Semiconductor product packaging and implanting mode
By using vacuum or inert gas packaging and air duct blowing and suction technology in semiconductor product packaging and implantation technology, the problems of contact pollution and high-speed operation stability are solved, and a more efficient packaging process and lower production costs are achieved.
Patent Information
- Application Number
- CN202411709611.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-02-14
AI Technical Summary
The existing semiconductor product packaging and implantation technology has problems such as contact pollution and damage, and the stability under high-speed operation is difficult to ensure.
Vacuum or inert gas packaging technology, combined with air duct blowing and air duct suction technology, semiconductor products are implanted. Through blowing and vacuum adsorption, the product is clean and stable during the packaging process.
Effectively prevent contact pollution and damage of semiconductor products during the test packaging process, improve stability under high-speed operation, reduce waste rate, improve product qualification rate, and thus reduce production costs.
Smart Images
Figure CN119429291A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor products, and in particular to a semiconductor product packaging and implantation method. Background Art
[0002] Background technology of a semiconductor product packaging implantation method mainly stems from the rapid development of the semiconductor industry and the continuous pursuit of product packaging technology. With the advancement of science and technology, the semiconductor industry has developed rapidly on a global scale. From the initial basic material research to today's advanced process technology and packaging technology, the semiconductor industry has undergone tremendous changes. This rapid development has promoted the miniaturization, multifunctionality and intelligence of electronic products, and at the same time has put forward higher requirements for the packaging technology of semiconductor products. Packaging is an important link in the manufacturing process of semiconductor products. It is directly related to the reliability, performance and service life of the product. An excellent packaging technology can protect the semiconductor chip from interference and damage from the external environment, while providing stable electrical connection and heat dissipation performance. Therefore, the continuous innovation and improvement of the semiconductor product packaging implantation method is of great significance to improving product quality, reducing costs and meeting market demand. For this reason, this application now proposes a semiconductor product packaging implantation method. Summary of the invention
[0003] Technical Solution To achieve the above-mentioned purpose, the present invention provides the following technical solution: a semiconductor product packaging and implantation method, including a pre-processing stage, a packaging stage, a post-processing stage and material selection, and the specific steps are as follows: S1. The product is placed in the empty space on the delivery tray; S2, the product rotates to the top of the carrier belt; S3, the upper part is blown up and blown into the carrier, and the lower part is vacuum sucked; S4. Select adhesives and packaging materials for semiconductor product packaging and implantation.
[0004] Preferably, the material is packed in the pre-processing stage, and the product is rotated to the top of the carrier: a specific method is used to perform rotational shifting to solve the testing difficulties, the top is blown up and blown into the carrier, and the bottom is vacuum sucked: semiconductor products are passed through this method to solve the difficulties of product contamination, slow implantation, and unstable implantation.
[0005] Preferably, the packaging stage is to package the semiconductor bare die onto a carrier to form a complete semiconductor device, which specifically includes feeding into a carrier, electrical testing, visual testing, and implanting a carrier tape. The detailed steps are as follows: Feeding into the tray: The product is sent into the space of the tray through linear vibration; Electrical test: The product is tested when the carrier plate rotates to the electrical test position; Visual test: The product is visually tested when the carrier plate rotates to the visual test area.
[0006] Implanting the carrier tape: The product tray with both electrical and visual tests is transferred to the top of the carrier tape for implantation.
[0007] Preferably, the packaging stage utilizes tracheal blowing and tracheal suction technology to implant the product from the carrier into the carrier tape. Specifically, during implantation, the tracheal blowing technology is used to quickly blow the product into the carrier tape, and the vacuum adsorption technology is used to suck the product into and fix it in the carrier tape, and then the product is sealed in the carrier tape.
[0008] Preferably, the post-processing electrical test, visual test, and carrier tape implantation and sealing steps are specifically as follows: Electrical testing: Place the packaged semiconductor device into the carrier and process it so that the product can be tested for electrical properties at the test position; Visual test: Place the packaged semiconductor device into the carrier and process it so that the product can be visually tested at the visual test position; Implantation and sealing in carrier tape: Perform performance tests on packaged semiconductor devices, select qualified semiconductor devices based on the test results, and seal them in carrier tape.
