Production process of high-precision flexible conductive circuit board

Abstract

The invention relates to a production process of a high-precision flexible conductive circuit board, the flexible conductive circuit board comprises at least one layer of flexible conductive circuit and at least one layer of insulating layer bearing the flexible conductive circuit, the production process comprises the following steps: step a, punching a flexible conductive material belt through a die cutting module, forming an end contour line of the flexible conductive circuit and a contour line of an area where a main circuit part of the flexible conductive circuit is located; and b, performing laser cutting on the area where the main body circuit part is located through a laser cutting module, and forming a main body circuit part contour line of the flexible conductive circuit. According to the invention, the cutting die is firstly used for punching the conductive layer to form the overall contours of the port part and the circuit part, and then laser cutting is carried out on the circuit part with a high precision requirement to form the specific shape of the circuit part, so that the size precision is improved compared with the mode that all shapes of the conductive layer are formed at a time only by using the cutting die; compared with the mode that all shapes of the conducting layer are formed at a time only through laser cutting, cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit board production technology, and in particular to a production technology of a high-precision flexible conductive circuit board. Background Art

[0002] FPC is a flexible printed circuit board. In some fields, very precise FPC is required. Its line width and spacing are usually measured in millimeters, and the tolerance range is less than 0.1mm, especially for some functional lines, such as: lines that replace the function of current fuses, the line width is between 0.1 and 0.15mm. The current metal foil line forming process uses corrosion forming on the market, which has high precision and good forming. However, when it comes to hard problems such as chemical emissions and environmental pollution, the production cost has remained high; in addition, when chemical corrosion forming is used, there are many processes, high cleaning requirements, and a large waste of water resources.

[0003] In addition to chemical etching molding, another solution is die-cutting molding, which uses a customized die to directly punch and cut the conductive layer. This solution is relatively low-cost, has no environmental pollution, and does not waste water resources. However, due to the accuracy of the die itself and the wear of the die during production, the dimensional tolerance of the finished product is far inferior to that of etching molding, making it difficult to adapt to FPC production with high precision requirements.

[0004] In addition, there is also a solution of laser cutting, which has high precision, but also high cost and is not as efficient as etching and die cutting. Summary of the invention

[0005] The purpose of the present invention is to address the above-mentioned shortcomings of the prior art, overcome the problems that the existing process cannot balance efficiency, cost, precision and environmental protection, and provide a comprehensive production process for high-precision flexible conductive circuit boards, which can effectively reduce costs and solve environmental protection and resource waste problems while ensuring efficiency and precision.

[0006] The technical solution adopted by the present invention is: a production process of a high-precision flexible conductive circuit board, the flexible conductive circuit board includes at least one layer of flexible conductive circuit and at least one layer of insulating layer carrying the flexible conductive circuit, and the production process includes the following steps: Step a, punching the flexible conductive material strip by a die-cutting module to form the end contour line of the flexible conductive circuit and the contour line of the area where the main circuit part of the flexible conductive circuit is located, and then removing the waste of the flexible conductive material strip other than the end contour line and the contour line of the area where the main circuit part is located; Step b, laser cutting the area where the main circuit part is located by using a laser cutting module to form the main circuit part contour line of the flexible conductive circuit, and the ends of the main circuit part contour line are respectively connected with the end contour lines formed in step a, and the inner area surrounded by the end contour lines and the main circuit part contour lines forms the flexible conductive circuit, and the outer area is the waste to be excluded; finally, the obtained flexible conductive circuit is compounded with the insulating layer to obtain a finished flexible conductive circuit board.

[0007] Furthermore, in the above production process, in step a, the process release film tape and the bottom film tape are respectively compounded on the upper and lower surfaces of the flexible conductive tape, and then die-cut by a die-cutting module to form the end contour line of the flexible conductive circuit and the contour line of the area where the main circuit part of the flexible conductive circuit is located; after die-cutting, waste of the process release film tape and waste of the flexible conductive tape outside the end contour line and the contour line of the area where the main circuit part is located are removed, and waste of the process release film within the contour line frame is removed by the first row of waste tape; In step b, after laser cutting, the flexible conductive material waste outside the outline of the main circuit part is removed through the second row of waste tape; then the first insulating film tape is compounded on the formed flexible conductive circuit to cover the flexible conductive circuit, and then the second insulating film tape is compounded below after removing the bottom film tape on the lower surface to form a flexible conductive circuit sheet tape consisting of the second insulating film tape, the flexible conductive circuit, and the first insulating film tape from bottom to top, which can be rolled up or cut as needed.

