Transformer heat dissipation device and method

By using a combination device of hollow capillary alloy heat sink, thermal grease and refrigerator on the transformer, the problem of unsatisfactory heat dissipation effect of transformers in the prior art under high load and high temperature environments is solved, and high-efficiency and low-energy heat dissipation is achieved Effect.

CN119446726APending Publication Date: 2025-02-14ELECTRIC POWER RESEARCH INSTITUTE OF STATE GRID QINGHAI ELECTRIC POWER COMPANY +2
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Patent Information

Application Number
CN202411381869.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-02-14

AI Technical Summary

Technical Problem

The existing transformer heat dissipation method has poor heat dissipation effect under high load and high temperature environments, and has disadvantages such as high energy consumption and high noise.

Method used

The combination device of hollow capillary alloy heat sink, thermal grease and refrigerator is adopted. The hollow capillary alloy heat sink is set on the transformer wave fins, and the thermal grease fills the thermal interface gap. The refrigerator cools the top of the heat sink through the heat conduction pipe. The phase change process of liquid phase refrigerant achieves efficient conduction and dispersion of heat.

Benefits of technology

It significantly improves the heat dissipation efficiency of the transformer, reduces energy consumption and noise, and ensures the stable operation of the transformer in a high-temperature environment.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to the method, hollow capillary alloy cooling fins are directly attached to wave fins of a transformer, and heat conduction silicone grease is filled between the hollow capillary alloy cooling fins to optimize heat conduction. The interior of the hollow capillary alloy cooling fin is tubular, liquid-phase refrigerants are stored, the liquid-phase refrigerants are heated to volatilize and absorb heat to the top, the refrigerator cools the top through a heat conduction pipe, and gas-phase refrigerants are condensed and flow back to the bottom for circulation heat dissipation. By utilizing the efficient heat conduction characteristic of the capillary alloy, the heat dissipation efficiency is remarkably improved, meanwhile, energy consumption and operation noise are reduced, and an innovative solution is provided for heat dissipation of the transformer.
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Description

Technical Field

[0001] The present application relates to the field of transformer heat dissipation, and in particular to a transformer heat dissipation device and method. Background Art

[0002] In the power system, the transformer is a key equipment, and its operating stability and efficiency directly affect the performance of the entire power grid. However, the transformer will generate a lot of heat during operation. If the heat cannot be dissipated in a timely and effective manner, the transformer temperature will rise, which will affect its insulation performance and service life, and may even cause safety accidents. Therefore, how to dissipate heat from the transformer efficiently and reliably has always been an important research topic in the field of power engineering technology.

[0003] Traditional transformer cooling methods mainly include natural air cooling, forced air cooling, and oil-immersed cooling, etc. Although these methods can meet the heat dissipation requirements to a certain extent, their heat dissipation effects are often not ideal under high load and high temperature environments, and they have disadvantages such as high energy consumption and high noise. Summary of the invention

[0004] The purpose of the present application is to overcome the defects in the above-mentioned prior art and provide a transformer heat dissipation device and method.

[0005] The present application provides a transformer heat dissipation device, characterized in that it comprises: a hollow capillary alloy heat sink, thermal conductive silicone grease, and a refrigerator;

[0006] The hollow capillary alloy heat sink is arranged on the transformer wave fin;

[0007] The thermal conductive silicone grease is arranged between the hollow capillary alloy heat sink and the transformer wave fin;

[0008] The refrigerator cools the top of the hollow capillary alloy heat sink through a heat conduction pipe;

[0009] The interior of the hollow capillary alloy heat sink is a tubular structure, and the lower part of the hollow capillary alloy heat sink stores liquid refrigerant. After being heated, the liquid refrigerant can absorb heat and volatilize to the upper part of the hollow capillary alloy heat sink;

[0010] The power calculation formula of the refrigerator is:

[0011]

[0012]

[0013] Among them, α, β, γ, δ are weight coefficients, T ambient is the ambient temperature, HeatGenerated(t) is the heat generated by the transformer 101;

[0014] The refrigerator reduces the heat at the top of the hollow capillary alloy heat sink according to the power, and the gas phase evaporated to the upper part of the hollow capillary alloy heat sink is recondensed back into liquid and flows to the lower part of the hollow capillary alloy heat sink to complete the heat dissipation.