[0009] Preferably, the post-processing electrical test, visual test, and implantation carrier tape sealing selection are specifically: Electrical testing: Choose one with good detection accuracy, fast speed and clear classification; Visual test: choose the one with good detection accuracy, fast speed and clear classification; Implantation and tape sealing: Choose a non-contact implant with good performance to avoid contact contamination and damage Compared with the prior art, the present invention provides a semiconductor product packaging and implantation method, which has the following beneficial effects: 1. The semiconductor product packaging and implantation method can effectively prevent the contact contamination and damage of semiconductor products during the testing and packaging process through vacuum or inert gas packaging, while solving the stability under high-speed operation.
[0010] 2. The packaging and implantation method of semiconductor products. Modern semiconductor product packaging and implantation methods often adopt automated production lines, which can greatly improve production efficiency and reduce labor costs. By selecting appropriate packaging materials and processes, material costs and production costs can be reduced while ensuring product quality. Precise packaging technology and strict quality control can effectively reduce the scrap rate, improve the product qualification rate, and thus reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a schematic diagram of the air pipe blowing and air pipe suction operation in the packaging stage of the present invention. DETAILED DESCRIPTION
[0012] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0013] A semiconductor product packaging and implantation method, including a semiconductor product packaging and implantation method, including a pre-processing stage, a packaging stage, a post-processing stage and material selection, and the specific steps are as follows: S1. The product is placed in the empty space on the delivery tray; S2, the product rotates to the top of the carrier belt; S3, the upper part is blown up and blown into the carrier, and the lower part is vacuum sucked; S4. Select adhesives and packaging materials for semiconductor product packaging and implantation.
[0014] Furthermore, the product is rotated to the top of the carrier: a specific method is used to perform rotational shifting to solve the testing difficulties, the top is blown up and blown into the carrier, and the bottom is vacuum sucked: this method of placing semiconductor products can solve the difficulties of product contamination, slow implantation, and unstable implantation.
[0015] Furthermore, the packaging stage is to package the semiconductor bare die onto a carrier to form a complete semiconductor device, which specifically includes feeding into a carrier, electrical testing, visual testing, and implanting a carrier tape. The detailed steps are as follows: Feeding into the tray: The product is sent into the space of the tray through linear vibration; Electrical test: The product is tested when the carrier plate rotates to the electrical test position; Visual test: The product is visually tested when the carrier plate rotates to the visual test area.
[0016] Implanting the carrier tape: The product tray with both electrical and visual tests is transferred to the top of the carrier tape for implantation.
[0017] Embodiment 1: A semiconductor product packaging and implantation method includes a pre-processing stage, a packaging stage, a post-processing stage and material selection, and the specific steps are as follows: S1. The product is placed in the empty space on the delivery tray; S2, the product rotates to the top of the carrier belt; S3, the upper part is blown up and blown into the carrier, and the lower part is vacuum sucked; S4. Select adhesives and packaging materials to package and implant semiconductor products.
[0018] Embodiment 2: According to a semiconductor product packaging and implantation method proposed in Embodiment 1, the pre-processing stage includes sending the product into a carrier, and the product is sent into the carrier: a specific semiconductor product is sent for electrical testing, and after visual inspection, qualified products are packaged in the required carrier.
[0019] Embodiment 3: According to a semiconductor product packaging and implantation method proposed in Embodiment 1, the packaging stage is to package the semiconductor bare chip onto the carrier, and the process of forming a complete semiconductor device specifically includes bonding, gold wire bonding, and packaging glue injection. The detailed steps are as follows: Bonding: Use adhesive to bond the semiconductor die to a carrier, such as a lead frame or ceramic substrate. During the bonding process, it is necessary to ensure that the adhesive has good compatibility with the semiconductor die and the carrier material to ensure bonding strength and reliability; Gold wire bonding: Use gold wire or other metal wires to connect the electrodes on the semiconductor die to the pins on the carrier. Gold wire bonding technology has the advantages of high precision and high reliability, and is one of the commonly used connection methods in semiconductor packaging. Packaging glue injection: The packaging glue is injected into the gap between the semiconductor die and the carrier to provide protection and fixation. The packaging glue needs to have good insulation, heat resistance and moisture resistance to protect the semiconductor device from the influence of the external environment.
[0020] Embodiment 4: According to a semiconductor product packaging and implantation method proposed in Embodiment 1, impurities are cleaned by using air pipe blowing and air pipe suction technology in the packaging stage. Specifically, before packaging, air pipe blowing technology is used to blow away dust, particles and residues on the surface of semiconductor chips, carriers or packaging materials to improve packaging quality. During the packaging process, air pipe suction technology is used to suck away tiny particles and dust in the packaging environment to ensure the cleanliness of the packaging environment and product quality. Tracheal blowing and tracheal suction technology may have potential application value in the semiconductor product packaging and implantation process. Through the reasonable design and use of these two technologies, the packaging quality and reliability of semiconductor products can be further improved.
