Water-cooling heat dissipation type computer case

Abstract

The invention discloses a water-cooling heat dissipation type computer case, and belongs to the technical field of computers, the water-cooling heat dissipation type computer case comprises a heat dissipation metal box body, a temperature-adjustable heat dissipation mechanism is arranged in the heat dissipation metal box body, a deformable exhaust mechanism is arranged at the bottom of the heat dissipation metal box body, and the temperature-adjustable heat dissipation mechanism comprises a first cooling metal water tank; the first cooling metal water tank is fixedly connected with the heat dissipation metal box body, a second cooling metal water tank is arranged above the first cooling metal water tank, second heat insulation conveying pipes are arranged at the two ends of the lower surface of the second cooling metal water tank, and the tops of the second heat insulation conveying pipes penetrate through the bottom wall of the second cooling metal water tank; the second heat insulation conveying pipe is fixedly connected with the second cooling metal water tank; water cooling is carried out on the interior of the case through mutual cooperation of multiple structures, the heat dissipation effect of the computer case is remarkably improved, and electronic equipment installed in the case is prevented from being damaged due to too high temperature.

Description

Technical Field

[0001] The invention belongs to the technical field of computers, and in particular relates to a water-cooling and heat-dissipating computer case. Background Art

[0002] Computer, commonly known as computer, is a modern electronic computing machine used for high-speed calculation. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to programs and automatically and quickly process massive amounts of data. When assembling a desktop computer, a corresponding computer case will be used.

[0003] The traditional computer case includes a host power button, a foldable handle, a temperature display screen, a heat dissipation strip, an external headphone jack, a network cable interface, a data interface, a host power jack, a dust-proof and electrostatic coating, a host heat dissipation hole, and screws. The advantage of this computer case is that the heat dissipation hole can be opened to dissipate the heat inside the case;

[0004] However, the traditional computer case has a relatively simple heat dissipation structure, resulting in poor heat dissipation effect of the computer case, making it easy for electronic equipment installed in the computer case to be damaged due to excessive temperature, and improvement is urgently needed. Summary of the invention

[0005] The object of the present invention is to provide a water-cooled computer case to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a water-cooled heat dissipation type computer case, comprising a heat dissipation metal box body, an adjustable temperature heat dissipation mechanism is arranged inside the heat dissipation metal box body, a deformable exhaust mechanism is arranged at the bottom of the heat dissipation metal box body, the adjustable temperature heat dissipation mechanism comprises a first cooling metal water tank, the first cooling metal water tank is fixedly connected to the heat dissipation metal box body, a second cooling metal water tank is arranged above the first cooling metal water tank, second insulation feed pipes are arranged at both ends of the lower surface of the second cooling metal water tank, the top of the second insulation feed pipe passes through the bottom wall of the second cooling metal water tank, the second insulation feed pipe is fixedly connected to the second cooling metal water tank, the bottom of the second insulation feed pipe passes through the top wall of the first cooling metal water tank, the second insulation feed pipe is fixedly connected to the first cooling metal water tank, and the interior of the second cooling metal water tank is filled with a flowable A cooling liquid is provided, and a first limiting support baffle is also provided above the first cooling metal water tank, the first limiting support baffle is fixedly connected to the heat dissipation metal box body, the first limiting support baffle is fixedly connected to the second cooling metal water tank, a plurality of hollow cooling metal tubes are also provided above the first cooling metal water tank, the plurality of hollow cooling metal tubes are arranged at intervals, the hollow cooling metal tubes penetrate the second cooling metal water tank, the hollow cooling metal tubes are fixedly connected to the second cooling metal water tank, a second limiting support baffle is provided above the second cooling metal water tank, the second limiting support baffle is fixedly connected to the heat dissipation metal box body, a plurality of second adjustable speed cooling fans corresponding to the hollow cooling metal tubes are provided at both ends of the second limiting support baffle, the second adjustable speed cooling fan penetrates the second limiting support baffle, and the second adjustable speed cooling fan is fixedly connected to the second limiting support baffle.

