Crystal bar cutting method and system

Abstract

The invention provides a crystal bar cutting method and system. The crystal bar cutting method comprises the steps that the output load of a cutting saw during crystal bar cutting is obtained; obtaining the roughness of the cutting surface of the crystal bar; monitoring the passivation degree of the cutting saw according to the output load and the roughness; and cutting the crystal bar according to the passivation degree. Therefore, the passivation degree of the cutting saw can be monitored in real time, so that the cutting saw can be polished or replaced according to the passivation degree of the cutting saw, the service life of the cutting saw is prolonged, and the cutting quality of a crystal bar is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a crystal rod cutting method and system. Background Art

[0002] In the production process of semiconductor wafers, after the crystal rod is pulled out by the direct pulling method, it is necessary to first cut the crystal rod into multiple crystal rod segments (blocks), and then cut each block into thin slices of initial wafers. Finally, the initial wafers are ground, polished, and cleaned to obtain wafers.

[0003] Among them, the crystal rod is usually cut by a band saw. During the use of the band saw, the cutting blade will become blunt as the service life increases, resulting in a decrease in cutting force, which in turn causes the crystal rod cutting surface to be uneven. In the prior art, the cutting performance of the band saw needs to be judged by personnel. After the band saw is passivated, it needs to be manually polished with a grinding stone, which has high requirements on personnel and is difficult to monitor and handle in real time. Summary of the invention

[0004] In view of this, the present application provides a crystal rod cutting method and system, which can monitor the cutting saw in real time, which is conducive to the maintenance of the cutting saw.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] A method for cutting a crystal rod, comprising:

[0007] Obtain the output load of the cutting saw when cutting the crystal rod;

[0008] Obtaining the roughness of the cut surface of the crystal rod;

[0009] monitoring a degree of dullness of the cutting saw based on the output load and the roughness;

[0010] The crystal rod is cut according to the passivation degree.

[0011] Optionally, monitoring the degree of passivation of the cutting saw includes:

[0012] Setting a first preset value and a second preset value;

[0013] comparing the maximum value of the output load with the first preset value, and comparing the roughness with the second preset value;

[0014] If the maximum value of the output load is greater than the first preset value, and the roughness is greater than the second preset value, it is determined that the cutting saw is in a passive state.

[0015] Optionally, it also includes:

[0016] If it is determined that the cutting saw is in a dull state, the cutting saw is sharpened.

[0017] Optionally, the output load is set to an output current of the cutting saw.

[0018] Optionally, when cutting the crystal ingot, the cutting saw operates at a constant feed speed.

[0019] A crystal ingot cutting system, based on the crystal ingot cutting method as described in any one of the above items, comprising:

[0020] A cutting saw is used to cut the crystal rod;

[0021] A measuring device, used to measure the roughness of the cut surface of the crystal rod;

[0022] A grinding device for grinding the cutting saw;

[0023] The control device is connected to the cutting device, the measuring device and the grinding device for communication, and can control the grinding device to grind the cutting saw according to the output load of the cutting saw and the measurement result of the measuring device.

[0024] Optionally, the cutting saw comprises a band saw, and a main pulley and a secondary pulley for driving the band saw to rotate, and the output load is set to the output current of the main pulley.

[0025] Optionally, the measuring device comprises a support and a measuring instrument, wherein the measuring instrument is arranged on the support and can move in a direction approaching and moving away from the cut surface of the crystal rod.

[0026] Optionally, the grinding device includes a base and a grinding head, wherein the grinding head is connected to the base via a buffer module and can elastically abut against the cutting saw under the drive of the base.

[0027] Optionally, the crystal rod is arranged on a carrying device, and the carrying device is communicatively connected with the control device and can drive the crystal rod to move.

[0028] The crystal rod cutting method and system provided in the present application can monitor the passivation degree of the cutting saw in real time by calculating and comparing the data of the output load of the cutting saw and the roughness of the cutting surface of the crystal rod after the cutting and inspection of the crystal rod are completed, so as to facilitate the grinding or replacement of the cutting saw according to the passivation degree of the cutting saw, which is beneficial to prolong the service life of the cutting saw and improve the cutting quality of the crystal rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0030] Figure 1 A flow chart of a method for cutting a crystal rod according to some embodiments;

[0031] Figure 2 A top view of a crystal ingot truncation system according to some embodiments;

[0032] Figure 3 A front view of a crystal rod cutting system according to some embodiments;

[0033] Figure 4 Schematic diagram of the structure of the grinding device shown in some embodiments.

