Packaging structure and forming method thereof

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a packaging structure and a forming method thereof. The packaging structure comprises a substrate which comprises a front surface and a back surface which are oppositely distributed along a first direction; the inductor structure comprises a first main surface, a second main surface and a side surface, the first main surface and the second main surface are oppositely distributed along a second direction, the side surface is positioned between the first main surface and the second main surface, the side surface of the inductor structure is mounted on the front surface of the substrate along the first direction, and the second direction is vertically intersected with the first direction; the first functional chip is mounted on the first main surface of the inductance structure; and the second functional chip is mounted on the second main surface of the inductor structure. The packaging structure is simplified, the occupied area on the substrate is reduced, the size of the packaging structure can be further reduced, and the integration level of the packaging structure is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a packaging structure and a forming method thereof. Background Art

[0002] In order to increase the integration of the packaging structure, it is often necessary to integrate multiple chips in the same packaging structure. At present, in order to improve the integration of the packaging structure, it is usually necessary to set a lower substrate and an upper substrate located above the lower substrate in the packaging structure, and multiple chips are laid flat on the upper substrate. Therefore, it is necessary to reserve more space on the upper substrate to facilitate the layout of multiple chips, which leads to an increase in the size of the packaging structure. A plurality of copper pillars are arranged between the upper substrate and the lower substrate, which are used to electrically connect the upper substrate and the lower substrate and transmit signals between the upper substrate and the lower substrate. The setting of the copper pillars not only increases the manufacturing difficulty of the packaging structure, but also leads to an increase in the parasitic capacitance effect inside the packaging structure, which is not conducive to further improvement and enhancement of the performance of the packaging structure. In order to further expand the function of the packaging structure, a magnetic inductor is usually arranged between the upper substrate and the lower substrate, and the magnetic inductor is welded to the upper substrate and the lower substrate by solder. The heat dissipation channel of the packaging structure is usually arranged above the chip, but in the actual operation of the packaging structure, the heat is mainly concentrated on the upper substrate and the magnetic inductor, which leads to limited heat dissipation efficiency of the packaging structure, which is not conducive to improving the performance of the packaging structure and affects the service life of the packaging structure.

[0003] Therefore, how to reduce the size of a packaging structure integrating multiple chips and improve the heat dissipation performance of the packaging structure, thereby achieving improved performance and extended service life of the packaging structure, is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present invention provides a packaging structure and a forming method thereof, which are used to reduce the size of a packaging structure integrating multiple chips and improve the heat dissipation performance of the packaging structure, thereby achieving improved performance of the packaging structure and extended service life.

[0005] According to some embodiments, the present invention provides a packaging structure, comprising:

[0006] A substrate, comprising a front surface and a back surface that are oppositely distributed along a first direction;

[0007] An inductor structure, comprising a first main surface and a second main surface that are relatively distributed along a second direction and a side surface between the first main surface and the second main surface, the side surface of the inductor structure being mounted on the front surface of the substrate along the first direction, and the second direction intersecting the first direction perpendicularly;

[0008] A first functional chip mounted on the first main surface of the inductor structure;

[0009] The second functional chip is mounted on the second main surface of the inductor structure.

[0010] In some embodiments, it also includes:

[0011] A wiring structure is located inside the inductor structure and extends to a side of the inductor structure, and the wiring structure is electrically connected to the first function chip, the second function chip and the substrate.

[0012] In some embodiments, the inductor structure includes a magnetic material layer and a metal coil located in the magnetic material layer;

[0013] The wiring structure includes metal wiring located in the magnetic material layer, a plurality of conductive connection columns electrically connected to the metal wiring and exposed on the first main surface and the second main surface, and pins electrically connected to the metal wiring and exposed on the side of the inductor structure, the conductive connection columns are electrically connected to the first functional chip and the second functional chip, and the pins are electrically connected to the substrate.

[0014] In some embodiments, it also includes:

[0015] The first surface component is mounted on at least the first main surface or the second main surface, and the first surface component is electrically connected to the conductive connection column.

[0016] In some embodiments, it also includes:

[0017] The heat dissipation structure at least covers a surface of the first function chip or the second function chip away from the inductor structure along the second direction.

[0018] In some embodiments, the heat dissipation structure includes:

[0019] A first side heat sink is mounted on a surface of the first functional chip away from the inductor structure along the second direction;

[0020] The second side heat sink is mounted on a surface of the second functional chip away from the inductor structure along the second direction.

[0021] In some embodiments, the heat dissipation structure further includes:

[0022] an end heat sink located in the magnetic material layer and distributed on a side of the magnetic material layer away from the substrate along the first direction;

[0023] The internal heat sink is located in the magnetic material layer, one end of which is connected to the end heat sink and the other end of which extends out of the side surface of the inductor structure.

