Flexible circuit board, display module and display device

Abstract

The invention provides a flexible circuit board, a display module and a display device, the flexible circuit board comprises a first circuit board and a second circuit board, and the first circuit board at least comprises a first single-layer board and a second single-layer board which are stacked; the second circuit board comprises a third single-layer board arranged at one end of the first single-layer board, the third single-layer board is connected with the first single-layer board, and the surface, close to the second single-layer board, of the third single-layer board is flush with the surface, close to the second single-layer board, of the first single-layer board. The groove exposes a part of the first single-layer board, and the arrangement of the groove can increase the adsorption area of the adsorption equipment on the flexible circuit board, thereby improving the adsorption stability of the adsorption equipment. Meanwhile, a device part is arranged on the surface, away from the first single-layer plate, of the second single-layer plate, and the device part and the side wall of the groove are arranged at intervals, so that interference between the device part and the adsorption equipment is avoided.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a flexible circuit board, a display module and a display device. Background Art

[0002] As the market demand for foldable screen mobile phones increases, users have higher requirements for the battery life, thinness, etc. of the devices. In order to meet these demands, the whole machine manufacturers need to compress various components to make more space for increasing battery capacity or reducing the overall thickness.

[0003] At present, as a key component of the folding screen, the flexible printed circuit board is responsible for connecting the screen and the motherboard. In the traditional production process, an adsorption device is required to adsorb the flexible circuit board from the packaging tray to the operating table for binding. The equipment for adsorbing the flexible circuit board generally adopts a vacuum adsorption mode; as users' requirements for the size of flexible circuit boards become smaller and smaller, the area on the flexible circuit board provided for adsorption equipment to adsorb is reduced, which increases the difficulty of adsorption of the equipment, resulting in unstable or offset connection between the flexible circuit board and the screen, thereby affecting the final quality of the screen. Summary of the invention

[0004] Embodiments of the present invention provide a flexible circuit board, a display module and a display device to alleviate the deficiencies in the related art.

[0005] To achieve the above functions, the technical solutions provided by the embodiments of the present application are as follows:

[0006] The present application provides a flexible circuit board, including:

[0007] A first circuit board at least comprises a first single-layer board and a second single-layer board which are stacked;

[0008] A second circuit board, comprising a third single-layer board arranged at one end of the first single-layer board, the third single-layer board is connected to the first single-layer board, and a surface of the third single-layer board close to the second single-layer board is flush with a surface of the first single-layer board close to the second single-layer board, and at least one groove is formed on a side of the second single-layer board close to the second circuit board, and at least two of the grooves expose a portion of the first single-layer board;

[0009] Wherein, a device portion is provided on a surface of the second single-layer board away from the first single-layer board, and the device portion is spaced apart from a side wall of the groove.

[0010] Optionally, in one embodiment, the first single-layer plate includes a first portion corresponding to the groove, and the third single-layer plate includes a second portion disposed close to the first portion;

[0011] The flexible circuit board further includes an adsorption area, at least a portion of the first portion is located in the adsorption area, and at least a portion of the second portion is located in the adsorption area.

[0012] Optionally, in one embodiment, the groove includes a first side wall, and the first side wall is arranged on a side of the groove away from the second circuit board;

[0013] Wherein, along the direction from the first circuit board to the second circuit board, the ratio of the distance between the first side wall and the boundary of the third single-layer board away from the first single-layer board to the width of the flexible circuit board is 0.55-0.71.

[0014] Optionally, in one embodiment, the ratio of the distance between the first side wall and the adsorption area to the distance between the first side wall and a boundary of the third single-layer plate away from the first single-layer plate is 1 / 25 to 5 / 44.

[0015] Optionally, in one embodiment, the side wall of the groove is spaced apart from the adsorption area, and the distance between the side wall of the groove and the adsorption area is greater than or equal to 0.2 mm and less than or equal to 0.5 mm.

[0016] Optionally, in one embodiment, the shape of the adsorption area is circular, and the diameter of the adsorption area is greater than or equal to 4.4 mm and less than or equal to 5 mm.

[0017] Optionally, in one embodiment, the shape of the adsorption area is circular, and the diameter of the adsorption area is greater than or equal to 4.4 mm and less than or equal to 5 mm. Optionally, in one embodiment, the device portion includes a plurality of drive devices arranged at intervals, the plurality of drive devices are arranged around at least a portion of the side wall of the groove, and the drive device close to one side of the groove among the plurality of drive devices has a spacing greater than or equal to 0.2 mm and less than or equal to 0.5 mm from the side wall of the groove.

