cooperates with the plug-in connecting bridge to hang the glass fiber substrate two and switch the conductive material and non-conductive material inside the glass fiber substrate one and the glass fiber substrate two, and the heat dissipation component cooperates with the self-locking splicing component to open the glass fiber substrate one and the glass fiber substrate two and dissipate heat.

[0009] Furthermore, the self-locking splicing assembly includes an arc-shaped spring, a contact piece, a hook spring, a support frame, a filler switching part and an opening switching part, the arc-shaped spring is installed inside the glass fiber substrate one, the contact piece is fixedly connected to the two ends of the bottom of the arc-shaped spring, the hook spring is installed on one side of the contact piece and is used to hang on the glass fiber substrate two, the support frame is installed on the other side of the contact piece, the filler switching part is installed inside the glass fiber substrate one and the glass fiber substrate two, and the opening switching part is symmetrically distributed on both sides of the support frame.

[0010] Furthermore, the filler switching part includes a limit frame, a silver-plated copper particle epoxy resin strip and a polyimide strip. The limit frame is installed inside the glass fiber substrate one and the glass fiber substrate two. The silver-plated copper particle epoxy resin strip and the polyimide strip are slidably connected inside the limit frame and are used for electrical signal transmission and electrical signal interference between the layers of the circuit board.

[0011] Furthermore, the opening switching part includes a contact bracket, a fixed plate, a linear shaft and a compression spring, the contact bracket is fixedly connected to the outer side of the support frame, the fixed plate is installed on the top inner side of the glass fiber substrate one and the glass fiber substrate two and is located obliquely above the contact bracket, the linear shaft is installed on one side of the fixed plate, and the two ends of the compression spring are respectively fixedly connected to the opposite side surfaces of the heat dissipation assembly and the fixed plate.

[0012] Furthermore, the heat dissipation assembly includes a circular cover, a fan-shaped baffle, a sliding plate and a connecting block, the circular cover is installed on the top of glass fiber substrate one and glass fiber substrate two, the fan-shaped baffle is slidably connected to the lower end of the circular cover, the sliding plate is installed at the bottom of the fan-shaped baffle, and the connecting block is installed on both sides of the sliding plate and is used to slide and connect the linear shaft.

[0013] Furthermore, a T-shaped groove for placing the arc-shaped spring piece and the contact piece is provided inside the glass fiber substrate 1.

[0014] Furthermore, an L-shaped groove matching the size of the contact piece and the hook spring piece is also provided inside the second glass fiber substrate.

[0015] Furthermore, the outer side of the support frame is also provided with abutment notches that match the sizes of the silver-plated copper particle epoxy resin strips and the polyimide strips.

[0016] Furthermore, the plug-in connecting bridge includes a U-shaped connecting plate, an insertion strip and a limit spring, the U-shaped connecting plate is fixedly connected to the top of the second glass fiber substrate, the insertion strip is slidably connected to the bottom inner side of the U-shaped connecting plate and is used to resist the arc-shaped spring sheet, and the two sides of the limit spring are respectively fixedly connected to the opposite side surfaces of the insertion strip and the U-shaped connecting plate.

[0017] Furthermore, the self-locking splicing components are provided in a plurality of groups, and the plurality of groups of self-locking splicing components are symmetrically distributed inside the first glass fiber substrate and the second glass fiber substrate.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. In the present invention, the device deforms the arc spring piece by inserting the plug-in connecting bridge into the inner side of the glass fiber substrate one, and inserts the hook spring piece into the interior of the glass fiber substrate two through the telescopic deformation of the specially made arc spring piece and stably connects it, and there is no through hole in the connecting part, so that multiple groups of spliced ​​circuit boards are easy to separate without affecting the strength of the boards, and are easy to disassemble.

[0020] 2. In the present invention, when the glass fiber substrate 1 and the glass fiber substrate 2 are clamped together, the contact piece will abut against the support frame, and the support frame will push the silver-plated copper particle epoxy resin strip in a direction horizontal to the limit frame, thereby squeezing out the non-conductive polyimide strip originally located in the cap via hole to prevent stress cracking of the circuit board, and squeezing the conductive silver-plated copper particle epoxy resin strip into the via hole, thereby forming an electrical connection.

