High-temperature-resistant UV (ultraviolet) visbreaking double-sided tape for vacuum sputtering and preparation method thereof

Abstract

The invention provides a high-temperature-resistant UV visbreaking double-sided adhesive tape for vacuum sputtering and a preparation method thereof. The high-temperature-resistant UV visbreaking double-sided adhesive tape for vacuum sputtering comprises a light release layer, a first visbreaking adhesive layer, a base material layer, a second visbreaking adhesive layer and a heavy release layer which are sequentially stacked, and the preparation raw materials of the first viscosity-reducing adhesive layer and the second viscosity-reducing adhesive layer both comprise tackifying resin. The preparation method disclosed by the invention is simple, and the prepared high-temperature-resistant UV visbreaking double-sided tape for vacuum sputtering is environment-friendly and pollution-free; according to the UV viscosity-reducing adhesive tape, the first viscosity-reducing adhesive layer and the second viscosity-reducing adhesive layer are arranged, and the tackifying resin is introduced into the two layers, so that the problems that an existing UV viscosity-reducing adhesive tape is low in initial stripping force, high in stripping force after being irradiated by ultraviolet light, poor in viscosity-reducing effect and the like are effectively solved.

Description

Technical Field

[0001] The invention belongs to the technical field of adhesive tapes and relates to a high-temperature resistant UV-reducing double-sided adhesive tape for vacuum sputtering and a preparation method thereof. Background Art

[0002] With the rapid development of the electronics industry and the continuous upgrading of consumer electronics products, the production process is also developing in the direction of rapidity, diversification and multi-function. Various new technologies and processes are constantly being developed, and new requirements are constantly being put forward for the protective films and adhesive tapes that play the role of process protection, transfer and waste discharge in the related processing. In the existing technology, protective films and adhesive tapes are key materials for high-temperature processes of various optoelectronic products, which are of great significance to the quality and production efficiency of optoelectronic products.

[0003] However, the existing UV anti-viscosity tape has the following problems: low initial peeling force, high peeling force after ultraviolet light irradiation, poor anti-viscosity effect, and low adhesion rate of the tape, which also makes its quality low. At the same time, the cohesion and heat resistance of the tape are not high, and residual glue problems are prone to occur.

[0004] Therefore, it is desirable in the art to develop a UV adhesive tape that can solve the above problems. Summary of the invention

[0005] In view of the deficiencies in the prior art, the object of the present invention is to provide a high temperature resistant UV anti-viscosity double-sided adhesive tape for vacuum sputtering and a preparation method thereof.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a high temperature resistant UV anti-viscosity double-sided adhesive tape for vacuum sputtering, wherein the high temperature resistant UV anti-viscosity double-sided adhesive tape for vacuum sputtering comprises a light release layer, a first anti-viscosity adhesive layer, a substrate layer, a second anti-viscosity adhesive layer, and a heavy release layer which are sequentially stacked;

[0008] The raw materials for preparing the first and second viscosity-reducing adhesive layers both include tackifying resin.

[0009] The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering provided by the present invention effectively solves the problems of low initial peeling force, high peeling force after ultraviolet light irradiation, poor viscosity reducing effect, etc. of the existing UV viscosity reducing adhesive tape by arranging a first viscosity reducing adhesive layer and a second viscosity reducing adhesive layer and introducing a tackifying resin into the two layers; the release layer is arranged to be beneficial to protecting the adhesive layer, and the design of the light and heavy release layers makes it easy to peel off the release layer without reverse release phenomenon during use of the product, and the residual adhesion rate of the release layer is ≥90%, so that the quality of the double-sided adhesive tape product is improved.

[0010] Preferably, the raw materials for preparing the first viscosity-reducing layer include the following components in parts by weight:

[0011]

[0012] Preferably, the raw materials for preparing the first viscosity-reducing adhesive layer can be used in an amount of 35 parts, 36 parts, 37 parts, 38 parts, 39 parts, 40 parts, etc., by weight.

[0013] Preferably, the raw materials for preparing the first viscosity-reducing adhesive layer may be used in an amount of 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, etc., by weight.

[0014] Preferably, the raw materials for preparing the first viscosity-reducing adhesive layer are measured in parts by weight, and the amount of the tackifying resin used can be 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, etc.