[0015] Optionally, the surface of the hollow capillary alloy heat sink is provided with a nanoscale heat reflective coating.

[0016] Optionally, the thermal grease includes: graphene, carbon nanotubes or metal oxides mixed into the thermal grease.

[0017] Optionally, the heat conducting pipe is a corrugated heat conducting pipe with adjustable angle.

[0018] Optionally, the alloy material of the hollow capillary alloy heat sink includes: copper-tungsten pseudo alloy.

[0019] The present application also provides a transformer heat dissipation method, characterized by comprising:

[0020] The hollow capillary alloy heat sink is arranged on the transformer wave fin, including: heat-conducting silicone grease is arranged between the hollow capillary alloy heat sink and the transformer wave fin; the hollow capillary alloy heat sink has a tubular structure inside, and a liquid phase refrigerant is stored in the lower part, and the liquid phase refrigerant can absorb heat and volatilize to the upper part after being heated;

[0021] The refrigerator transfers the heat transfer medium to the top of the hollow capillary alloy heat sink through the heat transfer pipe;

[0022] The refrigerator reduces the heat at the top of the hollow capillary alloy heat sink, and the gas phase volatilized to the upper part of the hollow capillary alloy heat sink is recondensed back into liquid and flows to the bottom of the hollow capillary alloy heat sink to complete the heat dissipation.

[0023] Optionally, the hollow capillary alloy heat sink comprises: a surface covered with a nanoscale heat reflective coating.

[0024] Optionally, the thermal grease includes: graphene, carbon nanotubes or metal oxides mixed into the thermal grease.

[0025] Optionally, the heat conducting pipe is a corrugated heat conducting pipe with adjustable angle.

[0026] Optionally, the alloy material of the hollow capillary alloy heat sink includes: copper-tungsten pseudo alloy.

[0027] The beneficial effects of this application are:

[0028] The present application provides a transformer heat dissipation device, characterized in that it includes: a hollow capillary alloy heat sink, a thermal conductive silicone grease, and a refrigerator; the hollow capillary alloy heat sink is arranged on the transformer wave fin; the thermal conductive silicone grease is arranged between the hollow capillary alloy heat sink and the transformer wave fin; the refrigerator cools the top of the hollow capillary alloy heat sink through a heat-conducting pipe; the hollow capillary alloy heat sink is a tubular structure, and the lower part of the hollow capillary alloy heat sink stores liquid refrigerant, and after being heated, the liquid refrigerant can absorb heat and evaporate to the upper part of the hollow capillary alloy heat sink; the refrigerator reduces the heat at the top of the hollow capillary alloy heat sink according to the calculated power, and the gas phase evaporated to the upper part of the hollow capillary alloy heat sink is re-condensed back into liquid and flows to the lower part of the hollow capillary alloy heat sink to complete the heat dissipation. The present application uses the capillary alloy material as a hollow capillary alloy heat sink, which improves the heat dissipation efficiency of the transformer and reduces energy consumption and noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the transformer heat dissipation device in this application. DETAILED DESCRIPTION

[0030] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that various forms of implementing the present disclosure should not be limited by the embodiments set forth herein. On the contrary, the embodiments are provided to more thoroughly understand the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0031] This embodiment provides an innovative transformer heat dissipation device, which aims to significantly reduce the operating temperature of the transformer in a high temperature environment and improve the operating stability and reliability of the transformer through efficient heat conduction and circulating refrigeration mechanism. The core components of the device include hollow capillary alloy heat sink, thermal grease and refrigerator, which work together to achieve efficient heat conduction and dissipation.