[0018] Optionally, in one embodiment, a first groove and a second groove are formed on a side of the second single-layer board close to the second circuit board, and the first groove and the second groove both expose a portion of the first single-layer board;

[0019] Wherein, along the direction from the first circuit board to the second circuit board, the first groove and the second groove are symmetrically arranged about the central axis of the first circuit board, and the driving device is arranged around at least a part of the side wall of the first groove.

[0020] Optionally, in one embodiment, both the first circuit board and the second circuit board include single-layer boards, and the number of the single-layer boards in the first circuit board is greater than the number of the single-layer boards in the second circuit board.

[0021] Optionally, in one embodiment, the first circuit board includes two layers of the single-layer boards stacked together, and the second circuit board includes one layer of the single-layer board, and the single-layer board includes:

[0022] Insulating substrate;

[0023] A conductive layer, disposed on one side of the insulating substrate;

[0024] A first adhesive layer is provided on a side of the conductive layer away from the insulating substrate;

[0025] A first insulating layer, disposed on a side of the first adhesive layer away from the conductive layer;

[0026] A second adhesive layer is provided on a side of the insulating substrate away from the conductive layer;

[0027] The second insulating layer is arranged on a side of the second adhesive layer away from the insulating substrate.

[0028] An embodiment of the present application also provides a display module, which includes a display panel and any of the above-mentioned flexible circuit boards; wherein the display panel includes a display portion, a first binding portion arranged opposite to the display portion, and a bending portion connected between the display portion and the first binding portion; the flexible circuit board is located on a side of the first binding portion away from the display portion, and the flexible circuit board is connected to the first binding portion.

[0029] An embodiment of the present application further provides a display device, which includes any of the display modules described above.

[0030] The beneficial effects of the embodiments of the present application are as follows: the embodiments of the present application provide a flexible circuit board, a display module and a display device, by opening at least one groove on the side of the second single-layer board close to the second circuit board, the groove exposes part of the first single-layer board, the setting of the groove can avoid the height difference problem between the single-layer board and the multi-layer board, can increase the area on the flexible circuit board for adsorption by the adsorption device, and improve the stability of the adsorption device during adsorption; at the same time, a device part is provided on the surface of the second single-layer board away from the first single-layer board, and the device part is spaced apart from the side wall of the groove, so as to avoid interference between the device part and the adsorption device, thereby improving the yield rate of the display module after the flexible circuit board and the display panel are bound. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic diagram of the structure of a display module provided in an embodiment of the present application;

[0033] Figure 2 A schematic diagram of the connection between the display panel and the flexible circuit board provided in the embodiment of the present application;

[0034] Figure 3 A schematic diagram of the structure of a single-layer board provided in an embodiment of the present application;

[0035] Figure 4 A schematic diagram of the structure of a flexible circuit board provided in an embodiment of the present application;

[0036] Figure 5 A schematic diagram of the top view of the flexible circuit board provided in an embodiment of the present application;

[0037] Figure 6 For the embodiment of this application Figure 5 Schematic diagram of the cross-sectional structure along the MM` direction;

[0038] Figure 7 A schematic diagram of the structure of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that

[0040] The specific embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application. In the present application, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working mode, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device. In addition, the terms "first" and "second" are only used for descriptive purposes, and the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] The disclosure below provides many different embodiments to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0043] In order to solve the above problems, the embodiments of the present application provide a flexible circuit board, a display module and a display device. The following are detailed descriptions of each. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0044] Please combine Figure 1 and Figure 2 ;in, Figure 1 A schematic diagram of the structure of a display module provided in an embodiment of the present application; Figure 2 A schematic diagram of the connection between the display panel and the flexible circuit board provided in an embodiment of the present application.

[0045] In one embodiment, the display module 1 includes a display panel 11 and a circuit board assembly. The display panel 11 can be used for display terminals such as foldable mobile phones. The display panel 11 includes a display part 111, a first binding part 112 arranged opposite to the display part 111, and a bending part 113 connected between the display part 111 and the first binding part 112; the circuit board assembly is located on a side of the first binding part 112 away from the display part 111, and the circuit board assembly is connected to the first binding part 112.

[0046] In which, the display module 1 can also include a first back panel 114, a first supporting layer 115, a second supporting layer 116 and a second back panel 117, the first back panel 114 is arranged on the side of the display part 111 close to the first binding part 112, the first supporting layer 115 is arranged on the side of the first back panel 114 away from the display part 111, the second back panel 117 is arranged on the side of the first binding part 112 close to the display part 111, and the second supporting layer 116 is arranged on the side of the second back panel 117 away from the first binding part 112.