[0024] In some embodiments, the heat dissipation structure further includes:

[0025] A top heat sink is located on a side of the inductor structure away from the substrate along the first direction, and the top heat sink continuously covers the first side heat sink, the second side heat sink and the end heat sink.

[0026] In some embodiments, it also includes:

[0027] A plastic encapsulation layer, wherein the plastic encapsulation layer at least encapsulates the inductor structure, the first functional chip and the second functional chip to form a magnetic module, and the magnetic module is mounted on the front side of the substrate;

[0028] The second surface component is mounted on the front surface of the substrate, and the second surface component is located outside the magnetic module.

[0029] According to some other embodiments, the present invention further provides a method for forming a packaging structure, comprising the following steps:

[0030] forming an inductor structure, the inductor structure comprising a first main surface and a second main surface that are oppositely distributed along a second direction, and a side surface located between the first main surface and the second main surface;

[0031] Mounting a first functional chip on the first main surface of the inductor structure, and mounting a second functional chip on the second main surface of the inductor structure;

[0032] The inductor structure is mounted on the front side of the substrate with the side of the inductor structure facing the front side of the substrate. The substrate includes a front side and a back side that are relatively distributed along a first direction. The second direction is perpendicular to the first direction.

[0033] In some embodiments, the specific steps of forming the inductor structure further include:

[0034] A magnetic material layer, a metal coil located in the magnetic material layer, and a wiring structure located in the magnetic material layer are formed, the magnetic material layer and the metal coil together serve as the inductor structure, and the wiring structure includes metal wiring located in the magnetic material layer, a plurality of conductive connection columns electrically connected to the metal wiring and exposed on the first main surface and the second main surface, and pins electrically connected to the metal wiring and exposed on the side of the inductor structure.

[0035] In some embodiments, the specific steps of mounting the first functional chip on the first main surface of the inductor structure and mounting the second functional chip on the second main surface of the inductor structure include:

[0036] Mounting a first functional chip on the first main surface of the inductor structure, and electrically connecting the first functional chip to the conductive connection pillars exposed on the first main surface;

[0037] The second function chip is mounted on the second main surface of the inductor structure, and the second function chip is electrically connected to the conductive connection column exposed on the second main surface.

[0038] In some embodiments, the specific steps of mounting the first functional chip on the first main surface of the inductor structure and electrically connecting the first functional chip to the conductive connection pillars exposed on the first main surface further include:

[0039] A first surface component is mounted on the first main surface of the inductor structure, and the first surface component is electrically connected to a conductive connection column exposed on the first main surface.

[0040] In some embodiments, before mounting the second functional chip on the second main surface of the inductor structure, the following steps are further included:

[0041] A first side heat sink is mounted on a surface of the first functional chip that is away from the inductor structure along the second direction.

[0042] In some embodiments, before mounting the second functional chip on the second main surface of the inductor structure, the following steps are further included:

[0043] A first plastic encapsulation layer is formed to encapsulate the inductor structure, the first functional chip and the first side heat sink.

[0044] In some embodiments, the specific steps of mounting the second functional chip on the second main surface of the inductor structure include:

[0045] Mounting a second side heat sink on a surface of the second functional chip away from the inductor structure along the second direction;

[0046] A second plastic sealing layer is formed to cover the first plastic sealing layer and seal the second functional chip and the second side heat sink. The first plastic sealing layer and the second plastic sealing layer together constitute a plastic sealing layer.

[0047] In some embodiments, after mounting the inductor structure on the front surface of the substrate with the side surface of the inductor structure facing the front surface of the substrate, the following steps are further included:

[0048] A top heat sink is mounted on a side of the inductor structure away from the substrate, and the top heat sink continuously covers the first side heat sink, the second side heat sink and the plastic packaging layer.

[0049] The packaging structure and the forming method thereof provided by the present invention form an inductor structure including a first main surface and a second main surface relatively distributed along a second direction, and a side surface located between the first main surface and the second main surface, and mount the inductor structure on the front surface of the substrate in a direction in which the side surface of the inductor structure is opposite to the front surface of the substrate, so that the inductor structure is vertically mounted on the substrate, and the first functional chip and the second functional chip are respectively mounted on the first main surface and the second main surface of the inductor structure. On the one hand, in the packaging structure of the integrated inductor structure and multiple functional chips, there is no need to stack multiple substrates, thereby achieving simplification of the packaging structure; on the other hand, the inductor structure is vertically mounted on the substrate, thereby reducing the area occupied on the substrate, thereby helping to further reduce the size of the packaging structure and improve the integration of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 is a schematic cross-sectional view of a packaging structure in a specific embodiment of the present invention;

[0051] Figure 2 is a schematic diagram of an inductor structure and a wiring structure in a specific implementation manner of the present invention;

[0052] Figure 3 is a flow chart of a method for forming a packaging structure in a specific embodiment of the present invention;

[0053] Figure 4 is a schematic diagram after forming an inductor structure and a wiring structure in a specific embodiment of the present invention;