[0021] 3. In the present invention, when the electrical connection is made, as the support frame is pushed, the contact brackets on both sides touch the sliding block, and push the fan-shaped baffle to the outside of the circular cover in the opening direction of the linear axis, so that the circular cover forms a semi-open effect, thereby accelerating the heat dissipation of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0023] Figure 1 It is a structural schematic diagram of the present invention;

[0024] Figure 2 The figure is a disassembly diagram of the glass fiber substrate 1 and the glass fiber substrate 2 in the present invention;

[0025] Figure 3 It is an enlarged view of the T-slot in the present invention;

[0026] Figure 4 This is an end face cutaway view of a glass fiber substrate 1 in the present invention;

[0027] Figure 5 It is a structural schematic diagram of the internal cross section of the glass fiber substrate in the present invention;

[0028] Figure 6 It is a structural schematic diagram of the self-locking splicing assembly in the present invention;

[0029] Figure 7 It is a structural schematic diagram of the filler switching part in the present invention;

[0030] Figure 8 It is a structural schematic diagram of the opening switching part in the present invention;

[0031] Fig. 9 is a distribution diagram of the heat dissipation components in the present invention;

[0032] Fig.10 It is a structural schematic diagram of one end of the glass fiber substrate in the present invention;

[0033] Fig.11 It is a structural schematic diagram of the plug-in connecting bridge in the present invention.

[0034] In the figure:

[0035] 1. Glass fiber substrate one; 2. Glass fiber substrate two; 3. Conductive layer; 4. BGA pad; 5. Cap via; 6. Plug-in connecting bridge; 61. U-shaped connecting plate; 62. Insertion strip; 63. Limit spring; 7. Self-locking splicing assembly; 71. Arc spring; 72. Contact piece; 73. Hook spring; 74. Support frame; 75. Filler switching part; 751. Limit frame; 752. Silver-plated copper particle epoxy resin strip; 753. Polyimide strip; 76. Open switching part; 761. Contact bracket; 762. Fixed plate; 763. Linear shaft; 764. Compression spring; 8. Heat dissipation assembly; 81. Round cover; 82. Fan-shaped baffle; 83. Sliding plate; 84. Connecting block; 9. T-slot; 10. L-slot; 11. Abutment notch. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] like Figure 1-Figure 11 A PCB circuit board shown in the figure includes a glass fiber substrate 1, a glass fiber substrate 2, a conductive layer 3, a BGA pad 4, a cap via 5, an inserted connecting bridge 6, a self-locking splicing component 7 and a heat dissipation component 8, wherein the conductive layer 3 is welded on the top of the glass fiber substrate 1 and the glass fiber substrate 2, the surface of the inserted connecting bridge 6 is fixedly connected to the two ends of the glass fiber substrate 2, the BGA pad 4 is welded on the middle of the glass fiber substrate 1 and the glass fiber substrate 2, the cap via 5 is installed inside the glass fiber substrate 1 and the glass fiber substrate 2, the self-locking splicing component 7 is installed on the two ends of the glass fiber substrate 1, and the heat dissipation component 8 is installed The top of the glass fiber substrate 1 and the glass fiber substrate 2; the plug-in connecting bridge 6 is used to connect the glass fiber substrate 1 and the glass fiber substrate 2, the BGA pad 4 is used to connect the high-density integrated circuit and the chipset, the conductive layer 3 is used to transmit current and signals, the cap via 5 is used to optimize the electrical connection and reduce electromagnetic radiation and interference, the self-locking splicing component 7 cooperates with the plug-in connecting bridge 6 to hang the glass fiber substrate 2 and switch the conductive material and non-conductive material inside the glass fiber substrate 1 and the glass fiber substrate 2, and the heat dissipation component 8 cooperates with the self-locking splicing component 7 to open the glass fiber substrate 1 and the glass fiber substrate 2 and dissipate heat.

[0038] BGA pad 4 is a packaging method of integrated circuit using organic substrate, which is connected to the pad on the main board through spherical solder beads to achieve electrical connection between the chip and the main board. The conductive layer 3 is mainly composed of copper foil, and a circuit pattern is formed on the substrate through a specific process and is responsible for transmitting current and signals. The device deforms the arc spring 71 by inserting the plug-in connection bridge 6 into the inner side of the glass fiber substrate 1, and the hook spring 73 is inserted into the inner side of the glass fiber substrate 2 2 through the expansion and contraction of the specially made arc spring 71 and stably connected, and the connecting part The absence of vias makes it easy to separate multiple groups of spliced ​​circuit boards without affecting the strength of the boards, and it is convenient to disassemble; when the glass fiber substrate 1 and the glass fiber substrate 2 are clamped, the contact piece 72 will abut the support frame 74, and the support frame 74 will push the silver-plated copper particle epoxy resin strip 752 in a direction horizontal to the limit frame 751, thereby squeezing out the non-conductive polyimide strip 753 originally located in the cap via 5 to prevent stress cracking of the circuit board, and squeezing the conductive silver-plated copper particle epoxy resin strip 752 into the via, thereby forming an electrical connection.