[0021] Embodiment 5: According to a semiconductor product packaging implantation method proposed in Embodiment 1, the post-processing stage includes curing, cutting and shaping, testing and screening steps, which are as follows: Curing: Put the packaged semiconductor device into the oven for curing to fully cure the packaging material. The temperature and time of the oven need to be controlled during the curing process to ensure the performance of the packaging material. Cutting and shaping: Cut the solidified semiconductor device from the carrier and perform shaping. During the cutting and shaping process, it is necessary to ensure that the size and shape of the device meet the specification requirements; Testing and screening: Perform performance tests on packaged semiconductor devices, such as electrical performance tests, reliability tests, etc. Qualified semiconductor devices are screened out based on the test results and classified and labeled.
[0022] Embodiment 6: According to a semiconductor product packaging and implantation method proposed in Embodiment 1, the material selection includes the selection of adhesive, packaging material, metal wire, and carrier material, specifically: Adhesive: Choose an adhesive with good bonding strength, heat resistance, and moisture resistance. At the same time, ensure that the adhesive has good compatibility with the semiconductor die and carrier material. Packaging materials: Select packaging materials with good insulation, heat resistance and moisture resistance. The packaging materials must also have low shrinkage and good fluidity to ensure packaging quality; Metal wire: Choose metal wire with good conductivity and mechanical strength. At the same time, ensure that the metal wire has good welding properties with the semiconductor die and carrier material; Carrier material: Select a carrier material with good thermal conductivity and mechanical strength. The carrier material must also have good compatibility with the semiconductor die and packaging material.
[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor product packaging and implantation method, characterized in that: It includes pre-processing stage, packaging stage, post-processing stage and material selection. The specific steps are as follows: S1. The product is placed in the empty space on the delivery tray; S2, the product rotates to the top of the carrier belt; S3, the upper part is blown up and blown into the carrier, and the lower part is vacuum sucked; S4. Select adhesives and packaging materials for semiconductor product packaging and implantation.
2. A semiconductor product packaging and implantation method according to claim 1, characterized in that: The pre-processing stage includes sending the product into the carrier, and the product is sent into the carrier: a specific semiconductor product is sent for electrical testing, and after visual inspection, qualified products are packaged in the required carrier.
3. A semiconductor product packaging and implantation method according to claim 1, characterized in that: The packaging stage is to package the semiconductor bare chip onto the carrier to form a complete semiconductor device. The process specifically includes feeding into the carrier, electrical testing, visual testing, and implanting the carrier tape. The detailed steps are as follows: Feeding into the carrier: The product is sent into the space of the carrier through linear vibration; Electrical test: The product is tested when the carrier plate rotates to the electrical test position; Visual test: The product is visually tested when the carrier plate rotates to the visual test area.
4. Implantation of the carrier tape: The product tray that has undergone both electrical and visual tests is transferred to the top of the carrier tape for implantation.
5. A semiconductor product packaging and implantation method according to claim 1, characterized in that: The packaging stage utilizes air tube blowing and air tube suction technology to implant the product from the carrier into the carrier tape. Specifically, during implantation, the air tube blowing technology is used to quickly blow the product into the carrier tape, and the vacuum adsorption technology is used to suck the product into and fix it in the carrier tape, and then the product is sealed in the carrier tape.
6. A semiconductor product packaging and implantation method according to claim 1, characterized in that: The post-processing electrical test, visual test, and carrier tape implantation and sealing steps are as follows: Electrical testing: Place the packaged semiconductor device into the carrier and process it so that the product can be tested for electrical properties at the test position; Visual test: Place the packaged semiconductor device into the carrier and process it so that the product can be visually tested at the visual test position; Implantation and sealing in carrier tape: Perform performance tests on packaged semiconductor devices, select qualified semiconductor devices based on the test results, and seal them in carrier tape.
7. A semiconductor product packaging and implantation method according to claim 1, characterized in that: The post-processing electrical test, visual test, and implantation carrier tape sealing selection are specifically: Electrical testing: Choose one with good detection accuracy, fast speed and clear classification; Visual test: choose the one with good detection accuracy, fast speed and clear classification; Implantation and tape sealing: Choose a carrier with good non-contact implantation to avoid contact contamination and damage.