[0007] As a further solution of the present invention: a plurality of cooling metal fins are arranged on the inner wall of the hollow cooling metal tube, the cooling metal fins are fixedly connected to the hollow cooling metal tube, and a plurality of detachable semiconductor refrigeration plates for cooling the flowable cooling liquid are arranged at both ends of the second cooling metal water tank.

[0008] As a further solution of the present invention: third insulated feed pipes corresponding to the detachable semiconductor refrigeration plates are arranged at both ends of the second cooling metal water tank, the third insulated feed pipe is fixedly connected to the second cooling metal water tank, the third insulated feed pipe passes through the first limit support partition, the third insulated feed pipe is fixedly connected to the first limit support partition, and the first insulated feed pipe is arranged at the bottom of the third insulated feed pipe.

[0009] As a further solution of the present invention: a plurality of first adjustable speed cooling fans are arranged at both ends of the second limit support partition to cooperate with the third insulation feed pipe to cool the detachable semiconductor refrigeration plate. The first adjustable speed cooling fan is arranged through the second limit support partition, and the first adjustable speed cooling fan is fixedly connected to the second limit support partition.

[0010] As a further solution of the present invention: a plurality of cooling silicone sheets are arranged on the side of the first cooling metal water tank, and the plurality of cooling silicone sheets are arranged at intervals on the side of the first cooling metal water tank, and the first cooling metal water tank is fixedly connected to the cooling silicone sheets.

[0011] As a further solution of the present invention: the deformable exhaust mechanism includes a limit insulation feed pipe, which is arranged to penetrate the bottom wall of the heat dissipation metal box, and is fixedly connected to the heat dissipation metal box. An insulation exhaust pipe connected to the first insulation feed pipe is arranged inside the limit insulation feed pipe, and a plurality of limit fixing rods corresponding to the insulation exhaust pipe are arranged on the top of the limit insulation feed pipe, one end of the limit fixing rod is fixedly connected to the insulation exhaust pipe, and the other end of the limit fixing rod is fixedly connected to the limit insulation feed pipe, and the bottom of the insulation exhaust pipe is sealed and rotatably connected with a first rotatable exhaust hood, one end of the first rotatable exhaust hood is provided with a first universal exhaust pipe, the first rotatable exhaust hood is sealed and rotatably connected to the limit insulation feed pipe, and a plurality of pressure relief holes are opened on the side of the limit insulation feed pipe.

[0012] As a further solution of the present invention: a second rotatable exhaust hood corresponding to the pressure relief hole is arranged above the first rotatable exhaust hood, the second rotatable exhaust hood is sealed and rotatably connected to the limiting insulation conveying pipe, a second universal exhaust pipe is arranged at one end of the second rotatable exhaust hood, and a plurality of pressure relief holes are arranged in a circular array on the limiting insulation conveying pipe.

[0013] As a further solution of the present invention: the upper surface of the first rotatable exhaust hood is provided with an anti-falling protection tube corresponding to the limiting insulation conveying pipe, the anti-falling protection tube is fixedly connected to the first rotatable exhaust hood, and the anti-falling protection tube is sealed and rotatably connected to the limiting insulation conveying pipe.

[0014] As a further solution of the present invention: the lower surface of the heat dissipation metal box is provided with a plurality of deformable protective plates for anti-slip and fixing purposes, the plurality of deformable protective plates are arranged at both ends of the lower surface of the heat dissipation metal box, the heat dissipation metal box is fixedly connected to the deformable protective plates, and the top of the heat dissipation metal box is provided with a removable metal filter for dust prevention purposes.

