Cutting and jacking device and cutting and jacking method for single crystal silicon rod

Abstract

The invention discloses a silicon single crystal rod cutting and jacking device and a rod cutting and jacking method, and belongs to the technical field of silicon crystal rod machining equipment.The silicon single crystal rod cutting and jacking device comprises a jacking mechanism capable of reciprocating in the X-axis direction and a cutting wheel train arranged on one side of the jacking mechanism in the Y-axis direction; the ejection mechanism comprises an inductor assembly; the sensing end of the sensor assembly can move in a reciprocating mode in the X-axis direction, and the sensing end of the sensor assembly can penetrate through the material ejecting end of the material ejecting mechanism. The sensor assembly is combined with the material ejecting mechanism, so that the sensing end of the sensor assembly extends out of the material ejecting end of the material ejecting mechanism while the material ejecting mechanism moves towards the section of the bar material, and the gradient of the section is rapidly detected; and when the numerical value meets the design requirement, the material cutting work can be directly carried out after the material jacking mechanism abuts against the cross section of the bar, otherwise, the material cutting work is continued after the thin cross section, and therefore the cutting precision of the section material is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon crystal rod processing equipment, and in particular relates to a cutting and pushing device for a single crystal silicon rod and a cutting and pushing method for a rod. Background Art

[0002] When processing a silicon crystal rod, a telescopic mechanism is usually set at the end of the silicon crystal rod, such as the "A silicon wafer suction cup adsorption method" disclosed in the Chinese invention patent with application number 202310623797.X. The telescopic mechanism drives the suction cup to contact the end of the silicon crystal rod to improve the stability of the cut material.

[0003] However, in the actual cutting process, it was found that although the cutting machine using the telescopic device can improve the stability during cutting, it cannot guarantee the overall cutting accuracy, which makes it easy for the cross section to have an inclination greater than 1.5 mm; at the same time, the cutting equipment cannot effectively identify this error, which will seriously affect the quality of the bar after cutting. Summary of the invention

[0004] The technical problem to be solved by the present invention is: how to provide a cutting and pushing device for a single crystal silicon rod and a cutting and pushing method for a rod material, so as to improve the stability of the rod material during processing and the quality of the segmented material.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A cutting and pushing device for a single crystal silicon rod comprises a pushing mechanism that can reciprocate along an X-axis direction, and a cutting wheel train that is arranged on one side of the pushing mechanism along a Y-axis direction;

[0007] The ejection mechanism includes a sensor assembly;

[0008] The sensing end of the sensor component can reciprocate along the X-axis direction, and the sensing end of the sensor component can penetrate the ejecting end of the ejecting mechanism.

[0009] The present invention also provides a method for cutting and pushing a single crystal silicon rod using the above-mentioned cutting and pushing device, comprising the following steps:

[0010] S1, drive the ejection mechanism to move along the X-axis direction toward the cross section of the bar material until it moves to the specified position, and then start the sensor assembly;

[0011] S2. When the sensor assembly moves toward the cross section of the bar along the X-axis direction until the sensing end of the sensor assembly contacts the cross section of the bar, the inclination of the cross section is recorded;

[0012] S3. When the inclination of the cross section is less than or equal to the preset value, the sensor assembly is retracted, and the ejection end of the ejection mechanism is driven to contact the cross section of the bar along the X-axis direction, and then the cutting wheel system is driven to cut off the bar;

[0013] When the inclination of the cross section is greater than a preset value, the cutting wheel system is driven to move from the cross section of the bar material to the middle of the bar material along the X-axis direction by a distance greater than the inclination recorded in step S2, and then the cutting wheel system is driven to cut off the cross section of the bar material;

[0014] S4, driving the ejection end of the ejection mechanism to collide with the cross section corrected in step S3 along the X-axis direction, and driving the cutting wheel train to cut off the bar material.