[0054] Figure 5 is a structural schematic diagram of a specific implementation mode of the present invention after a plurality of inductor structures are placed on a first carrier;

[0055] Figure 6 is a structural schematic diagram after the first functional chip is mounted on the first main surface of the inductor structure in a specific implementation manner of the present invention;

[0056] Figure 7 is a structural schematic diagram of a specific embodiment of the present invention after the first side heat sink is mounted on the first functional chip;

[0057] Figure 8 is a schematic diagram of the structure after the first plastic sealing layer is formed in a specific embodiment of the present invention;

[0058] Fig. 9is a structural schematic diagram after the second functional chip is mounted on the second main surface of the inductor structure in a specific implementation manner of the present invention;

[0059] Fig.10 is a schematic diagram of the structure after the second plastic sealing layer is formed in a specific embodiment of the present invention;

[0060] Fig.11 It is a schematic diagram of the structure of a single packaging unit in a specific implementation manner of the present invention. DETAILED DESCRIPTION

[0061] The specific implementation manner of the packaging structure and the method for forming the same provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0062] This specific embodiment provides a packaging structure. Figure 1 is a schematic cross-sectional view of a packaging structure in a specific embodiment of the present invention, Figure 2 Schematic diagram of the inductor structure and wiring structure in a specific implementation manner of the present invention. Figure 1 and Figure 2 As shown, the packaging structure includes:

[0063] The substrate 10 comprises a front surface 101 and a back surface 102 which are oppositely distributed along a first direction D1;

[0064] The inductor structure 13 comprises a first main surface 133 and a second main surface 134 which are relatively distributed along a second direction D2, and a side surface 135 located between the first main surface 133 and the second main surface 134, the side surface 135 of the inductor structure 13 is mounted on the front surface 101 of the substrate 10 along the first direction D1, and the second direction D2 intersects the first direction D1 perpendicularly;

[0065] A first functional chip 11 is mounted on the first main surface 133 of the inductor structure 13;

[0066] The second functional chip 12 is mounted on the second main surface 134 of the inductor structure 13 .

[0067] Specifically, the substrate 10 may be, but is not limited to, a PCB (printed circuit board). The inductor structure 13 is mounted on the front surface 101 of the substrate 10 with the side surface 135 facing the front surface 101 of the substrate 10, so that the first main surface 133 and the second main surface 134 of the inductor structure 13 extend in a direction perpendicular to the front surface 101 of the substrate 10 (i.e., the first direction D1), and the first main surface 133 and the second main surface 134 are distributed at opposite ends of the inductor structure 13 in a direction parallel to the front surface 101 of the substrate 10 (e.g., the second direction D2). In an example, the first function chip 11 is flip-mounted on the first main surface 133 of the inductor structure 13, and the second function chip 12 is flip-mounted on the second main surface 134 of the inductor structure 13, that is, the first function chip 11 and the second function chip 12 are both perpendicular to the front surface 101 of the substrate 10. Among them, the structure of the first function chip 11 and the structure of the second function chip 12 may be the same or different. In one example, the inductor structure 13 includes a magnetic inductor.

[0068] In this specific embodiment, the inductor structure 13 is mounted vertically on the front side 101 of the substrate 10 (i.e., the inductor structure 13 is mounted on the front side 101 of the substrate 10 with the side surface 135 facing the front side 101 of the substrate 10), so that there is no need to stack multiple substrates in the packaging structure of the integrated inductor structure and multiple functional chips, thereby simplifying the packaging structure. Moreover, the inductor structure is mounted vertically on the substrate, thereby reducing the area occupied on the substrate, thereby helping to further reduce the size of the packaging structure and improve the integration of the packaging structure. The first main surface 133 and the second main surface 134 of the inductor structure 13 extend in a direction perpendicular to the front side 101 of the substrate 10 (i.e., the first direction D1), so that multiple functional chips or surface components can be mounted on the first main surface 133 and the second main surface 134, which helps to further reduce the size of the packaging structure while improving the integration of the packaging structure.

[0069] In one example, a plurality of the first functional chips 11 are mounted on the first main surface 133 of the inductor structure 13, and the plurality of the first functional chips 11 are arranged at intervals along the first direction D1, so as to further improve the integration of the packaging structure and expand the functions and application fields of the packaging structure. The structures of the plurality of the first functional chips 11 mounted on the first main surface 133 may be the same or different. The plurality described in this specific embodiment refers to more than two.

[0070] In another example, a plurality of second function chips 12 are mounted on the second main surface 134 of the inductor structure 13, and the plurality of second function chips 12 are arranged at intervals along the first direction D1 to further improve the integration of the packaging structure and expand the function and application field of the packaging structure.

[0071] In some embodiments, the packaging structure further includes:

[0072] The wiring structure 28 is located inside the inductor structure 13 and extends to a side surface 135 of the inductor structure 13 . The wiring structure 28 is electrically connected to the first function chip 11 , the second function chip 12 and the substrate 10 .