[0047] The circuit board assembly may include a flexible printed circuit 12 (FPC), wherein the flexible circuit board 12 includes a first circuit board 121, a second circuit board 122, a connecting portion 123 and a second binding portion 124; the second circuit board 122 is arranged at one end of the first circuit board 121, the connecting portion 123 is arranged at an end of the first circuit board 121 away from the second circuit board 122, the connecting portion 123 is used to connect to an external main board, and the second binding portion 124 is arranged at an end of the second circuit board 122 away from the first circuit board 121, and the second binding portion 124 is used to connect to the first binding portion 112 of the display panel 11.

[0048] It can be understood that the external main board includes but is not limited to a processor, a memory, a power management unit, and a graphics processing unit, etc. The signals on the external main board are distributed to the first circuit board 121 and the second circuit board 122 of the flexible circuit board 12 through the connecting part 123. After processing, the signals are transmitted to the display panel 11 through the second binding part 124; the display panel 11 receives the signals from the second circuit board 122 and converts these electrical signals into visible images or information to realize the display function of the display part 111.

[0049] Please combine Figure 1 , Figure 2 and Figure 3 ;in, Figure 3 A schematic diagram of the structure of a single-layer board provided in an embodiment of the present application.

[0050] In one embodiment, along the first direction X, the second binding portion 124, the second circuit board 122, the first circuit board 121 and the connecting portion 123 are connected in sequence; wherein, the first circuit board 121 and the second circuit board 122 both include single-layer boards 1200, and the number of the single-layer boards 1200 in the first circuit board 121 is greater than the number of the single-layer boards 1200 in the second circuit board 122.

[0051] Specifically, the second circuit board 122 may include a single-layer board 1200, and the first circuit board 121 may include a plurality of single-layer boards 1200 stacked along a second direction Z; wherein the single-layer board 1200 may include an insulating substrate 1201, a conductive layer 1202, a first adhesive layer 1203, a first insulating layer 1204, a second adhesive layer 1205 and a second insulating layer 1206, the conductive layer 1202 is arranged on one side of the insulating substrate 1201, the first adhesive layer 1203 is arranged on a side of the conductive layer 1202 away from the insulating substrate 1201, the first insulating layer 1204 is arranged on a side of the first adhesive layer 1203 away from the conductive layer 1202, the second adhesive layer 1205 is arranged on a side of the insulating substrate 1201 away from the conductive layer 1202, and the second insulating layer 1206 is arranged on a side of the second adhesive layer 1205 away from the insulating substrate 1201; wherein the first direction X and the second direction Z form a preset angle.

[0052] Among them, the material of the insulating substrate 1201 can be a flexible insulating material such as polyimide, the material of the conductive layer 1202 can be a metal material with good conductivity such as metallic copper, the material of the first insulating layer 1204 and the material of the second insulating layer 1206 can both be flexible insulating materials such as polyimide, and the materials of the first adhesive layer 1203 and the second adhesive layer 1205 can both be insulating adhesive materials; at the same time, an electromagnetic shielding layer (not shown in the figure) can also be provided on the surface of the first insulating layer 1204 and the surface of the second insulating layer 1206 located on the outermost side of the single-layer board 1200 to shield the interference of external electrical signals on the inside of the flexible circuit board 12.

[0053] Furthermore, the single-layer board 1200 in the second circuit board 122 can be arranged on the same layer as any single-layer board 1200 in the first circuit board 121, that is, the first insulating layer 1204, the first adhesive layer 1203, the insulating substrate 1201, the conductive layer 1202, the second adhesive layer 1205 and the second insulating layer 1206 in the single-layer board 1200 on the same layer can all be formed in the same process, thereby reducing the process steps in the production process of the flexible circuit board 12 and reducing the manufacturing complexity.

[0054] It can be understood that, in this embodiment, by setting the first circuit board 121 to include a plurality of single-layer boards 1200 stacked along the first direction X, the wiring space of the first circuit board 121 in the first direction X is increased, and the width of the first circuit board 121 is reduced, thereby reducing the space occupied by the first circuit board 121 in the flexible circuit board 12 inside the display module 1, improving the internal layout of the display module 1, and making the components more compactly arranged, thereby improving the overall space utilization and design flexibility.

[0055] Furthermore, since more single-layer boards 1200 are stacked in the first circuit board 121, more electrical functions or devices can be integrated on the first circuit board 121, and the number of single-layer boards 1200 is reduced in the second circuit board 122, thereby reducing the thickness of the second circuit board 122, improving its flexibility and facilitating folding and installation.