[0034] In the figure: 1. crystal rod; 2. carrying device; 3. measuring instrument; 4. bracket; 5. grinding device; 6. band saw; 7. main pulley; 8. slave pulley; 51. grinding head; 52. buffer module; 53. base. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] like Figure 1-Figure 4 As shown, an embodiment of the present application provides a method for cutting a crystal rod, comprising the following steps:

[0037] S1, obtaining the output load of the cutting saw when cutting the crystal rod 1;

[0038] In step S1, a cutting saw is used to cut the crystal rod 1. During the cutting process, the cutting saw cuts the crystal rod 1 at a constant feed speed and forms a cutting surface on the crystal rod 1. Among them, the output load of the cutting saw first increases and then decreases as the cutting depth increases, that is, the output load is small when the cutting saw starts cutting, the output load is maximum when the cutting saw cuts to the middle of the wafer, and the output load is small when the cutting saw completes cutting. When factors such as the feed speed and the material of the crystal rod 1 are constant, the greater the output load, the greater the passivation degree of the cutting saw, that is, the lower the cutting force of the cutting saw. Here, the output load of the cutting saw obtained is preferably set to the output current load, and can also be set to other load parameters such as power load.

[0039] S2, obtaining the roughness of the cut surface of the crystal rod 1;

[0040] In step S2, after the cutting saw completes the cutting, the roughness of the cut surface of the crystal rod 1 can be detected using a measuring instrument 3, wherein the measuring method can be manual or automatic. When the feed speed of the cutting saw and the material of the crystal rod 1 are constant, the greater the roughness of the cut surface of the crystal rod 1, the greater the passivation degree of the cutting saw.

[0041] S3, monitoring the degree of passivation of the cutting saw according to the output load and roughness;

[0042] S4. Cut the crystal rod according to the degree of passivation.

[0043] In steps S3 and S4, after the cutting and inspection of the crystal rod 1 are completed, the passivation degree of the cutting saw can be monitored in real time by calculating and comparing the obtained output load of the cutting saw and the roughness of the cutting surface of the crystal rod 1, and then the subsequent crystal rod cutting process can be performed according to the passivation degree of the cutting saw, for example, the crystal rod is continued to be cut in the subsequent process, or the cutting saw is polished in the subsequent process. In this way, the subsequent process can be controlled according to the real-time state of the cutting saw, so that the cutting saw can be polished or replaced according to the passivation degree of the cutting saw, which is conducive to improving the service life of the cutting saw and improving the cutting quality of the crystal rod 1.

[0044] It should be noted that the passivation degree of the cutting saw can include a passivated state and an unpassivated state. By judging whether the cutting saw is passivated, it is determined whether the cutting saw needs to be polished. That is, when the cutting saw is in a passivated state, the crystal rod can continue to be cut, and when the cutting saw is in a passivated state, the cutting saw can be polished. In addition, the passivation degree of the cutting saw can also include multiple levels of passivation. For example, when the passivation degree of the cutting saw reaches level one, the cutting saw needs to be polished, and when the passivation degree of the cutting saw reaches level two, the cutting saw needs to be replaced.

[0045] In some embodiments, the above step S3 includes:

[0046] Setting a first preset value and a second preset value;

[0047] comparing the maximum value of the output load with a first preset value, and comparing the roughness with a second preset value;

[0048] If the maximum value of the output load is greater than the first preset value, and the roughness is greater than the second preset value, it is determined that the cutting saw is in a dull state.

[0049] Among them, the first preset value is the maximum value specification of the output load of the cutting saw, and the second preset value is the maximum roughness specification of the cut surface of the crystal rod 1. The operator can appropriately adjust the preset value and the second preset value according to the actual situation. When the passivation degree of the cutting saw is at a critical value (i.e., in a state between passivation and non-passivation), the maximum output load of the cutting saw when cutting the crystal rod 1 is the first preset value, and the roughness of the cut surface of the crystal rod 1 after cutting is the second preset value. In this way, by comparing the actual output load of the cutting saw and the roughness of the cut surface of the crystal rod 1, the passivation degree of the cutting saw can be determined, and then it can be determined whether the cutting saw needs to be polished and depassivated.

[0050] Furthermore, the crystal rod cutting method further comprises:

[0051] If the cutting saw is determined to be in a dull state, the cutting saw is sharpened.