[0015] Preferably, the amount of the photoinitiator used in the preparation of the first viscosity-reducing adhesive layer can be 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 parts, 1.1 parts, 1.2 parts, 1.3 parts, 1.4 parts, 1.5 parts, 1.6 parts, 1.7 parts, 1.8 parts, 1.9 parts, 2 parts, etc., based on the weight parts of the raw materials.

[0016] Preferably, the raw materials for preparing the first viscosity-reducing adhesive layer are measured in parts by weight, and the amount of the thermal curing agent used can be 0.01 part, 0.02 part, 0.03 part, 0.04 part, 0.05 part, 0.06 part, 0.07 part, 0.08 part, 0.09 part, 0.1 part, etc.

[0017] Preferably, the raw materials for preparing the first viscosity-reducing adhesive layer are measured in parts by weight, and the amount of the solvent used can be 45 parts, 46 parts, 47 parts, 48 ​​parts, 49 parts, 50 parts, etc.

[0018] Preferably, the raw materials for preparing the second viscosity-reducing adhesive layer include the following components in parts by weight:

[0019]

[0020] Preferably, the raw materials for preparing the second viscosity-reducing adhesive layer are measured in parts by weight, and the amount of the active diluent used can be 0.1 parts, 0.3 parts, 0.5 parts, 0.8 parts, 1 parts, 1.3 parts, 1.5 parts, 1.8 parts, 2 parts, 2.3 parts, 2.5 parts, 2.8 parts, 3 parts, etc.

[0021] Preferably, the raw materials for preparing the second viscosity-reducing adhesive layer are calculated by weight, and the amount of the solvent-based high temperature resistant polyacrylate pressure-sensitive adhesive used can be 20 parts, 22 parts, 24 parts, 26 parts, 28 parts, 30 parts, 32 parts, 34 parts, 36 parts, 38 parts, 40 parts, etc.

[0022] Preferably, the raw materials for preparing the second viscosity-reducing adhesive layer may be used in an amount of 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, etc., by weight.

[0023] Preferably, the raw materials for preparing the second viscosity-reducing adhesive layer are measured by weight, and the amount of the tackifying resin used can be 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, etc.

[0024] Preferably, the amount of the photoinitiator used in the preparation of the second viscosity-reducing adhesive layer can be 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 parts, 1.1 parts, 1.2 parts, 1.3 parts, 1.4 parts, 1.5 parts, 1.6 parts, 1.7 parts, 1.8 parts, 1.9 parts, 2 parts, etc., based on the weight parts of the raw materials.

[0025] Preferably, the raw materials for preparing the second viscosity-reducing adhesive layer are measured in parts by weight, and the amount of the thermal curing agent used can be 0.01 part, 0.02 part, 0.03 part, 0.04 part, 0.05 part, 0.06 part, 0.07 part, 0.08 part, 0.09 part, 0.1 part, etc.

[0026] Preferably, the raw materials for preparing the second viscosity-reducing adhesive layer are measured in parts by weight, and the amount of the solvent used can be 45 parts, 46 parts, 47 parts, 48 ​​parts, 49 parts, 50 parts, etc.

[0027] Preferably, the solvent-based high temperature resistant polyacrylate pressure-sensitive adhesive in the raw materials for preparing the first viscosity-reducing adhesive layer and the second viscosity-reducing adhesive layer both include polybutyl acrylate.

[0028] Preferably, the multifunctional oligomer and / or multifunctional monomer in the raw materials for preparing the first and second adhesive-reducing layers independently include trimethylolpropane triacrylate (TMPTA) and / or polyacrylate oligomers. By adding the multifunctional oligomer and / or multifunctional monomer, the condition that the number of photosensitive groups is limited by the number of polar groups on the acrylic main chain can be avoided, giving users more room for adjustment, and enhancing the cohesion and heat resistance of the double-sided tape, while avoiding the problem of residual glue.

[0029] Preferably, the tackifying resin in the raw materials for preparing the first and second tackifying layers independently comprises any one of rosin resin, phenolic resin, terpene phenol resin and polystyrene resin, or a combination of at least two of them.

[0030] Preferably, the photoinitiator in the raw materials for preparing the first and second adhesive-reducing layers both includes benzophenone (BP).