[0015] Compared with the prior art, the beneficial effects of the present invention are: the present invention has a simple structure, is easy to use, has a low cost, and has a low failure rate. When in use, the interior of the chassis is cooled by water through the cooperation of multiple structures, which significantly improves the heat dissipation effect of the computer chassis and avoids damage to electronic equipment installed in the chassis due to excessive temperature. Secondly, the present invention can provide cooling for users in summer and heating for users in winter, thereby achieving full utilization of energy and making the use of computer chassis more environmentally friendly, which is worthy of promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of a water-cooled heat dissipation type computer case;

[0017] Figure 2 It is a schematic diagram of the structure of a temperature-adjustable heat dissipation mechanism in a water-cooled computer case;

[0018] Figure 3 It is a structural schematic diagram of a second cooling metal water tank in a water-cooling heat dissipation computer case;

[0019] Figure 4 It is a structural schematic diagram of a deformable exhaust mechanism in a water-cooled computer case;

[0020] In the figure: 1- heat dissipation metal box, 2-adjustable temperature heat dissipation mechanism, 3-detachable metal filter, 4-deformable exhaust mechanism, 5-deformable protection plate, 20-cooling silicone sheet, 21-first cooling metal water tank, 22-first insulation feed pipe, 23-second insulation feed pipe, 24-third insulation feed pipe, 25-first limit support partition, 26-second limit support partition, 27-first adjustable speed cooling fan, 28-second cooling metal water tank, 291-cooling metal fins, 292-second adjustable speed cooling fan, 293-hollow cooling metal tube, 294-flowable cooling liquid, 295-detachable semiconductor refrigeration plate, 40-first universal exhaust pipe, 41-anti-fall protection tube, 42-first rotatable exhaust hood, 43-second rotatable exhaust hood, 44-second universal exhaust pipe, 45-insulated exhaust pipe, 46-limiting fixing rod, 47-limiting insulating feed pipe, 48-pressure relief hole. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" and "set" should be understood in a broad sense. For example, it can be fixedly connected or set, or it can be detachably connected or set, or integrally connected or set.

[0023] For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] See also Figure 1 The present embodiment provides a water-cooled heat dissipation type computer case, including a heat dissipation metal case 1, a temperature-adjustable heat dissipation mechanism 2 is arranged inside the heat dissipation metal case 1, a deformable exhaust mechanism 4 is arranged at the bottom of the heat dissipation metal case 1, a plurality of deformable protective plates 5 for anti-slip fixing and shock absorption are arranged on the lower surface of the heat dissipation metal case 1, the deformable protective plates 5 are rubber plates or silicone plates, a plurality of deformable protective plates 5 are arranged at both ends of the lower surface of the heat dissipation metal case 1, the heat dissipation metal case 1 is fixedly connected to the deformable protective plates 5, and a removable metal filter 3 for dust prevention is arranged on the top of the heat dissipation metal case 1;

[0025] See also Figure 1 , Figure 2 and Figure 3 In one embodiment, in order to make the use of the adjustable temperature heat dissipation mechanism 2 more reliable, in this embodiment, preferably, the adjustable temperature heat dissipation mechanism 2 includes a first cooling metal water tank 21, the material of the first cooling metal water tank 21 is copper, the first cooling metal water tank 21 is fixedly connected to the heat dissipation metal box body 1, and a second cooling metal water tank 28 is arranged above the first cooling metal water tank 21, the material of the second cooling metal water tank 28 is copper, and second insulation conveying pipes 23 are arranged at both ends of the lower surface of the second cooling metal water tank 28, the top of the second insulation conveying pipe 23 penetrates the bottom wall of the second cooling metal water tank 28, the second insulation conveying pipe 23 is fixedly connected to the second cooling metal water tank 28, the bottom of the second insulation conveying pipe 23 penetrates the top wall of the first cooling metal water tank 21, and the second insulation conveying pipe 23 is fixedly connected to the first cooling metal water tank 21 The interiors of the second cooling metal water tank 28 and the first cooling metal water tank 21 are both filled with a flowable cooling liquid 294, which is mineral oil. A first limit support baffle 25 is also provided above the first cooling metal water tank 21, and the first limit support baffle 25 is fixedly connected to the heat dissipation metal box body 1, and the first limit support baffle 25 is fixedly connected to the second cooling metal water tank 28. A plurality of hollow cooling metal pipes 293 are also provided above the first cooling metal water tank 21, and the plurality of hollow cooling metal pipes 293 are arranged at intervals, and the hollow cooling metal pipes 293 penetrate the second cooling metal water tank 28, and the hollow cooling metal pipes 293 are fixedly connected to the second cooling metal water tank 28. A second limit support baffle 26 is provided above the second cooling metal water tank 28, and the second limit support baffle 26 is fixedly connected to the heat dissipation metal box body 1;