[0056] It is understandable that in a folding screen device, the flexible circuit board 12 needs to be wired in a small space and must meet complex functional requirements. This embodiment reduces the complexity of the second circuit board 122 by setting the number of single-layer boards 1200 in the first circuit board 121 to be greater than the number of single-layer boards 1200 in the second circuit board 122, thereby avoiding unnecessary material stacking and optimizing the thickness design of the flexible circuit board 12.

[0057] It should be noted that, in this embodiment, the connecting portion 123 may include a plurality of single-layer boards 1200, the number of the single-layer boards 1200 stacked in the connecting portion 123 is greater than the number of the single-layer boards 1200 of the second circuit board 122, and the number of the single-layer boards 1200 stacked in the connecting portion 123 is less than the number of the single-layer boards 1200 of the second circuit board 122, and at least one of the single-layer boards 1200 in the connecting portion 123 may be arranged on the same layer as the single-layer boards 1200 in the second circuit board 122, thereby further reducing the process steps in the production process of the flexible circuit board 12; at the same time, it can also effectively and evenly distribute stress, avoid local stress concentration, and improve the structural stability of the flexible circuit board 12.

[0058] In addition, in this embodiment, the first direction can be Figure 2 The X direction in the figure, that is, the direction in which the first circuit board 121 points to the second circuit board 122, the second direction can be Figure 2 In the Z direction, the preset angle may be 90 degrees; in addition, the above-mentioned reduction in the width of the first circuit board 121 means that, Figure 2 The length of the first circuit board 121 in the first direction X.

[0059] Please combine Figure 1 , Figure 2 , Figure 4 and Figure 5 ;in, Figure 4 A schematic diagram of the structure of a flexible circuit board provided in an embodiment of the present application; Figure 5 This is a schematic diagram of the top view of the flexible circuit board provided in an embodiment of the present application.

[0060] In one embodiment, the first circuit board 121 at least includes a first single-layer board 1211 and a second single-layer board 1212 which are stacked, and the second circuit board 122 includes a third single-layer board 1221 which is arranged at one end of the first single-layer board 1211, the third single-layer board 1221 is connected to the first single-layer board 1211, and the surface of the third single-layer board 1221 close to the second single-layer board 1212 is flush with the surface of the first single-layer board 1211 close to the second single-layer board 1212, and at least one groove 1210 is provided on a side of the second single-layer board 1212 close to the second circuit board 122, and the groove 1210 exposes a portion of the first single-layer board 1211; wherein a device portion 125 is provided on a surface of the second single-layer board 1212 away from the first single-layer board 1211, and the device portion 125 is spaced apart from the side wall of the groove 1210.

[0061] It should be noted that, as the user's requirements for the size of the existing flexible circuit board 12 are reduced, the area of ​​the adsorption zone 126 of the adsorption device is also reduced; in addition, there is often a height difference in the combined structure of the single-layer board 1200 and the multi-layer board, which causes vacuum leakage in the adsorption device during the adsorption process and makes it impossible to adsorb stably, thereby causing the problem of unstable or offset connection when the flexible circuit board 12 is bound to the display panel 11.

[0062] It can be understood that in this embodiment, at least one groove 1210 is opened on the side of the second single-layer board 1212 close to the second circuit board 122, and the groove 1210 exposes a portion of the first single-layer board 1211, and the surface of the third single-layer board 1221 close to the second single-layer board 1212 is flush with the surface of the first single-layer board 1211 close to the second single-layer board 1212, thereby solving the problem of height difference between different circuit boards and avoiding the problem of unstable adsorption of the adsorption equipment due to inconsistent heights of the first circuit board 121 and the second circuit board 122.

[0063] In addition, a device portion 125 is provided on the surface of the second single-layer board 1212 away from the first single-layer board 1211, and the device portion 125 is spaced apart from the side wall of the groove 1210, thereby avoiding physical interference between the device portion 125 and the groove 1210, preventing the device portion 125 from colliding with the groove 1210 or affecting the stability during the production process, thereby improving the yield rate of the display module 1 after the flexible circuit board 12 and the display panel 11 are bound.