[0015] The beneficial effects of the present invention are as follows: the cutting and pushing device for the single crystal silicon rod provided by the present invention, by combining the sensor component with the pushing mechanism, can extend the sensing end of the sensor component out of the pushing end of the pushing mechanism while the pushing mechanism moves toward the cross-section of the rod, thereby quickly detecting the inclination of the cross-section; when the value meets the design requirements, the cutting work can be carried out directly after the pushing mechanism presses against the cross-section of the rod, otherwise the cutting work can continue after the thin cut surface, thereby improving the cutting accuracy of the segmented material. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shown is a schematic structural diagram of a material ejection mechanism according to a specific embodiment of the present invention;

[0017] Figure 2 Shown is a schematic structural diagram of a single crystal silicon rod cutting and lifting device according to a specific embodiment of the present invention;

[0018] Figure 3 Shown Figure 1 A magnified view of point A;

[0019] Figure 4 FIG. 1 is a partial cross-sectional schematic diagram of a material ejection mechanism according to a specific embodiment of the present invention;

[0020] Description of labels:

[0021] 1. Material ejection mechanism; 11. Sensor assembly; 12. Elastic enclosure;

[0022] 2. Cutting gear train;

[0023] 3. The first traverse device;

[0024] 4. Driving parts;

[0025] 5. Lifting device;

[0026] 6. Second traverse device;

[0027] 7. Vacuum adsorption device. DETAILED DESCRIPTION

[0028] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in combination with the implementation modes and the accompanying drawings.

[0029] The most critical concept of the present invention is to combine the sensor component with the push-up mechanism so that when the push-up mechanism moves toward the cross-section of the bar material, the inclination of the cross-section can be quickly detected by the sensor component; when the value meets the design requirements, the material cutting work can be carried out directly after the push-up mechanism presses against the cross-section of the bar material, otherwise the material cutting work will continue after the thin cut surface, thereby improving the cutting accuracy of the segmented material.

[0030] Please refer to Figures 1 to 4 The cutting and pushing device for a single crystal silicon rod provided by the present invention comprises a pushing mechanism 1 which can reciprocate along the X-axis direction, and a cutting wheel train 2 which is arranged on one side of the pushing mechanism 1 along the Y-axis direction;

[0031] The ejecting mechanism 1 includes a sensor assembly 11;

[0032] The sensing end of the sensor component 11 can reciprocate along the X-axis direction, and the sensing end of the sensor component 11 can penetrate the ejecting end of the ejecting mechanism 1 .

[0033] From the above description, it can be seen that the beneficial effects of the present invention are: providing a cutting and pushing device for a single crystal silicon rod, by combining the sensor component 11 with the pushing mechanism 1, the sensing end of the sensor component 11 can be extended out of the pushing end of the pushing mechanism 1 while the pushing mechanism 1 moves toward the cross-section of the rod, thereby quickly detecting the inclination of the cross-section; compared with the existing pushing device, it can not only provide axial support force to the rod during cutting, so as to improve the stability during cutting; it also has the ability to judge whether the inclination of the end face meets the design, that is, when the detected value meets the design requirements, the cutting work can be carried out directly after the pushing mechanism 1 is against the cross-section of the rod, otherwise the cutting can continue after the thin cut surface, thereby improving the cutting accuracy of the segment material.

[0034] Furthermore, the above-mentioned single crystal silicon rod cutting and pushing device further includes a first transverse moving device 3;

[0035] The material ejecting mechanism 1 is connected to the movable part of the first transverse moving device 3;

[0036] The first transverse moving device 3 can drive the ejecting mechanism 1 to move back and forth along the X-axis direction.

[0037] Furthermore, the above-mentioned single crystal silicon rod cutting and pushing device further includes a driving member 4;

[0038] The sensor assembly 11 is connected to the movable part of the driving member 4;

[0039] The driving member 4 can drive the sensor assembly 11 to reciprocate along the X-axis direction.

[0040] From the above description, it can be seen that the design has made specific modifications to the component structure of the cutting and pushing device for the single crystal silicon rod of the present invention. By setting the corresponding first transverse movement device 3 and the driving member 4, structural support can be provided for the pushing mechanism 1 and the sensor assembly 11 to independently realize reciprocating movement in the X-axis direction.

[0041] Furthermore, the above-mentioned single crystal silicon rod cutting and lifting device further includes a lifting device 5;

[0042] The material ejecting mechanism 1 is connected to the movable part of the first transverse moving device 3 through the lifting device 5;

[0043] The lifting device 5 can drive the ejecting mechanism 1 to move back and forth along the Z-axis direction.