[0073] Specifically, by integrating at least part of the wiring structure 28 inside the inductor structure 13, it is not necessary to form leads electrically connecting the first function chip 11, the second function chip 12 and the substrate 10 by wire bonding, thereby simplifying the manufacturing process of the packaging structure. Moreover, by integrating at least part of the wiring structure 28 inside the inductor structure 13, it is helpful to further reduce the size of the packaging structure and improve the space utilization inside the packaging structure.

[0074] In some embodiments, the inductor structure 13 includes a magnetic material layer 131 and a metal coil 132 located in the magnetic material layer 131;

[0075] The wiring structure 28 includes a metal wiring 281 located in the magnetic material layer 131, a plurality of conductive connection pillars 282 electrically connected to the metal wiring 281 and exposed on the first main surface 133 and the second main surface 134, and a pin 283 electrically connected to the metal wiring 281 and exposed on the side 135 of the inductor structure 13, the conductive connection pillar 282 is electrically connected to the first function chip 11 and the second function chip 12, and the pin 283 is electrically connected to the substrate 10. In an example, the material of the magnetic material layer 131 includes a magnetic material and a coating material, and the coating material is an organic polymer material or an inorganic material.

[0076] For example, the substrate 10 includes a substrate body and a rewiring layer located in the substrate body. The inductor structure 13 includes the magnetic material layer 131 and the metal coil 132 located inside the magnetic material layer 131. In one example, a plurality of the metal coils 132 are disposed in the inductor structure 13. Figure 1 and Figure 2In the example, the inductor structure 13 has two metal coils 132 arranged at intervals along the second direction D2. The metal coil 132 is located in the middle area of ​​the magnetic material layer 131, and the metal wiring 281 in the wiring structure 28 is located in the edge area of ​​the magnetic material layer 131, so as to reduce the connection distance between the first function chip 11 and the second function chip 12 and the wiring structure 28. The wiring structure 28 includes the metal wiring 281 distributed at least in the edge areas on both sides of the magnetic material layer 131 along the second direction D2, a plurality of the conductive connection columns 282 electrically connected to the metal wiring 281 and exposed on the first main surface 133 and the second main surface 134, and the pins 283 connected to the ends of the metal wiring 281 and exposed on the side 135 of the inductor structure 13. The conductive connection column 282 exposed on the first main surface 133 is electrically connected to the first function chip 11 through the first conductive bump 15, and the conductive connection column 282 exposed on the second main surface 134 is electrically connected to the second function chip 12 through the second conductive bump 21. The pin 283 exposed on the side 135 of the inductor structure 13 is electrically connected to the rewiring layer in the substrate 10 through the solder layer 25. By providing the wiring structure 28, the transmission of electrical signals between the first function chip 11 and the second function chip 12 and the substrate 10 can be achieved through the wiring structure 28 pre-embedded in the inductor structure 13. By providing the pin 283 in the wiring structure 28 on the side 135 of the inductor structure 13, the area requirement on the substrate 10 can be further reduced, thereby helping to further reduce the size of the packaging structure. In one example, the wiring structure 28 located at the first main surface 133 of the inductor structure 13 and the wiring structure 28 located at the second main surface 134 are independent of each other (ie, not connected) to achieve independent control of the first function chip 11 and the second function chip 12 .

[0077] In some embodiments, the packaging structure further includes:

[0078] The first surface component 23 is mounted on at least the first main surface 133 or the second main surface 134 , and the first surface component 23 is electrically connected to the conductive connection column 282 .

[0079] In one example, a plurality of the first surface components 23 are respectively mounted on the first main surface 133 and the second main surface 134 of the inductor structure 13, and the first surface components 23 are electrically connected to the conductive connecting columns 282 in the wiring structure 28 to realize electrical signal transmission between the first surface components 23 and the substrate 10 and the first functional chip 11 or the second functional chip 12, so as to further improve the integration of the packaging structure and expand the function of the packaging structure.

[0080] In some embodiments, the packaging structure further includes:

[0081] The heat dissipation structure at least covers a surface of the first function chip 11 or the second function chip 12 away from the inductor structure 13 along the second direction D2.

[0082] In some embodiments, the heat dissipation structure includes:

[0083] A first side heat sink 16 is mounted on a surface of the first functional chip 11 away from the inductor structure 13 along the second direction D2;

[0084] The second side heat sink 20 is mounted on a surface of the second functional chip 12 away from the inductor structure 13 along the second direction D2.