[0064] Specifically, the first single-layer board 1211 includes a first part 12111 corresponding to the groove 1210, and the third single-layer board 1221 includes a second part 12211 arranged close to the first part 12111, and the second part 12211 is connected to the first part 12111; the flexible circuit board 12 also includes an adsorption area 126, at least part of the first part 12111 is located in the adsorption area 126, and at least part of the second part 12211 is located in the adsorption area 126; wherein, the second single-layer board 1212 is located outside the adsorption area 126, thereby ensuring that the adsorption area 126 is separated from the second single-layer board 1212, thereby avoiding the height difference problem caused by the adsorption part spanning different single-layer boards 1200.

[0065] In this embodiment, part of the first part 12111 and part of the second part 12211 in the adsorption area 126 can serve as adsorption positions on the flexible circuit board 12 for adsorption by the adsorption device; by defining the adsorption area 126 on the flexible circuit board 12, and arranging at least part of the first part 12111 to be located in the adsorption area 126, and at least part of the second part 12211 to be located in the adsorption area 126, the problem of unstable adsorption of the flexible circuit board 12 due to structural inconsistency or position deviation during the adsorption process can be avoided.

[0066] It can be understood that this embodiment provides a flat and consistent adsorption position for the adsorption device by arranging at least a portion of the first part 12111 to be located in the adsorption area 126 and at least a portion of the second part 12211 to be located in the adsorption area 126, thereby ensuring the precise operation of the adsorption device in production, thereby eliminating the vacuum leakage and unstable adsorption problems caused by the height difference or unreasonable layout between the single-layer board 1200 and the multi-layer board, thereby avoiding the unstable connection or offset problems that may occur when the flexible circuit board 12 is bound to the display panel 11.

[0067] Furthermore, the design of the groove 1210 can limit at least a portion of the first portion 12111 to be located within the adsorption area 126. By combining the first portion 12111 with the second portion 12211, the area on the flexible circuit board 12 for adsorption by the adsorption device can be increased, which helps to improve the overall stability of the device during operation, thereby improving the yield rate of the display module 1 after the flexible circuit board 12 and the display panel 11 are bound.

[0068] It should be noted that the adsorption device includes but is not limited to a vacuum adsorption device. During the binding process of the flexible circuit board 12 and the display panel 11, the adsorption device generates negative pressure through the suction nozzle and the adsorption area 126 of the flexible circuit board 12, thereby firmly adsorbing the circuit board to prevent it from moving or warping, thereby ensuring the accuracy and stability of the subsequent process.

[0069] Please continue to combine Figure 1 , Figure 2 , Figure 4 and Figure 5 In one embodiment, the side wall of the groove 1210 is spaced apart from the adsorption area 126, and the distance between the side wall of the groove 1210 and the adsorption area 126 is greater than or equal to 0.2 mm and less than or equal to 0.5 mm.

[0070] Specifically, the shape of the adsorption area 126 can be one of a circle, a rectangle or a trapezoid; wherein, when the shape of the adsorption area 126 is a circle, the diameter of the adsorption area 126 is greater than or equal to 4.4 mm, and less than or equal to 5 mm. At this time, the adsorption device can use a circular suction nozzle with a diameter of 4 mm, and grasp the flexible circuit board 12 by vacuum adsorption with the adsorption part.

[0071] During the binding process of the flexible circuit board 12 and the display panel 11, the suction nozzle of the adsorption device is required to fully contact the surface of the flexible circuit board 12 when adsorbing the flexible circuit board 12 to form a stable vacuum adsorption effect. If the suction nozzle directly contacts the side wall of the groove 1210, the uneven surface pressure or height difference may cause the adsorption device to tilt or slide when grasping the flexible circuit board 12, aggravating the poor adsorption and further affecting the production efficiency. It can be understood that in this embodiment, the side wall of the groove 1210 is spaced apart from the adsorption area 126, and the distance between the side wall of the groove 1210 and the adsorption area 126 is greater than or equal to 0.2 mm and less than or equal to 0.5 mm, thereby avoiding the suction nozzle of the adsorption device and the side wall of the groove 1210 from contacting each other, ensuring that the suction nozzle can stably grasp the flexible circuit board 12, and enhancing the stability and accuracy of the adsorption device.

[0072] Further, in one embodiment, the groove 1210 includes a first side wall 12101, and the first side wall 12101 is arranged on the side of the groove 1210 away from the second circuit board 122; wherein, along the direction of the first circuit board 121 pointing to the second circuit board 122, the ratio of the distance D1 between the first side wall 12101 and the boundary of the third single-layer board 1221 away from the first single-layer board 1211 and the width D2 of the flexible circuit board 12 is 0.55 to 0.71.