[0008] Furthermore, the line width of the main circuit portion formed by laser cutting in step b is 0.1 mm to 0.2 mm.

[0009] Furthermore, the main body line portion is in a continuous winding shape.

[0010] The flexible conductive material strip is a metal foil material strip such as copper foil, silver foil, or a conductive film material strip such as carbon black film, carbon nanotube film, conductive adhesive, etc.; The materials of the first insulating film strip and the second insulating film strip are insulating film materials such as polyimide or polyester; The flexible conductive circuit is respectively laminated with the first insulating film material strip and the second insulating film material strip on the upper and lower sides, and then heat-pressed and laminated by a heat-pressing and laminating roller group.

[0011] The materials of the first insulating film material strip and the second insulating film material strip are adhesive PET films; The present invention uses the above process to first use a die cutter to punch the conductive layer to form the outlet portion and the overall contour of the circuit portion, and then laser cut the circuit portion with higher precision requirements to form the specific shape of the circuit portion. Compared with using only a die cutter to form all the shapes of the conductive layer at one time, the dimensional accuracy is improved; compared with using only laser cutting to form all the shapes of the conductive layer at one time, the cost is reduced and the environmental problems caused by the chemical corrosion process are overcome. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of an embodiment FPC produced by the present invention; Figure 2 This is a process flow chart of an embodiment of the present invention; Figure 3 yes Figure 1 Effect diagram of the embodiment after die cutting; Figure 4 yes Figure 1 Embodiment laser cutting effect diagram; Figure 5 yes Figure 1 Schematic diagram of the combined effect after die cutting and laser cutting in the embodiment; Figure 6 yes Figure 1 Schematic diagram of the flexible conductive circuit in the finished product of the embodiment. DETAILED DESCRIPTION

[0013] like Figure 1-Figure 6 As shown, a production process of a high-precision flexible conductive circuit board, the flexible conductive circuit board includes at least one layer of flexible conductive circuit 1, at least one layer of insulating layer 2 carrying the flexible conductive circuit 1, the flexible conductive circuit 1 includes two end portions 11 and a main circuit portion 12 in the middle, wherein the line width of the main circuit portion 12 is 0.1mm~0.2mm and is in a continuous winding shape; the end portion 11 is in a rectangular block shape. This embodiment has two layers of insulating layers, the upper and lower layers, combined with Figure 2-Figure 6 As shown, the production process includes the following steps: Step a, respectively compounding the process release film tape G1 and the bottom film tape T1 on the upper and lower surfaces of the flexible conductive tape D1, and then die-cutting through the die-cutting die group M1 to form the end contour line 101 of the flexible conductive circuit 1 and the contour line 102 of the area where the main circuit part of the flexible conductive circuit 1 is located; after die-cutting, the process release film tape waste G11 and the flexible conductive tape waste D11 other than the end contour line 101 and the contour line 102 of the area where the main circuit part is located are excluded, and the process release film waste G12 within the contour line frame is excluded through the first row of waste tapes P1; the die-cutting module group M1 is used to complete the finalization die-cutting of the circuit end with low precision requirements, and the contour line of the area where the main circuit part is located is die-cut at the same time, so as to first exclude most of the tape waste, and provide convenience for subsequent laser cutting and waste discharge; Step b, laser cutting the area where the main circuit part is located by the laser cutting module M2 to form the main circuit part contour line 103 of the flexible conductive circuit 1, and the ends of the main circuit part contour line 103 are respectively connected with the end contour lines 101 formed in step a, and the inner area surrounded by the end contour line 101 and the main circuit part contour line 103 forms a flexible conductive circuit, and the outer area is the waste to be excluded; after laser cutting, the flexible conductive material waste D12 outside the main circuit part contour line 103 is excluded by the second row of waste tapes P2; then the first insulating film tape J1 is compounded on the upper part of the formed flexible conductive circuit to cover the flexible conductive circuit, and then the second insulating film tape J2 is compounded below after the bottom supporting film tape T1 is excluded, so as to form a flexible conductive circuit sheet tape consisting of the second insulating film tape J2, the flexible conductive circuit 1, and the first insulating film tape J1 from bottom to top, which can be rolled up or cut as needed.