[0032] Please refer to Figure 1 As shown, a transformer heat dissipation device provided in the present application includes: a hollow capillary alloy heat sink 103, thermal grease, and a refrigerator 105.

[0033] The hollow capillary alloy heat sink 103 is designed as a tubular structure, and is filled with liquid refrigerant. The hollow capillary alloy heat sink 103 is precisely mounted on the wave fin 102 of the transformer 101 to ensure close contact between the two. The liquid refrigerant inside the hollow capillary alloy heat sink 103 can quickly absorb heat and evaporate to the top after being heated, thereby achieving effective heat transfer.

[0034] The thermal grease is a high-performance thermal interface material. The thermal grease is evenly applied between the hollow capillary alloy heat sink 103 and the wave fin 102 of the transformer 101 to fill the tiny gap and enhance the heat conduction efficiency between the two. If a self-healing material is used as the thermal grease, it can also automatically repair tiny damage caused by aging or external force during long-term use to ensure the stability of thermal conduction performance.

[0035] The refrigerator 105 is connected to the top of the hollow capillary alloy heat sink 103 through an angle-adjustable heat pipe 104. The refrigerator 105 transfers the heat transfer medium to the top of the hollow capillary alloy heat sink 103, so that the gas-phase refrigerant evaporated to the top is quickly condensed back to a liquid state and flows back to the bottom of the hollow capillary alloy heat sink 103, forming a complete heat cycle.

[0036] Covering the surface of the hollow capillary alloy heat sink 103 with a layer of nano-scale heat reflective coating can further reduce heat radiation loss and improve heat dissipation efficiency.

[0037] The hollow capillary alloy heat sink 103 is made of copper-tungsten pseudo alloy material, which not only has excellent thermal conductivity, but also has high strength and corrosion resistance, and can meet the strict requirements of heat dissipation of the transformer 101.

[0038] The hollow capillary alloy heat sink 103 is a hollow capillary alloy heat sink 103 made of an alloy material with a tubular structure inside and filled with a liquid refrigerant, and achieves efficient conduction and dissipation of heat through a phase change process.

[0039] The thermal grease is a high-performance material used to fill the gap of the thermal interface and improve the thermal conduction efficiency, and generally has good fluidity and thermal stability.

[0040] The refrigerator 105 is a mechanical device that reduces the temperature of an object by consuming electrical energy or other energy sources. In this embodiment, the refrigerator 105 is used to reduce the temperature of the top of the hollow capillary alloy heat sink 103 .

[0041] The heat pipe 104 is a tubular element for transferring heat. In this embodiment, the heat pipe 104 connects the refrigerator 105 and the hollow capillary alloy heat sink 103 to achieve the transfer of heat transfer medium.

[0042] The nanoscale heat reflective coating is a coating material prepared using nanotechnology, which can effectively reflect thermal radiation and reduce heat loss.

[0043] The copper-tungsten pseudo alloy is an alloy material composed of elements such as copper and tungsten, has excellent thermal conductivity and mechanical properties, and is suitable for manufacturing heat dissipation components in high-temperature environments.

[0044] Furthermore, based on the thermodynamic model and machine learning algorithm, the temperature and heat dissipation efficiency of the transformer 101 are monitored in real time, and the cooling power of the refrigerator 105 and the thermal efficiency of the heat pipe 104 are dynamically adjusted to achieve the optimal heat dissipation effect and energy consumption balance.

[0045] In this embodiment, the function of the temperature of the transformer 101 changing with time is T(t), and the power of the refrigerator 105 is P cooler , the heat transfer efficiency of the heat pipe 104 is η pipe , the objective function of the intelligent temperature control system can be expressed as:

[0046]

[0047] Among them, α, β, γ, δ are weight coefficients, T ambient is the ambient temperature, and HeatGenerated(t) is the heat generated by the transformer 101.