[0073] It can be understood that this embodiment can optimize the space utilization of the flexible circuit board 12 by controlling the ratio between D1 and D2. For example, increasing the distance D1 between the first side wall 12101 and the boundary of the third single-layer board 1221 away from the first single-layer board 1211 can provide more adsorption space for the adsorption device, while reducing the width D2 of the flexible circuit board 12 can save the overall installation space of the flexible circuit board 12; and, by controlling the ratio between D1 and D2, it can also ensure the universality of the distance D1 between the first side wall 12101 and the boundary of the third single-layer board 1221 away from the first single-layer board 1211 in flexible circuit boards 12 of different sizes, that is, the design provided in this embodiment can better adapt to the width design of different flexible circuit boards 12, ensure the design consistency between different product models, and improve the production yield.

[0074] It should be noted that the width D2 of the flexible circuit board 12 refers to the sum of the width of the first circuit board 121 and the width of the second circuit board 122 along the first direction X. In this embodiment, the width D2 of the flexible circuit board 12 does not include the width of the connecting portion 123 and the width of the second binding portion 124.

[0075] Please continue to combine Figure 1 , Figure 2 , Figure 4 and Figure 5 In one embodiment, the ratio of the distance D3 between the first side wall 12101 and the adsorption area 126 to the distance D1 between the first side wall 12101 and the boundary of the third single-layer plate 1221 away from the first single-layer plate 1211 is 1 / 25 to 5 / 44; specifically, the distance D3 between the first side wall 12101 and the adsorption area 126 is greater than or equal to 0.2 mm and less than or equal to 0.5 mm.

[0076] It can be understood that this embodiment can optimize the design of the adsorption area 126 by controlling the ratio between D1 and D3; specifically, by adjusting the ratio between D1 and D3, it can ensure that the distance between the adsorption area 126 and the first side wall 12101 is appropriate, thereby providing a flat, interference-free area for the adsorption device; at the same time, by adjusting the ratio between D1 and D3, it is also possible to maintain the consistency and rationality of the design of the nozzle adsorption area 126 in different application scenarios, further improving the adaptability of the design of the flexible circuit board 12.

[0077] Please combine Figure 1 , Figure 2 , Figure 4, Figure 5 and Figure 6 ;in, Figure 6 Embodiments of the present application Figure 5 Schematic diagram of the cross-sectional structure along the MM` direction.

[0078] In one embodiment, the first circuit board 121 also includes a fourth single-layer board 1213, a fifth single-layer board 1214, a sixth single-layer board 1215 and a seventh single-layer board 1216; the fourth single-layer board 1213, the fifth single-layer board 1214, the sixth single-layer board 1215 and the seventh single-layer board 1216 are stacked in sequence on the side of the first single-layer board 1211 away from the second single-layer board 1212.

[0079] It can be understood that, in this embodiment, the technical solution of the present application is illustrated by taking the example that the first circuit board 121 includes six single-layer boards 1200 stacked along the second direction Z, and the second circuit board 122 includes one single-layer board 1200.

[0080] It should be noted that, in this embodiment, the second single-layer board 1212 can be located at the topmost layer of the first circuit board 121, and the third single-layer board 1221 can be in the same plane with any layer of the first single-layer board 1211, the fourth single-layer board 1213, the fifth single-layer board 1214, the sixth single-layer board 1215 or the seventh single-layer board 1216. The groove 1210 penetrates part of the first circuit board 121 in the opposite direction of the second direction Z, and exposes part of the single-layer board 1200 in the first circuit board 121 that is arranged on the same layer as the third single-layer board 1221, thereby meeting the requirements of this design.

[0081] Please continue to combine Figure 1 , Figure 2 , Figure 4 and Figure 5 In one embodiment, the device portion 125 includes a plurality of drive devices 1251 that are spaced apart from each other, and the plurality of drive devices 1251 are disposed around at least a portion of the side wall of the groove 1210, and a spacing between the drive device 1251 that is close to one side of the groove 1210 and the side wall of the groove 1210 is greater than or equal to 0.2 mm and less than or equal to 0.5 mm.

[0082] Specifically, the orthographic projection of the driving device 1251 on the first single-layer board 1211 does not overlap with the orthographic projection of the groove 1210 on the first single-layer board 1211, and the driving device 1251 includes but is not limited to one or more of integrated circuit chips, power management modules, driving display devices, sensors and capacitors, inductors, crystal oscillators and other passive components.

[0083] It is understandable that during the binding process of the flexible circuit board 12 and the display panel 11, when the suction nozzle of the adsorption device adsorbs the flexible circuit board 12, if the position of the driving device 1251 overlaps with the position of the groove 1210, the adsorption device will fail to effectively adsorb the flexible circuit board 12, thereby affecting the stability of the flexible circuit board 12 during the binding process, resulting in defective products or reduced yield.