[0052] Each time the saw completes cutting of the crystal rod 1, it is necessary to determine the passivation degree of the saw. If the saw is in a passivated state, the saw is polished. If the saw is not in a passivated state, the saw cuts the crystal rod 1 again. In this way, after each cutting is completed, the passivation degree of the saw can be obtained, and the passivation degree of the saw can be monitored in real time, which is beneficial to prolonging the service life of the saw and improving the cutting quality of the crystal rod 1.

[0053] It should be noted that the cutting saw can be polished manually, that is, the operator manually polishes the cutting saw after receiving the signal that the cutting saw is in a passivation state, or it can be set to automatic polishing, that is, the grinding device manually polishes the cutting saw after receiving the signal that the cutting saw is in a passivation state.

[0054] The embodiment of the present application also provides a crystal rod cutting system, which is based on the above-mentioned crystal rod cutting method and includes a cutting saw, a measuring device, a grinding device 5 and a control device. Among them, the cutting saw is used to cut the crystal rod 1 and form a cutting surface on the crystal rod 1, the measuring device is used to measure the roughness of the cutting surface of the crystal rod 1, and the grinding device 5 is used to grind the cutting saw. In the process of the cutting saw cutting the crystal rod 1, the cutting saw will gradually become passivated due to wear. If the roughness measured by the measuring device is large, it means that the degree of passivation of the cutting saw is large, and then the cutting saw can be polished by the grinding device 5.

[0055] The control device is connected in communication with the cutting device, the measuring device and the grinding device 5, so that the control device can obtain the output load of the cutting saw and the measurement result of the measuring device. The control device can determine whether the cutting saw is in a passivation state by calculating and comparing the obtained data information, and grind the cutting saw in a passivation state through the grinding device 5. In this way, the control device can automatically monitor the passivation degree of the cutting saw, and automatically grind the cutting saw according to the monitoring result, which is conducive to improving the service life of the cutting saw and the cutting quality of the crystal rod 1.

[0056] In some embodiments, the cutting saw includes a band saw 6, a main pulley 7 and a slave pulley 8, the band saw 6 is connected to the main pulley 7 and the slave pulley 8, the main pulley 7 and the slave pulley 8 are used to support the band saw 6, and the main pulley 7 can drive the band saw 6 to rotate, so as to cut the crystal rod 1 through the band saw 6. The output load of the cutting saw is set to the output current of the main pulley 7, that is, the control device determines whether the cutting saw is in a passivation state according to the output current of the main pulley 7 and the measurement result of the measuring device. In this way, judging the passivation degree of the cutting saw by the output current of the main pulley 7 is conducive to improving the accuracy and timeliness of monitoring.

[0057] The crystal rod 1 is arranged on the carrying device 2 so that the carrying device 2 can carry the crystal rod 1 and drive the crystal rod 1 to move. During operation, the carrying device 2 can drive the crystal rod 1 to move along its own axial direction to adjust the cutting position of the crystal rod 1. After the cutting saw completes the cutting of the crystal rod 1, the carrying device 2 drives the crystal rod 1 to move along the axial direction by a unit distance so that the cutting saw can cut the crystal rod 1 again. Among them, the carrying device 2 is connected to the control device in communication so that the control device can control the position of the crystal rod 1, which is conducive to cooperating with the cutting saw and the measuring device to complete the cutting of the crystal rod 1 and the roughness measurement of the cut surface of the crystal rod 1.

[0058] It should be noted that the carrier 2 can also drive the crystal rod 1 to move radially so that the cutting saw can cut the crystal rod 1. In addition, other components can also be used to drive the cutting saw to move radially relative to the crystal rod 1 to cut the crystal rod 1.

[0059] like Figure 3 As shown, the measuring device includes a bracket 4 and a measuring instrument 3. The measuring instrument 3 is arranged on the bracket 4 and can move in the direction of approaching and moving away from the cutting surface of the crystal rod 1. Specifically, a pendulum is arranged on the bracket 4, the first end of the pendulum is rotatably connected to the bracket 4, and the second end is connected to the measuring instrument 3. When it is necessary to measure the roughness of the cutting surface of the crystal rod 1, the control device controls the pendulum to swing forward so that the second end of the pendulum is close to the crystal rod 1, and then the measuring instrument 3 can be moved to the cutting surface of the crystal rod 1, which is conducive to improving the measurement accuracy of the roughness. After the roughness measurement is completed, the pendulum swings in the opposite direction so that the second end of the pendulum is away from the crystal rod 1, thereby preventing the measuring instrument 3 from affecting the subsequent cutting of the crystal rod 1.