[0039] like Figure 1-Figure 11 As shown, the self-locking splicing assembly 7 includes an arc-shaped spring piece 71, a contact piece 72, a hook spring piece 73, a support frame 74, a filling switching part 75 and an opening switching part 76. The arc-shaped spring piece 71 is installed inside the glass fiber substrate 1, the contact piece 72 is fixedly connected to the two ends of the bottom of the arc-shaped spring piece 71, the hook spring piece 73 is installed on one side of the contact piece 72 and is used to hang on the glass fiber substrate 2, the support frame 74 is installed on the other side of the contact piece 72, the filling switching part 75 is installed inside the glass fiber substrate 1 and the glass fiber substrate 2, and the opening switching part 76 is symmetrically distributed on both sides of the support frame 74.

[0040] When the contact piece 72 and the hook spring piece 73 extend inside the glass fiber substrate 1 and the glass fiber substrate 2, they will both contact the support frame 74 through the contact piece 72. The support frames 74 symmetrically distributed inside the glass fiber substrate 1 and the glass fiber substrate 2 will gather toward the middle. At this time, the slope of the contact groove of the support frame 74 contacts and sticks to the silver-plated copper particle epoxy resin strip 752. The silver-plated copper particle epoxy resin strip 752 sticks to the non-conductive polyimide strip 753 originally located in the cap via 5 to prevent stress cracking of the circuit board along the direction of the limiting frame 751 and squeezes it outward, and squeezes the conductive silver-plated copper particle epoxy resin strip 752 into the via, thereby forming an electrical connection.

[0041] The filler switching part 75 includes a limiting frame 751, a silver-plated copper particle epoxy resin strip 752 and a polyimide strip 753. The limiting frame 751 is installed inside the glass fiber substrate 1 and the glass fiber substrate 2. The silver-plated copper particle epoxy resin strip 752 and the polyimide strip 753 are slidably connected inside the limiting frame 751 and are used for electrical signal transmission and electrical signal interference between various layers of the circuit board.

[0042] The opening switching part 76 includes a contact bracket 761, a fixing plate 762, a linear shaft 763 and a compression spring 764. The contact bracket 761 is fixedly connected to the outer side of the support frame 74. The fixing plate 762 is installed on the top inner side of the glass fiber substrate 1 and the glass fiber substrate 2 and is located obliquely above the contact bracket 761. The linear shaft 763 is installed on one side of the fixing plate 762. The two ends of the compression spring 764 are respectively fixedly connected to the opposite side surfaces of the heat dissipation component 8 and the fixing plate 762.

[0043] The heat dissipation assembly 8 includes a circular cover 81, a fan-shaped baffle 82, a sliding plate 83 and a connecting block 84. The circular cover 81 is installed on the top of the glass fiber substrate 1 and the glass fiber substrate 2, the fan-shaped baffle 82 is slidably connected to the lower end of the circular cover 81, the sliding plate 83 is installed at the bottom of the fan-shaped baffle 82, and the connecting block 84 is installed on both sides of the sliding plate 83 and is used for slidingly connecting the linear shaft 763.

[0044] The sliding plate 83 at the lower end of the fan-shaped baffle 82 contacts the contact bracket 761, and the contact bracket 761 pushes the sliding plate 83 and indirectly pushes the fan-shaped baffle 82 to move in the direction of the fixed plate 762. The linear shaft 763 cooperates with the connecting block 84 to achieve a stable limiting effect, thereby opening the gap of the circular cover 81 to achieve ventilation and heat dissipation; when the glass fiber substrate 1 and the glass fiber substrate 2 2 are disassembled, the limiting spring 63 rebounds, thereby pushing the fan-shaped baffle 82 back to the gap below the circular cover 81, completing the re-blocking, which is safe and convenient to use.

[0045] The glass fiber substrate 1 is also provided with a T-shaped slot 9 for placing the arc-shaped spring piece 71 and the contact piece 72.

[0046] The interior of the glass fiber substrate 2 is also provided with an L-shaped groove 10 that matches the size of the contact piece 72 and the hook spring piece 73 .

[0047] The outer side of the support frame 74 is also provided with abutment notches 11 that match the sizes of the silver-plated copper particle epoxy resin strips 752 and the polyimide strips 753 .