[0044] From the above description, it can be seen that due to the different sizes of the materials to be cut, it is easy to have differences in the support height. By setting the corresponding lifting device 5, the lifting mechanism 1 can be provided with freedom in the Z-axis direction, so that the staff can freely adjust the lifting height of the lifting mechanism 1 according to the actual situation, thereby ensuring the stability of the material when cutting.

[0045] Furthermore, the ejecting mechanism 1 further includes a second transverse moving device 6;

[0046] The second traverse device 6 is connected to the movable part of the lifting device 5;

[0047] The second transverse moving device 6 can drive the ejecting mechanism 1 to move back and forth along the X-axis direction.

[0048] From the above description, it can be seen that the design further optimizes the composition structure of the ejecting mechanism 1. By setting the second transverse moving device 6, the degree of freedom of the ejecting mechanism 1 can be further improved. That is, the first transverse moving device 3 can drive the lifting device 5 and the ejecting mechanism 1 to move along the X-axis direction. At the same time, the ejecting mechanism 1 can also move relative to the lifting device 5 and the first transverse moving device 3 under the action of the second transverse moving device 6. Therefore, after the equipment moves to the approximate position, it can independently drive the ejecting mechanism 1 to move toward the end face of the material, thereby avoiding interference with the subsequent cutting work due to the overall proximity of the equipment to the material.

[0049] Furthermore, the ejecting mechanism 1 further includes a vacuum adsorption device 7;

[0050] The vacuum adsorption device 7 is arranged at one end of the material-lifting mechanism 1 close to the material to be cut;

[0051] When the adsorption end of the vacuum adsorption device 7 and the end surface of the material to be cut are in conflict with each other, a negative pressure is formed between the adsorption end of the vacuum adsorption device 7 and the end surface of the material to be cut.

[0052] From the above description, it can be seen that after the pushing mechanism 1 presses against the material, the vacuum adsorption device 7 further adsorbs the material, which can not only better improve the overall stability; at the same time, when cutting the sheet material, it can also avoid the problem of the sheet material falling and being damaged due to the loss of connection with the material at the moment of cutting.

[0053] Furthermore, when the sensing end of the sensor assembly 11 is in the maximum extended state, the distance between the sensing end of the sensor assembly 11 and the end surface of the material to be cut off is smaller than the distance between the adsorption end of the vacuum adsorption device 7 and the end surface of the material to be cut off.

[0054] From the above description, it can be seen that this design can ensure that the sensing end of the sensor component 11 can contact the end face of the material to be cut off under any circumstances, so that the sensor component 11 can accurately detect the verticality of the end face of the material to be cut off, thereby improving the final product quality.

[0055] Furthermore, both the first transverse moving device 3 and the second transverse moving device 6 are provided with a locking mechanism;

[0056] When the material pushing end of the material pushing mechanism 1 contacts the end surface of the material to be cut, the corresponding locking mechanisms respectively limit the freedom of the first transverse moving device 3 and the second transverse moving device 6 in the X-axis direction.

[0057] Furthermore, the above-mentioned single crystal silicon rod cutting and lifting device also includes a pressure sensor and a controller;

[0058] The pressure sensor is arranged at one end of the material ejecting mechanism 1 close to the material to be cut off;

[0059] The pressure sensor and the locking mechanism are both electrically connected to the controller.

[0060] From the above description, it can be seen that when the pressure applied by the ejection mechanism 1 on the end face of the material to be cut off reaches a specified value, the corresponding locking signal can be transmitted to the corresponding locking mechanism, thereby preventing the ejection mechanism 1 from moving in the X-axis direction due to external force during the material cutting process, thereby affecting the supporting effect of the ejection device on the material to be cut off, and thereby reducing the product quality.

[0061] Furthermore, the ejecting mechanism 1 further includes an elastic enclosure 12;

[0062] The elastic enclosure 12 is arranged at one end of the material-pushing mechanism 1 close to the material to be cut off, and the elastic enclosure 12 is arranged around the edge of the material-pushing mechanism 1 .

[0063] Specifically, the elastic enclosure 12 is made of any commercially available adaptive flexible material that can deform according to pressure changes, such as rubber.

[0064] Furthermore, the adsorption end of the vacuum adsorption device 7 is flush with the end surface of the elastic enclosure 12 close to the material to be cut.