[0085] For example, if Figure 1 As shown, the first side heat sink 16 is attached to the surface of the first function chip 11 away from the inductor structure 13 along the second direction D2 through the first heat conductive layer 14, and the second side heat sink 20 is attached to the surface of the second function chip 12 away from the inductor structure 13 along the second direction D2 through the second heat conductive layer 22. In one example, the material of the first heat conductive layer 14 and the material of the second heat conductive layer 22 can both be conductive silver paste. By providing the first side heat sink 16 and the second side heat sink 20, the first function chip 11, the second function chip 12 and the inductor structure 13 can be cooled along the second direction D2, reducing the accumulation of heat in the inductor structure 13, the first function chip 11 and the second function chip 12, and improving the uniformity of the heat dissipation of the packaging structure, thereby improving the reliability of the packaging structure, thereby helping to ensure the stable performance of the packaging structure and extend the service life of the packaging structure.

[0086] In some embodiments, the heat dissipation structure further includes:

[0087] The end heat sink 27 is located in the magnetic material layer 131 and distributed on a side of the magnetic material layer 131 away from the substrate 10 along the first direction D1;

[0088] The internal heat sink 26 is located in the magnetic material layer 131 , and one end of the internal heat sink 26 is connected to the end heat sink 27 , and the other end of the internal heat sink 26 extends out of the side of the inductor structure 13 .

[0089] For example, if Figure 1 and Figure 2 As shown, the end heat sink 27 is located in the magnetic material layer 131 and is exposed to the surface of the magnetic material layer 131. The inductor structure 13 includes two metal coils 132, the internal heat sink 26 is distributed between the two metal coils 132, and the end of the internal heat sink 26 is connected to the end heat sink 27, so that the heat inside the inductor structure 13 is exported through the internal heat sink 26 and the end heat sink 27, so as to further improve the heat dissipation performance of the packaging structure. In one example, the internal heat sink 26 extends to the side of the inductor structure 13 and is connected to the substrate 10 through the solder layer 25, so that the heat inside the inductor structure 13 can also be exported to the substrate 10 through the internal heat sink 26 and the end heat sink 27, so as to further improve the heat dissipation performance of the packaging structure.

[0090] In some embodiments, the heat dissipation structure further includes:

[0091] The top heat sink 18 is located on a side of the inductor structure 13 away from the substrate 10 along the first direction D1 , and the top heat sink 18 continuously covers the first side heat sink 16 , the second side heat sink 20 and the end heat sink 27 .

[0092] For example, if Figure 1 As shown, the top heat sink 18 is attached to the surface of the inductor structure 13 away from the substrate 10 along the first direction D1 through the third heat conductive layer 19, and the top heat sink 18 continuously covers the first side heat sink 16, the second side heat sink 20 and the end heat sink 27, so that the heat in the packaging structure is extracted from the upper part of the packaging structure, further reducing the accumulation of heat in the substrate 10, thereby further improving the heat dissipation performance of the packaging structure and achieving efficient heat dissipation of the packaging structure.

[0093] In some embodiments, the packaging structure further includes:

[0094] A plastic encapsulation layer 17, wherein the plastic encapsulation layer 17 at least encapsulates the inductor structure 13, the first functional chip 11 and the second functional chip 12 to form a magnetic module, and the magnetic module is mounted on the front surface 101 of the substrate 10;

[0095] The second surface component 24 is mounted on the front surface 101 of the substrate 10 , and the second surface component 24 is located outside the magnetic module.

[0096] Specifically, the plastic encapsulation layer 17 continuously encapsulates the inductor structure 13, the first functional chip 11, the second functional chip 12, the first side heat sink 16 and the second side heat sink 20. Since the plastic encapsulation layer 17 is distributed on the opposite sides of the inductor structure 13 along the second direction D2, it helps to balance the stress inside the packaging structure to further improve the performance of the packaging structure. In addition, since the coating of the plastic encapsulation layer 17 forms an encapsulated magnetic module, the product reliability can be improved. Since the area occupied by the inductor structure 13 on the front side 101 of the substrate 10 is reduced, space is reserved for the mounting of the second surface component 24, thereby achieving further improvement in the integration and function of the packaging structure. In one example, the structure and function of the first surface component 23 are different from the structure and function of the second surface component 24.

[0097] In some embodiments, for better heat dissipation, outer surfaces of the first side heat sink 16 and the second side heat sink 20 may be exposed to the plastic packaging layer 17 .

[0098] This specific embodiment also provides a method for forming a packaging structure. Figure 3 is a flow chart of a method for forming a packaging structure in a specific embodiment of the present invention. The schematic diagram of the packaging structure formed in this specific embodiment can be found in Figure 1 and Figure 2 .like Figure 1-Figure 3 As shown, the method for forming the packaging structure includes the following steps:

[0099] Step S31, forming an inductor structure 13, wherein the inductor structure 13 includes a first main surface 133 and a second main surface 134 that are relatively distributed along a second direction D2, and a side surface 135 located between the first main surface 133 and the second main surface 134;

[0100] Step S32, mounting the first function chip 11 on the first main surface 133 of the inductor structure 13, and mounting the second function chip 12 on the second main surface 134 of the inductor structure 13;

[0101] Step S33, mounting the inductor structure 13 on the front surface of the substrate 10 with the side surface 135 of the inductor structure 13 facing the front surface 101 of the substrate 10, wherein the substrate 10 includes a front surface 101 and a back surface 102 relatively distributed along a first direction D1, and the second direction D2 intersects the first direction D1 perpendicularly.