[0026] See also Figure 2 and Figure 3In one embodiment, in order to make the functions of the adjustable temperature heat dissipation mechanism 2 more abundant, in this embodiment, preferably, a plurality of second adjustable speed cooling fans 292 corresponding to the hollow cooling metal tube 293 are arranged at both ends of the second limit support baffle 26, the second adjustable speed cooling fan 292 runs through the second limit support baffle 26, the second adjustable speed cooling fan 292 is fixedly connected to the second limit support baffle 26, a plurality of cooling metal fins 291 are arranged on the inner wall of the hollow cooling metal tube 293, the cooling metal fins 291 are fixedly connected to the hollow cooling metal tube 293, and a plurality of detachable semiconductor refrigeration sheets 295 for cooling the flowable cooling liquid 294 are arranged at both ends of the second cooling metal water tank 28;

[0027] See also Figure 2 and Figure 3 In one embodiment, in order to make the function of the adjustable temperature heat dissipation mechanism 2 more abundant, in this embodiment, preferably, the two ends of the second cooling metal water tank 28 are provided with a third insulation conveying pipe 24 corresponding to the detachable semiconductor refrigeration plate 295, the third insulation conveying pipe 24 is a ceramic tube, and the third insulation conveying pipe 24 is provided with a mounting through hole corresponding to the detachable semiconductor refrigeration plate 295, the third insulation conveying pipe 24 is fixedly connected to the second cooling metal water tank 28, the third insulation conveying pipe 24 passes through the first limit support partition 25, the third insulation conveying pipe 24 is fixedly connected to the first limit support partition 25, and the bottom of the third insulation conveying pipe 24 is provided with The first insulated feed pipe 22 and the second limit support partition 26 are provided with a plurality of first adjustable speed cooling fans 27 at both ends for cooperating with the third insulated feed pipe 24 to cool the detachable semiconductor refrigeration plate 295. The first adjustable speed cooling fan 27 is arranged through the second limit support partition 26. The first adjustable speed cooling fan 27 is fixedly connected to the second limit support partition 26. A plurality of cooling silicone sheets 20 are arranged on the side of the first cooling metal water tank 21. The cooling silicone sheets 20 are heat-conducting silicone sheets. The plurality of cooling silicone sheets 20 are arranged at intervals on the side of the first cooling metal water tank 21. The first cooling metal water tank 21 is fixedly connected to the cooling silicone sheets 20.

[0028] In another embodiment, the adjustable temperature heat dissipation mechanism 2 includes a first cooling metal water tank 21, the material of the first cooling metal water tank 21 is aluminum alloy, the first cooling metal water tank 21 is fixedly connected to the heat dissipation metal box body 1, a second cooling metal water tank 28 is arranged above the first cooling metal water tank 21, the material of the second cooling metal water tank 28 is aluminum alloy, and second insulation conveying pipes 23 are arranged at both ends of the lower surface of the second cooling metal water tank 28, the top of the second insulation conveying pipe 23 passes through the bottom wall of the second cooling metal water tank 28, the second insulation conveying pipe 23 is fixedly connected to the second cooling metal water tank 28, the bottom of the second insulation conveying pipe 23 passes through the top wall of the first cooling metal water tank 21, the second insulation conveying pipe 23 is fixedly connected to the first cooling metal water tank 21, and the interior of the second cooling metal water tank 28 is filled with flowable cooling liquid 294. The dynamic cooling liquid 294 is water. A first limit support baffle 25 is also provided above the first cooling metal water tank 21. The first limit support baffle 25 is fixedly connected to the heat dissipation metal box body 1. The first limit support baffle 25 is fixedly connected to the second cooling metal water tank 28. A plurality of hollow cooling metal tubes 293 are also provided above the first cooling metal water tank 21. The plurality of hollow cooling metal tubes 293 are arranged at intervals. The hollow cooling metal tubes 293 penetrate the second cooling metal water tank 28. The hollow cooling metal tubes 293 are fixedly connected to the second cooling metal water tank 28. A second limit support baffle 26 is provided above the second cooling metal water tank 28. The second limit support baffle 26 is fixedly connected to the heat dissipation metal box body 1. A plurality of second adjustable speed cooling fans 292 corresponding to the hollow cooling metal tubes 293 are provided at both ends of the second limit support baffle 26.