[0065] From the above description, it can be seen that the design has made further improvements to the positional relationship between the vacuum adsorption device 7 and the elastic enclosure 12. The elastic enclosure 12 can prevent the pushing mechanism 1 from causing damage to the end surface of the material to be cut due to excessive impact force when it is approaching the material to be cut; at the same time, it ensures that the adsorption end of the vacuum adsorption device 7 is flush with the end surface of the elastic enclosure 12 close to the material to be cut, and can prevent the adsorption end of the vacuum adsorption device 7 from being unable to directly contact the end surface of the material, thereby affecting the vacuum adsorption effect.

[0066] The present invention also provides a method for cutting and pushing a single crystal silicon rod using the above-mentioned cutting and pushing device, comprising the following steps:

[0067] S1, driving the ejection mechanism 1 to move toward the cross section of the bar material along the X-axis direction until it moves to a specified position, and then starting the sensor assembly 11;

[0068] S2, when the sensor assembly 11 moves toward the cross section of the bar material along the X-axis direction until the sensing end of the sensor assembly 11 contacts the cross section of the bar material, the inclination of the cross section is recorded;

[0069] S3, when the inclination of the cross section is less than or equal to the preset value, the sensor assembly 11 is retracted, and the pushing end of the pushing mechanism 1 is driven to collide with the cross section of the bar along the X-axis direction, and then the cutting wheel system 2 is driven to cut off the bar;

[0070] When the inclination of the cross section is greater than a preset value, the cutting wheel train 2 is driven to move from the cross section of the bar material to the middle of the bar material along the X-axis direction for a distance greater than the inclination recorded in step S2, and then the cutting wheel train 2 is driven to cut off the cross section of the bar material;

[0071] S4, driving the ejection end of the ejection mechanism 1 to collide with the cross section corrected in step S3 along the X-axis direction, and driving the cutting wheel train 2 to cut off the bar material.

[0072] From the above description, it can be seen that the design provides a set of complete bar cutting steps, which ensures that the bar cutting work can be carried out in an orderly manner, and can further ensure that the cross-sectional inclination of the bar can meet the design requirements, thereby effectively improving the quality of the cut section material.

[0073] The cutting and lifting device for the single crystal silicon rod of the present invention can assist the cutting work of the silicon crystal rod.

[0074] Please refer to Figures 1 to 4 , Embodiment 1 of the present invention is:

[0075] A cutting and pushing device for a single crystal silicon rod comprises a first transverse moving device 3, a driving member 4, a lifting device 5, a pressure sensor, a controller, a pushing mechanism 1 which can reciprocate along the X-axis direction, and a cutting wheel train 2 which is arranged on one side of the pushing mechanism 1 along the Y-axis direction; the pushing mechanism 1 comprises a sensor assembly 11, a second transverse moving device 6, a vacuum adsorption device 7 and an elastic enclosure 12; the sensing end of the sensor assembly 11 can reciprocate along the X-axis direction, and the sensing end of the sensor assembly 11 can penetrate the pushing end of the pushing mechanism 1; the sensor assembly 11 is connected to the movable part of the driving member 4; the driving member 4 can drive the sensor assembly 11 to reciprocate along the X-axis direction; the vacuum adsorption device 7 is arranged on one end of the pushing mechanism 1 close to the material to be cut off; when the adsorption end of the vacuum adsorption device 7 and the end face of the material to be cut off are in conflict, the adsorption end of the vacuum adsorption device 7 and the end face of the material to be cut off form a negative pressure.

[0076] The material pushing mechanism 1 is connected to the movable part of the first transverse moving device 3; the first transverse moving device 3 can drive the material pushing mechanism 1 to reciprocate along the X-axis direction; the material pushing mechanism 1 is connected to the movable part of the first transverse moving device 3 through the lifting device 5; the lifting device 5 can drive the material pushing mechanism 1 to reciprocate along the Z-axis direction; the second transverse moving device 6 is connected to the movable part of the lifting device 5; the second transverse moving device 6 can drive the material pushing mechanism 1 to reciprocate along the X-axis direction.

[0077] When the sensing end of the sensor assembly 11 is in the maximum extended state, the distance between the sensing end of the sensor assembly 11 and the end surface of the material to be cut off is smaller than the distance between the adsorption end of the vacuum adsorption device 7 and the end surface of the material to be cut off.