[0102] Figure 4 is a schematic diagram of a specific embodiment of the present invention after forming an inductor structure and a wiring structure. In some embodiments, Figure 1 , Figure 2 and Figure 4 As shown, the specific steps of forming the inductor structure 13 also include:

[0103] A magnetic material layer 131, a metal coil 132 located in the magnetic material layer 131, and a wiring structure 28 located in the magnetic material layer 131 are formed. The magnetic material layer 131 and the metal coil 132 together serve as the inductor structure 13. The wiring structure 28 includes a metal wiring 281 located in the magnetic material layer 131, a plurality of conductive connection columns 282 electrically connected to the metal wiring 281 and exposed on the first main surface 133 and the second main surface 134, and a pin 283 electrically connected to the metal wiring 281 and exposed on the side 135 of the inductor structure 13.

[0104] Specifically, in the process of forming the inductor structure 13, the wiring structure 28 is pre-buried in the inductor structure 13, and the pins 283 in the wiring structure 28 are exposed to the side of the inductor structure 13, thereby further reducing the size of the packaging structure while simplifying the manufacturing process of the packaging structure and improving the manufacturing efficiency of the packaging structure.

[0105] In some embodiments, the specific steps of mounting the first functional chip 11 on the first main surface 133 of the inductor structure 13 and mounting the second functional chip 12 on the second main surface 134 of the inductor structure 13 include:

[0106] Mounting the first function chip 11 on the first main surface 133 of the inductor structure 13, and electrically connecting the first function chip 11 to the conductive connection pillars 282 exposed on the first main surface 133;

[0107] The second function chip 12 is mounted on the second main surface 134 of the inductor structure 13 , and the second function chip 12 is electrically connected to the conductive connection pillars 282 exposed on the second main surface 134 .

[0108] Figure 5 is a schematic diagram of a structure after a plurality of inductor structures are placed on a first carrier board in a specific embodiment of the present invention, Figure 61 is a schematic diagram of a structure after the first functional chip is mounted on the first main surface of the inductor structure in a specific embodiment of the present invention. In some embodiments, the specific steps of mounting the first functional chip 11 on the first main surface 133 of the inductor structure 13 and electrically connecting the first functional chip 11 to the conductive connection column 282 exposed on the first main surface 133 also include:

[0109] Mount the first surface component 23 on the first main surface 133 of the inductor structure 13, and electrically connect the first surface component 23 to the conductive connection column 282 exposed on the first main surface 133, such as Figure 6 shown.

[0110] For example, a plurality of the inductor structures 13 pre-embedded with the wiring structures 28 are attached to the surface of the first carrier 50 to form a reconstructed body, such as Figure 5 Next, the first functional chip 11 and the first surface component 23 are mounted on the first main surface 133 of each of the inductor structures 13, as shown. Figure 6 For example, a plurality of the first function chips 11 are flip-chip mounted one by one on the first main surface 133 of the inductor structure 13 , and the first function chips 11 are electrically connected to the conductive connection pillars 282 in the wiring structure 28 .

[0111] Figure 7 1 is a schematic diagram of a structure after the first side heat sink is mounted on the first functional chip in a specific embodiment of the present invention. In some embodiments, before mounting the second functional chip 12 on the second main surface 134 of the inductor structure 13, the following steps are also included:

[0112] The first side heat sink 16 is mounted on the surface of the first functional chip 11 away from the inductor structure 13 along the second direction D2, such as Figure 7 shown.

[0113] Figure 8 1 is a schematic diagram of a structure after forming the first plastic encapsulation layer in a specific embodiment of the present invention. In some embodiments, before mounting the second functional chip 12 on the second main surface 134 of the inductor structure 13, the following steps are also included:

[0114] A first plastic encapsulation layer 80 is formed to encapsulate the inductor structure 13, the first functional chip 11 and the first side heat sink 16. Figure 8 shown.

[0115] For example, the first side heat sink is attached to the surface of the first functional chip 11 away from the inductor structure 13 through the first heat conductive layer 14. Figure 7Next, the first plastic encapsulation layer 80 is formed on the first carrier 50 to continuously encapsulate the inductor structure 13, the first functional chip 11 and the first side heat sink 16, forming a plurality of first plastic encapsulation bodies 81. Afterwards, the first carrier 50 is removed by debonding or peeling to obtain the first plastic encapsulation body 81. Figure 8 The structure shown.