[0048] The plug-in connecting bridge 6 includes a U-shaped connecting plate 61, an insertion strip 62 and a limit spring 63. The U-shaped connecting plate 61 is fixedly connected to the top of the glass fiber substrate 2, the insertion strip 62 is slidably connected to the bottom inner side of the U-shaped connecting plate 61 and is used to resist the arc-shaped spring leaf 71, and the two sides of the limit spring 63 are fixedly connected to the opposite side surfaces of the insertion strip 62 and the U-shaped connecting plate 61 respectively.

[0049] Insert the U-shaped connecting plate 61 above the glass fiber substrate 2 into the T-shaped slot 9 of the glass fiber substrate 1, and the insertion strip 62 squeezes the arc-shaped spring sheet 71. The arc-shaped spring sheet 71 is deformed under pressure and pushes the contact sheet 72 to both sides along the bottom of the T-shaped slot 9. The hook spring sheet 73 on one side of the contact sheet 72 is fully extended into the L-shaped slot 10 of the glass fiber substrate 2 and then rebounds, and fully rests on the inner wall surface of the L-shaped slot 10, completing the clamping and fixing of the glass fiber substrate 1 and the glass fiber substrate 2.

[0050] A plurality of self-locking splicing components 7 are provided, and the plurality of self-locking splicing components 7 are symmetrically distributed inside the glass fiber substrate 1 and the glass fiber substrate 2 2 .

[0051] Working principle: When in use, the U-shaped connecting plate 61 above the glass fiber substrate 2 is inserted into the T-shaped slot 9 of the glass fiber substrate 1, and the insertion strip 62 squeezes the arc-shaped spring sheet 71. The arc-shaped spring sheet 71 is deformed under pressure and pushes the contact sheet 72 to both sides along the bottom of the T-shaped slot 9. The hook spring sheet 73 on one side of the contact sheet 72 is fully extended into the L-shaped slot 10 of the glass fiber substrate 2 and then rebounds, and fully rests on the inner wall surface of the L-shaped slot 10, completing the clamping and fixing of the glass fiber substrate 1 and the glass fiber substrate 2; in this process, the contact sheet 72 and the hook spring sheet 73 will both contact the support frame 74 through the contact sheet 72 when extending inside the glass fiber substrate 1 and the glass fiber substrate 2, and the support frames 74 symmetrically distributed inside the glass fiber substrate 1 and the glass fiber substrate 2 will gather toward the middle. At this time, the slope of the contact notch of the support frame 74 contacts and sticks to the silver-plated copper particle epoxy resin strip 752, and the silver-plated copper particle epoxy resin strip 752 sticks and extrude the non-conductive polyimide strip 753 originally located in the cap via 5 for preventing stress cracking of the circuit board along the direction of the limit frame 751, and squeezes outward, and squeezes the conductive silver-plated copper particle epoxy resin strip 752 into the via, thereby forming an electrical connection. At the same time, when the support frame 74 moves, the contact brackets 761 located on both sides simultaneously approach the circular cover 81. During this process, the sliding plate 83 located at the lower end of the fan-shaped baffle 82 contacts the contact bracket 761, and the contact bracket 761 pushes the sliding plate 83 and indirectly pushes the fan-shaped baffle 82 to move in the direction of the fixed plate 762. The linear shaft 763 cooperates with the connecting block 84 to achieve a stable limiting effect, thereby opening the gap of the circular cover 81 to achieve ventilation and heat dissipation. When the glass fiber substrate 1 and the glass fiber substrate 2 are disassembled, the limit spring 63 rebounds, thereby pushing the fan-shaped baffle 82 back to the gap below the circular cover 81, completing the re-blocking, which is safe and convenient to use.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB circuit board, characterized in that: The invention comprises a glass fiber substrate (1), a glass fiber substrate (2), a conductive layer (3), a BGA soldering pad (4), a cap via hole (5), an insert-type connecting bridge (6), a self-locking splicing component (7) and a heat dissipation component (8), wherein the conductive layer (3) is welded on the top of the glass fiber substrate (1) and the glass fiber substrate (2), the surface of the insert-type connecting bridge (6) is fixedly connected to the two ends of the glass fiber substrate (2), the BGA soldering pad (4) is welded on the middle of the glass fiber substrate (1) and the glass fiber substrate (2), the cap via hole (5) is installed inside the glass fiber substrate (1) and the glass fiber substrate (2), the self-locking splicing component (7) is installed on the two ends of the glass fiber substrate (1), and the heat dissipation component (8) is installed on the top of the glass fiber substrate (1) and the glass fiber substrate (2); The plug-in connection bridge (6) is used to connect the first glass fiber substrate (1) and the second glass fiber substrate (2), the BGA pad (4) is used to connect a high-density integrated circuit and a chipset, the conductive layer (3) is used to transmit current and signals, and the cap via (5) is used to optimize electrical connection and reduce electromagnetic radiation and interference.