[0029] In another embodiment, in order to make the functions of the adjustable temperature heat dissipation mechanism 2 more abundant, in this embodiment, preferably, a second adjustable speed cooling fan 292 is arranged to penetrate the second limit support baffle 26, the second adjustable speed cooling fan 292 is fixedly connected to the second limit support baffle 26, a plurality of cooling metal fins 291 are arranged on the inner wall of the hollow cooling metal tube 293, the cooling metal fins 291 are fixedly connected to the hollow cooling metal tube 293, a plurality of detachable semiconductor refrigeration sheets 295 for cooling the flowable cooling liquid 294 are arranged at both ends of the second cooling metal water tank 28, a third heat insulation conveying pipe 24 corresponding to the detachable semiconductor refrigeration sheet 295 is arranged at both ends of the second cooling metal water tank 28, the third heat insulation conveying pipe 24 is a plastic pipe, and a mounting through hole corresponding to the detachable semiconductor refrigeration sheet 295 is opened on the third heat insulation conveying pipe 24, and the third heat insulation conveying pipe 24 It is fixedly connected to the second cooling metal water tank 28, the third insulation conveying pipe 24 is set through the first limit support partition 25, the third insulation conveying pipe 24 is fixedly connected to the first limit support partition 25, the bottom of the third insulation conveying pipe 24 is provided with the first insulation conveying pipe 22, and both ends of the second limit support partition 26 are provided with a plurality of first adjustable speed cooling fans 27 for cooperating with the third insulation conveying pipe 24 to cool the detachable semiconductor refrigeration plate 295, the first adjustable speed cooling fan 27 is set through the second limit support partition 26, the first adjustable speed cooling fan 27 is fixedly connected to the second limit support partition 26, a plurality of cooling silicone sheets 20 are arranged on the side of the first cooling metal water tank 21, the cooling silicone sheets 20 are heat-conducting silicone sheets, and a plurality of cooling silicone sheets 20 are arranged at intervals on the side of the first cooling metal water tank 21, and the first cooling metal water tank 21 is fixedly connected to the cooling silicone sheets 20.

[0030] See also Figure 1 and Figure 4In one embodiment, in order to make the use of the deformable exhaust mechanism 4 more reliable, in this embodiment, preferably, the deformable exhaust mechanism 4 includes a limit insulation conveying pipe 47, the limit insulation conveying pipe 47 is a ceramic tube, the limit insulation conveying pipe 47 is arranged to pass through the bottom wall of the heat dissipation metal box 1, the limit insulation conveying pipe 47 is fixedly connected to the heat dissipation metal box 1, the interior of the limit insulation conveying pipe 47 is provided with an insulation exhaust pipe 45 connected to the first insulation conveying pipe 22, the insulation exhaust pipe 45 is a ceramic tube, and the top of the limit insulation conveying pipe 47 is provided with a plurality of limit fixing rods 46 corresponding to the insulation exhaust pipe 45, and the limit fixing rods 46 are provided with a plurality of limit fixing rods 46 corresponding to the insulation exhaust pipe 45. One end is fixedly connected to the heat-insulating exhaust cylinder 45, and the other end of the limit fixing rod 46 is fixedly connected to the limit heat-insulating feed pipe 47. The bottom of the heat-insulating exhaust cylinder 45 is sealed and rotatably connected with the first rotatable exhaust hood 42. One end of the first rotatable exhaust hood 42 is provided with a first universal exhaust pipe 40. The first universal exhaust pipe 40 is a universal metal hose. The first rotatable exhaust hood 42 is sealed and rotatably connected to the limit heat-insulating feed pipe 47. A plurality of pressure relief holes 48 are provided on the side of the limit heat-insulating feed pipe 47. A second rotatable exhaust hood 43 corresponding to the pressure relief holes 48 is provided above the first rotatable exhaust hood 42.