[0116] Fig. 9 is a schematic diagram of a structure after the second functional chip is mounted on the second main surface of the inductor structure in a specific embodiment of the present invention, Fig.10 is a schematic diagram of the structure after the second plastic sealing layer is formed in a specific embodiment of the present invention, Fig.11 1 is a schematic diagram of the structure of a single packaging unit in a specific embodiment of the present invention. In some embodiments, the specific steps of mounting the second functional chip 12 on the second main surface 134 of the inductor structure 13 include:

[0117] The second side heat sink 20 is mounted on the surface of the second functional chip 12 away from the inductor structure 13 along the second direction D2, such as Fig. 9 As shown;

[0118] A second plastic encapsulation layer 100 is formed to cover the first plastic encapsulation layer 80 and to encapsulate the second functional chip 12 and the second side heat sink 20. Fig.10 As shown, the first plastic encapsulation layer 80 and the second plastic encapsulation layer 100 together constitute a plastic encapsulation layer 17 (see Figure 1 ).

[0119] For example, after removing the first carrier 50, the first plastic package is attached to the second carrier 90 along the direction in which the second main surface 134 of the inductor structure 13 is away from the second carrier 90. Then, the second functional chip 12 and the first surface component 23 are mounted on the second main surface 134 of each of the inductor structures 13. For example, a plurality of the second functional chips 12 are flipped one by one on the second main surface 134 of the inductor structure 13, and the second functional chips 12 are electrically connected to the conductive connection pillars 282 in the wiring structure 28. Then, the second side heat sink 20 is attached to the surface of the second functional chip 12 away from the inductor structure 13 through the second heat conductive layer 22, as shown in FIG. Fig. 9 Then, the second plastic encapsulation layer 100 is formed on the first plastic encapsulation layer 80 to continuously encapsulate the second functional chip 12 and the second side heat sink 20, so as to obtain a plurality of second plastic encapsulation bodies 101, as shown in FIG. Fig.10 shown.

[0120] In some embodiments, after mounting the inductor structure 13 on the front surface 101 of the substrate 10 with the side surface 135 of the inductor structure 13 facing the front surface 101 of the substrate 10, the following steps are further included:

[0121] A top heat sink 18 is mounted on a side of the inductor structure 13 away from the substrate 10 , and the top heat sink 18 continuously covers the first side heat sink 16 , the second side heat sink 20 and the plastic packaging layer 17 .

[0122] For example, after forming the second plastic encapsulation layer 100, a plurality of packaging units are obtained, each of which includes a first plastic encapsulation body 81 and a second plastic encapsulation body 101 stacked on the surface of the first plastic encapsulation body 81. After separating the adjacent packaging units by a cutting process and removing the second carrier board 90, the following is obtained: Fig.11 The independent packaging unit shown in FIG. 1 forms an encapsulated magnetic module. Next, the magnetic module is mounted on the front surface 101 of the substrate 10, and the top heat sink 18 is mounted on the surface of the magnetic module away from the substrate 10, so as to obtain the following: Figure 1 The structure shown.

[0123] The packaging structure and the forming method thereof provided in this specific embodiment form an inductor structure including a first main surface and a second main surface relatively distributed along a second direction, and a side surface located between the first main surface and the second main surface, and the inductor structure is mounted on the front surface of the substrate in a direction in which the side surface of the inductor structure is opposite to the front surface of the substrate, so that the inductor structure is vertically mounted on the substrate, and the first functional chip and the second functional chip are respectively mounted on the first main surface and the second main surface of the inductor structure. On the one hand, there is no need to stack multiple substrates in the packaging structure of the integrated inductor structure and multiple functional chips, thereby simplifying the packaging structure; on the other hand, the inductor structure is vertically mounted on the substrate, thereby reducing the area occupied on the substrate, which helps to further reduce the size of the packaging structure and improve the integration of the packaging structure.

[0124] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A packaging structure, characterized in that: include: A substrate, comprising a front surface and a back surface that are oppositely distributed along a first direction; An inductor structure, comprising a first main surface and a second main surface that are relatively distributed along a second direction and a side surface between the first main surface and the second main surface, the side surface of the inductor structure being mounted on the front surface of the substrate along the first direction, and the second direction intersecting the first direction perpendicularly; A first functional chip mounted on the first main surface of the inductor structure; The second functional chip is mounted on the second main surface of the inductor structure.

2. The packaging structure according to claim 1, characterized in that: Also includes: A wiring structure is located inside the inductor structure and extends to a side of the inductor structure, and the wiring structure is electrically connected to the first function chip, the second function chip and the substrate.

3. The packaging structure according to claim 2, characterized in that: The inductor structure includes a magnetic material layer and a metal coil located in the magnetic material layer; The wiring structure includes metal wiring located in the magnetic material layer, a plurality of conductive connection columns electrically connected to the metal wiring and exposed on the first main surface and the second main surface, and pins electrically connected to the metal wiring and exposed on the side of the inductor structure, the conductive connection columns are electrically connected to the first functional chip and the second functional chip, and the pins are electrically connected to the substrate.