2. The PCB circuit board according to claim 1, characterized in that: The self-locking splicing assembly (7) comprises an arc-shaped spring sheet (71), a contact sheet (72), a hook spring sheet (73), a support frame (74), a filling switching portion (75) and an opening switching portion (76); the arc-shaped spring sheet (71) is mounted inside the first glass fiber substrate (1); the contact sheet (72) is fixedly connected to the two ends of the bottom of the arc-shaped spring sheet (71); the hook spring sheet (73) is mounted on one side of the contact sheet (72) and is used to hang on the second glass fiber substrate (2); the support frame (74) is mounted on the other side of the contact sheet (72); the filling switching portion (75) is mounted inside the first glass fiber substrate (1) and the second glass fiber substrate (2); and the opening switching portion (76) is symmetrically distributed on both sides of the support frame (74).

3. The PCB circuit board according to claim 2, characterized in that: The filler switching part (75) comprises a limiting frame (751), a silver-plated copper particle epoxy resin strip (752) and a polyimide strip (753); the limiting frame (751) is installed inside the first glass fiber substrate (1) and the second glass fiber substrate (2); the silver-plated copper particle epoxy resin strip (752) and the polyimide strip (753) are slidably connected inside the limiting frame (751) and are used for electrical signal transmission and electrical signal interference between various layers of the circuit board.

4. The PCB circuit board according to claim 2, characterized in that: The opening switching portion (76) comprises a contact bracket (761), a fixing plate (762), a linear shaft (763) and a compression spring (764); the contact bracket (761) is fixedly connected to the outer side of the support frame (74); the fixing plate (762) is mounted on the inner side of the top of the glass fiber substrate 1 (1) and the glass fiber substrate 2 (2) and is located obliquely above the contact bracket (761); the linear shaft (763) is mounted on one side of the fixing plate (762); and the two ends of the compression spring (764) are respectively fixedly connected to the opposite side surfaces of the heat dissipation component (8) and the fixing plate (762).

5. The PCB circuit board according to claim 4, characterized in that: The heat dissipation assembly (8) comprises a circular cover (81), a fan-shaped baffle (82), a sliding plate (83) and a connecting block (84); the circular cover (81) is mounted on the top of the first glass fiber substrate (1) and the second glass fiber substrate (2); the fan-shaped baffle (82) is slidably connected to the lower end of the circular cover (81); the sliding plate (83) is mounted on the bottom of the fan-shaped baffle (82); and the connecting block (84) is mounted on both sides of the sliding plate (83) and is used for slidably connecting the linear shaft (763).

6. The PCB circuit board according to claim 2, characterized in that: The glass fiber substrate (1) is also provided with a T-shaped groove (9) for accommodating the arc-shaped spring piece (71) and the contact piece (72).

7. The PCB circuit board according to claim 2, characterized in that: The second glass fiber base plate (2) is also provided with an L-shaped groove (10) matching the size of the contact piece (72) and the hook spring piece (73).

8. The PCB circuit board according to claim 3, characterized in that: The outer side of the support frame (74) is also provided with abutment notches (11) matching the sizes of the silver-plated copper particle epoxy resin strips (752) and the polyimide strips (753).

9. The PCB circuit board according to claim 2, characterized in that: The plug-in connecting bridge (6) comprises a U-shaped connecting plate (61), an inserting strip (62) and a limiting spring (63); the U-shaped connecting plate (61) is fixedly connected to the top of the second glass fiber base plate (2); the inserting strip (62) is slidably connected to the inner side of the bottom of the U-shaped connecting plate (61) and is used to abut against the arc-shaped spring sheet (71); and the two sides of the limiting spring (63) are respectively fixedly connected to the opposite side surfaces of the inserting strip (62) and the U-shaped connecting plate (61).

10. The PCB circuit board according to claim 2, characterized in that: The self-locking splicing components (7) are provided in a plurality of groups, and the plurality of groups of self-locking splicing components (7) are symmetrically distributed inside the glass fiber substrate one (1) and the glass fiber substrate two (2). The self-locking splicing components (7) cooperate with the plug-in connecting bridge (6) to be hung on the glass fiber substrate two (2) and to switch the conductive material and the non-conductive material inside the glass fiber substrate one (1) and the glass fiber substrate two (2). The heat dissipation components (8) cooperate with the self-locking splicing components (7) to open the glass fiber substrate one (1) and the glass fiber substrate two (2) and to dissipate heat.

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