[0048] The temperature of the transformer 101 is monitored in real time by a temperature sensor and the data is transmitted to the controller. The controller uses a built-in algorithm to calculate the optimal power of the refrigerator 105 and the efficiency of the heat pipe 104, and adjusts the corresponding equipment through control signals to achieve dynamic optimization.

[0049] Furthermore, the hollow capillary alloy heat sink 103 is subjected to thermal stress analysis using finite element analysis (FEA) and stress-life model to predict its fatigue life under long-term operation and ensure the safety and reliability of the heat sink.

[0050] Thermal stress analysis involves complex thermodynamics and solid mechanics equations, including: Thermoelasticity equations:

[0051]

[0052] Among them, a ij is the stress tensor, E is the elastic modulus, ν is the Poisson's ratio, ∈ ij is the strain tensor, ∈ kk is the thermal conductivity, α is the thermal expansion coefficient, ΔT is the temperature change, δ ij is the Kronecker function.

[0053] Fatigue life prediction is based on fatigue cumulative damage theory and Miner criterion:

[0054]

[0055] Where D is the total damage, n i is the number of cycles under the stress level, N i The number of cycles required for the material to fail at a given stress level.

[0056] Thermal stress analysis is performed using professional software to simulate the impact of temperature changes under different working conditions on the hollow capillary alloy heat sink 103 and evaluate its thermal stress distribution. Combined with material fatigue test data, a fatigue life prediction model is established to conduct long-term reliability evaluation of the hollow capillary alloy heat sink 103.

[0057] An adaptive thermal management strategy is provided, which automatically adjusts the heat dissipation strategy according to the real-time load condition of the transformer 101, the ambient temperature and the working state of the heat dissipation device to achieve high efficiency and energy saving.

[0058] The multi-objective optimization problem of the adaptive strategy is expressed as follows:

[0059] max(CoolingEfficiency,EnergyEfficiency)

[0060] texts.t.Constraints on T(t),P cooler (t), η pipe (t), etc.

[0061] Among them, CoolingEfficiency and EnergyEfficiency are heat dissipation efficiency and energy consumption efficiency respectively, and their quantitative indicators and constraints need to be determined through experiments or simulations.

[0062] By integrating sensors, controllers and algorithm modules, intelligent control of the heat dissipation device of the transformer 101 is realized. According to the real-time monitoring data, the power of the refrigerator 105, the angle of the heat pipe 104 and other parameters are automatically adjusted to adapt to different working scenarios and needs.

[0063] The present application also provides a transformer 101 heat dissipation method, comprising:

[0064] The hollow capillary alloy heat sink 103 is arranged on the corrugated fin 102 of the transformer 101, comprising: heat-conductive silicone grease is arranged between the hollow capillary alloy heat sink 103 and the corrugated fin 102 of the transformer 101; the hollow capillary alloy heat sink 103 has a tubular structure inside, and a liquid-phase refrigerant is stored in the lower part, and the liquid-phase refrigerant can absorb heat and volatilize to the upper part after being heated;

[0065] The refrigerator 105 transfers the heat transfer medium to the top of the hollow capillary alloy heat sink 103 through the heat transfer pipe 104;

[0066] The refrigerator 105 reduces the heat at the top of the hollow capillary alloy heat sink 103, and the gas phase evaporated to the upper part of the hollow capillary alloy heat sink 103 is recondensed back into liquid and flows to the bottom of the hollow capillary alloy heat sink 103 to complete the heat dissipation.

[0067] Furthermore, the hollow capillary alloy heat sink 103 includes: a surface covered with a nano-scale heat reflective coating.

[0068] Furthermore, the thermal grease is a self-healing material.

[0069] Furthermore, the heat conducting pipe 104 is a heat conducting pipe 104 with an adjustable angle.

[0070] Furthermore, the alloy material of the hollow capillary alloy heat sink 103 includes: copper-tungsten pseudo alloy.