[0078] The first transverse moving device 3 and the second transverse moving device 6 are both provided with locking mechanisms; when the pushing end of the pushing mechanism 1 collides with the end surface of the material to be cut off, the corresponding locking mechanisms respectively limit the freedom of the first transverse moving device 3 and the second transverse moving device 6 in the X-axis direction; a pressure sensor is arranged at one end of the pushing mechanism 1 close to the material to be cut off; the pressure sensor and the locking mechanism are both electrically connected to the controller.

[0079] The elastic enclosure 12 is arranged at one end of the material-to-be-cut-off material-lifting mechanism 1, and the elastic enclosure 12 is arranged around the edge of the material-to-be-cut-off mechanism 1; the adsorption end of the vacuum adsorption device 7 is flush with the end face of the elastic enclosure 12 close to the material-to-be-cut-off material.

[0080] Embodiment 2 of the present invention is:

[0081] A method for cutting and pushing a single crystal silicon rod using the above-mentioned cutting and pushing device for a single crystal silicon rod comprises the following steps:

[0082] S1, driving the ejection mechanism 1 to move toward the cross section of the bar material along the X-axis direction until it moves to a specified position, and then starting the sensor assembly 11;

[0083] S2, when the sensor assembly 11 moves toward the cross section of the bar material along the X-axis direction until the sensing end of the sensor assembly 11 contacts the cross section of the bar material, the inclination of the cross section is recorded;

[0084] S3, when the inclination of the cross section is less than or equal to the preset value, the sensor assembly 11 is retracted, and the pushing end of the pushing mechanism 1 is driven to collide with the cross section of the bar along the X-axis direction, and then the cutting wheel system 2 is driven to cut off the bar;

[0085] When the inclination of the cross section is greater than a preset value, the cutting wheel train 2 is driven to move from the cross section of the bar material to the middle of the bar material along the X-axis direction for a distance greater than the inclination recorded in step S2, and then the cutting wheel train 2 is driven to cut off the cross section of the bar material;

[0086] S4, driving the ejection end of the ejection mechanism 1 to collide with the cross section corrected in step S3 along the X-axis direction, and driving the cutting wheel train 2 to cut off the bar material.

[0087] The working principle of the present invention is as follows: first, the ejection mechanism 1 is driven to move toward the cross section of the bar material along the X-axis direction until it moves to the specified position, and then the sensor assembly 11 is started; when the sensor assembly 11 moves toward the cross section of the bar material along the X-axis direction until the sensing end of the sensor assembly 1 conflicts with the cross section of the bar material, the inclination of the cross section is recorded; when the inclination of the cross section is less than or equal to a preset value, the sensor assembly 11 is retracted, and the ejection end of the ejection mechanism 1 is driven to conflict with the cross section of the bar material along the X-axis direction, and then the cutting wheel train 2 is started to cut off the bar material; when the inclination of the cross section is greater than the preset value, the cutting wheel train 2 is driven to move from the cross section of the bar material to the middle of the bar material along the X-axis direction for a distance greater than the inclination recorded by the previous operation, and then the cutting wheel train 2 is started to cut off the cross section of the bar material; finally, the ejection end of the ejection mechanism 1 is driven to conflict with the corrected cross section along the X-axis direction, and the cutting wheel train 2 is started to cut off the bar material, thereby completing the ejection and cutting work of the material.

[0088] In summary, the present invention provides a single crystal silicon rod cutting and pushing device, which combines a sensor component with a pushing mechanism, and can extend the sensing end of the sensor component from the pushing end of the pushing mechanism while the pushing mechanism moves toward the cross section of the rod, thereby quickly detecting the inclination of the cross section; compared with the existing pushing devices, it can not only provide axial support force to the rod during cutting to improve the stability during cutting; it also has the ability to judge whether the inclination of the end face meets the design, that is, when the detected value meets the design requirements, the cutting work can be carried out directly after the pushing mechanism resists the cross section of the rod, otherwise the cutting will continue after the thin cut surface, thereby improving the cutting accuracy of the segmented material; and it provides a set of complete rod cutting steps, which ensures that the cutting work of the rod can be carried out in an orderly manner, and can further ensure that the cross-sectional inclination of the rod can meet the design requirements, thereby effectively improving the quality of the cut segmented material.