[0031] See also Figure 4 In one embodiment, in order to make the function of the deformable exhaust mechanism 4 more abundant, in this embodiment, preferably, the second rotatable exhaust hood 43 is sealed and rotatably connected with the limiting heat-insulating feed pipe 47, and a second universal exhaust pipe 44 is provided at one end of the second rotatable exhaust hood 43. The second universal exhaust pipe 44 is a universal metal hose, and a plurality of pressure relief holes 48 are arranged in a circular array on the limiting heat-insulating feed pipe 47. The upper surface of the first rotatable exhaust hood 42 is provided with an anti-falling protection tube 41 corresponding to the limiting heat-insulating feed pipe 47. The anti-falling protection tube 41 is fixedly connected to the first rotatable exhaust hood 42, and the anti-falling protection tube 41 is sealed and rotatably connected with the limiting heat-insulating feed pipe 47.

[0032] In another embodiment, the deformable exhaust mechanism 4 includes a limit insulation feed pipe 47, which is a plastic pipe. The limit insulation feed pipe 47 is arranged to penetrate the bottom wall of the heat dissipation metal box 1, and the limit insulation feed pipe 47 is fixedly connected to the heat dissipation metal box 1. The interior of the limit insulation feed pipe 47 is provided with an insulation exhaust pipe 45 connected to the first insulation feed pipe 22, and the insulation exhaust pipe 45 is a plastic pipe. The top of the limit insulation feed pipe 47 is provided with a plurality of limit fixing rods 46 corresponding to the insulation exhaust pipe 45, one end of the limit fixing rod 46 is fixedly connected to the insulation exhaust pipe 45, and the other end of the limit fixing rod 46 is fixedly connected to the limit insulation feed pipe 47. The bottom of the insulation exhaust pipe 45 is sealed and rotatably connected with a first rotatable exhaust hood 42, and one end of the first rotatable exhaust hood 42 is provided with a first universal exhaust pipe 40. The first universal exhaust pipe 40 The first rotatable exhaust hood 42 is a rubber tube, and the first rotatable exhaust hood 42 is sealed and rotatably connected to the limiting heat-insulating feed pipe 47. A plurality of pressure relief holes 48 are provided on the side of the limiting heat-insulating feed pipe 47. A second rotatable exhaust hood 43 corresponding to the pressure relief holes 48 is arranged above the first rotatable exhaust hood 42. The second rotatable exhaust hood 43 is sealed and rotatably connected to the limiting heat-insulating feed pipe 47. A second universal exhaust pipe 44 is provided at one end of the second rotatable exhaust hood 43. The second universal exhaust pipe 44 is a rubber tube, and a plurality of pressure relief holes 48 are arranged in a circular array on the limiting heat-insulating feed pipe 47. An anti-falling protection tube 41 corresponding to the limiting heat-insulating feed pipe 47 is provided on the upper surface of the first rotatable exhaust hood 42. The anti-falling protection tube 41 is fixedly connected to the first rotatable exhaust hood 42, and the anti-falling protection tube 41 is sealed and rotatably connected to the limiting heat-insulating feed pipe 47.

[0033] The working principle and use process of the present invention are as follows: when in use, the circuit board is mounted on the first cooling metal water tank 21, and the heat on the circuit board is transferred to the first cooling metal water tank 21 through the cooling silicone sheet 20. When the interior of the heat dissipation metal box 1 needs to be cooled, the power of the first adjustable speed cooling fan 27, the second adjustable speed cooling fan 292 and the detachable semiconductor cooling sheet 295 is turned on. At this time, the flowable cooling liquid 294 is cooled by the detachable semiconductor cooling sheet 295, so that the temperature of the first cooling metal water tank 21 and the second cooling metal water tank 28 is reduced, and the hot end of the detachable semiconductor cooling sheet 295 is cooled by the first adjustable speed cooling fan 27 to further enhance the cooling effect of the detachable semiconductor cooling sheet 295, thereby realizing multiple water cooling of the interior of the heat dissipation metal box 1;