[0031] Preferably, the heat curing agent in the raw materials for preparing the first viscosity-reducing adhesive layer and the second viscosity-reducing adhesive layer both includes organic peroxide.

[0032] Preferably, the solvent in the raw materials for preparing the first viscosity-reducing adhesive layer and the second viscosity-reducing adhesive layer both includes acrylate-modified polysiloxane.

[0033] Preferably, the reactive diluent comprises a reactive diluent containing a carbon-carbon double bond.

[0034] Preferably, the reactive diluent comprises epoxy acrylate.

[0035] Preferably, the release force of the light release layer is smaller than the release force of the heavy release layer.

[0036] Preferably, the light release layer is provided with an adhesive-blocking and filled release film on a side close to the first viscosity-reducing adhesive layer.

[0037] Preferably, a glue-blocking and filled release film is provided on a side of the heavy release layer close to the second viscosity-reducing adhesive layer.

[0038] During the hot pressing process, the adhesive-blocking filled release film has the characteristics of high temperature resistance, easy release, good filling and coating, and excellent adhesive blocking effect.

[0039] As a preferred technical solution of the present invention, by providing a glue-blocking filled release film, the residual adhesion rates of the light release layer and the heavy release layer can be made ≥90%, for example, 90%, 91%, 92%, 93%, 94%, 95%, 96%, etc.

[0040] Preferably, the surface tension of the surface of the substrate layer, ie, the adhesive coating surface, is 53 to 56 dyn / cm, such as 53 dyn / cm, 54 dyn / cm, 55 dyn / cm, 56 dyn / cm, etc.

[0041] Preferably, the thickness of the substrate layer is 20 to 100 μm, for example, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc.

[0042] Preferably, the thickness of the first and second viscosity reducing adhesive layers are independently 10 to 50 μm, for example, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, etc.

[0043] Preferably, the light release layer has a thickness of 25 to 50 μm, for example, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, etc.

[0044] Preferably, the thickness of the heavy release layer is 50-75 μm, for example, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, etc.

[0045] Preferably, the high temperature resistant temperature of the high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering is 180 degrees Celsius for long term resistance and 200 degrees Celsius for short term resistance.

[0046] Preferably, the long period is 4 to 6 hours, such as 4 hours, 5 hours, 6 hours, etc.

[0047] Preferably, the short term is 1 to 2 hours, such as 1 hour, 1.5 hours, 2 hours, etc.

[0048] In a second aspect, the present invention provides a method for preparing the high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering as described in the first aspect, the preparation method comprising the following steps:

[0049] (1) mixing raw materials for preparing the first viscosity-reducing adhesive layer to obtain a first mixture; and mixing raw materials for preparing the second viscosity-reducing adhesive layer to obtain a second mixture;

[0050] (2) The first mixture and the second mixture are respectively coated on both sides of the substrate layer, dried and solidified, and then a light release layer and a heavy release layer are attached to obtain the high temperature resistant UV anti-tack double-sided adhesive tape for vacuum sputtering.

[0051] Preferably, when mixing the raw materials for preparing the first viscosity-reducing adhesive layer, the mixture is first heated to 120° C., and then the tackifying resin and the photoinitiator are added. After stirring and mixing evenly, vacuum is drawn to remove bubbles. Similarly, when mixing the raw materials for preparing the second viscosity-reducing adhesive layer, the mixture is also first heated to 120° C., and then the tackifying resin and the photoinitiator are added. After stirring and mixing evenly, vacuum is drawn to remove bubbles.

[0052] Compared with the prior art, the present invention has at least the following beneficial effects:

[0053] The preparation method of the invention is simple, and the obtained high-temperature resistant UV viscosity-reducing double-sided adhesive tape for vacuum sputtering is environmentally friendly and pollution-free; by setting a first viscosity-reducing adhesive layer and a second viscosity-reducing adhesive layer and introducing a tackifying resin into the two layers, the problems of low initial peeling force, high peeling force after ultraviolet light irradiation, poor viscosity-reducing effect, etc. in the existing UV viscosity-reducing adhesive tape are effectively solved; by setting a release layer, it is beneficial to protect the adhesive layer, and the design of the light and heavy release layers makes it easy to peel off the release layer without reverse release phenomenon during use of the product, and the residual adhesion rate of the release layer is ≥90%, so that the quality of the double-sided adhesive tape product is improved. DETAILED DESCRIPTION