[0071] This embodiment includes setting a hollow capillary alloy heat sink on the transformer wave fin, and ensuring close contact and efficient heat conduction between the two through thermal grease. Subsequently, a refrigerator is used to cool the top of the hollow capillary alloy heat sink through a heat pipe, so that the liquid refrigerant inside the hollow capillary alloy heat sink is heated and volatilized and then quickly condensed and refluxed, thereby achieving efficient heat dissipation inside the transformer. In addition, according to specific needs, enhancement measures such as nano-scale heat reflective coatings, self-healing thermal grease, and heat pipes with adjustable angles can be selectively applied to further improve the heat dissipation effect.

Claims

1. A transformer heat dissipation device, characterized in that: include: Hollow capillary alloy heat sink, thermal grease, refrigerator; The hollow capillary alloy heat sink is arranged on the transformer wave fin; The thermal conductive silicone grease is arranged between the hollow capillary alloy heat sink and the transformer wave fin; The refrigerator cools the top of the hollow capillary alloy heat sink through a heat conduction pipe; The interior of the hollow capillary alloy heat sink is a tubular structure, and the lower part of the hollow capillary alloy heat sink stores liquid refrigerant. After being heated, the liquid refrigerant can absorb heat and volatilize to the upper part of the hollow capillary alloy heat sink; The power calculation formula of the refrigerator is: Among them, α, β, γ, δ are weight coefficients, T ambient is the ambient temperature, HeatGenerated(t) is the heat generated by the transformer 101; The refrigerator reduces the heat at the top of the hollow capillary alloy heat sink according to the power, and the gas phase evaporated to the upper part of the hollow capillary alloy heat sink is recondensed back into liquid and flows to the lower part of the hollow capillary alloy heat sink to complete the heat dissipation.

2. The transformer heat dissipation device according to claim 1, characterized in that: The surface of the hollow capillary alloy heat sink is provided with a nano-scale heat reflection coating.

3. The transformer heat dissipation device according to claim 1, characterized in that: The thermal conductive silicone grease comprises: graphene, carbon nanotubes or metal oxides mixed into the thermal conductive silicone grease.

4. The transformer heat sink according to claim 1, characterized in that: The heat conducting pipe is a corrugated heat conducting pipe with adjustable angle.

5. The transformer heat sink according to claim 1, characterized in that: The alloy material of the hollow capillary alloy heat sink includes: copper-tungsten pseudo alloy.

6. A transformer heat dissipation method, characterized in that: include: The hollow capillary alloy heat sink is arranged on the transformer wave fin, including: heat-conducting silicone grease is arranged between the hollow capillary alloy heat sink and the transformer wave fin; the hollow capillary alloy heat sink has a tubular structure inside, and a liquid phase refrigerant is stored in the lower part, and the liquid phase refrigerant can absorb heat and volatilize to the upper part after being heated; The refrigerator transfers the heat transfer medium to the top of the hollow capillary alloy heat sink through the heat transfer pipe; The refrigerator reduces the heat at the top of the hollow capillary alloy heat sink, and the gas phase volatilized to the upper part of the hollow capillary alloy heat sink is recondensed back into liquid and flows to the lower part of the hollow capillary alloy heat sink to complete the heat dissipation.

7. The transformer heat dissipation method according to claim 6, characterized in that: The hollow capillary alloy heat sink comprises: a surface covered with a nano-scale heat reflection coating.

8. The transformer heat dissipation method according to claim 6, characterized in that: The thermal conductive silicone grease comprises: graphene, carbon nanotubes or metal oxides mixed into the thermal conductive silicone grease.

9. The transformer heat dissipation method according to claim 6, characterized in that: The heat conducting pipe is a corrugated heat conducting pipe with adjustable angle.

10. The transformer heat dissipation method according to claim 6, characterized in that: The alloy material of the hollow capillary alloy heat sink includes: copper-tungsten pseudo alloy.