[0034] The second adjustable speed cooling fan 292 blows air into the heat dissipation metal box 1 to cool the inside of the heat dissipation metal box 1, and the flowable cooling liquid 294 cools the hollow cooling metal tube 293 and the cooling metal fins 291, and then the hollow cooling metal tube 293 and the cooling metal fins 291 cooperate with each other to cool the air blown by the second adjustable speed cooling fan 292, thereby achieving rapid and sufficient cooling of the inside of the heat dissipation metal box 1;

[0035] The air blown in by the second adjustable speed cooling fan 292 is discharged to the outside through the second universal exhaust pipe 44, while the air blown in by the first adjustable speed cooling fan 27 for cooling the detachable semiconductor cooling sheet 295 is discharged to the outside through the first universal exhaust pipe 40. When the weather is cold in winter and the exhaust temperature of the first universal exhaust pipe 40 and the second universal exhaust pipe 44 is higher than the room temperature, the user can rotate the first rotatable exhaust cover 42 and the second rotatable exhaust cover 43, and then adjust the posture of the first universal exhaust pipe 40 and the second universal exhaust pipe 44, so that the hot air exhausted by the first universal exhaust pipe 40 and the second universal exhaust pipe 44 is blown toward the user. , thereby achieving heating for the user. Secondly, in summer, when the exhaust temperature of the second universal exhaust pipe 44 is lower than the room temperature and the exhaust temperature of the first universal exhaust pipe 40 is higher than the room temperature, the user can rotate the first rotatable exhaust cover 42 and the second rotatable exhaust cover 43 to make the low-temperature air exhausted by the second universal exhaust pipe 44 blow toward the user and the high-temperature air exhausted by the first universal exhaust pipe 40 be discharged in a direction away from the user, thereby achieving cooling for the user. In other words, the user can adjust the exhaust direction of the first universal exhaust pipe 40 and the second universal exhaust pipe 44 according to actual use needs to achieve cooling or heating for himself.

[0036] Therefore, the interior of the chassis can be water-cooled through the cooperation of multiple structures, which significantly improves the heat dissipation effect of the computer chassis and avoids damage to electronic equipment installed in the chassis due to excessive temperature. Secondly, the present invention can provide cooling for users in summer and heating for users in winter, thereby achieving full utilization of energy and making the use of computer chassis more environmentally friendly. In addition, the present invention has a simple structure, is easy to use, low cost, and has a low failure rate, and is worthy of promotion and use.

[0037] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0038] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A water-cooled computer case, comprising a heat dissipation metal case, characterized in that: The interior of the heat dissipation metal box is provided with an adjustable temperature heat dissipation mechanism, and the bottom of the heat dissipation metal box is provided with a deformable exhaust mechanism, the adjustable temperature heat dissipation mechanism includes a first cooling metal water tank, the first cooling metal water tank is fixedly connected to the heat dissipation metal box, a second cooling metal water tank is provided above the first cooling metal water tank, second insulation feed pipes are provided at both ends of the lower surface of the second cooling metal water tank, the top of the second insulation feed pipe passes through the bottom wall of the second cooling metal water tank, the second insulation feed pipe is fixedly connected to the second cooling metal water tank, the bottom of the second insulation feed pipe passes through the top wall of the first cooling metal water tank, the second insulation feed pipe is fixedly connected to the first cooling metal water tank, the interior of the second cooling metal water tank is filled with flowable cooling liquid, and a second A limit support baffle, the first limit support baffle is fixedly connected to the heat dissipation metal box, the first limit support baffle is fixedly connected to the second cooling metal water tank, a plurality of hollow cooling metal tubes are also arranged above the first cooling metal water tank, the plurality of hollow cooling metal tubes are arranged at intervals, the hollow cooling metal tubes penetrate the second cooling metal water tank, the hollow cooling metal tubes are fixedly connected to the second cooling metal water tank, a second limit support baffle is arranged above the second cooling metal water tank, the second limit support baffle is fixedly connected to the heat dissipation metal box, a plurality of second adjustable speed cooling fans corresponding to the hollow cooling metal tubes are arranged at both ends of the second limit support baffle, the second adjustable speed cooling fan penetrates the second limit support baffle, and the second adjustable speed cooling fan is fixedly connected to the second limit support baffle.