4. The packaging structure according to claim 3, characterized in that: Also includes: The first surface component is mounted on at least the first main surface or the second main surface, and the first surface component is electrically connected to the conductive connection column.

5. The packaging structure according to claim 3, characterized in that: Also includes: The heat dissipation structure at least covers a surface of the first function chip or the second function chip away from the inductor structure along the second direction.

6. The packaging structure according to claim 5, characterized in that: The heat dissipation structure comprises: A first side heat sink is mounted on a surface of the first functional chip away from the inductor structure along the second direction; The second side heat sink is mounted on a surface of the second functional chip away from the inductor structure along the second direction.

7. The packaging structure according to claim 6, characterized in that: The heat dissipation structure further includes: an end heat sink located in the magnetic material layer and distributed on a side of the magnetic material layer away from the substrate along the first direction; The internal heat sink is located in the magnetic material layer, one end of which is connected to the end heat sink and the other end of which extends out of the side surface of the inductor structure.

8. The packaging structure according to claim 7, characterized in that: The heat dissipation structure further includes: A top heat sink is located on a side of the inductor structure away from the substrate along the first direction, and the top heat sink continuously covers the first side heat sink, the second side heat sink and the end heat sink.

9. The packaging structure according to claim 1, characterized in that: Also includes: A plastic encapsulation layer, wherein the plastic encapsulation layer at least encapsulates the inductor structure, the first functional chip, and the second functional chip to form a magnetic module, and the magnetic module is mounted on the front side of the substrate; The second surface component is mounted on the front surface of the substrate, and the second surface component is located outside the magnetic module.

10. A method for forming a packaging structure, characterized in that: The steps include: forming an inductor structure, the inductor structure comprising a first main surface and a second main surface that are oppositely distributed along a second direction, and a side surface located between the first main surface and the second main surface; Mounting a first functional chip on the first main surface of the inductor structure, and mounting a second functional chip on the second main surface of the inductor structure; The inductor structure is mounted on the front side of the substrate with the side of the inductor structure facing the front side of the substrate. The substrate includes a front side and a back side that are relatively distributed along a first direction. The second direction is perpendicular to the first direction.

11. The method for forming a packaging structure according to claim 10, characterized in that: The specific steps of forming the inductor structure also include: A magnetic material layer, a metal coil located in the magnetic material layer, and a wiring structure located in the magnetic material layer are formed, the magnetic material layer and the metal coil together serve as the inductor structure, and the wiring structure includes metal wiring located in the magnetic material layer, a plurality of conductive connection columns electrically connected to the metal wiring and exposed on the first main surface and the second main surface, and pins electrically connected to the metal wiring and exposed on the side of the inductor structure.

12. The method for forming a packaging structure according to claim 11, characterized in that: The specific steps of mounting a first functional chip on the first main surface of the inductor structure and mounting a second functional chip on the second main surface of the inductor structure include: Mounting a first functional chip on the first main surface of the inductor structure, and electrically connecting the first functional chip to the conductive connection pillars exposed on the first main surface; The second function chip is mounted on the second main surface of the inductor structure, and the second function chip is electrically connected to the conductive connection column exposed on the second main surface.

13. The method for forming a packaging structure according to claim 12, characterized in that: The specific steps of mounting a first functional chip on the first main surface of the inductor structure and electrically connecting the first functional chip to the conductive connection pillars exposed on the first main surface also include: A first surface component is mounted on the first main surface of the inductor structure, and the first surface component is electrically connected to a conductive connection column exposed on the first main surface.

14. The method for forming a packaging structure according to claim 12, characterized in that: Before mounting the second functional chip on the second main surface of the inductor structure, the method further includes the following steps: A first side heat sink is mounted on a surface of the first functional chip that is away from the inductor structure along the second direction.

15. The method for forming a packaging structure according to claim 14, characterized in that: Before mounting the second functional chip on the second main surface of the inductor structure, the method further includes the following steps: A first plastic encapsulation layer is formed to encapsulate the inductor structure, the first functional chip and the first side heat sink.

16. The method for forming a packaging structure according to claim 15, characterized in that: The specific steps of mounting the second functional chip on the second main surface of the inductor structure include: Mounting a second side heat sink on a surface of the second functional chip away from the inductor structure along the second direction; A second plastic sealing layer is formed to cover the first plastic sealing layer and seal the second functional chip and the second side heat sink. The first plastic sealing layer and the second plastic sealing layer together constitute a plastic sealing layer.

17. The method for forming a packaging structure according to claim 16, wherein: After mounting the inductor structure on the front side of the substrate with the side surface of the inductor structure facing the front side of the substrate, the following steps are also included: A top heat sink is mounted on a side of the inductor structure away from the substrate, and the top heat sink continuously covers the first side heat sink, the second side heat sink and the plastic packaging layer.

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