[0014] In the process of the present invention, the flexible conductive material strip D1 can be a metal foil material strip such as copper foil, silver foil, or a conductive film material strip such as carbon black film, carbon nanotube film, conductive adhesive, etc.; the materials of the first insulating film material strip J1 and the second insulating film material strip J2 as the insulating layer are insulating film materials such as polyimide or polyester, or can also be adhesive PET film. When the first insulating film material strip J1 and the second insulating film material strip J2 are insulating film materials such as polyimide or polyester, they are hot-pressed and laminated by a hot-pressing laminating roller group M3 after lamination to make the FPC structure more stable; when it is an adhesive PET film, ordinary lamination is sufficient.

[0015] The present invention uses the above process to first use a die cutter to punch the conductive layer to form the outlet portion and the overall contour of the circuit portion, and then laser cut the circuit portion with higher precision requirements to form the specific shape of the circuit portion. Compared with using only a die cutter to form all the shapes of the conductive layer at one time, the dimensional accuracy is improved; compared with using only laser cutting to form all the shapes of the conductive layer at one time, the cost is reduced and the environmental problems caused by the chemical corrosion process are overcome.

[0016] The above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention. For example, the shape and quantity of the main circuit portion 12 and the end portion 11 of the flexible conductive circuit 1 can be modified according to actual needs, which also falls within the scope of protection of the present invention. Moreover, the above process can be repeated multiple times to produce multi-layer FPCs, which are then bonded to form an FPC with a multi-layer complex circuit structure.

Claims

1. A production process for a high-precision flexible conductive circuit board, the flexible conductive circuit board comprising at least one layer of flexible conductive circuit and at least one layer of insulating layer supporting the flexible conductive circuit, characterized in that: The production process includes the following steps: Step a, punching the flexible conductive material strip by a die-cutting module to form the end contour line of the flexible conductive circuit and the contour line of the area where the main circuit part of the flexible conductive circuit is located, and then removing the waste of the flexible conductive material strip other than the end contour line and the contour line of the area where the main circuit part is located; Step b, laser cutting the area where the main circuit part is located by using a laser cutting module to form the main circuit part contour line of the flexible conductive circuit, and the ends of the main circuit part contour line are respectively connected with the end contour lines formed in step a, and the inner area surrounded by the end contour lines and the main circuit part contour lines forms the flexible conductive circuit, and the outer area is the waste to be excluded; finally, the obtained flexible conductive circuit is compounded with the insulating layer to obtain a finished flexible conductive circuit board.

2. The production process of the high-precision flexible conductive circuit board according to claim 1, characterized in that: In step a, a process release film tape and a bottom film tape are respectively compounded on the upper and lower surfaces of the flexible conductive tape, and then die-cut by a die-cutting module to form an end contour line of the flexible conductive circuit and an area contour line where the main circuit part of the flexible conductive circuit is located; after die-cutting, waste of the process release film tape and waste of the flexible conductive tape other than the end contour line and the area contour line where the main circuit part is located are removed, and waste of the process release film within the contour line frame is removed by the first row of waste tape; In step b, after laser cutting, the flexible conductive material waste outside the outline of the main circuit part is removed through the second row of waste tape; then the first insulating film tape is compounded on the formed flexible conductive circuit to cover the flexible conductive circuit, and then the second insulating film tape is compounded below after removing the bottom film tape on the lower surface to form a flexible conductive circuit sheet tape consisting of the second insulating film tape, the flexible conductive circuit, and the first insulating film tape from bottom to top, which can be rolled up or cut as needed.

3. The production process of the high-precision flexible conductive circuit board according to claim 2, characterized in that: The line width of the main circuit portion formed by laser cutting in step b is 0.1 mm to 0.2 mm.

4. The production process of the high-precision flexible conductive circuit board according to claim 1, 2 or 3, characterized in that: The main body line portion is in a continuous winding shape.

5. The production process of the high-precision flexible conductive circuit board according to claim 1 or 2, characterized in that: The flexible conductive material strip is a metal foil material strip such as copper foil, silver foil, or a conductive film material strip such as carbon black film, carbon nanotube film, conductive adhesive, etc.

6. The production process of the high-precision flexible conductive circuit board according to claim 2, characterized in that: The materials of the first insulating film strip and the second insulating film strip are insulating film materials such as polyimide or polyester.

7. The production process of the high-precision flexible conductive circuit board according to claim 6, characterized in that: The flexible conductive circuit is respectively laminated with the first insulating film material strip and the second insulating film material strip on the upper and lower sides, and then heat-pressed and laminated by a heat-pressing and laminating roller group.

8. The production process of the high-precision flexible conductive circuit board according to claim 2, characterized in that: The materials of the first insulating film strip and the second insulating film strip are adhesive PET films.

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