[0060] like Figure 4 As shown, the grinding device 5 includes a base 53 and a grinding head 51. The grinding head 51 is connected to the base 53 through a buffer module 52, so that the grinding head 51 can be elastically displaced relative to the base 53. For example, the buffer module 52 is configured as a compression spring. When the cutting saw is in a passivation state, the control device controls the base 53 to approach the cutting saw, and the base 53 drives the grinding head 51 to contact the cutting saw. Under the action of the buffer module 52, the grinding head 51 elastically abuts against the cutting saw. In this way, by configuring the buffer module 52, it is possible to prevent the grinding head 51 from exerting too much thrust on the cutting saw and damaging the cutting saw.

[0061] like Figure 1 As shown, the method for cutting the crystal rod 1 is specifically described in combination with the above embodiment.

[0062] Set the feed speed V0, set the maximum current load of the primary pulley 7 to A0 (i.e., the first preset value), and set the roughness specification Ra0 (i.e., the second preset value);

[0063] The main pulley 7 drives the band saw 6 to cut the crystal rod 1 at a set speed V0 by rotating at high speed;

[0064] During the cutting process, the output current AX of the main pulley 7 is recorded;

[0065] After the cutting is completed, the roughness Ra of the cutting surface is measured. When AX>A0 and Ra>Ra0, the grinding device 5 is activated to grind the band saw 6;

[0066] Make the next cut.

[0067] The following table shows the corresponding relationship between the feed speed V0, the maximum current load A0 and the roughness specification Ra0. In the process of cutting the crystal rod by the cutting saw, the feed speed of the cutting saw is different, and the maximum current load when the cutting saw is in the passivation state is also different. Therefore, the setting value of the maximum current load A0 is related to the setting value of the feed speed V0, that is, the larger the setting value of the feed speed is, the larger the setting value of the corresponding maximum current load is.

[0068] Feed speed V0 / mm / min The maximum current load is A0 / A Roughness specification Ra0 / μm 14 6.7 2 16 6.9 2 18 7.2 2 20 7.6 2 22 8.2 2 24 8.8 2

[0069] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0070] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0071] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0072] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0073] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0074] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A method for cutting a crystal rod, characterized in that: include: Obtain the output load of the cutting saw when cutting the crystal rod; Obtaining the roughness of the cut surface of the crystal rod; monitoring a degree of dullness of the cutting saw based on the output load and the roughness; The crystal rod is cut according to the passivation degree.

2. The method for cutting a crystal rod according to claim 1, characterized in that: The monitoring of the passivation degree of the cutting saw comprises: Setting a first preset value and a second preset value; comparing the maximum value of the output load with the first preset value, and comparing the roughness with the second preset value; If the maximum value of the output load is greater than the first preset value, and the roughness is greater than the second preset value, it is determined that the cutting saw is in a passive state.

3. The method for cutting a crystal rod according to claim 2, characterized in that: Also includes: If it is determined that the cutting saw is in a dull state, the cutting saw is sharpened.

4. The method for cutting a crystal rod according to claim 1, characterized in that: The output load is set to the output current of the cutting saw.

5. The method for cutting a crystal rod according to claim 1, characterized in that: When cutting the ingot, the cutting saw operates at a constant feed speed.

6. A crystal rod cutting system, characterized in that: The method for cutting a crystal rod according to any one of claims 1 to 5 comprises: A cutting saw is used to cut the crystal rod; A measuring device, used to measure the roughness of the cut surface of the crystal rod; A grinding device for grinding the cutting saw; The control device is connected to the cutting device, the measuring device and the grinding device for communication, and can control the grinding device to grind the cutting saw according to the output load of the cutting saw and the measurement result of the measuring device.

7. The crystal rod cutting system according to claim 6, characterized in that: The cutting saw comprises a band saw, and a main pulley and a secondary pulley for driving the band saw to rotate, and the output load is set to the output current of the main pulley.

8. The crystal rod cutting system according to claim 6, characterized in that: The measuring device comprises a support and a measuring instrument. The measuring instrument is arranged on the support and can move in a direction approaching and away from a cutting surface of the crystal rod.

9. The ingot cutting system according to claim 6, characterized in that: The grinding device comprises a base and a grinding head. The grinding head is connected to the base via a buffer module and can elastically abut against the cutting saw under the drive of the base.

10. The crystal ingot cutting system according to claim 6, characterized in that: The crystal rod is arranged on a carrying device, and the carrying device is in communication connection with the control device and can drive the crystal rod to move.

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