[0084] In this embodiment, a plurality of the driving devices 1251 are arranged around at least a portion of the side wall of the groove 1210, and the distance between the driving device 1251 close to the side of the groove 1210 and the side wall of the groove 1210 is greater than or equal to 0.2 mm and less than or equal to 0.5 mm, thereby effectively avoiding interference between the driving device 1251 and the adsorption portion, ensuring that the adsorption device can reliably adsorb the flexible circuit board 12, and avoiding the phenomenon of unstable adsorption or device vacuum breaking.

[0085] Furthermore, by arranging that the orthographic projection of the driving device 1251 on the first single-layer board 1211 does not overlap with the orthographic projection of the groove 1210 on the first single-layer board 1211, the mechanical structural stability of the flexible circuit board 12 can be improved, thereby avoiding problems such as board deformation or device damage caused by uneven force on the adsorption part, thereby ensuring the long-term durability of the entire flexible circuit board 12 in the folding mobile phone.

[0086] It should be noted that, according to the design requirements of the flexible circuit board 12 , the device portion 125 may also be located above the second circuit board 122 . In this embodiment, the device portion 125 on the second circuit board 122 is not described in detail.

[0087] Please continue to combine Figure 1 , Figure 2 , Figure 4 and Figure 5 In one embodiment, a first groove 12102 and a second groove 12103 are formed on one side of the second single-layer board 1212 close to the second circuit board 122, and the first groove 12102 and the second groove 12103 both expose a portion of the first single-layer board 1211; wherein, along the direction from the first circuit board 121 to the second circuit board 122, the first groove 12102 and the second groove 12103 are symmetrically arranged about the central axis W1 of the first circuit board 121, and the driving device 1251 is arranged around at least a portion of the side wall of the first groove 12102.

[0088] It can be understood that in this embodiment, the first groove 12102 and the second groove 12103 are symmetrically arranged about the central axis of the first circuit board 121, so that the adsorption device can grasp the flexible circuit board 12 more stably and accurately, reduce the deformation or damage of the flexible circuit board 12 caused by uneven force on the adsorption surface during grasping, and improve the yield.

[0089] At the same time, since the first groove 12102 and the second groove 12103 are symmetrically arranged, the two sides of the flexible circuit board 12 are evenly stressed, which improves its ability to resist bending and impact, reduces warping, deformation and other problems that may occur during the binding process, and ensures the reliability of the flexible circuit board 12.

[0090] Please continue to combine Figure 1 , Figure 2 , Figure 4 and Figure 5 In one embodiment, the display module 1 further includes a functional film layer 118, a packaging structure 119 and a chip 13. The functional film layer 118 and the packaging structure 119 are sequentially arranged on the light-emitting side of the display portion 111 of the display panel 11. The functional film layer 118 includes but is not limited to a polarizer 1181 located on the light-emitting side of the display panel 11. The orthographic projection of the functional film layer 118 in a direction perpendicular to the display panel 11 completely covers the display portion 111. The shape of the packaging structure 119 matches the shape of the functional film layer 118 and can be attached to the side of the functional film layer 118 away from the display panel 11 through an adhesive layer (not shown in the figure). The packaging structure 119 includes but is not limited to a flexible substrate 1191 and a flexible cover plate 1192 sequentially away from the body of the display panel 11, and the flexible substrate 1191 is located between the functional film layer 118 and the flexible cover plate 1192.

[0091] Among them, the material of the flexible substrate 1191 includes but is not limited to one of cover glass (Cover window, CW) and ultra-thin glass (Ultra-Thin Glass, UTG), and the flexible cover plate 1192 includes but is not limited to a combination of a cover plate material protective film (protect window, PW) and optically clear adhesive (Optically Clear Adhesive OCA); further, the material of the cover plate material protective film includes but is not limited to one of polyethylene glycol terephthalate (PET) and transparent polyimide (Colorless Polyimide, CPI).

[0092] See also Figure 7, is a schematic diagram of the structure of the display device provided in an embodiment of the present application.

[0093] This embodiment further provides a display device 2 , which includes the display module 1 described in any one of the above embodiments.

[0094] It can be understood that the display module 1 has been described in detail in the above embodiments and will not be repeated here.

[0095] The display device 2 may further include a housing 21 , which is integrated with the display module 1 to provide support, fixation and protection for the display module 1 .