[0089] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A cutting and lifting device for a single crystal silicon rod, characterized in that: It includes a material ejecting mechanism that can reciprocate along the X-axis direction, and a cutting gear train that is arranged on one side of the material ejecting mechanism along the Y-axis direction; The ejection mechanism includes a sensor assembly; The sensing end of the sensor component can reciprocate along the X-axis direction, and the sensing end of the sensor component can penetrate the ejecting end of the ejecting mechanism.

2. The cutting and lifting device for a single crystal silicon rod according to claim 1, characterized in that: Also included is a first traverse device; The material ejecting mechanism is connected to the movable part of the first transverse moving device; The first transverse moving device can drive the ejecting mechanism to move back and forth along the X-axis direction.

3. The cutting and lifting device for a single crystal silicon rod according to claim 1, characterized in that: Also includes a drive member; The sensor assembly is connected to the movable part of the driving member; The driving member can drive the sensor assembly to move back and forth along the X-axis direction.

4. The cutting and lifting device for a single crystal silicon rod according to claim 2, characterized in that: Also includes a lifting device; The material ejecting mechanism is connected to the movable part of the first transverse moving device through the lifting device; The lifting device can drive the ejecting mechanism to move back and forth along the Z-axis direction.

5. The cutting and lifting device for a single crystal silicon rod according to claim 4, characterized in that: The ejecting mechanism further comprises a second transverse moving device; The second transverse moving device is connected to the movable part of the lifting device; The second transverse moving device can drive the ejecting mechanism to move back and forth along the X-axis direction.

6. The cutting and lifting device for a single crystal silicon rod according to claim 1, characterized in that: The material pushing mechanism also includes a vacuum adsorption device; The vacuum adsorption device is arranged at one end of the material-lifting mechanism close to the material to be cut off; When the adsorption end of the vacuum adsorption device and the end surface of the material to be cut are in conflict with each other, a negative pressure is formed between the adsorption end of the vacuum adsorption device and the end surface of the material to be cut.

7. The cutting and lifting device for a single crystal silicon rod according to claim 1, characterized in that: When the sensing end of the sensor assembly is in the maximum extended state, the distance between the sensing end of the sensor assembly and the end surface of the material to be cut off is smaller than the distance between the adsorption end of the vacuum adsorption device and the end surface of the material to be cut off.

8. The cutting and lifting device for a single crystal silicon rod according to claim 5, characterized in that: The first lateral movement device and the second lateral movement device are both provided with a locking mechanism; When the material pushing end of the material pushing mechanism contacts the end surface of the material to be cut, the corresponding locking mechanisms respectively limit the freedom of the first transverse moving device and the second transverse moving device in the X-axis direction.

9. The cutting and lifting device for a single crystal silicon rod according to claim 8, characterized in that: Also included are a pressure sensor and controller; The pressure sensor is arranged at one end of the material ejecting mechanism close to the material to be cut off; The pressure sensor and the locking mechanism are both electrically connected to the controller.

10. A method for cutting and pushing a single crystal silicon rod using the cutting and pushing device of any one of claims 1 to 9, characterized in that: The following steps are involved: S1, drive the ejection mechanism to move along the X-axis direction toward the cross section of the bar material until it moves to the specified position, and then start the sensor assembly; S2. When the sensor assembly moves toward the cross section of the bar along the X-axis direction until the sensing end of the sensor assembly contacts the cross section of the bar, the inclination of the cross section is recorded; S3. When the inclination of the cross section is less than or equal to the preset value, the sensor assembly is retracted, and the ejection end of the ejection mechanism is driven to contact the cross section of the bar along the X-axis direction, and then the cutting wheel system is driven to cut off the bar; When the inclination of the cross section is greater than a preset value, the cutting wheel system is driven to move from the cross section of the bar material to the middle of the bar material along the X-axis direction by a distance greater than the inclination recorded in step S2, and then the cutting wheel system is driven to cut off the cross section of the bar material; S4, driving the ejection end of the ejection mechanism to collide with the cross section corrected in step S3 along the X-axis direction, and driving the cutting wheel train to cut off the bar material.

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