[0054] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0055] Unless otherwise specified, the raw materials used in the following examples and comparative examples of the present invention are as follows:

[0056] Solvent-based high temperature resistant polyacrylate pressure-sensitive adhesive: polybutyl acrylate, brand: DH05286;

[0057] Multifunctional oligomer: polyacrylate oligomer, brand: EBECRYL1200;

[0058] Multifunctional monomer: TMPTA;

[0059] Tackifying resin: rosin resin, brand: DH-RHR;

[0060] Photoinitiator: benzophenone (BP);

[0061] Thermal curing agent: organic peroxide, TMCH-90MO;

[0062] Solvent: acrylate modified polysiloxane, brand: 3821F3;

[0063] Reactive diluent: epoxy acrylate, brand: U-Cure 9273.

[0064] Example 1

[0065] In this embodiment, a high temperature resistant UV anti-viscosity double-sided adhesive tape for vacuum sputtering is provided, wherein the high temperature resistant UV anti-viscosity double-sided adhesive tape for vacuum sputtering comprises a light release layer, a first anti-viscosity adhesive layer, a substrate layer, a second anti-viscosity adhesive layer, and a heavy release layer which are stacked in sequence.

[0066] The thickness, material or amount of raw materials used for preparing each layer of the high temperature resistant UV anti-viscosity double-sided tape for vacuum sputtering are shown in Table 1.

[0067] The preparation method comprises the following steps:

[0068] (1) mixing raw materials for preparing the first viscosity-reducing adhesive layer to obtain a first mixture; and mixing raw materials for preparing the second viscosity-reducing adhesive layer to obtain a second mixture;

[0069] (2) The first mixture and the second mixture are respectively coated on both sides of the substrate layer, dried and solidified, and then a light release layer and a heavy release layer are attached to obtain the high temperature resistant UV anti-tack double-sided adhesive tape for vacuum sputtering.

[0070] Embodiment 2-4

[0071] The difference between Examples 2-4 and Example 1 is that the thickness, material or amount of raw materials used in the preparation of each layer is different, as shown in Table 1; the contents not shown in Table 1 are deemed to be the same as those in Example 1.

[0072] Table 1

[0073]

[0074] Comparative Example 1

[0075] The only difference between this comparative example and Example 3 is that the adhesive tape does not include the first viscosity-reducing adhesive layer.

[0076] Comparative Example 2

[0077] The only difference between this comparative example and Example 3 is that the adhesive tape does not include a second viscosity-reducing adhesive layer.

[0078] Comparative Example 3

[0079] The only difference between this comparative example and Example 3 is that the raw materials for preparing the first viscosity-reducing adhesive layer do not include a tackifying resin.

[0080] Comparative Example 4

[0081] The only difference between this comparative example and Example 3 is that the raw materials for preparing the second viscosity-reducing adhesive layer do not include a tackifying resin.

[0082] The performance test of the adhesive tapes provided in the embodiments and comparative examples is carried out as follows:

[0083] (1) Initial peel force: tested according to GB / T 2792;

[0084] (2) Peel strength after UV irradiation: tested according to GB / T 2792.

[0085] The performance test results are shown in Table 2.

[0086] Table 2

[0087]

[0088] It can be seen from Table 2 that the UV viscosity-reducing double-sided adhesive tapes provided by the embodiments of the present invention all have relatively high initial peeling force, relatively low peeling force after ultraviolet light irradiation, and relatively good viscosity-reducing effect.

[0089] Compared with Example 3, the UV pre-UV viscosity of the UV viscosity-reducing tape provided in Comparative Example 1 is less than that of Example 3, and the UV post-UV viscosity is greater than that of Example 3; the UV pre-UV viscosity of the UV viscosity-reducing tape provided in Comparative Example 2 is less than that of Example 3, and the UV post-UV viscosity is greater than that of Example 3; the UV pre-UV viscosity of the UV viscosity-reducing tape provided in Comparative Example 3 is less than that of Example 3; and the UV pre-UV viscosity of the UV viscosity-reducing tape provided in Comparative Example 4 is less than that of Example 3.