[0096] In specific applications, the display device 2 can be at least one of a foldable smartphone, a foldable tablet computer, a foldable mobile phone, a video phone, an e-book reader, a desktop computer, a laptop, a netbook, a workstation, a server, a personal digital assistant, a portable media player, an MP3 player, a mobile medical machine, a camera, a game console, a digital camera, a car navigation system, an electronic billboard, an ATM or a wearable device, etc., which have a display function.

[0097] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] The above is a detailed introduction to a flexible circuit board, a display module and a display device provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. A flexible circuit board, characterized in that: include: A first circuit board at least comprises a first single-layer board and a second single-layer board which are stacked; A second circuit board, comprising a third single-layer board arranged at one end of the first single-layer board, the third single-layer board is connected to the first single-layer board, and a surface of the third single-layer board close to the second single-layer board is flush with a surface of the first single-layer board close to the second single-layer board, and at least one groove is formed on a side of the second single-layer board close to the second circuit board, and the groove exposes a portion of the first single-layer board; Wherein, a device portion is provided on a surface of the second single-layer board away from the first single-layer board, and the device portion is spaced apart from a side wall of the groove.

2. The flexible circuit board according to claim 1, characterized in that: The first single-layer plate includes a first portion corresponding to the groove, and the third single-layer plate includes a second portion disposed close to the first portion; The flexible circuit board further includes an adsorption area, at least a portion of the first portion is located in the adsorption area, and at least a portion of the second portion is located in the adsorption area.

3. The flexible circuit board according to claim 2, characterized in that: The groove comprises a first side wall, and the first side wall is arranged on a side of the groove away from the second circuit board; Wherein, along the direction from the first circuit board to the second circuit board, the ratio of the distance between the first side wall and the boundary of the third single-layer board away from the first single-layer board to the width of the flexible circuit board is 0.55-0.

71.

4. The flexible circuit board according to claim 3, characterized in that: The ratio of the distance between the first side wall and the adsorption area to the distance between the first side wall and the boundary of the third single-layer plate away from the first single-layer plate is 1 / 25 to 5 / 44.

5. The flexible circuit board according to claim 3, characterized in that: The side wall of the groove is spaced apart from the adsorption area, and the distance between the side wall of the groove and the adsorption area is greater than or equal to 0.2 mm and less than or equal to 0.5 mm.

6. The flexible circuit board according to claim 2, characterized in that: The adsorption area is circular in shape, and the diameter of the adsorption area is greater than or equal to 4.4 mm and less than or equal to 5 mm.

7. The flexible circuit board according to any one of claims 1 to 6, characterized in that: The device portion includes a plurality of drive devices arranged at intervals, and the plurality of drive devices are arranged around at least a portion of the side wall of the groove, and the drive device close to one side of the groove among the plurality of drive devices has a spacing greater than or equal to 0.2 mm and less than or equal to 0.5 mm between the side wall of the groove.

8. The flexible circuit board according to claim 7, characterized in that: A first groove and a second groove are formed on a side of the second single-layer board close to the second circuit board, and the first groove and the second groove both expose a portion of the first single-layer board; Wherein, along the direction from the first circuit board to the second circuit board, the first groove and the second groove are symmetrically arranged about the central axis of the first circuit board, and the driving device is arranged around at least a part of the side wall of the first groove.

9. The flexible circuit board according to any one of claims 1 to 6, characterized in that: The first circuit board and the second circuit board both include single-layer boards, and the number of the single-layer boards in the first circuit board is greater than the number of the single-layer boards in the second circuit board.

10. The flexible circuit board according to claim 9, characterized in that: The first circuit board includes two layers of the single-layer board stacked together, the second circuit board includes one layer of the single-layer board, and the single-layer board includes: Insulating substrate; A conductive layer, disposed on one side of the insulating substrate; A first adhesive layer is provided on a side of the conductive layer away from the insulating substrate; A first insulating layer, disposed on a side of the first adhesive layer away from the conductive layer; A second adhesive layer is provided on a side of the insulating substrate away from the conductive layer; The second insulating layer is arranged on a side of the second adhesive layer away from the insulating substrate.

11. A display module, characterized in that: It comprises a display panel and a flexible circuit board as described in any one of claims 1 to 10: wherein the display panel comprises a display portion, a first binding portion arranged opposite to the display portion, and a bending portion connected between the display portion and the first binding portion; the flexible circuit board is located on a side of the first binding portion away from the display portion, and the flexible circuit board is connected to the first binding portion.

12. A display device, characterized in that: The display device comprises the display module as claimed in claim 11.

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