2. The water-cooled computer case according to claim 1, characterized in that: A plurality of cooling metal fins are arranged on the inner wall of the hollow cooling metal tube, and the cooling metal fins are fixedly connected to the hollow cooling metal tube. A plurality of detachable semiconductor refrigeration sheets for cooling the flowable cooling liquid are arranged at both ends of the second cooling metal water tank.

3. The water-cooled computer case according to claim 2, characterized in that: The second cooling metal water tank has third insulation feed pipes at both ends corresponding to the detachable semiconductor refrigeration plates, the third insulation feed pipe is fixedly connected to the second cooling metal water tank, the third insulation feed pipe passes through the first limit support partition, the third insulation feed pipe is fixedly connected to the first limit support partition, and the first insulation feed pipe is arranged at the bottom of the third insulation feed pipe.

4. The water-cooled computer case according to claim 3, characterized in that: A plurality of first adjustable speed cooling fans are arranged at both ends of the second position limiting support partition for cooperating with the third insulation feed pipe to cool the detachable semiconductor refrigeration plate. The first adjustable speed cooling fan runs through the second position limiting support partition, and the first adjustable speed cooling fan is fixedly connected to the second position limiting support partition.

5. The water-cooled computer case according to claim 4, characterized in that: A plurality of cooling silicone sheets are arranged on the side of the first cooling metal water tank, and the plurality of cooling silicone sheets are arranged at intervals on the side of the first cooling metal water tank. The first cooling metal water tank is fixedly connected to the cooling silicone sheets.

6. The water-cooled computer case according to claim 5, characterized in that: The deformable exhaust mechanism includes a limit heat insulation feed pipe, which is arranged to penetrate the bottom wall of the heat dissipation metal box, and is fixedly connected to the heat dissipation metal box. An insulation exhaust pipe connected to the first insulation feed pipe is arranged inside the limit heat insulation feed pipe, and a plurality of limit fixing rods corresponding to the insulation exhaust pipe are arranged on the top of the limit heat insulation feed pipe, one end of the limit fixing rod is fixedly connected to the insulation exhaust pipe, and the other end of the limit fixing rod is fixedly connected to the limit heat insulation feed pipe, and the bottom of the insulation exhaust pipe is sealed and rotatably connected with a first rotatable exhaust hood, and a first universal exhaust pipe is arranged at one end of the first rotatable exhaust hood, and the first rotatable exhaust hood is sealed and rotatably connected to the limit heat insulation feed pipe, and a plurality of pressure relief holes are opened on the side of the limit heat insulation feed pipe.

7. The water-cooled computer case according to claim 6, characterized in that: A second rotatable exhaust hood corresponding to the pressure relief holes is arranged above the first rotatable exhaust hood, the second rotatable exhaust hood is sealed and rotatably connected to the limited insulation conveying pipe, a second universal exhaust pipe is arranged at one end of the second rotatable exhaust hood, and a plurality of pressure relief holes are arranged in a circular array on the limited insulation conveying pipe.

8. The water-cooled computer case according to claim 7, characterized in that: An anti-falling protection tube corresponding to the position-limiting heat-insulating material conveying pipe is arranged on the upper surface of the first rotatable exhaust hood. The anti-falling protection tube is fixedly connected to the first rotatable exhaust hood, and the anti-falling protection tube is sealingly and rotatably connected to the position-limiting heat-insulating material conveying pipe.

9. The water-cooled computer case according to any one of claims 1 to 8, characterized in that: The lower surface of the heat dissipating metal box is provided with several deformable protective plates for anti-slip and fixing purposes. The several deformable protective plates are arranged at both ends of the lower surface of the heat dissipating metal box. The heat dissipating metal box is fixedly connected to the deformable protective plates. The top of the heat dissipating metal box is provided with a detachable metal filter for dust prevention purposes.

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