[0090] The applicant declares that the present invention uses the above-mentioned embodiments to illustrate the high temperature resistant UV anti-tack double-sided adhesive tape for vacuum sputtering and the preparation method thereof, but the present invention is not limited to the above-mentioned embodiments, that is, it does not mean that the present invention must rely on the above-mentioned embodiments to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of various raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A high temperature resistant UV anti-viscosity double-sided tape for vacuum sputtering, characterized in that: The high temperature resistant UV anti-viscosity double-sided adhesive tape for vacuum sputtering comprises a light release layer, a first anti-viscosity adhesive layer, a substrate layer, a second anti-viscosity adhesive layer, and a heavy release layer which are stacked in sequence; The raw materials for preparing the first and second viscosity-reducing adhesive layers both include tackifying resin.

2. The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The raw materials for preparing the first viscosity-reducing layer include the following components in parts by weight: The raw materials for preparing the second viscosity-reducing adhesive layer include the following components in parts by weight:

3. The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering according to claim 2, characterized in that: The solvent-based high temperature resistant polyacrylate pressure-sensitive adhesive in the raw materials for preparing the first viscosity-reducing adhesive layer and the second viscosity-reducing adhesive layer both include polybutyl acrylate; Preferably, the multifunctional oligomer and / or multifunctional monomer in the raw materials for preparing the first and second viscosity-reducing adhesive layers independently include trimethylolpropane triacrylate and / or polyacrylate oligomer; Preferably, the tackifying resin in the raw materials for preparing the first and second tackifying layers independently comprises any one of rosin resin, phenolic resin, terpene phenol resin and polystyrene resin, or a combination of at least two of them.

4. The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering according to claim 2 or 3, characterized in that: The photoinitiator in the raw materials for preparing the first and second adhesive-reducing layers both includes benzophenone; Preferably, the heat curing agent in the raw materials for preparing the first viscosity-reducing adhesive layer and the second viscosity-reducing adhesive layer both includes an organic peroxide; Preferably, the solvent in the raw materials for preparing the first viscosity-reducing adhesive layer and the second viscosity-reducing adhesive layer both includes acrylate-modified polysiloxane.

5. The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering according to any one of claims 2 to 4, characterized in that: The reactive diluent includes a reactive diluent containing a carbon-carbon double bond; Preferably, the reactive diluent comprises epoxy acrylate.

6. The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering according to any one of claims 1 to 5, characterized in that: The release force of the light release layer is smaller than the release force of the heavy release layer; Preferably, the light release layer is provided with an adhesive-blocking and filled release film on a side close to the first viscosity-reducing adhesive layer; Preferably, the heavy release layer is provided with an adhesive-blocking filling release film on a side close to the second viscosity-reducing adhesive layer; Preferably, the residual adhesion rates of the light release layer and the heavy release layer are both ≥ 90%.

7. The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering according to any one of claims 1 to 6, characterized in that: The surface tension of the substrate layer is 53-56 dyn / cm.

8. The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering according to any one of claims 1 to 7, characterized in that: The thickness of the substrate layer is 20 to 100 μm; Preferably, the thickness of the first and second viscosity-reducing adhesive layers are independently 10 to 50 μm; Preferably, the thickness of the light release layer is 25 to 50 μm; Preferably, the thickness of the heavy release layer is 50-75 μm.

9. The high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering according to any one of claims 1 to 8, characterized in that: The high temperature resistant temperature of the high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering is 180 degrees Celsius for long term and 200 degrees Celsius for short term; Preferably, the long term is 4 to 6 hours; Preferably, the short term is 1 to 2 hours.

10. A method for preparing a high temperature resistant UV viscosity reducing double-sided adhesive tape for vacuum sputtering as claimed in any one of claims 1 to 9, characterized in that: The preparation method comprises the following steps: (1) mixing raw materials for preparing the first viscosity-reducing adhesive layer to obtain a first mixture; and mixing raw materials for preparing the second viscosity-reducing adhesive layer to obtain a second mixture; (2) The first mixture and the second mixture are respectively coated on both sides of the substrate layer, dried and solidified, and then a light release layer and a heavy release layer are attached to obtain the high temperature resistant UV anti-tack double-sided adhesive tape for vacuum sputtering.

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